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Overload protection
Current limitation
Short circuit protection
Thermal shutdown
Overvoltage protection (including load dump)
Fast demagnetization of inductive loads
Reverse battery protection1)
Undervoltage and overvoltage shutdown with auto-restart
and hysteresis
Open drain diagnostic output
Open load detection in ON-state
CMOS compatible input
Loss of ground and loss of Vbb protection
Electrostatic discharge (ESD) protection
Product Summary
Overvoltage protection
Operating voltage
On-state resistance
Load current (ISO)
Current limitation
Vbb(AZ)
Vbb(on)
RON
IL(ISO)
IL(SCr)
43
V
5.0 ... 34 V
60 m
7.0
A
16
A
TO-220AB/5
5
1
Straight leads
Standard
SMD
Application
C compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads
All types of resistive, inductive and capacitve loads
Replaces electromechanical relays, fuses and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, monolithically
+ V bb
Voltage
Overvoltage
Current
Gate
source
protection
limit
protection
V Logic
Charge pump
sensor
Level shifter
Limit for
unclamped
ind. loads
Rectifier
IN
ESD
Voltage
OUT
Temperature
sensor
Open load
Short to Vbb
detection
Logic
Load
ST
GND
PROFET
GND
1
Signal GND
1)
Load GND
With external current limit (e.g. resistor RGND=150 ) in GND connection, resistor in series with ST connection, reverse load
current limited by connected load.
Semiconductor Group
1 of 14
2003-Oct-01
BTS426L1
Pin
Symbol
Function
GND
Logic ground
IN
Vbb
ST
OUT
(Load, L)
Symbol
Vbb
Vbb
Values
43
34
Unit
V
V
60
self-limited
-40 ...+150
-55 ...+150
75
A
C
0.74
1.0
2.0
J
kV
V
mA
VLoad dump4)
IL
Tj
Tstg
Ptot
EAS
VESD
VIN
IIN
IST
Thermal Characteristics
Parameter and Conditions
Thermal resistance
2)
3)
4)
5)
Symbol
chip - case: RthJC
junction - ambient (free air): RthJA
SMD version, device on PCB5):
min
---
Values
typ
--34
Unit
max
1.67
75
K/W
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a 150 resistor in the
GND connection and a 15 k resistor in series with the status pin. A resistor for the protection of the input is integrated.
RI = internal resistance of the load dump test pulse generator
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb connection. PCB is vertical
without blown air.
Semiconductor Group
2003-Oct-01
BTS426L1
Electrical Characteristics
Parameter and Conditions
Symbol
min
Values
typ
Unit
max
Tj=25 C: RON
--
50
60
120
5.8
100
7.0
Tj=150 C:
Nominal load current, ISO Norm (pin 3 to 5)
VON = 0.5 V, TC = 85 C
Output current (pin 5) while GND disconnected or GND pulled
up, Vbb=30 V, VIN= 0, see diagram page 7
Turn-on time
IN
to 90% VOUT:
Turn-off time
IN
to 10% VOUT:
RL = 12 , Tj =-40...+150C
Slew rate on
10 to 30% VOUT, RL = 12 , Tj =-40...+150C
Slew rate off
70 to 40% VOUT, RL = 12 , Tj =-40...+150C
IL(ISO)
IL(GNDhigh)
--
--
-10
ton
toff
80
80
200
230
400
450
dV /dton
0.1
--
V/s
-dV/dtoff
0.1
--
V/s
5.0
3.5
--
----
V
V
V
--
5.6
34
5.0
5.0
7.0
7.0
-34
33
-42
0.2
--0.5
47
-43
----
V
V
V
V
V
----
10
12
--
25
28
12
--
1.8
3.5
mA
Operating Parameters
Operating voltage6)
Undervoltage shutdown
Undervoltage restart
Tj =-40...+150C: Vbb(on)
Tj =-40...+150C: Vbb(under)
Tj =-40...+25C: Vbb(u rst)
Tj =+150C:
Undervoltage restart of charge pump
Vbb(ucp)
see diagram page 12
Tj =-40...+150C:
Undervoltage hysteresis Vbb(under) = Vbb(u rst) - Vbb(under)
Vbb(under)
Overvoltage shutdown
Tj =-40...+150C: Vbb(over)
Overvoltage restart
Tj =-40...+150C: Vbb(o rst)
Overvoltage hysteresis
Tj =-40...+150C: Vbb(over)
7
)
Overvoltage protection
Tj =-40...+150C: Vbb(AZ)
Ibb=40 mA
Standby current (pin 3)
VIN=0
Tj=-40...+25C: Ibb(off)
Tj= 150C:
IL(off)
Leakage output current (included in Ibb(off))
VIN=0
Operating current (Pin 1)8), VIN=5 V, Tj =-40...+150C
IGND
6)
7)
8)
A
mA
At supply voltage increase up to Vbb= 5.6 V typ without charge pump, VOUT Vbb - 2 V
See also VON(CL) in table of protection functions and circuit diagram page 7.
Add IST, if IST > 0, add IIN, if VIN>5.5 V
Semiconductor Group
2003-Oct-01
BTS426L1
Parameter and Conditions
Symbol
min
Protection Functions9)
Initial peak short circuit current limit (pin 3 to 5)
Diagnostic Characteristics
Open load detection current
(on-condition)
Unit
max
IL(SCp)
Tj =-40C:
Tj =25C:
Tj =+150C:
Values
typ
21
15
11
32
25
17
43
35
24
--
16
--
41
150
---
47
-10
--
53
--32
V
C
K
V
--
610
--
mV
20
10
---
850
750
mA
10
30
IL(SCr)
Tj=-40 C: IL (OL)
Tj=25 ..150C:
9)
Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault
conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive
operation.
10) Requires 150 resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by
the connected load. Note that the power dissipation is higher compared to normal operating conditions due to the voltage drop
across the intrinsic drain-source diode. The temperature protection is not active during reverse current operation! Input and Status
currents have to be limited (see max. ratings page 2 and circuit page 7).
11) External pull up resistor required for open load detection in off state.
Semiconductor Group
2003-Oct-01
BTS426L1
Parameter and Conditions
Symbol
min
RI
Tj =-40..+150C: VIN(T+)
Tj =-40..+150C: VIN(T-)
VIN(T)
IIN(off)
IIN(on)
Delay time for status with open load after switch off
(see timing diagrams, page 11), Tj =-40..+150C
Status invalid after positive input slope
(open load)
Tj=-40 ... +150C:
Status output (open drain)
Zener limit voltage
Tj =-40...+150C, IST = +1.6 mA:
ST low voltage
Tj =-40...+25C, IST = +1.6 mA:
Tj = +150C, IST = +1.6 mA:
td(ST OL4)
12)
td(ST)
VST(high)
VST(low)
Values
typ
Unit
max
2.5
3.5
1.7
1.5
-1
--0.5
--
3.5
--50
V
V
V
A
20
50
90
100
520
1000
--
250
600
5.4
---
6.1
---
-0.4
0.6
If a ground resistor RGND is used, add the voltage drop across this resistor.
Semiconductor Group
2003-Oct-01
BTS426L1
Truth Table
Input-
Output
level
level
425 L1
426 L1
L
H
L
H
L
H
L
H
H
H
H (L14))
L
L15)
H (L16))
H
L
H
H
H
H
Normal
operation
Open load
Short circuit to
Vbb
Overtemperature
Undervoltage
13)
H
H
H
L
H
L
H
L
H
Overvoltage
L = "Low" Level
H = "High" Level
Status
L
L
L
L
L
L
X = don't care
Z = high impedance, potential depends on external circuit
Status signal after the time delay shown in the diagrams (see fig 5. page 11...12)
Terms
IN
V ST
IN
Vbb
IN
IL
PROFET
I ST
OUT
VON
ESD-ZD I
ST
bb
GND
GND
1
R
IGND
V OUT
GND
13)
Semiconductor Group
2003-Oct-01
BTS426L1
Status output
Open-load detection
+5V
R ST(ON)
ST
ESDZD
GND
VON
ON
ESD-Zener diode: 6.1 V typ., max 5 mA; RST(ON) < 380 at 1.6
mA, ESD zener diodes are not to be used as voltage clamp at DC
conditions. Operation in this mode may result in a drift of the zener
voltage (increase of up to 1 V).
OUT
Open load
detection
Logic
unit
+ V bb
V
VON
EXT
OFF
OUT
GND
PROFET
Open load
detection
Logic
unit
OUT
Signal GND
GND disconnect
V
R IN
IN
RI
Z2
Logic
R ST
ST
2
V
IN
PROFET
Z1
Vbb
PROFET
GND
R GND
Signal GND
bb
IN
ST
OUT
ST
GND
1
V
GND
Semiconductor Group
2003-Oct-01
BTS426L1
Inductive Load switch-off energy dissipation
E bb
E AS
3
Vbb
IN
IN
OUT
PROFET
4
GND
bb
V
IN ST
ST
GND
ZL
GND
Any kind of load. If VGND > VIN - VIN(T+) device stays off
Due to VGND >0, no VST = low signal available.
Vbb
ST
GND
EAS=
1
V
IL L
ILRL
(Vbb + |VOUT(CL)|) ln (1+
)
|VOUT(CL)|
2RL
bb
L [mH]
high
2
IN
Vbb
PROFET
10000
1000
OUT
ST
GND
1
ER
PROFET
4
RL
EL
EL = 1/2LI L
3
IN
high
OUT
PROFET
ST
1
ELoad
Vbb
100
bb
10
1
2
12
17
IL [A]
Semiconductor Group
2003-Oct-01
BTS426L1
Typ. transient thermal impedance chip case
ZthJC = f(tp)ZthJC [K/W]
10
D=
0.5
0.2
0.1
0.05
0.02
0.01
0
0.1
0.01
1E-5
1E-4
1E-3
1E-2
1E-1
1E0
1E1
tp [s]
Transient thermal impedance chip ambient air
ZthJA = f(tp)ZthJA [K/W]
100
10
D=
0.5
0.2
0.1
0.05
0.02
0.01
0
0.1
1E-5
1E-4
1E-3
1E-2
1E-1
1E0
1E1
1E2
1E3
tp [s]
Semiconductor Group
2003-Oct-01
BTS426L1
Timing diagrams
Figure 2b: Switching an inductive load
IN
IN
V
bb
t
ST
d(ST)
*)
OUT
OUT
ST open drain
IL
I L(OL)
ST
IL
V
IL(SCr)
OUT
I L(SCp)
ST
Semiconductor Group
10
2003-Oct-01
BTS426L1
Figure 5b: Open load: detection in ON-state, open load occurs in
on-state
IN
IN
ST
t
d(ST OL1)
d(ST OL2)
ST
OUT
OUT
I
T
normal
open
normal
t
t
td(ST OL1) = 20 s typ., td(ST OL2) = 10 s typ
IN
IN
ST
t
d(ST)
d(ST OL4)
ST
V
OUT
I
L
open
d(ST)
OUT
open
t
t
The status delay time td(ST OL4) allows to ditinguish between
the failure modes "open load" and "overtemperature".
Semiconductor Group
11
2003-Oct-01
BTS426L1
Figure 7a: Overvoltage:
Figure 6a: Undervoltage:
IN
IN
Vbb
bb
V ON(CL)
Vbb(over)
V bb(o rst)
Vbb(u cp)
V
bb(under)
bb(u rst)
OUT
V OUT
ST
ST open drain
t
t
on-state
off-state
bb(u rst)
V
V
bb(over)
off-state
VON(CL)
V on
bb(o rst)
bb(u cp)
bb(under)
V bb
charge pump starts at Vbb(ucp) =5.6 V typ.
Semiconductor Group
12
2003-Oct-01
BTS426L1
Standard TO-220AB/5
Ordering code
BTS426L1
Q67060-S6108-A2
Semiconductor Group
T&R:
Ordering code
Q67060-S6108-A4
Ordering code
Q67060-S6108-A3
13
2003-Oct-01
BTS426L1
Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 Mnchen
Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall
not be considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to
warranties of non-infringement, regarding circuits, descriptions and charts
stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and
prices please contact your nearest Infineon Technologies Office in
Germany or our Infineon Technologies Representatives worldwide (see
address list).
Warnings
Due to technical requirements components may contain dangerous
substances. For information on the types in question please contact your
nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support
devices or systems with the express written approval of Infineon
Technologies, if a failure of such components can reasonably be expected
to cause the failure of that life-support device or system, or to affect the
safety or effectiveness of that device or system. Life support devices or
systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
Semiconductor Group
14
2003-Oct-01