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This paper explores the use of signature analysis equipment as used with in die strain gauges
and other analog devices monitoring for part quality and tool reliability.
Figure 1
Required Equipment:
1.Resolver
2.Strain gauges or other analog devices
3.Process Monitor
4.Operator interface
The resolver is the feedback device that provides positional information to the monitoring
system. Mounting and driving the resolver is critical. The drive mechanism must be either direct,
through a spiral coupling from the end of the crankshaft, or by means of a toothed timing belt from the
crankshaft. Resolvers for this purpose should not be driven by roller chain.
Strain gauges, piezo electric sensors, and/or other analog devices provide force measurement
and dimensional information to the system. These devices are used to monitor tonnage on the press,
measure force directly in the tool, and part position along with many other functions.
Figure 3 shows how changes in thickness effect the starting Process Feature -Thickness
position of the signature (phase shift). As thickness increases, the
starting position of the signature occurs earlier. Conversely, as material
thickness decreases, the starting position of the signature is later. Force
Tooling Position
Figure 4 depicts the effect of material hardness changes on the Phase Shift =Thickness
Figure 4
Signature Applications
Some specific examples where signature analysis was used to determine presence and sharpness
of punches, the condition of in die taps, part quality, and part position are outlined below.
Example 1
This case demonstrates the differences in data collected from the same process by sensors
mounted in different locations on the press. The press is a 200-ton Bliss straight side with sensors
mounted both on the uprights and the connections.
The signatures shown are for the same stroke of the press providing a good comparison from
the connections and the uprights of the machine. Material feed is left to right. Station one is a blank and
draw. This die also incorporates a pierce and urethane form with a pinch trim at the right side of the
press.
Figure 5 Figure 6
Figure 7 Figure 8
Figure 9 Figure 10
Figure 12
Example 3
A part being formed in a progressive die has a small
punched hole (.020 diameter) and it is being punched through
a .020 to .030 inch wall (figure 14). This situation is difficult
to monitor in the die by conventional methods using proximity
sensors or optical sensors. An alternative to electronic
monitoring might be to perform 100% visual inspection (only
about 80% effective) requiring the additional manpower.
Figure 14
Punch Signature
Figure 16
Example 4
This next example is from a high-speed application. The press is a Minster Pulsar running from
500 to 800 SPM. Two (2) parts are formed and merged on the same die. One part is a spring that is
formed in one portion of the die and then assembled into the second part being produced in the same
die. The spring tension and position are critical to the proper function of the finished product. One
hundred percent monitoring of the spring is required by the end user.
An in die sensor is used to measure the force of the spring. Spring pressure must be held to +/-
1/10 Newton. Once assembled the part spring position is measured in a laser station outside the
forming area of the die.
Laser Station
Figure 22
Conclusion
The examples set forth here are only a few illustration of how some stamping companies are
employing electronics to aid in monitoring tool wear, tool breakage, and part quality.
Signature analysis systems provide a window into the die and the process. With real-time
process controls the user can identify problem areas before press or tool damage occurs and mountains
of scrap are produced.
The stamping industry knows the cost of die damage, press damage, downtime, scrapped parts,
hand sorting, etc. Isnt it timed to examine the benefits of prevention?
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