Topic:

Improvement of Heat Sink using CarbAl based Material

Keywords:
Heat Sink, Property, Aluminum, Copper
Patent Documents:
1. Advanced heat sinks and thermal spreaders (US20070053168A1)
2. Heat sink substrate consisting essentially of copper and molybdenum
and method of manufacturing the same (US6271585B1)
3. Composite heat sink with metal base and graphite fins (US6749010B2)
Features/Chracteri
stics

Proposed

Higher Thermal
Conductance
Lower Thermal
Resistance
Lightweight
Low Cost
Efficient

Rationale:
Nowadays, overheating is frequently an issue of the systems
malfunctioning. Heat sink is a passive heat exchanger that disperses the
heat generated by an electronic or mechanical device and it is commonly
made of aluminum and copper. Aluminum material provide an average
thermal conductance which can sustain the stability of the system and its
cheap and lightweight, while copper have a higher thermal conductance but
expensive and heavy. We found out that there is a certain material which is
called CarbAl that is a carbon based material with additives of aluminum. Its

unique attributes allow it to far exceed the capabilities of conventional

thermal management materials, and lighter like copper and aluminum.