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Single-layer substrate integrated waveguide

directional couplers
Z.C. Hao, W. Hong, J.X. Chen, H.X. Zhou and K. Wu

Abstract: Novel single-layer planar directional couplers based on substrate integrated waveguide
(SIW) technology are presented. These proposed couplers are totally realised in single-layer
dielectric substrate with metallicvias, and fabricated using a standard PCB process. Prototypes of
 3 dB,  6 dB and  10 dB SIW directional couplers are designed, fabricated and measured. It is
concluded from the simulated and measured results that these couplers show good performances
with broad operation bandwidth, low insertion loss, low return loss and high isolation etc. The
characteristics of compact size and planar form make such SIW directional couplers can be easily
integrated in microwave and millimetre-wave planar circuits.

1 Introduction technique is a promising technique for designing microwave


and millimetre-wave components and circuits.
Rectangular waveguide components have been widely used In this paper, two types of novel single-layer SIW
in microwave and millimetre-wave communication system, directional couplers are presented. The parameters which
radar and other equipment with their salient features such determine the coupler’s performance have been studied and
as low insertion loss, high quality factor (Q-factor) and high prototypes for  3 dB,  6 dB and  10 dB millimetre-
power capability etc. However, owing to their bulky size, wave SIW directional couplers with different topologies are
strict requirement of manufacturing precision and non- designed. These SIW couplers are fabricated on a single-
planar structure, it is difficult to be integrated in modern layer substrate using a standard print-circuit-board (PCB)
microwave and millimetre-wave integrated circuits. Benefit- process and measured with vector network analyser (VNA).
ing from the properties of low profile, moderate insertion Simulated and measured results that show these couplers
loss, and low cost, etc., microstrip-like circuits are presently have good performances with broad operation bandwidth,
the main integration choice in microwave and millimetre- low insertion losses, low return losses and high isolations
wave circuits. Unfortunately, the printed circuit suffers from are provided.
significant trade-offs between costs, size and performance at
millimetre-wave frequency and it is sensitive to the outside 2 Design of SIW directional couplers
interference caused by radiation of other passive compo-
nents and active devices in the same substrate. Figure 1 shows the configurations for SIW directional
Recently, there is growing interest in a novel planar couplers with its geometric parameters. The SIW directional
circuit technique called substrate integrated waveguide coupler is realised by two SIWs with a common wall on
(SIW) as it shares many of the advantages with printed which an aperture is utilised to realise the coupling between
circuits such as low cost, small size etc. and being easily two SIWs which are mainly working with TE10-like modes.
integrated in millimetre-wave integrated circuits [1–33]. In Fig. 1, port 1 is the input port, port 2 is named as the
Additionally, since the SIW components are covered by through port, port 3 is the coupling port and port 4 is used
metal surfaces on both sides of the substrate, they takes the as an isolation port. The metallic vias which synthesised side
merits of low insertion loss, extremely low radiation loss, walls of two SIWs have diameters of Dvia and the spaces
and insensitive to outside interference etc. A similar between them are Svp. Cvia and Cvp are the diameter and
technique is also known as photoimageable thick films [2, space of vias which synthesised the SIW coupler’s common
25], low-temperature co-fired ceramics (LTCC) waveguide wall, respectively. As shown in Fig. 1a, the aperture width
[26–30], post-wall waveguide [31, 32], and laminated Waperture and metallic-via diameter Cvia are adopted to
waveguide [33]. Many passive components and active control the coupling between port 1 and port 3. In Fig. 1b, a
devices based on SIW technology, such as antennas metallic-via with diameter IDvia is placed at the centre of
[8–12], filters [2, 12–18], diplexers [19], power dividers [20], the coupling aperture to decrease the coupling of port 3.
SIW-microstrip transitions [21], oscillators [22], millimetre- Then couplers with weak-coupling can be designed.
wave SIW ferrite phase shifter [23] and couplers [24] have
been reported recently. These studies show that the SIW 2.1 Design of SIW
It should be designed carefully to ensure SIWs of the
r The Institution of Engineering and Technology 2006 coupler support TE10-like mode exclusively in the operating
IEE Proceedings online no. 20050171 frequency range. The SIW is made of numerous metallicvias
doi:10.1049/ip-map:20050171 in a substrate, and it requires huge computer resource to
Paper first received 17th July 2005 and in revised form 3rd April 2006 simulate the SIW components with electromagnetic full-
The authors are with the State Key Lab. of Millimetre Waves, Dept. of Radio wave algorithms. Since the E-field distribution in a SIW is
Engineering, Southeast University, Nanjing, 210096, People’s Republic of China like that in a traditional rectangular waveguide, we can
E-mail: zchao@emfield.org initially design SIW components using an equivalent
426 IEE Proc.-Microw. Antennas Propag., Vol. 153, No. 5, October 2006
Fig. 2 Simulated S31 with different Waperture

Fig. 1 Configuration for the proposed strong and weak-coupling


SIW couplers with geometric parameters
a Proposed strong-coupling SIW coupler
b Proposed weak-coupling SIW coupler

rectangular waveguide model to reduce design complexity. Fig. 3 Simulated S31 with different Cvia
In the millimetre-wave frequency band, the geometric
parameters for SIWs in directional coupler can be chosen common wall is 0.4 mm, the relative permittivity and
using an empirical formula [5, 6] thickness of substrate are 2.2 and 0.25 mm, respectively. It
can be seen from Fig. 2 that the coupling of port 3 decreases
Dvia2 Dvia2 with Waperture becoming small.
Weff ¼ WSIW  1:08  þ 0:1  ð1Þ
Svp WSIW The thickness of the common wall which equals to Cvia is
also helpful to control the coupling between port 1 and port
where W eff is the width of the corresponding traditional 3. We studied the thickness from 0.4 mm to 0.8 mm and the
rectangular waveguide, and the empirical formula is very couplings are shown in Fig. 3 where the coupling aperture
accurate when (Svp/Dvia) is smaller than 3 and (Dvia/ Waperture is chosen as 6.2 mm and the width of
WSIW) is smaller than 0.2 [5, 6]. corresponding rectangular waveguide is 5.0 mm. It can be
SIW components can be integrated with other SIW seen from Fig. 3 that the coupling between port 1 and port
components such as SIW filters and SIW antennas without 3 will decrease as Cvia increasing. Additionally, the coupling
any transition. However, in order to measure these is insensitive to Cvia compared with Waperture. Then in the
components or integrate them with microstrip circuits or design of a SIW directional coupler, the Cvia can be
active IC chips, a SIW–microstrip transition is necessary, adopted to slightly tune the coupling of port 3.
and it can be designed by matching impedances between In above simulation, it can be found that when the
SIW and 50 O microstrip [19, 21]. Naturally, this will coupling between port 1 and port 3 becomes more weakly,
increase the insert loss of SIW components. the return loss and isolation response will become worse,
and then it is difficult to design a weak-coupling coupler
2.2 Parameter studies for SIW directional using the configuration shown in Fig. 1a. To overcome this
couplers difficulty, an extra metallicvia can be added to improve the
We studied the parameters such as Waperture, Cvia and return loss as shown in Fig. 1b. As an example,  8.5 dB
IDvia with an equivalent rectangular waveguide model to couplers are designed using configurations in Figs. 1a and
initially design the proposed coupler. As shown in Fig. 2, we 1b, respectively. Parameters for these couplers are listed in
can effectively control the output coupling at port 3 by Table 1 and simulated results are shown in Fig. 4. It can be
adjusting Waperture, here the width of the corresponding clearly seen from Fig. 4 that although S21 and S31 are
rectangular waveguide is 5.0 mm, the thickness of the similar for both kinds of couplers, the coupler which takes

IEE Proc.-Microw. Antennas Propag., Vol. 153, No. 5, October 2006 427
Table 1: Geometric parameters for  8.5 dB directional the same working-frequency ranges; can take the same
couplers values, we used different widths for those SIWs in our
applications. This is mainly caused by following reasons: 1.
Parameters for With tuning Without tuning Owing to limitations of the fabrication process in which
corresponding metallicvia metallicvia diameters of metallicvias should be changed with 0.1 mm or
rectangular waveguide
integral-multiple of 0.1 mm, diameters Cvia for metalvias in
coupler
the coupler’s common wall cannot be arbitrarily chosen.
Width of rectangular 5.0 5.0 And then the widths of SIWs are tuned to get good
waveguide (mm) performances to ensure SIW couplers can be accurately
Width of coupling 6.2 5.0
fabricated using traditional printed circuits board (PCB)
aperture (mm) process; 2. Because diameters of metallicvias which
synthesise the two side walls of SIW have different values
Thickness of common 0.4 0.3
wall (mm)
( for example Cvia is different with Dvia in our design),
performances of SIW are different to that of corresponding
Diameter of 0.3
rectangular waveguide. Then SIW’s widths should be
tuning metallicvia (mm)
changed a little.
Height of rectangular 0.25 0.25 A  3 dB SIW directional coupler with the configuration
waveguide (mm)
shown in Fig. 1a is firstly designed and its geometric
parameters are listed in Table 2, where Wtaper and Ltaper
are the width and length of SIW-microstrip transition,
respectively. Simulated results are presented in Fig. 5
which shows this directional coupler can be operated from
24.0 GHz to 27.0 GHz with return loss less than  12.5 dB.
Both of the magnitudes of S21 and S31 are approximately
 4.0 dB, and the isolation of port 4 is less than  15 dB
within the operating frequency range. In simulation, four
SIW-microstrip transitions are introduced, which will cause
the extra insertion loss to the coupler.
As mentioned above, by narrowing the coupling
aperture, the coupling between SIWs will be decreased. A
 6 dB millimetre-wave SIW directional coupler is designed
using the configuration shown in Fig. 1a and the geometric
parameters are given in Table 3. Simulated results are
shown in Fig. 6, where both return loss and isolation are
less than  19 dB within the frequency range from

Table 2: Geometric parameters for the  3 dB SIW direc-


Fig. 4 Simulated S-parameters for  8.5 dB SIW couplers tional coupler

Dvia (mm) 0.3 Wapeture (mm) 9.9


the configuration shown Fig. 1a has bad return loss and Svp (mm) 0.6 Wtaper (mm) 1.25
isolation response, and these responses can be greatly Cvia (mm) 0.4 Ltaper (mm) 2.75
improved by using configuration shown in Fig. 1b. Cvp (mm) 0.8 h (mm) 0.25
From the above investigations, we can conclude that the
WSIW (mm) 5.9 W 50 (mm) 0.72
coupling between port 1 and port 3 is mainly affected by
Waperture, and Cvia can be used to slightly adjust the
coupling of port 3. To design SIW directional couplers with
weak coupling, an extra metallicvia may be placed at the
centre of the coupling aperture to decrease the coupling
between port 1 and port 3 with improved return loss and
isolation response. Then by properly choosing the initial
parameters such as Waperture, Cvia and IDvia with an
equivalent rectangular waveguide model, geometric para-
meters for SIW directional couplers can be obtained by a
simple optimising process with full-wave electromagnetic
(EM) solvers.

2.3 Design examples


In this paper, SIW directional couplers are designed on
Rogers RT 5880 substrate with er ¼ 2.2 and thickness of
0.25 mm, and the coupling aperture and the diameter of the
extra metallicvia are optimised by commercially available
software, High Frequency Structure Simulator (HFSS).
Widths of SIWs, which determine the SIW components’
working frequency ranges, are initially obtained from (1).
Although SIWs’ widths in different couplers, which have Fig. 5 Simulated results for the  3 dB SIW directional coupler

428 IEE Proc.-Microw. Antennas Propag., Vol. 153, No. 5, October 2006
Table 3: Geometric parameters for the  6 dB SIW direc- design couplers with weak coupling. As an example, a
tional coupler  10 dB SIW directional coupler is designed by optimising
the diameters of the extra metallicvia, the size of the
Dvia (mm) 0.3 Wapeture (mm) 6.4 coupling aperture and the diameter IDvia. Its geometric
Svp (mm) 0.6 Wtaper (mm) 1.25 parameters are listed in Table 4, and simulated results are
Cvia (mm) 0.4 Ltaper (mm) 2.75 shown in Fig. 7. It can be seen from Fig. 7 that the return
Cvp (mm) 0.8 h (mm) 0.25 loss and isolation are lower than  20 dB from 23.0 GHz to
27.0 GHz. The output of port 3 is  10.15 dB with a ripple
WSIW (mm) 5.1 W 50 (mm) 0.72
of 0.2 dB in the operating frequency band.

3 Experiment results

The prototypes of  3 dB,  6 dB and  10 dB SIW


directional couplers are fabricated on a single-layer
substrate using a traditional PCB process in which the
minimum radius for the metallicvia is 0.15 mm. Using this
fabricating process, metallicvias in SIW couplers can be
located at the design position with a high accuracy of
0.01 mm and SIW-microstrip transitions can be realised
with an error of 0.05 mm,. Photographs for  3 dB and
 10 dB directional couplers are presented in Figs. 8a
and 8b, respectively.
We measured these directional couplers from 22.0 GHz
to 28.0 GHz with an Agilent 8363B vector network analyser
(VNA). In the measurement processes, two measured ports
are connected to the VNA with two 2.4 mm connectors,
respectively. And other ports are terminated with 50 O

Fig. 6 Simulated results for the  6 dB SIW directional coupler

Table 4: Geometric parameters for the  10 dB SIW direc-


tional coupler

Dvia (mm) 0.4 Wapeture (mm) 6.9


Svp (mm) 0.8 Wtaper (mm) 1.25
Cvia (mm) 0.7 Ltaper (mm) 2.75
Cvp (mm) 1.1 h (mm) 0.25
WSIW (mm) 5.45 W50 (mm) 0.72
IDvia (mm) 0.3

Fig. 7 Simulated results for the  10 dB SIW directional coupler

23.0 GHz to 28.0 GHz, S31 varies from  5.8 dB at


23.0 GHz to  6.4 dB at 28.0 GHz and the magnitude of Fig. 8 Photograph of the  3 dB and  10 dB SIW directional
S21 is approximately  3.0 dB. couplers
By employing an extra metallicvia at the centre of the a  3 dB coupler
aperture, the configuration shown in Fig. 1b can be used to b  10 dB coupler

IEE Proc.-Microw. Antennas Propag., Vol. 153, No. 5, October 2006 429
matching loads. Generally, those 2.4 mm connectors will
cause leakage losses owing to model transform between
coax and microstrip, and it can be previously calibrated. To
estimate insert losses caused by SIW-microstrip transitions,
5.0 cm and 8.0 cm SIWs with two SIW-microstrip transi-
tions are firstly designed and measured, respectively. By
comparing these measured results, insert losses of the SIW
and SIW-microstrip transition can be deduced, respectively.
Figure 9 shows the insert losses for two SIW-microstrip
transitions. The whole insert loss caused by those transitions
is about  0.6 dB with a ripple of 0.2 dB over the whole
working frequency band.
The measured results for SIW couplers are presented in
Figs. 10–13, respectively. Figure 10 shows magnitude
responses for the S-parameters of the  3 dB SIW
directional coupler whose geometric parameters are listed
in Table 2. The magnitudes of S21 and S31 are nearly same,
which are  4.2 dB at 23.0 GHz and  3.9 dB at 27.0 GHz, Fig. 11 Measured results for the phase difference between the S21
respectively. As mentioned above, the increase of insertion and S31 of  3 dB SIW directional coupler
loss is caused by the SIW-microstrip transitions and
dielectric loss.
Since the phase difference between S21 and S31 is
important in  3 dB coupler’s application, we have also
measured it and the measured results are shown in Fig. 11.
It can be seen from Fig. 11 that the phase difference
between S21 and S31 varies within ten degrees, and it is
nearly 90 degrees from 23.0 GHz to 27.0 GHz.

Fig. 12 Measured results of the  6 dB SIW directional coupler

Fig. 9 Insertion losses for two SIW-microstrip transitions

Fig. 13 Measured results of the  10 dB SIW directional coupler

The measured results of the  6 dB SIW directional


coupler are presented in Fig. 12, both return loss
and isolation response are lower than  17.0 dB from
 23.0 GHz to 28.0 GHz. The magnitude of S31 is
approximately  5.9 dB at 23.0 GHz,  6.1 dB at
Fig. 10 Measured results for the  3 dB SIW directional coupler 25.5 GHz and  5.8 dB at 28.0 GHz, respectively.
430 IEE Proc.-Microw. Antennas Propag., Vol. 153, No. 5, October 2006
The measured results of the  10 dB SIW directional 10 Yan, L., Hong, W., and Wu, K.: ‘Substrate integrated waveguide
coupler are shown in Fig. 13. As shown in the photograph, monopulse antenna’. In IEEE Int. Symp. on Antenna and Propaga-
tion, USA, 2005
this directional coupler takes the configuration shown 11 Hao, Z.C., Hong, W., Chen, J.X., Chen, X.P., and Wu, K.: ‘A novel
in Fig. 1b. The isolation response is lower than  18.0 dB feeding technique for antipodal linearly tapered slot antenna array’.
from 22.0 GHz to 28.0 GHz, and S11 is better than In IEEE MTT-S 2005 Int. Microwave Symp., Long Beach, California,
USA, 12–17 June 2005
 15.0 dB in whole operating frequency band. The 12 Stephens, D., Yong, P.R., and Robertson, I.D.: ‘W-band
magnitude of S31 is approximately  10.0 dB with a ripple substrate integrated waveguide slot antenna’, Electron. Lett., 2005,
41, pp. 165–167
of 0.5 dB, and S21 varies from  2.4 dB at 22.0 GHz to 13 Zhang, Y.L., Hong, W., Wu, K., Chen, J.X., and Tang, H.J.:
 1.4 dB at 27.0 GHz. The measured results show the ‘Novel substrate integrated waveguide cavity filter with defected
relative bandwidth of the 10 dB directional coupler is ground structure’, IEEE Trans. Microw. Theory Tech., 2005, 53, (4),
pp. 1280–1287
approximately 24%. 14 Hao, Z.C., Hong, W., Chen, X.P., Chen, J.X., Wu, K., and Cui, T.J.:
‘Multilayered substrate integrated waveguide (MSIW) elliptic filter’,
4 Conclusions IEEE Microw. Wirel. Compon. Lett., 2005, 15, (2), pp. 95–97
15 Hao, Z.-C., Hong, W., Chen, J.X., Chen, X.P., and Wu, K.: ‘Compact
super-wide band-pass substrate integrated waveguide (SIW) filters’,
Two types of single-layer planar millimetre-wave SIW IEEE Trans. Microw. Theory Tech., 2005, (accepted for publication in)
directional couplers are presented in this paper. Prototypes 16 Chen, X.P., and Hong, W.: ‘Planar asymmetric dual-mode filters
based on substrate integrated waveguide (SIW)’, IEEE MTT-S Int.
of these directional couplers with different topologies are Microw. Symp. Dig., 2005
designed, fabricated using a PCB process and measured 17 Hao, Z.C., Hong, W., Li, H., Zhang, H., and Wu, K.: ‘A broadband
substrate integrated waveguide (SIW) filter’. IEEE Int. Symp. on
with a VNA. Measured results show these types of Antennas and Propagation, Washington, DC, USA, 3–8 July 2005
directional couplers have good performance in broad 18 Deslandes, D., and Wu, K.: ‘Single-substrate integration technique of
operating bandwidths. These proposed directional couplers planar circuits and waveguide filters’, IEEE Trans. Microw. Theory
Tech, 2003, 51, (2), pp. 593–596
are totally realised by metallicvias in single-layer substrate, 19 Hao, Z.C., Hong, W., Chen, J.X., Chen, X.P., and Wu, K.: ‘Planar
and take the advantages of compact size, low-weight and diplexer for microwave integrated circuits’, IEE Proc. Microw.
low-cost. It is a favourable choice for designing microwave Antennas Propag., 2005, 152, (6), pp. 455–459
20 Hao, Z.C., Hong, W., and Wu, K.: ‘Multi-way broadband
and millimetre-wave planar circuits. substrate integrated waveguide (SIW) power divider’. In IEEE Int.
Symp. on Antennas and Propagation, Washington, DC, USA, 3–8
5 Acknowledgment July 2005
21 Deslandes, D., and Wu, K.: ‘Integrated microstrip and rectangular
waveguide in planar form’, IEEE Microw. Wirel. Compon. Lett., 2001,
The authors are grateful to H.-J. Tang for his collaborations 11, pp. 68–70
during the measurement of SIW couplers. 22 Cassivi, Y., and Wu, K.: ‘Low cost microwave oscillator using
substrate integrated waveguide cavity’, IEEE Microw. Wirel. Compon.
Lett., 2003, 13, (2), pp. 48–50
6 References 23 Che, W., Yung, E.K.-N., and Wu, K.: ‘Millimeter-wave substrate
integrated waveguide ferrite phase shifter for wireless communication
1 Zhang, Y.L., Hong, W., Xu, F., Wu, K., and Cui, T.J.: ‘Analysis application’. In Wireless Communication Technology, 2003, IEEE
of guided-wave problems in substrate integrated waveguides – Topical Conf., 15–17 Oct. 2003, pp. 320–324
numerical simulations and experimental results’. IEEE MTT-S 24 Cassivi, Y., Deslandes, D., and Wu, K.: ‘Substrate integrated
Int. Microw. Symp. Dig., Philadelphia, USA, June 2003, Vol. 3, waveguide directional couplers’. In ASIA-Pacific Conf. 2002, Kyoto,
pp. 2049–2052 Nov. 2002
2 Stephens, D., Young, P.R., and Robertson, I.D.: ‘Millimeter-wave 25 Aftanasar, M.S., Young, P.R., Robertson, I.D., Minalgiene, J.,
substrate integrated waveguides and filters in photoimageable thick- and Lucyszyn, S.: ‘Photoimageable thick-film millimeter-wave
film technology’, IEEE Trans. Microw. Theory Tech., 2005, 53, (12), metal-pipe rectangular waveguides’, Electron. Lett., 2001, 37, (18),
pp. 3832–3838 pp. 1122–1123
3 Li, H., Hong, W., Cui, T.J., Wu, K., Zhang, Y.L., and Yan, L.: 26 Piloto, A., Leahy, K., Flanick, B., and Zaki, K.A.: ‘Waveguide filters
‘Propagation characteristics of substrate integrated waveguide based having a layered dielectric structures’, U.S. Patent 5 382 931, 17 Jan.
on LTCC’. IEEE MTT-S Int. Microw. Symp. Dig., Philadelphia, 1995
USA, June 2003, Vol. 3, pp. 2045–2048 27 Stevens, D., and Gipprich, J.: ‘Microwave characterization and
4 Wu, K., Deslandes, D., and Cassivi, Y.: ‘The substrate integrated modelling of multilayered cofired ceramic waveguides’. In Proc. Int.
circuits – a new concept for high-frequency electronics and opto- Microelectron. Symp., San Diego, CA, Nov. 1998, pp. 195–200
eletronics’. Telecommunications in Modern Satellite, Cable and 28 Gipprich, J., Stevens, D., Hageman, M., Piloto, A., Zaki, K.A., and
Broadcasting Service, TELSIKS 2003, 6th Int. Conf., 1–3 October Rong, Y.: ‘Embedded waveguide filters for microwave and wireless
2003, Vol. 1, pp. P-III–P-X applications using cofired ceramic technologies’. Proc. In Int.
5 Xu, F., Zhang, Y., Hong, W., Wu, K., and Cui, T.J.: ‘Finite-difference Microelectron. Symp., San Diego, CA, Nov. 1998, pp. 23–26
frequency-domain algorithm for modeling guided-wave properties of 29 Rong, Y., Zaki, K.A., Hageman, M., Stevens, D., and Gipprich, J.:
substrate integrated waveguide’, IEEE Trans. Microw. Theory Tech., ‘Low temperature cofires ceramic (LTCC) ridge waveguide bandpass
2003, 51, (11), pp. 2221–2227 chip filter’, IEEE Trans. Microw. Theory Tech., 1999, 47, pp. 2317–2324
6 Yan, L., and Hong, W.: ‘Investigations on the propagation 30 Rong, Y., Zaki, A., Gipprich, J., Hageman, M., and Stevens, D.:
characteristics of the substrate integrated waveguide based on the ‘LTCC wide-band ridge-waveguide bandpass filters’, IEEE Trans.
method of lines’, IEE Proc. Microw. Antennas Propag., 2005, 152, (1), Microw. Theory Tech., 1999, 47, pp. 1836–1840
pp. 35–42 31 Yamamoto, S.-I., Hikono, N., Hirokawa, J., and Ando, M.: ‘A 120-
7 Xu, F., and Wu, K.: ‘Guided-wave and leakage characteristics of degree beamwidth post-wall waveguide slot array with a three-way
substrate integrated waveguide’, IEEE Trans. Microw. Theory Tech., power divider on a single-layer dielectric substrate’. Wireless Com-
2005, 53, (1), pp. 66–73 munication Technology, 2003, IEEE Topical Conf., 15–17 Oct. 2003,
8 Yan, L., Hong, W., Hua, G., Chen, J.X., Wu, K., and Cui, T.J.: pp. 354–355
‘Simulation and experiment on SIW slot array antennas’, IEEE 32 Bray, J.R., and Roy, L.: ‘Resonant frequencies of post-wall
Microw. Wirel. Compon. Lett., 2004, 14, pp. 446–448 waveguide cavities’, IEE Proc. Microw. Antennas Propag., 2003, 150,
9 Lu, H.-C., and Chu, T.-H.: ‘Equivalent circuit of radiating (5), pp. 365–368
longitudinal slots in substrate integrated waveguide’. In IEEE 33 Uchimura, H., Takenoshita, T., and Fujii, M.: ‘Development of a
Antennas and Propagation Society Symp. 2004, 20–25 June 2004, laminated waveguide’, IEEE Trans. Microw. Theory Tech., 1998, 46,
Vol. 3, pp. 2341–2344 (12), pp. 2438–2443

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