Application Note n2 - July 2012/ page 1

Sub-ns Microchip Lasers

Added value for the process
Sub-ns Microchip Lasers
Added value for the process
Application Note n2 - July 2012/ page 2
Main features from the applicative point of view
Main features from the applicative point of view
Laser characteristics :
> 100s kW peak power
> Sub-ns pulses down to 300ps
> 1064nm to DUV wavelengths (266nm)
> Cost effective and reliable
> Compact and air-cooled
Favourite playgrounds :
> Precise marking & scribing of virtually all materials
> Controlled heat-input selective ablation processes
> NL interaction driven processes (Supercontinuum, TPA)
> Applications where UV is needed
> Industrial environment
Application Note n2 - July 2012/ page 3
Hard materials processing capability
Hard materials processing capability
Excellent surface quality and removal rate
demonstrated for machinig oxydes, ceramics, diamond-
like structures, hard metals..
Applications / Markets:
> Diamond, PCD, CVD
marking and scribing
> Ivory, tooth, dental
ceramics machining
> Tungsten, SiC drilling
> Titanium layers
selective ablation
(1) Dental ceramics machining (Image courtesy of ILT, Germany)
(2) PCD machining (Image courtesy of ILT, Germany)
(1) (1)
(2)
(2)
Key laser models: HNG, PNV, HNP, PNG
Application Note n2 - July 2012/ page 4
Transparent materials processing capability
Transparent materials processing capability
Applications / Markets:
> Biomedical : Lasik surgery,
cataract surgery
> Glass plate cutting for touch-
screens or biological applications
> Bulk marking transparent plastics
for traceability purpose (CR39,
Polycarbonate,1.67)
> Anti-counterfeit semi-transparent
bulk marking for watch glasses
Thin glass plates cutting with 10m-scale chipping
Bulk marking with excellent repeatability proved in
various structures (crystal, glass, plastic) No cracks
(3) Pig eye flap (Image courtesy of Luebeck university, Germany)
(4) Glass engraving (Muse de la dentelle, France)
(3)
10m
(4)
Key laser models: XNV, HNG, PNU
Application Note n2 - July 2012/ page 5
Reflective material processing capability
Reflective material processing capability
Micron-scale texturing thanks to low HAZ
Marking on metals even at low energy
Applications / Markets :
> Surface texturing of metals
parts to reduce friction
(PicoSpark)
> High-end soft black
marking on Aluminium
> Fine scale scribing of cast
or injection moulds
(5)
(5) Stainless steel machining
(6) Single-pulse marking on aluminium (6J only)
(6)
25m
Key laser models: XNP, HNG, SNP
Application Note n2 - July 2012/ page 6
Reduced Heat Affected Zone
Reduced Heat Affected Zone
Key laser models : HNG, HNP, PNG
Compared to ns-lasers based processes, while
conserving the economical figure
Controlled heat input for selective ablation processes
Applications / Markets :
> Electronics : to manage increasing
components density (PCB tracks
correction, glue removal)
> Machining plastics (polymide,
polyurethane,..)
> Precision machining of metals parts
(clock-making, micromechanics)
> Multilayers selective removal
(7) PCB Flex cutting 50m HAZ only on polymide layer
(image courtesy of ILT, Germany)
(7)
(7)
Application Note n2 - July 2012/ page 7
Getting similar quality at lower cost
Getting similar quality at lower cost
For ultrafast lasers based processes
For EDM based processes
For prototyping
Applications / Markets :
> Photovoltac : thin-film PV cell manufacturing (CIGS -
P2,P3)
> Alternative cost-effective solution for EDM-based
processes
> Prototyping laser for series production industries (Flex
PCB cutting, micro-mechanical parts)
(8)
(8)
Key laser models : HNG, HNP, XNP, XNG
Application Note n2 - July 2012/ page 8
Cost-effective UV solutions
Cost-effective UV solutions
Applications / Markets :
> Fluorescence measurements
(UVLED wafer testing, LIF)
> Biomedical (-dissection)
> PCB repair
> LCD/FPD panel repair
> Excimer lasers replacement
market
For industrial environment
To reduce the COO of excimer lasers based processes
Key laser models : SNU, SNV, PNU, PNV, XNV
(9)
(9) Laser-induced fluorescence (Courtesy of Kinzle, Germany)
(10) Micro-dissection of biological tissue (Courtesy of mmi, Germany)
(10)
Application Note n2 - July 2012/ page 9
Conclusion and perspectives
Conclusion and perspectives
Market evolutions seem to be increasingly pointing
towards such laser solutions
New applications fields still being explored, at the
cross-roads between cost-effective ultrafast processes
and improved quality nanosecond processes
Already a wide range of qualified applications so far :
> Lasik surgery
> Thin-film P2 scribing process (CIGS)
> PCB/LCD/FPD repair
> More to come
Picolasers offer picosecond class laser solutions
at nanosecond economics