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HTAI NS
Thermal Class: 200°C
Copper
THEIC Modified Polyester*
Nano SHIELD COAT*
Modified Polyamide-imide*
*multiple coats
Typical Properties
This data is typical of 18 AWG copper, heavy build
insulation only. It is not intended to be used to create
specification limits.
Thermal Electrical
Thermal Endurance Pulse Endurance Test
20,000 hr life >200°C 20,000 Hz, 2000 V, 0.025 microsecond rise time
Thermoplastic Flow minimum typical 150°C, 50% Duty Cycle - Twisted pairs
300°C 350°C 18 HTAIH Reference = 600 seconds
Heat Shock (20%3x) 18 HTAI NS >80,000 seconds
1/2 hr at 220°C minimum no cracks Pulse Endurance Index (PEI) >100
Solderability Life of product/life of same size and build MW-35
not designed to be self-solderable (Reference)
1,000
Copper
Chemical
100 120 160 200 240 280 320 Retained Dielectric
Temperature, degrees C After 72 hrs exposure to R-22 + 300°C conditioning:
3.5 kV
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