Dec.

2012

DDR3 SDRAM Memory

Product Guide
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 Dec. 2012

Product Guide DDR3 SDRAM Memory

1. DDR3 SDRAM MEMORY ORDERING INFORMATION

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

K 4 B X X X X X X X - X X X X
SAMSUNG Memory Speed
DRAM Temp & Power
DRAM Type Package Type
Density Revision
Bit Organization Interface (VDD, VDDQ)
# of Internal Banks

1. SAMSUNG Memory : K 10. Revision

M : 1st Gen.
A : 2nd Gen.
2. DRAM : 4 B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
3. DRAM Type E : 6th Gen.
F : 7th Gen.
B : DDR3 SDRAM
G : 8th Gen.
H : 9th Gen.
4~5. Density
51 : 512Mb 11. "-"
1G : 1Gb
2G : 2Gb 12. Package Type
4G : 4Gb
8G : 8Gb H : FBGA (Halogen-free & Lead-free)
AG : 16Gb M : FBGA (Halogen-free & Lead-free, DDP)
B : FBGA (Halogen-free & Lead-free, Flip Chip)
E : FBGA(Lead-free & Halogen-free, QDP)
6~7. Bit Organization O : FBGA(Lead-free & Halogen-free, QDP for 64GB
04 : x4 LRDIMM)
08 : x8
16 : x16 13. Temp & Power
33 : x32
C : Commercial Temp.( 0C ~ 85C) & Normal Power(1.5V)
8. # of Internal Banks Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
K : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
3 : 4 Banks & RS( Reduced Standby )
4 : 8 Banks
5 : 16 Banks
14~15. Speed
F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
9. Interface ( VDD, VDDQ) F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
6 : SSTL (1.5V, 1.5V) H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
MA : DDR3-1866 (933MHz @ CL=13, tRCD=13, tRP=13)

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

2. DDR3 SDRAM Component Product Guide
Package & Power,
Density Banks Part Number Org. VDD Voltage1 PKG Avail. NOTE
Temp. & Speed
K4B1G0446G BCF8/H9/K0/MA 256M x 4
1.5V
K4B1G0846G BCF8/H9/K0/MA 128M x 8 78 ball
1Gb G-die 8Banks Now
K4B1G0446G BYF8/H9/K0 256M x 4 FBGA
1.35V
K4B1G0846G BYF8/H9/K0 128M x 8
K4B2G0446C HCF8/H9/K0 512M x 4
1.5V
K4B2G0846C HCF8/H9/K0 256M x 8 78 ball
2Gb C-die 8Banks Now
K4B2G0446C HYF8/H9 512M x 4 FBGA
1.35V
K4B2G0846C HYF8/H9 256M x 8
K4B2G0446D HCF8/H9/K0/MA 512M x 4
1.5V
K4B2G0846D HCF8/H9/K0/MA 256M x 8 78 ball
2Gb D-die 8Banks Now
K4B2G0446D HYF8/H9/K0 512M x 4 FBGA
1.35V
K4B2G0846D HYF8/H9/K0 256M x 8
K4B2G0446E BCH9/K0/MA 512M x 4
1.5V
K4B2G0846E BCH9/K0/MA 256M x 8 78 ball Now
2Gb E-die 8Banks
K4B2G0446E BYH9/K0 512M x 4 FBGA
1.35V
K4B2G0846E BYH9/K0 256M x 8
K4B4G0446B HCF8/H9/K0/MA 1G x 4
K4B4G0846B HCF8/H9/K0/MA 512M x 8 1.5V
K4B4G1646B HCH9/K0 256M x 16 78 ball
4Gb B-die 8Banks FBGA Now
K4B4G0446B HYF8/H9/K0 1G x 4
K4B4G0846B HYF8/H9/K0 512M x 8 1.35V
K4B4G1646B HYH9/K0 256M x 16
K4B4G0446C BCH9/K0/MA 1G x 4
1.5V
K4B4G0846C BCH9/K0/MA 512M x 8 78 ball
4Gb C-die 8Banks Now
K4B4G0446C BYH9/K0 1G x 4 FBGA
1.35V
K4B4G0846C BYH9/K0 512M x 8
K4B4G0446D BCH9/K0/MA 1G x 4
1.5V
K4B4G0846D BCH9/K0/MA 512M x 8 78 ball
4Gb D-die 8Banks 1Q’13
K4B4G0446D BYH9/K0 1G x 4 FBGA
1.35V
K4B4G0846D BYH9/K0 512M x 8
K4B8G1646B MCK0 DDP 512M x 16 1.5V 96 ball
Now
K4B8G1646B MYH9/K0 DDP 512M x 16 1.35V FBGA
8G B-die 8Banks
K4B8G3346B MCH9/K0 DDP 256M x 32 1.5V 136 ball
Now
K4B8G3346B MYH9/K0 DDP 256M x 32 1.35V FBGA

K4BAG0446B ECH9/K0 QDP 4G x 4 1.5V 78 ball

Now
K4BAG0446B EYH9/K0 QDP 4G x 4 1.35V FBGA
16G B-die 8Banks
K4BAG0446B OCK0 QDP 4G x4 1.5V 78 ball
Now
K4BAG0446B OYF8/H9/K0 QDP 4G x4 1.35V FBGA

* NOTE
1. 1.35V product is 1.5V operatable.

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

3. DDR3 SDRAM Module Ordering Information
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 171

M X X X B X X X X X X X - X X X X
Memory Module
DIMM Type Memory Buffer
Data bits Speed
DRAM Component Type Temp & Power
Depth PCB Revision
# of Banks in Comp. & Interface Package
Bit Organization Component Revision

1. Memory Module : M 10. Component Revision

M : 1st Gen. A : 2nd Gen.
B : 3rd Gen. C : 4th Gen.
2. DIMM Type D : 5th Gen. E : 6th Gen.
F : 7th Gen. G : 8th Gen.
3 : DIMM
4 : SODIMM 11. Package
Z : FBGA(Lead-free)
H : FBGA(Lead-free & Halogen-free)
3~4. Data Bits J : FBGA(Lead-free, DDP)
71 : x64 204pin Unbuffered SODIMM M : FBGA(Lead-free & Halogen-free, DDP)
74 : x72 204pin ECC Unbuffered SODIMM B : FBGA (Halogen-free & Lead-free, Flip Chip)
78 : x64 240pin Unbuffered DIMM E : FBGA(Lead-free & Halogen-free, QDP)
86 : x72 240pin LR DIMM O : FBGA(Lead-free & Halogen-free, QDP for 64GB
90 : x72 240pin VLP Unbuffered DIMM
91 : x72 240pin ECC Unbuffered DIMM LRDIMM)
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM 12. PCB Revision
0 : None 1 : 1st Rev.
5. DRAM Component Type 2 : 2nd Rev. 3 : 3rd Rev.
B : DDR3 SDRAM 4 : 4th Rev. S : Reduced Layer

13. "_"
6~7. Depth
32 : 32M 33 : 32M (for 128Mb/512Mb) 14. Temp & Power
64 : 64M 65 : 64M (for 128Mb/512Mb) C : Commercial Temp.( 0C ~ 85C) & Normal Power(1.5V)
28 : 128M 29 : 128M (for 128Mb/512Mb) Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
56 : 256M 57 : 256M (for 512Mb/2Gb)
51 : 512M 52 : 512M (for 512Mb/2Gb) 15~16. Speed2
1G: 1G 1K : 1G (for 2Gb) F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
2G: 2G 2K : 2G (for 2Gb) F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
4G: 4G H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
8G: 8G K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
MA: DDR3-1866 (933MHz @ CL=13, tRCD=13, tRP=13)
8. # of Banks in comp. & Interface
17. Memory Buffer
7 : 8Banks & SSTL-1.5V 0 : Inphi iMB02-GS02A
1 : IDT A2 (Greendale)
9. Bit Organization 2 : Montage MB C0
3 : Inphi iMB02-GS02B
0 : x4
4 : Montage MB CI
3 : x8
NOTE:
4 : x16 1. Only used for LRDIMM
2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
PC3-14900(DDR3-1866)

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
128Mx 72 1GB M391B2873GB0 CF8/H9/K0/MA D(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 30mm Now
FBGA
M378B5773CH0 CF8/H9/K0 256M x 8 * 8 pcs 2Gb C-die Now
78 ball
256Mx 64 2GB M378B5773DH0 CF8/H9/K0/MA A(1Rx8) 256M x 8 * 8 pcs 2Gb D-die 8 1 30mm Now
FBGA
M378B5773EB0 CH9/K0/MA 256M x 8 * 8 pcs 2Gb E-die Now
M391B5673GB0 CF8/H9/K0/MA E(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Now
M391B5773CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die 78 ball Now
256Mx 72 2GB 30mm
M391B5773DH0 CF8/H9/K0/MA D(1Rx8) 256M x 8 * 9 pcs 2Gb D-die 8 1 FBGA Now
M391B5773EB0 CH9/K0/MA 256M x 8 * 9 pcs 2Gb E-die Now
M378B5273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die Now
M378B5273DH0 CF8/H9/K0 B(2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 Now
78 ball
512Mx 64 4GB M378B5273EB0 CH9/K0/MA 256M x 8 * 16 pcs 2Gb E-die 30mm Now
FBGA
M378B5173CB0 CK0 512M x 8 * 8 pcs 4Gb C-die Now
D(1Rx8) 8 1
M378B5173DB0 CK0/MA 512M x 8 * 8 pcs 4Gb D-die 1Q’13
M391B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die Now
78 ball
512Mx 72 4GB M391B5273DH0 CF8/H9/K0/MA E(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 30mm Now
FBGA
M391B5273EB0 CH9/K0/MA 256M x 8 * 18 pcs 2Gb E-die Now
M378B1G73BH0 CF8/H9/K0 512M x 8 * 16 pcs 4Gb B-die Now
8 2
1Gx 64 8GB M378B1G73CB0 CK0 B(2Rx8) 512M x 8 * 16 pcs 4Gb C-die 30mm Now
78 ball
M378B5173DB0 CK0/MA 1G x 8 * 8 pcs 4Gb D-die FBGA 1Q’13
78 ball
1Gx 72 8GB M391B1G73BH0 CF8/H9/K0/MA E(2Rx8) 512M x 8 * 18 pcs 4Gb B-die 8 2 30mm Now
FBGA

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

240Pin DDR3 Unbuffered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
128Mx 72 1GB M391B2873GB0 YF8/H9/K0 D(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 30mm Now
FBGA
M391B5673GB0 YF8/H9/K0 E(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Now
78 ball
256Mx 72 2GB M391B5773CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die 30mm Now
D(1Rx8) 8 1 FBGA
M391B5773DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die Now
M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die 78 ball Now
512Mx 72 4GB E(2Rx8) 8 2 30mm
M391B5273DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die FBGA Now
78 ball
1Gx 72 8GB M391B1G73BH0 YF8/H9/K0 E(2Rx8) 512M x 8 * 18 pcs 4Gb B-die 8 2 30mm Now
FBGA
* NOTE : 1.35V product is 1.5V operatable.

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

4.3 240Pin DDR3 VLP Unbuffered DIMM (1.35V Product)
240Pin DDR3 VLP Unbuffered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
256Mx 72 2GB M390B5773DH0 YH9 J(1Rx8) 256M x 8 * 9pcs 2Gb D-die 8 1 18.75mm Now
FBGA
M390B5273DH0 YH9 K(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 78 ball Now
512Mx 72 4GB 18.75mm
M390B5173BH0 YH9 J(1Rx8) 256M x 8 * 18 pcs 4Gb B-die 8 1 FBGA Now
78 ball
1Gx 72 8GB M390B1G73BH0 YH9 K(2Rx8) 512M x 8 * 18 pcs 4Gb B-die 8 2 18.75mm Now
FBGA

* NOTE : 1.35V product is 1.5V operatable.

4.4 204Pin DDR3 SoDIMM (1.5V Product)

204Pin DDR3 SODIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M471B5773CHS CF8/H9/K0 256M x 8 * 8 pcs 2Gb C-die 78 ball Now
256Mx 64 2GB B(1Rx8) 8 1 30mm
M471B5773DH0 CF8/H9/K0 256M x 8 * 8 pcs 2Gb D-die FBGA Now
M471B5273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die Now
M471B5273DH0 CF8/H9/K0 F(2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 Now
78 ball
512Mx 64 4GB M471B5273EB0 CH9/K0 256M x 8 * 16 pcs 2Gb E-die 30mm Now
FBGA
M471B5173CB0 CK0 512M x 8 * 8 pcs 4Gb C-die Now
B(1Rx8) 8 1
M471B5173DB0 CH9/K0 512M x 8 * 8 pcs 4Gb D-die 1Q’13
M471B1G73BH0 CH9/K0 512M x 8 * 16 pcs 4Gb B-die Now
78 ball
1Gx 64 8GB M471B1G73CB0 CK0 F(2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 30mm Now
FBGA
M471B1G73DB0 CH9/K0 512M x 8 * 16 pcs 4Gb D-die 1Q’13

4.5 204Pin DDR3 SoDIMM (1.35V Product)

204Pin DDR3 SODIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
M471B5773CHS YF8/H9 256M x 8 * 8 pcs 2Gb C-die 78 ball Now
256Mx 64 2GB B(1Rx8) 8 1 30mm
M471B5773DH0 YF8/H9/K0 256M x 8 * 8 pcs 2Gb D-die FBGA Now
M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die Now
M471B5273DH0 YF8/H9/K0 F(2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 Now
78 ball
512Mx 64 4GB M471B5273EB0 YK0 256M x 8 * 16 pcs 2Gb E-die 30mm Now
FBGA
M471B5173CB0 YH9/K0 512M x 8 * 8 pcs 4Gb C-die Now
B(1Rx8) 8 1
M471B5173DB0 YH9/K0 512M x 8 * 8 pcs 4Gb D-die 4Q’12
M471B1G73BH0 YF8/H9/K0 512M x 8 * 16 pcs 4Gb B-die Now
78 ball
1Gx 64 8GB M471B1G73CB0 YH9/K0 F(2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 30mm Now
FBGA
M471B1G73DB0 YH9/K0 512M x 8 * 16 pcs 4Gb D-die 4Q’12
* NOTE : 1.35V product is 1.5V operatable.

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

4.6 204Pin DDR3 ECC SoDIMM (1.35V Product)
204Pin DDR3 SODIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
256Mx 72 2GB M474B5773DH0 YF8/H9 C(1Rx8) 256M x 8 * 9 pcs 2Gb D-die 8 1 30mm Now
FBGA
78 ball
M474B5273DH0 YF8/H9 D(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 30mm Now
FBGA
512Mx 72 4GB
78 ball
M474B5173BH0 YF8/H9/K0 C(1Rx8) 256M x 8 * 18 pcs 2Gb B-die 8 1 30mm Now
FBGA
78 ball
1Gx 72 8GB M474B1G73BH0 YF8/H9/K0 D(2Rx8) 512M x 8 * 18 pcs 4Gb B-die 8 2 30mm Now
FBGA
NOTE : 1.35V product is 1.5V operatable.

4.7 240Pin DDR3 Registered DIMM (1.5V Product)

240Pin DDR3 Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
128Mx 72 1GB M393B2873GB0 CH9/K0/MA A(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 30mm Now
FBGA
M393B5673GB0 CH9/K0/MA B(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Now
M393B5670GB0 CH9/K0/MA C(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 78 ball Now
256Mx 72 2GB 30mm
M393B5773CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die FBGA Now
A(1Rx8) 8 1
M393B5773DH0 CH9/K0/MA 256M x 8 * 9 pcs 2Gb D-die Now
M393B5173GB0 CH9 H(4Rx8) 128M x 8 * 36 pcs 1Gb G-die 8 4 Now
M393B5170GB0 CH9/K0/MA E(2Rx4) 256M x 4 * 36 pcs 1Gb G-die 8 2 Now
M393B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die Now
M393B5273DH0 CH9/K0/MA B(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 78 ball Now
512Mx 72 4GB 30mm
M393B5273EB0 CMA 256M x 8 * 18 pcs 2Gb E-die FBGA Now
M393B5270CH0 CH9/K0 512M x 4 * 18 pcs 2Gb C-die Now
M393B5270DH0 CH9/K0/MA C(1Rx4) 512M x 4 * 18 pcs 2Gb D-die 8 1 Now
M393B5270EB0 CH9/MA 512M x 4 * 18 pcs 2Gb E-die Now
M393B1K73CH0 CF8/H9 256M x 8 * 36 pcs 2Gb C-die Now
M393B1K73DH0 CH9 H(4Rx8) 256M x 8 * 36 pcs 2Gb D-die 8 4 Now
M393B1K73EB0 CH9 256M x 8 * 36 pcs 2Gb E-die Now
M393B1K70CH0 CF8/H9/K0 512M x 4 * 36 pcs 2Gb C-die 78 ball Now
1Gx 72 8GB 30mm
M393B1K70DH0 CH9/K0/MA E(2Rx4) 512M x 4 * 36 pcs 2Gb D-die FBGA Now
8 2
M393B1K70EB0 CH9/MA 512M x 4 * 36 pcs 2Gb E-die Now
M393B1G73BH0 CH9/K0/MA B(2Rx8) 512M x 8 * 18 pcs 4Gb B-die Now
M393B1G70BH0 CH9/K0/MA C(1Rx4) 1G x 4 * 18 pcs 4Gb B-die 8 1 Now
1G
M393B2K70DM0 CF8/H9 AB(4Rx4) x 4 * 36 pcs 2Gb D-die 8 4 Now
DDP
M393B2G70BH0 CF8/H9 1G x 4 * 36 pcs 4Gb B-die Now
E(2Rx4) 8 2 78 ball
2Gx 72 16GB 30mm
M393B2G70CB0 CK0/MA 1G x 4 * 36 pcs 4Gb C-die FBGA Now
M393B2G73BH0 CF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb B-die 8 4 Now
M393B2G70DB0 CK0/MA E(2Rx4) 1G x 4 * 36 pcs 4Gb D-die 8 2 1Q’13

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

4.8 240Pin DDR3 Registered DIMM (1.35V Product)
240Pin DDR3 Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
128Mx 72 1GB M393B2873GB0 YF8/H9/K0 A(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 30mm Now
FBGA
M393B5673GB0 YF8/H9/K0 B(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Now
M393B5670GB0 YF8/H9/K0 C(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 78 ball Now
256Mx 72 2GB 30mm
M393B5773CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die FBGA Now
A(1Rx8) 8 1
M393B5773DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die Now
M393B5173GB0 YF8/H9 H(4Rx8) 128M x 8 * 36 pcs 1Gb G-die 8 4 Now
M393B5170GB0 YF8/H9/K0 E(2Rx4) 256M x 4 * 36 pcs 1Gb G-die 8 2 Now
M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die Now
M393B5273DH0 YF8/H9/K0 B(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 78 ball Now
512Mx 72 4GB 30mm
M393B5273EB0 YH9/K0 256M x 8 * 18 pcs 2Gb E-die FBGA Now
M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die Now
M393B5270DH0 YF8/H9/K0 C(1Rx4) 512M x 4 * 18 pcs 2Gb D-die 8 1 Now
M393B5270EB0 YH9/K0 512M x 4 * 18 pcs 2Gb E-die Now
M393B1K73CH0 YF8/H9 256M x 8 * 36 pcs 2Gb C-die Now
M393B1K73DH0 YF8/H9 H(4Rx8) 256M x 8 * 36 pcs 2Gb D-die 8 4 Now
M393B1K73EB0 YH9 256M x 8 * 36 pcs 2Gb E-die Now
M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die 78 ball Now
1Gx 72 8GB 30mm
M393B1K70DH0 YF8/H9/K0 E(2Rx4) 512M x 4 * 36 pcs 2Gb D-die 8 2 FBGA Now
M393B1K70EB0 YH9/K0 512M x 4 * 36 pcs 2Gb E-die Now
M393B1G73BH0 YF8/H9/K0 B(2Rx8) 512M x 8 * 18 pcs 4Gb B-die 8 2 Now
M393B1G70BH0 YF8/H9/K0 C(1Rx4) 1G x 4 * 18 pcs 4Gb B-die 8 1 Now
1G
M393B2K70DM0 YF8/H9 AB(4Rx4) x 4 * 36 pcs 2Gb D-die 8 4 Now
DDP
M393B2G70BH0 YF8/H9/K0 1G x 4 * 36 pcs 4Gb B-die Now
78 ball
2Gx 72 16GB 30mm
M393B2G70CB0 YH9/K0 E(2Rx4) 1G x 4 * 36 pcs 4Gb C-die 8 2 FBGA Now
M393B2G70DB0 YH9/K0 1G x 4 * 36 pcs 4Gb D-die 1Q’13
M393B2G73BH0 YF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb B-die 8 4 Now
2G 78 ball
4Gx 72 32GB M393B4G70BM0 YF8/H9 AB(4Rx4) x 4 * 36 pcs 4Gb B-die 8 4 30mm Now
DDP FBGA
* NOTE : 1.35V product is 1.5V operatable.

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

4.9 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
128Mx 72 1GB M392B2873GB0 CF8/H9/K0/MA K(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 18.75mm Now
FBGA
M392B5673GB0 CF8/H9/K0/MA L(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Now
M392B5670GB0 CF8/H9/K0/MA M(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 78 ball Now
256Mx 72 2GB 18.75mm
M392B5773CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die 8 1 FBGA Now
K(1Rx8)
M392B5773DH0 CF8/H9/K0/MA 256M x 8 * 9 pcs 2Gb D-die Now
M392B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die Now
L(2Rx8) 8 2
M392B5273DH0 CF8/H9/K0/MA 256M x 8 * 18 pcs 2Gb D-die 78 ball Now
512Mx 72 4GB 18.75mm
M392B5270CH0 CF8/H9/K0 512M x 4 * 18 pcs 2Gb C-die FBGA Now
M(1Rx4) 8 1
M392B5270DH0 CF8/H9/K0/MA 512M x 4 * 18 pcs 2Gb D-die Now
512M
M392B1K73CM0 CF8/H9 x 8 * 18 pcs 2Gb C-die Now
DDP
V(4Rx8) 8 4
512M
M392B1K73DM0 CF8/H9 x 8 * 18 pcs 2Gb D-die Now
DDP
1G 78 ball
1Gx 72 8GB M392B1K70CM0 CF8/H9/K0 x 4 * 18 pcs 2Gb C-die 18.75mm Now
DDP FBGA
N(2Rx4)
1G 8 2
M392B1K70DM0 CF8/H9/K0/MA x 4 * 18 pcs 2Gb D-die Now
DDP
M392B1G73BH0 CF8/H9/K0/MA L(2Rx8) 512M x8 * 18 pcs 4Gb B-die Now
M392B1G70BH0 CF8/H9/K0/MA M(1Rx4) 1G x4 * 18 pcs 4Gb B-die 8 1 Now
2G
M392B2G70BM0 CF8/H9/K0/MA N(2Rx4) x4 * 18 pcs 4Gb B-die 8 2 Now
DDP 78 ball
2Gx 72 16GB 18.75mm
1G FBGA
M392B2G73BM0 CF8/H9 V(4Rx8) x8 * 18 pcs 4Gb B-die 8 4 Now
DDP
4G * 78 ball
4Gx 72 32GB M392B4G70BE0 CF8/H9 U(4Rx4) x4 18 pcs 4Gb B-die 8 4 18.75mm Now
QDP FBGA

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

4.10 240Pin DDR3 VLP Registered DIMM (1.35V Product)
240Pin DDR3 VLP Registered DIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
78 ball
128Mx 72 1GB M392B2873GB0 YF8/H9/K0 K(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 18.75mm Now
FBGA
M392B5673GB0 YF8/H9/K0 L(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Now
M392B5670GB0 YF8/H9/K0 M(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 78 ball Now
256Mx 72 2GB 18.75mm
M392B5773CH0 YF8/H9 512M x 4 * 9 pcs 2Gb C-die FBGA Now
K(1Rx8) 8 1
M392B5773DH0 YF8/H9/K0 512M x 4 * 9 pcs 2Gb D-die Now
M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die Now
L(2Rx8) 8 2
M392B5273DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die 78 ball Now
512Mx 72 4GB 18.75mm
M392B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die FBGA Now
M(1Rx4) 8 1
M392B5270DH0 YF8/H9/K0 512M x 4 * 18 pcs 2Gb D-die Now
512M
M392B1K73CM0 YF8/H9 x 8 * 18 pcs 2Gb C-die Now
DDP
V(4Rx8) 8 4
512M
M392B1K73DM0 YF8/H9 x 8 * 18 pcs 2Gb D-die Now
DDP
1G 78 ball
1Gx 72 8GB M392B1K70CM0 YF8/H9 x 4 * 18 pcs 2Gb C-die 18.75mm Now
DDP FBGA
N(2Rx4) 8 2
1G
M392B1K70DM0 YF8/H9/K0 x 4 * 18 pcs 2Gb D-die Now
DDP
M392B1G73BH0 YF8/H9/K0 L(2Rx8) 512M x 8 * 18 pcs 4Gb B-die 8 2 Now
M392B1G70BH0 YF8/H9/K0 M(1Rx4) 1G x 4 * 18 pcs 4Gb B-die 8 1 Now
2G
M392B2G70BM0 YF8/H9/K0 N(2Rx4) x4 * 18 pcs 4Gb B-die 8 2 Now
DDP 78 ball
2Gx 72 16GB 18.75mm
1G FBGA
M392B2G73BM0 YF8/H9 V(4Rx8) x8 * 18 pcs 4Gb B-die 8 4 Now
DDP
4G 78 ball
4Gx 72 32GB M392B4G70BE0 YF8/H9 U(4Rx4) x4 * 18 pcs 4Gb B-die 8 4 18.75mm Now
QDP FBGA
* NOTE : 1.35V product is 1.5V operatable.

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

4.11 240Pin DDR3 LRDIMM (1.5V Product)
240Pin DDR3 LDIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
2G
M386B4G70BM0 CMA x 4 * 36 pcs 4Gb B-die Now
DDP 78 ball
4G x 72 32GB C(4Rx4) 8 4 30.35mm
2G FBGA
M386B4G70DM0 CMA x 4 * 36 pcs 4Gb D-die 2Q’13 1)
DDP
4G 78 ball
8G x 72 64GB M386B8G70BO0 CK0 E(8Rx4) x 4 * 36 pcs 4Gb B-die 8 8 30.35mm Now
QDP FBGA
* NOTE
1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page.

4.12 240Pin DDR3 LRDIMM (1.35V Product)

240Pin DDR3 LDIMM
Comp. Internal
Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. NOTE
Version Banks
1G 78 ball
2G x 72 16GB M386B2G70DM0 YH9/K0 x 4 * 36 pcs 2Gb D-die 8 4 30.35mm Now
DDP FBGA
2G
M386B4G70BM0 YH9/K0 C(4Rx4) x 4 * 36 pcs 4Gb B-die Now
DDP 78 ball
4G x 72 32GB 8 4 30.35mm 1)
2G FBGA
M386B4G70DM0 YH9/K0 x 4 * 36 pcs 4Gb D-die 2Q’13
DDP
4G 78 ball
8G x 72 64GB M386B8G70BO0 YF8/H9 E(8Rx4) x 4 * 36 pcs 4Gb B-die 8 8 30.35mm Now
QDP FBGA
* NOTE
1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page.

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

5. RDIMM RCD Information
5.1 RCD Identification in JEDEC Description in Module Label

5.2 Label Example

4GB 2Rx8 PC3 - 12800R - 11 - 11 - B1 - P2

Made in Korea M393B5270DH0-CK0 1102

5.3 RCD Information

- Example

JEDEC Description
PKG RCD Vendor RCD Version(Rev.)
(Example - 4GB 2Rx8 PC3(L)1 - 12800R - 11 - 11 - B1 - XX)

1Gb F-die IDT HLB(B0) D2

2Gb C-die
4Gb A-die Inphi GS04(1.5V)/LV-GS02(1.35V) P1

1Gb G-die IDT A1(evergreen) D3

2Gb D-die
4Gb B-die
Inphi UV-GS02 P2
2Gb E-die

2Gb E-die IDT B1 D4

4Gb C-die
4Gb D-die Inphi XV-GS02 P3

* NOTE
1) PC3L is used for 1.35V
2) RCD information is subject to change.

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

6. LRDIMM Memory Buffer Information
6.1 Label Example

32GB 4Rx4 PC3L - 10600L - 09 - 11 - C0

Made in Korea M386B4G70BM0-YH90 1102

6.2 Memory Buffer Information

- Example

Voltage Vendor Revision Module P/N JEDEC Description On Label

Inphi iMB02-GS02A M386B4G70BM0-YH901 32GB 4Rx4 PC3L-10600L-09-11-C0

1.35V
Montage MB C0 M386B4G70BM0-YH921 32GB 4Rx4 PC3L-10600L-09-11-C0

Inphi iMB02-GS02A M386B4G70BM0-CMA31 32GB 4Rx4 PC3-14900L-13-11-C0

1.5V IDT A2 M386B4G70BM0-CMA11 32GB 4Rx4 PC3-14900L-13-11-C0

Montage MB C1 M386B4G70BM0-CMA41 32GB 4Rx4 PC3-14900L-13-11-C0

* NOTE
1) The 16th digit refers memory buffer vendor and revision.
0: Inphi iMB02-GS02A
1: IDT A2
2: Montage MB C0
3: Inphi iMB02-GS02B
4: Montage MB C1
2) Memory buffer information is subject to change.

- 13 -
 Dec. 2012

Product Guide DDR3 SDRAM Memory

7. Package Dimension
78Ball FBGA for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)

7.50 0.10

0.10MAX
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 7.50 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B)
4.80
D
E 0.80 x12 = 9.60

0.50  0.05
0.80

11.00  0.10

11.00  0.10
F
G
H
J
K
0.80

L
M
N
0.35 0.05
(0.95)
78 - 0.45 Solder ball
MOLDING AREA
(Post Reflow 0.05  0.05) 1.10 0.10
0.2 M A B (1.90)

BOTTOM VIEW TOP VIEW

78Ball FBGA Flip chip for 2Gb E-die (x4/x8)

7.50 0.10

0.10MAX
A
0.80 x 8 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 7.50 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B)
4.80

D
E
0.80 x12 = 9.60
0.80

11.00  0.10

11.00  0.10

F
G
H
J
K
0.80

L
M
N
0.37 0.05
(0.30)
78 - 0.48 Solder ball
(0.60) MOLDING AREA
(Post Reflow 0.50  0.05)
1.10 0.10
0.2 M A B

BOTTOM VIEW TOP VIEW

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

78Ball DDP for 2Gb C-die (x4/x8)

8.00 0.10

0.10MAX
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 8.00 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B)

4.80
D
E

0.80 x12 = 9.60

11.00  0.10
0.80

11.00  0.10
F
G
H
J
K
0.80

L
M
N
0.35 0.05
78 - 0.45 Solder ball
(Post Reflow 0.50  0.05)
1.40 0.10
0.2 M A B
BOTTOM VIEW TOP VIEW

78Ball DDP for 2Gb D-die (x4/x8)

7.50 0.10

0.10MAX
A
0.80 x 8 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 7.50 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B)
4.80

D
E
0.80 x12 = 9.60
0.80

11.00  0.10

11.00  0.10

F
G
H
J
K
0.80

L
M
N
0.35 0.05
78 - 0.45 Solder ball
(Post Reflow 0.50  0.05)
1.10 0.10
0.2 M A B

BOTTOM VIEW TOP VIEW

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

78Ball DDP for 4Gb A-die (x4/x8)

10.50  0.10
A

0.10MAX
0.80 x 8 = 6.40
3.20 #A1 INDEX MARK
(Datum A)
0.80 1.60
#A1 10.50 0.10
B
9 8 7 6 5 4 3 2 1

A
B
C
(Datum B)

4.80
D

0.80 x12 = 9.60

E
0.80

12.00 0.10

12.00 0.10
F
G
H
J
K
0.80

L
M
N

78 - 0.45 0.05Solder ball 0.35 0.05

(Post Reflow 0.50  0.05)
0.2 M A B 1.10 0.10

BOTTOM VIEW TOP VIEW

78Ball DDP for 4Gb B-die (x4/x8)

11.00  0.10
A

0.10MAX
0.80 x 8 = 6.40
3.20 #A1 INDEX MARK
(Datum A)
0.80 1.60
#A1 11.00 0.10
B
9 8 7 6 5 4 3 2 1

A
B
C
(Datum B)
4.80

D
0.80 x12 = 9.60

E
0.80

11.00 0.10

11.00 0.10

F
G
H
J
K
0.80

L
M
N

78 - 0.45 0.05 Solder ball 0.35 0.05

(Post Reflow 0.50  0.05)
0.2 M A B 1.10 0.10

BOTTOM VIEW TOP VIEW

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

78Ball FBGA for 4Gb B-die (x4/x8)

10.00  0.10
A

0.10MAX
0.80 x 8 = 6.40
3.20 #A1 INDEX MARK
(Datum A)
0.80 1.60 #A1 10.00 0.10
B
9 8 7 6 5 4 3 2 1
A
B
C
(Datum B)

4.80
D

0.80 x12 = 9.60

E
0.80

11.00 0.10

11.00 0.10
F
G
H
J
K
0.80

L
M
N

78 - 0.45 Solder ball 0.35 0.05

(0.95) MOLDING AREA
(Post Reflow 0.50  0.05)
1.10 0.10
0.2 M A B (1.90)

BOTTOM VIEW TOP VIEW

78Ball FBGA for 4Gb C-die (x4/x8)

8.50  0.10
A

0.10MAX
0.80 x 8 = 6.40
3.20 #A1 INDEX MARK
(Datum A)
0.80 1.60 8.50 0.10
#A1
B
9 8 7 6 5 4 3 2 1
A
B
C
(Datum B)
4.80

D
0.80 x12 = 9.60

E
0.80

11.00 0.10

11.00 0.10

F
G
H
A A’
J
K
0.80

L
M
N
(0.30)
78 - 0.48 Solder ball 0.37 0.05
(Post Reflow 0.50  0.05) (0.60) MOLDING AREA

0.20 M A B 1.10 0.10

BOTTOM VIEW TOP VIEW

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

78Ball FBGA for 4Gb D-die (x4/x8)
7.50  0.10
A

0.10MAX
0.80 x 8 = 6.40
3.20 #A1 INDEX MARK
(Datum A)
0.80 1.60 #A1 7.50 0.10
B
9 8 7 6 5 4 3 2 1
A
B
C
(Datum B)

4.80
D

0.80 x12 = 9.60

E
0.80

11.00 0.10

11.00 0.10
F
G
H
A A’
J
K
0.80

L
M
N
(0.30) 0.37 0.05
78 - 0.48 Solder ball
(Post Reflow 0.50  0.05) (0.60) MOLDING AREA
1.10 0.10
0.20 M A B

BOTTOM VIEW TOP VIEW

78Ball FBGA Flip chip for 1Gb G-die (x4/x8)

7.50 0.10

0.10MAX
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A) 0.80 1.60 3.20
#A1 7.50 0.10
9 8 7 6 5 4 3 2 1 B

A
B
C
(Datum B)
4.80

D
E
0.80 x12 = 9.60

0.50  0.05
0.80

11.00  0.10

11.00  0.10

F
G
H
J
K
0.80

L
M
N
0.35 0.05
78 - 0.48 Solder ball (0.30)
MOLDING AREA
(Post Reflow 0.05  0.05) 1.10 0.10
0.2 M A B (0.60)

Bottom Top

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

8. Module Dimension

x64/x72 240pin DDR3 SDRAM Unbuffered DIMM

Units : Millimeters

133.35 ± 0.15

(4X)3.00 ± 0.1
128.95

30.00 ± 0.15
N/A
9.50

(for x64)
SPD
ECC

17.30
(for x72)

2.30
(2)
2.50

54.675

A B
47.00 71.00 Max 4.0

N/A
(for x64)

ECC
(for x72)

1.270 ± 0.10
2.50 ± 0.20

5.00 2x 2.10 ± 0.15

0.80 ± 0.05

3.80 0.2 ± 0.15

1.50±0.10
1.00
2.50

Detail A Detail B

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM ECC VLP UDIMM Units : Millimeters

133.35 ± 0.15

128.95 Max 4.0

18.75 ± 0.15

SPD/TS

54.675

1.0 max

A B D
47.00 71.00 1.27 ± 0.10

2x 2.10 ± 0.15
2.50 ± 0.20

5.00
0.80 ± 0.05

3.80
0.2 ± 0.15

1.50±0.10
1.00
2.50 (2)xR0.8

Detail A Detail B Detail C & D

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

x64 204pin DDR3 SDRAM Unbuffered SODIMM Units : Millimeters

67.60 ± 0.13

63.60 Max 3.8

30.00 ± 0.13
SPD
20.00

6
1.00 ± 0.10
24.80

A B

21.00 39.00
2X 1.80
0.10 M C A B
(OPTIONAL HOLES)

2X 4.00 ± 0.10
0.10 M C A B

0.60

0.45 ± 0.03
1.65

4.00 ± 0.10 2.55

1.00 ± 0.10 0.25 MAX

Detail A Detail B

- 21 -
 Dec. 2012

Product Guide DDR3 SDRAM Memory

Units : Millimeters
x72 204 pin DDR3 SDRAM ECC Unbuffered SODIMM

67.60 ± 0.13

63.60 Max 3.8

30.00 ± 0.13
20.00

6
1.00 ± 0.10
24.80

A B

21.00 39.00
2X 1.80
0.10 M C A B
SPD

(OPTIONAL HOLES)

2X 4.00 ± 0.10
0.10 M C A B

0.60

0.45 ± 0.03
1.65

4.00 ± 0.10 2.55

1.00 ± 0.10 0.25 MAX

Detail A Detail B

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM Registered DIMM

Units : Millimeters
133.35 ± 0.15

(2X)3.00
128.95 Max 4.0
9.76 10.9 18.92 32.40 18.93 9.74

30.00 ± 0.15
9.50

Register

2.50

17.30
2.30
1.0 max
54.675
A B
1.27 ± 0.10
47.00 71.00
2.50 ± 0.20

5.00
0.80 ± 0.05

3.80 0.2 ± 0.15

10.9 0.4

2.50
50

1.50±0.10 1.00
0.
R

Detail A Detail B Detail C

2x 2.10 ± 0.15
Register

Address, Command and Control lines

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

Registered DIMM Heat Spreader Design

1. FRONT PART
Outside
133.15 ± 0.2
0.65 ± 0.2

1+0/ -0.3
130.45 ± 0.15
9.26 29.77
11.9 31.4 R0.2

23.6 ± 0.15
25.6 ± 0.15

25.6 ± 0.15
R
0.
1
4.65± 0.12

0.15
1.3 1

127 ± 0.12

2
2
2.6 ± 0.2

1.3

2 ± 0.1
Inside
0.4

Green Line : TIM Attatch Line

Reg. pedestal line

7.45

80.78
119.29
128.5

2. BACK PART
Outside

Inside
Green Line : TIM Attatch Line

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

3. CLIP PART
39.3 ± 0.2
Upper Bending
Tilting Gap
29.77
0.1 ~ 0.3
44.4

6.3± 0.12
7.3 ± 0.1

5
1.
R

0.5

4. DDR3 RDIMM ASS’Y View

Reference thickness total (Maximum) : 7.55mm (With Clip thickness)

133.15
1.27

3.77

39.3 ± 0.2
7.3 ± 0.1

19 ± 0.12
19 ± 0.12

D
Clip open size
text mark ’D’ 2.6~3.8
punch press_stamp

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM VLP Registered DIMM

Units : Millimeters

133.35 ± 0.15

128.95
C Max 4.0
9.76 20.92 32.40 20.93 9.74
18.75 ± 0.15

Register

54.675
A B
1.0 max
47.00 71.00
12.60

1.27 ± 0.10

SPD/TS

18.10
2.50 ± 0.20

5.00
0.80 ± 0.05
9.9

0.6
3.80
0.2 ± 0.15

1.50±0.10
50
0.

1.00
R

2.50

Detail A Detail B Detail C

Register
VTT

VTT
VTT
VTT

SPD/TS

Address, Command and Control lines

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

VLP Registered DIMM Heat Spreader Design (DDP)

1. FRONT PART

Outside

130.45

67

8.69 20.82 35.98 20.82 8.69

0.4

14.3
Driver
IC(DP:0.18mm)

Inside

Driver
IC(DP:0.18mm)

2. BACK PART

Outside

Driver
IC(DP:0.18mm)

Inside

Driver
IC(DP:0.18mm)

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

3. CLIP PART

7.2 ± 0.1 35.82 7.2 ± 0.1

9.16 ± 0.12

9.16 ± 0.12
9.16

Clip open size

3.0~4.3 0.1

SIDE-L FRONT SIDE-R

4. ASS’Y VIEW
Reference thickness total (Maximum) : 7.55 (With Clip thickness)
7.55

TIM Thickness 0.25

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

VLP Registered DIMM Heat Spreader Design (QDP)

1. FRONT PART

Outside

127 ± 0.12
51.97
36.56
21.15
9

13.6±0.15
9.07 9.07 9.07 9.07

Caution
"Hot surfoce"
11.6 51.95

Inside

2. BACK PART

Outside

Inside

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

3. CLIP PART

7.40 ± 0.1 36.82 ± 0.12 7.40 ± 0.1

9.16 ± 0.12
9.16

9.16
QU
Clip open size
3.85 ± 0.65 0.40 ± 0.05

SIDE-L FRONT SIDE-R

4. ASS’Y VIEW
Reference thickness total (Maximum) : 8 (With Clip thickness)
8

TIM Thickness 0.25

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM LRDIMM Units : Millimeters

133.35 ± 0.15
C

(2X)3.00
Max 4.8

30.35 ± 0.15
9.50

2.50

17.30
2.30
54.675 1.27

A B
47.00 71.00
2.50 ± 0.20

5.00
0.80 ± 0.05
9.9

0.6
3.80
0.2 ± 0.15

1.50±0.10
50
0.

1.00
R

2.50

Detail A Detail B Detail C

VTT

VTT
VTT

VTT
VTT

VTT

MB
VTT

VTT

Address, Command and Control lines

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 Dec. 2012

Product Guide DDR3 SDRAM Memory

x72 244pin DDR3 SDRAM Mini DIMM Units : Millimeters

82.00 ± 0.15

78.00 ± 0.1

SPD

17.90 ± 0.15
6.00

2.55± 0.20
33.60 38.40 3.20
1.80 ± 0.075
75.60

A B
Max 4.0

1.270 ± 0.10
2.55 ± 0.20

3.60 2x 2.00 ± 0.15

0.45 ± 0.03
2.30 1.30

3.80±0.10 0.25 ± 0.15

1.00±0.10
0.60

Detail A Detail B

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