HT9200A/HT9200B DTMF Generators

Features
Operating voltage: 2.0V~5.5V Serial mode for the HT9200A Serial/parallel mode for the HT9200B Low standby current Low total harmonic distortion 3.58MHz crystal or ceramic resonator HT9200A: 8-pin DIP/SOP package

HT9200B: 14-pin SOP package

General Description
The HT9200A/B tone generators are designed for MCU interfaces. They can be instructed by a MCU to generate 16 dual tones and 8 single tones from the DTMF pin. The HT9200A provides a serial mode whereas the HT9200B contains a selectable serial/parallel mode interface for various applications such as security systems, home automation, remote control through telephone lines, communication systems, etc.

Selection Table
Function Part No. HT9200A HT9200B Operating Voltage 2V~5.5V 2V~5.5V OSC Frequency 3.58MHz 3.58MHz Interface Serial Serial/Parallel Package 8 DIP/SOP 14 SOP

Block Diagram

X 1 X 2

3 .5 8 M H z C r y s ta l/R e s o n a to r O s c illa to r

D T M F G e n e ra to r

D T M F

D A T A C L K

S e r ia l D a ta In p u t C ir c u it

C o n tro l C ir c u it

P a r a l l e lD a t a I n p u tC ir c u it

C E

S /P

D 3

D 2

D 1

D 0

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
Pin Assignment
C E X 2 2 3 4 5 6 7 8 X 1 C E X 2 1 8 2 7 3 6 4 5 X 1 V S S V D D
D T M F

1 4 1 3 1 2 1 1 1 0 9

V D D D T M F D A T A C L K S /P D 3 D 2

V S S N C D 0 D 1

D A T A C L K

H T 9 2 0 0 A 8 D IP -A /S O P -A

H T 9 2 0 0 B 1 4 S O P -A

Pad Assignment
C E X 2 1 1 3 V D D 1 2 1 1 (0 ,0 ) X 1 2 9 3 4 5 D 1 6 7 D 3 D 2 8 S /P V S S D 0 D T M F

Pad Coordinates
Pad No. 1 2
1 0 D A T A C L K

Unit: mm Pad No. 8 9 10 11 12 13 X 553.30 553.30 553.30 553.30 374.90 -279.30 Y -523.50 -190.30 4.70 340.30 523.50 523.50

X -553.30 -553.30 -553.30 -553.30 -220.10 -25.10 308.10

Y 430.40 -133.50 -328.50 -523.50 -523.50 -523.50 -523.50

3 4 5 6 7

Chip size: 1460 1470 (mm)2 * The IC substrate should be connected to VSS in the PCB layout artwork.

Pin Description
Pin Name CE X2 X1 VSS NC I/O I O Oscillator I CMOS IN Pull-high or Floating Internal Connection CMOS IN Pull-high Chip enable, active low The system oscillator consists of an inverter, a bias resistor, and the required load capacitor on chip. The oscillator function can be implemented by Connect a standard 3.579545MHz crystal to the X1 and X2 terminals. Negative power suppl, ground No connection Data inputs for the parallel mode When the IC is operating in the serial mode, the data input terminals (D0~D3) are included with a pull-high resistor. When the IC is operating in the parallel mode, these pins become floating. Operation mode selection input S/P=H: Parallel mode S/P=L: Serial mode Data synchronous clock input for the serial mode When the IC is operating in the parallel mode, the input terminal (CLK) is included with a pull-high resistor. When the IC is operating in the serial mode, this pin becomes floating. Description

D0~D3

S/P

CMOS IN

CLK

CMOS IN Pull-high or Floating

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
Pin Name I/O Internal Connection CMOS IN Pull-high or Floating CMOS OUT Description Data input terminal for the serial mode When the IC is operating in the parallel mode, the input terminal (DATA) is included with a pull-high resistor. When the IC is operating in the serial mode, this pin becomes floating. Output terminal of the DTMF signal Positive power supply, 2.0V~5.5V for normal operation

DATA

DTMF VDD

Approximate internal connection circuits

C M O S IN P u ll- h ig h
V
D D

C M O S O U T
V
D D

C M O S IN (F o r D 0 ~ D 3 , C L K , D A T A )
V
D D

C M O S IN

O S C IL L A T O R
X 1 2 0 p F 1 0 M X 2 1 0 p F E N

Absolute Maximum Ratings

Supply Voltage ............................................-0.3V to 6V Input Voltage ................................VSS-0.3 to VDD+0.3V Storage Temperature ............................-50C to 125C Operating Temperature...........................-20C to 75C

Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
Electrical Characteristics
Symbol VDD IDD VIL VIH ISTB Parameter Operating Voltage Operating Current Low Input Voltage High Input Voltage Standby Current 5.0V RP tDE VTDC ITOL VTAC ACR RL tHD fCLK tUP fOSC 2.5V Pull-high Resistance 5.0V DTMF Output Delay Time (Parallel Mode) DTMF Output DC Level DTMF Sink Current DTMF Output AC Level Column Pre-emphasis DTMF Output Load Tone Signal Distortion Clock Input Rate (Serial Mode) Oscillator Starting Time (When CE is low) System Frequency 5V VOL=0V Test Conditions VDD Conditions Min. 2 VSS 0.8VDD 120 45 0.45VDD -0.1 0.12 1 5 3.5759 Typ. 240 950 180 68 tUP+6 0.15 2 -30 100 3.5795 Max. 5.5 2500 3000 0.2VDD VDD 1 2 270 100 tUP+8 0.75VDD 0.18 3 -23 500 10 3.5831 Ta=25C Unit V mA V V mA

2.5V S/P=VDD,D0~D3=VSS, 5.0V CE=VSS, No load 2.5V S/P=VDD,CE=VDD, no load

kW ms V mA Vrms dB kW dB kHz ms MHz

2V~ DTMF Output 5.5V 2.5V VDTMF=0.5V 2.5V Row group, RL=5kW 2.5V Row group=0dB 2.5V tHD -23dB 2.5V RL=5kW

The time from CE falling 5.0V edge to normal oscillator operation Crystal=3.5795MHz

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
Functional Description
The HT9200A/B are DTMF generators for MCU interfaces. They are controlled by a MCU in the serial mode or the parallel mode (for the HT9200B only). Serial mode (HT9200A/B) The HT9200A/B employ a data input, a 5-bit code, and a synchronous clock to transmit a DTMF signal. Every digit of a phone number to be transmitted is selected by a series of inputs which consist of 5-bit data. Of the 5 bits, the D0(LSB) is the first received bit. The HT9200A/B will latch data on the falling edge of the clock (CLK pin). The relationship between the digital codes and the tone output frequency is shown in Table 1. As for the control timing diagram, refer to Figure 1. When the system is operating in the serial mode a pull-high resistor is attached to D0~D3 (for parallel mode) on the input terminal.

Table 1: Digits vs. input data vs. tone output frequency (serial mode) Digit 1 2 3 4 5 6 7 8 9 0 * # A B C D DTMF OFF D4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 D3 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 1 D2 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 1 1 1 1 1 D1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 1 1 0 0 1 1 1 D0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 0 1 0 1 0 1 1 Tone Output Frequency (Hz) 697+1209 697+1336 697+1477 770+1209 770+1336 770+1477 852+1209 852+1336 852+1477 941+1336 941+1209 941+1477 697+1633 770+1633 852+1633 941+1633 697 770 852 941 1209 1336 1477 1633

Note: The codes not listed in Table 1 are not used D4 is MSB

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
For the HT9200B, the S/P pin has to be connected low for serial mode operation. Parallel mode ( HT9200B) The HT9200B provides four data inputs D0~D3 to generate their corresponding DTMF signals. The S/P has to be connected high to select the parallel operation mode. Then the input data codes should be determined. Finally, the CE is connected low to transmit the DTMF signal from the DTMF pin. The TDE time (about 6ms) will be delayed from the CE falling edge to the DTMF signal output. The relationship between the digital codes and the tone output frequency is illustrated in Table 2. As for the control timing diagram, see Figure 2. When the system is operating in the parallel mode, D0~D3 are all in the floating state. Thus, these data input pins should not float.

S /P X 2 ( O s c illa to r ) C E

tU
P

C L K L S B D A T A 1 D ig it 1 D ig it 2 M S B L S B M S B L S B 1 1 1 M S B 1

S to p c o d e

D T M F D ig it 1 D T M F s ig n a l D ig it 2 D T M F s ig n a l

Figure 1 Table 2: Digits vs. input data vs. tone output frequency (parallel mode) Digit 1 2 3 4 5 6 7 8 9 0 * # A B C D D3 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 D2 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 D1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 D0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Tone Output Frequency (Hz) 697+1209 697+1336 697+1477 770+1209 770+1336 770+1477 852+1209 852+1336 852+1477 941+1336 941+1209 941+1477 697+1633 770+1633 852+1633 941+1633

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
S /P X 2 ( O s c illa to r ) C E

D 0 ~ D 3

D T M F

tD
E

tD
E

N o te : T h e d a ta ( D 0 ~ D 3 ) s h o u ld b e r e a d y b e fo r e th e C E
Figure 2

b e c o m e s lo w .

Tone frequency Output Frequency (Hz) Specified 697 770 852 941 1209 1336 1477 % Error does not contain the crystal frequency drift Actual 699 766 847 948 1215 1332 1472 %Error +0.29% 0.52% 0.59% +0.74% +0.50% 0.30% 0.34%

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
Application Circuits
Serial mode
V
D D

V V D D C E C L K V S S D A T A 2 0 p F 3 2 0 p F 4 3 .5 7 9 5 4 5 M H z 1 2 C E X 2 X 1 V S S V D D T M D A T C L D F A K 5 6 7 8

D D

T o n e O u tp u t

M C U

H T 9 2 0 0 A

Serial/parallel mode
V
D D

V V D D C E D 0 D 1 D 2 D 3 S /P C L K D A T A 3 .5 7 9 5 4 5 M H z 1 2 0 p F 2 3 2 0 p F 5 6 7 4 C E X 2 X 1 V S S N C D 0 D 1 V D D D T M F D A T A C L K S /P D 3 D 2 8 9 1 4 1 3 1 2 1 1 1 0

D D

T o n e O u tp u t

V S S

V S S

M C U

H T 9 2 0 0 B

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
Package Information
8-pin DIP (300mil) Outline Dimensions

A B
1 4 8 5

H C D E F G I

Symbol A B C D E F G H I

Dimensions in mil Min. 355 240 125 125 16 50 295 Nom. 100 Max. 375 260 135 145 20 70 315 375

Rev. 1.41

February 23, 2009

HT9200A/HT9200B
8-pin SOP (150mil) Outline Dimensions

A 1

5 B 4

C ' G D E F

MS-012

Symbol A B C C D E F G H a

Dimensions in mil Min. 228 150 12 188 4 16 7 0 Nom. 50 Max. 244 157 20 197 69 10 50 10 8

Rev. 1.41

10

February 23, 2009

HT9200A/HT9200B
14-pin SOP (150mil) Outline Dimensions

A 1

1 4 7

8 B

C C ' G H D E F

MS-012

Symbol A B C C D E F G H a

Dimensions in mil Min. 228 150 12 337 4 16 7 0 Nom. 50 Max. 244 157 20 344 69 10 50 10 8

Rev. 1.41

11

February 23, 2009

HT9200A/HT9200B
Product Tape and Reel Specifications
Reel Dimensions
T 2 D

T 1

SOP 8N Symbol A B C D T1 T2 SOP 14N Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.01.0 100.01.5 13.0
+0.5/-0.2

Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness

Dimensions in mm 330.01.0 100.01.5 13.0

+0.5/-0.2

2.00.5 12.8
+0.3/-0.2

18.20.2

2.00.5 16.8
+0.3/-0.2

22.20.2

Rev. 1.41

12

February 23, 2009

HT9200A/HT9200B
Carrier Tape Dimensions
D
E F W C

P 0

P 1
t

B 0

D 1

P A 0

K 0

R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e .

SOP 8N Symbol W P E F D D1 P0 P1 A0 B0 K0 t C SOP 14N Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Rev. 1.41 Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width 13 Description Carrier Tape Width Dimensions in mm 16.0
+0.3/-0.1

Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width

Dimensions in mm 12.0
+0.3/-0.1

8.00.1 1.750.1 5.50.1 1.550.1 1.50

+0.25/-0.00

4.00.1 2.00.1 6.40.1 5.20.1 2.10.1 0.300.05 9.30.1

8.00.1 1.750.1 7.50.1 1.5 1.50

+0.1/-0.0 +0.25/-0.00

4.00.1 2.00.1 6.50.1 9.50.1 2.10.1 0.300.05 13.30.1 February 23, 2009

HT9200A/HT9200B

Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) G Room, 3 Floor, No.1 Building, No.2016 Yi-Shan Road, Minhang District, Shanghai, China 201103 Tel: 86-21-5422-4590 Fax: 86-21-5422-4705 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, Gaoxin M 2nd, Middle Zone Of High-Tech Industrial Park, ShenZhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752 Fax: 86-10-6641-0125 Holtek Semiconductor Inc. (Chengdu Sales Office) 709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016 Tel: 86-28-6653-6590 Fax: 86-28-6653-6591 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com

Copyright 2009 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.

Rev. 1.41

14

February 23, 2009