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  • Stack Up: Design Is On Top Only Vias Go Through Both Substrates

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    Mahmoud Musbah
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    The document describes a multilayer printed circuit board design with two substrates. Vias connect between the top and bottom substrates. The design is located only on the top 5 mil thick Rogers 5880 substrate, which is bonded with adhesive to the bottom 60 mil thick Rogers 4003 substrate to form the multilayer board.

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    Stack up

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    The document describes a multilayer printed circuit board design with two substrates. Vias connect between the top and bottom substrates. The design is located only on the top 5 mil thick Rogers 5880 substrate, which is bonded with adhesive to the bottom 60 mil thick Rogers 4003 substrate to form the multilayer board.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    2 views1 page

    Stack Up: Design Is On Top Only Vias Go Through Both Substrates

    Uploaded by

    Mahmoud Musbah
    The document describes a multilayer printed circuit board design with two substrates. Vias connect between the top and bottom substrates. The design is located only on the top 5 mil thick Rogers 5880 substrate, which is bonded with adhesive to the bottom 60 mil thick Rogers 4003 substrate to form the multilayer board.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 1

    Stack up

    Vias go through both


    substrates

    Design is on top only

    Rogers 5880 (5Mil)


    Copper

    Bonding Adhesive
    Rogers 4003 (60Mil)

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