USB Port Protection

Superior Solutions with Bourns® Multifuse® Devices

and ChipGuard® ESD Suppressors
BACKGROUND
MF-NSMF
Speed and convenience are keywords that drive competition in any market. The
electronics industry is a perfect example of how the customer’s demands for speed and
MF-MSMF convenience influence a product beginning at the basic integrated circuit level. When
the Universal Serial Bus (USB) interface was introduced over a decade ago, its impact
on consumer and industrial markets alike was grossly underestimated. Several standard
MF-PSMF revisions and billions of devices later, USB is as common to computing as a keyboard.
In spite of the convenience and speed offered by the USB interface standard, there are
fundamental design-level considerations that need to be made to ensure functionality
CG0402 and reliability of the hardware. As integrated circuits shrink in size and as data transfer
rates increase, it is important to note that each time the interface is connected or
CG0603
disconnected, the port is subject to both overvoltage and overcurrent transients.
Additional threats include hot plugging, short circuiting, ESD events, faulty equipment,
and user error. Combining this variety of potential threats with the increased fragile
nature of small integrated circuits, it becomes more vital than ever to provide robust
CG0805
protection for USB ports.

Bourns, Inc. offers one of the industry’s most comprehensive lines of overcurrent and
CDSOD323
overvoltage protection for USB ports, specifically with its Multifuse® PPTC Resettable
Fuse and ChipGuard® ESD Suppressor products. The Bourns® Multifuse® line consists
of a family of lead free Polymer Positive Temperature Coefficient (PPTC) devices
that protect circuits from potentially destructive overcurrent conditions. Bourns®
CDSOT23
ChipGuard® technology is a Transient Voltage Suppression (TVS)-based technology,
which protects circuits from overvoltage, specifically electrostatic discharge (ESD),
electrical fast transient (EFT), and surge threats.
USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

USB Standards and Concerns for Protection

MF-NSMF
USB is a 4-wire interface with a pair of data lines, a single power line, and ground
which operates at 4.4 V – 5.25 VDC. It is required by the USB interface standard that a
MF-MSMF resettable fuse is used for overcurrent protection, which is only essential on the power
line. The power line and both data lines utilize overvoltage protection with reference to
ground, as illustrated below.
MF-PSMF

Vbus OC
CG0402
OV
D+
CG0603
USB
OV Controller
D-
CG0805
OV
GND
CDSOD323

Figure 1. Protected USB Interface

CDSOT23

The centerpiece of USB technology is the “plug and play” functionality that has
become an industry standard for computer peripherals and digital media. In fact,
USB ports are now used for charging and power transfer almost as much as for data
transfer. The USB interface standard has been updated several times to keep up with
the speed and power the end user has come to expect. From 48 Mbps in version
1.1 to 480 Mbps in version 2.0, another jump in speed will occur when version
3.0 provides 4.8 Gbps. Pending release at the time of this publication, USB 3.0 will
offer a significant increase in available current in addition to the higher data rate.
Some devices presently are operating at approximately 1 A, and this may increase
by as much as 50 % with USB 3.0. Along with the standards are general electrical
requirements for the USB interface to which designers must pay special attention for
any design.

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

USB Standards and Concerns for Protection (continued)

MF-NSMF
Overcurrent and overvoltage transients each introduce a different set of protection
concerns and thresholds which must be considered by the designer. Overcurrent
MF-MSMF protection must have a resistance no greater than 700 mOhms with a maximal voltage
drop of 350 mV. Low power ports operate below 100 mA, while high power ports have
a maximal operating current of 500 mA. According to UL60950, a 5 A trip must last
MF-PSMF less than 60 seconds. Overvoltage concerns focus largely on ESD protection, which
generally is based on the IEC Standard 61000-4-2 for the human body model (HBM).
The total line capacitance of a USB interface must be less than 10 pF, and the signal
CG0402
clamping voltage is at most 6 V.

CG0603 In any electronic design, the size of its components is a consideration. No single blow or
mechanical fuse can be used for overcurrent protection according to the USB standard.
The fuses must be resettable and typically come in a large 1812 package. However,
CG0805
Bourns has added 0805 solutions and the availability of a compact 0603 package will
provide even more flexibility to the designer. Overvoltage protection typically has used
the 0603 package size, though the 0402 has recently become available and is increasing
in popularity. It must be noted that the chosen package size for an assembly depends
CDSOD323
on multiple design criteria including board space and functional requirements such
as resistance and speed. For example, a smaller device tends to operate faster but
typically has a higher resistance. If lower resistance is necessary or more important than
CDSOT23
conserving board space, then designers can choose larger chip packages or alternate
components.

By combining the technology and capability of the Multifuse® and the ChipGuard®
devices, it is possible to choose the overcurrent and overvoltage portions independently
without sacrificing the integrity of the full solution. The selection that each Bourns®
product provides allows designers the utmost flexibility when considering the options
for any design. For instance, it is possible to use one PTC for several USB controllers or
one PTC per USB controller. This decision is made based on the resistance and current
in each load and the board space available. With the introduction of USB 3.0, increased
current requirements may lend themselves to dedicated PTCs. Similarly, overcurrent
protection can be combined in a single array chip or have a dedicated device per line.

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

Resettable Fuses for Overcurrent Protection

MF-NSMF
Resettable fuses exhibit a positive temperature coefficient effect when heated, as do many
materials, and are excellent for sensitive devices needing extra protection in a variety of
MF-MSMF applications. The entire cycle from normal operation through a fault and returning to
normal current levels is explained below and illustrated in figure 2.

MF-PSMF
Bourns® Multifuse® devices are manufactured from a mixture of polymer, carbon, and other
proprietary material, which is placed in a plaque or mold and then punched out of the
mold in the form of a conductive plastic. Non-conductive crystalline polymer with highly
CG0402
conductive carbon black particles are impregnated into a crystal lattice. The proximity of
carbon in this lattice allows for easy current flow through highly conductive carbon chains
CG0603 and multiple conductive paths under normal current conditions. The impedance in this
environment is as low as 3 mOhms to 8 Ohms.

CG0805 The transition from low to high resistance, referred to as tripping, generally occurs when the
current reaches twice the holding current. Tripping allows the resettable fuse to protect the
load. Resettable fuses generally have a trip time as quick as a fraction of a second depending
on how high the fault current is. What makes material in resettable fuses unique is the
CDSOD323
exponential rather than linear increase in resistance. Plastic heats at rate of I2R under fault
conditions, reaching the phase transformation temperature and changing the crystal lattice
structure to an amorphous structure. As conductive particles become isolated, the resistance
CDSOT23 of the material increases by two orders of magnitude. With few conductive paths available
the device is rendered incapable of conducting current. The carbon chains become non-
conductive and an open circuit with slight leakage current is created.

PTC is High
Fault Resistance
Current
PTC Resistance
Current

Normal Normal
Operating Operating
Current PTC Current
Resets
PTC
Trips

PTC is Low Trickle PTC is Low

Resistance Current Power Resistance
Cycled
Time
Figure 2. Current and Resistance vs Time

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

Resettable Fuses for Overcurrent Protection (continued)

MF-NSMF
Once current is removed from the device, the material can cool and return to its
original crystal lattice structure. The power must be cycled in order to reset the Bourns®
MF-MSMF Multifuse® device, generally for one second. If the power simply is left on after the
device has tripped, the PTC does not reset on its own. After an extended period in
tripped mode, the component continues to generate heat, causing a very high level
MF-PSMF
of resistance. Prolonged exposure to this temperature and resistance will render the
component ineffective even after cycling power. Note that the useful life of the Bourns®
Multifuse® product depends on the surge, duration, and current spike.
CG0402

A wide range of Bourns® Multifuse® parts are available for USB designs at a 6 V rating.
CG0603 Once the current and trip time requirements for a device are determined it is simple
to select the appropriate part. Due to the temperature variation supported by Bourns®
Multifuse® devices, it is important to choose a device with a greater current rating than
CG0805 the operating current of the load. For example a 900 mA load can use a 1.1 A PPTC
resettable fuse to account for temperature derating. The part number indicates the
current as a multiple of 100 such that -110 represents a 1.1 A part and -050 represents a
0.5 A part. Recommended parts for the USB interface are tabulated below.
CDSOD323

Table 1. Recommended Bourns®

CDSOT23
Multifuse® Parts for USB Ports

Part Number Size Ratings Port

MF-NSMF020-2 1206 6 V, 200 mA Low power
MF-MSMF020-2 1812 6 V, 200 mA Low power
MF-PSMF035X-2 0805 6 V, 350 mA Low power
MF-MSMF110-2 1812 6 V, 1.1 A High power
MF-PSMF110X-2 0805 6 V, 1.1 A High power

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

Overvoltage and Threats of ESD

MF-NSMF
Electrostatic Discharge (ESD) is the transfer of an electrical charge between two surfaces
of unequal potential. ESD is not harmful to humans, but it is dangerous to sensitive
MF-MSMF electronic components and is the primary cause of integrated circuit (IC) malfunctions.
An electronic device can be destroyed by ESD if the discharge bores through the layers
of the device and obliterates the reference design chip. A device can also be damaged
MF-PSMF
by ESD, which could result in a trace being nearly severed, thereby causing intermittent
operation. Alternatively, ESD can create an actual open circuit on this trace.

CG0402
By means of practical comparison, a person’s walking motion while wearing a pair of
jeans can generate up to 300 V of static electricity and while walking on carpet, can
CG0603 generate up to 10,000 V. ESD transients are modeled under several industry standards as
tabulated below.

CG0805
Table 2. Standards for ESD

CDSOD323 Standard Model C, pF R, Ohms

IEC 61000-4-2 Human Body Model 150 330
MIL STD 883 Human Body Model 100 1500
JEDEC A115 Machine Model 200 0
CDSOT23

In turn, different levels of IEC 61000-4-2 standards exist to which electronics are
designed. Currently defined through four levels, there is word of expanding the
standard to six levels. Level 2 is the minimal standard for consumer electronics. Bourns®
ChipGuard® ESD Suppressors are designed to currently meet the Level 4 standard.

Table 3. Levels of IEC 61000-4-2

IEC 61000-4-2 Contact Air Discharge Peak Contact Contact Current Contact Current
Standard Voltage (kV) Voltage (kV) Current (A) @ 30 ns (A) @ 60 ns (A)
Level 1 2 2 7.5 4 2
Level 2 4 4 15 8 4
Level 3 6 8 22.5 12 6
Level 4 8 15 30 16 8

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

ESD Protection Technology

MF-NSMF
Four basic types of suppression technology are available to protect against ESD events. The
polymer ESD suppressor uses a printed circuit board (PCB) manufacturing process and
MF-MSMF polymer space discharge. The breakdown of the inserted polymer between the electrodes
allows this device to work. A Multilevel Varistor (MLV) ESD suppressor uses a thick film
manufacturing process and works through the breakdown of the zinc oxide in the device.
MF-PSMF Unlike the MLV ESD suppressor, the Transient Voltage Suppressing Diode (TVSD) ESD
suppressor uses a thin film manufacturing process, and works through the breakdown of
the P/N junction, rather than that of zinc oxide. The air gap ESD suppressor also uses a
CG0402
thin film process. Its unique air gap discharge works through the breakdown of gas seeping
between the electrodes.
CG0603
Each process has traits which may make it more applicable for a specific design type;
general advantages and disadvantages are compared below.
CG0805

Table 4. ESD Suppressor Technology Comparison

CDSOD323
Product Advantage
-Low leakage current
Polymer ESD Suppressor -Withstands high ESD pulse
CDSOT23 -Ultra-low breakdown voltage
MLV ESD Suppressor -Lower breakdown voltage
-Lower trigger voltage
TVSD ESD Suppressor -Lower clamping voltage
-Ultra-low capacitance
-High ESD pulse withstand
Air Gap ESD Suppressor
-Low leakage
-Lower clamping voltage
Disadvantage
-Device size is limited by PCB
manufacturing process (min. 0603)
-High trigger voltage
-High clamping voltage
-Higher leakage current
-Limited device capacitance (1.5 pF)
-Lower ESD pulse withstand in low
capacitance device
-High clamping voltage in low
capacitance device (~100 V)
-Higher leakage current
-Limited device capacitance (1.5 pF)
-Limited device size
-Higher trigger voltage

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

Bourns® ChipGuard® Devices Features and Benefits

MF-NSMF
Because TVS devices historically have had capacitance as high as 2000-6000 pF, the
Schottky diode was a more popular solution for ESD and overvoltage suppression than
MF-MSMF the TVS diode. With advances in technology and the continual ingenuity of Bourns, the
Bourns® ChipGuard® device combines competitive pricing with capacitance under 5 pF.
As a result, Bourns offers a TVS solution in the ChipGuard® ESD Suppressor which may
MF-PSMF
be more appealing than the Schottky option. Other features and benefits that the Bourns®
ChipGuard® device provides include enhanced ESD and EFT protection as well as surge
protection. The data transmission can be as quick as it is clean because the capacitance is
CG0402
too low to distort data even at high data rates.

CG0603 Bourns® ChipGuard® ESD Suppressors are offered in a variety of package types and
employ two technologies. Bourns® ChipGuard® devices use polymer technology in
surface mount 1206 and 0603 packages. This enables the device to cause voltage charges
CG0805 to jump across the device in a stepping stone fashion. The distance between the metal
within the component determines the speed of the device. Bidirectional protection is
provided by the polymer-based Bourns® ChipGuard® device, and the repeatability with
this technology is approximately 100 hits.
CDSOD323

Bourns® ChipGuard® surface mount 0603 and 0402 package sizes employ a unique air
gap discharge technology. This technology enables the device to distinctly control ESD
CDSOT23 and EFT. Compared to the 5 pF of its TVS counterparts, the capacitance of some air gap
Bourns® ChipGuard® devices is a mere 0.5 pF, leaving a full 9.5 pF for the designer to
meet the 10 pF maximal capacitance for the USB interface. The highest observed leakage
current of 5 nA is far less than the 1 mA typical of most TVS components. Air gap
discharge provides bidirectional protection and can withstand approximately 1000 hits.

Individual Bourns® ChipGuard® parts can be used or an array can protect four lines or
more in a single package.

Table 5. Bourns® ChipGuard® Parts

Part Number Size Capacitance Voltage

CG0603MLC-05LE 0603 0.5 pF 5V
CG0402MLC-05LG 0402 0.5 pF 5V
CDSOD323-T05C SOD323 3 pF 5V
CDSOT23-SR208 SOT23-6 5 pF +Vc/-Vc
CDSC706-0504F SC70-6 3 pF 5V

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

Protection Examples for Various USB Interfaces

MF-NSMF
To help match the most optimal protection solution from overvoltage and overcurrent
threats for a given type of USB interface, several examples are illustrated below.
MF-MSMF

MF-NSMF150-2

MF-PSMF Vbus
D+
USB
CG0402
USB Port CD143A-SR05 Controller
D-
CG0603 GND

CG0805
Figure 3. USB 1.1

CDSOD323

MF-NSMF150-2
Vbus
CDSOT23
D+
D- USB
CDSOD323-T05C
Controller
USB Port
OR
CG0603MLC-05LF
GND

Figure 4. USB 2.0 with Individual ChipGuard® Devices

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

Protection Examples for Various USB Interfaces

MF-NSMF
To help match the most optimal protection solution from overvoltage and overcurrent
threats for a given type of USB interface, several examples are illustrated below.
MF-MSMF

MF-NSMF150-2
MF-PSMF Vbus
D+
D- USB
CG0402 Controller
USB Port CDSOT23-SR208

CG0603
GND

CG0805
Figure 5. USB 2.0 with ChipGuard® Array

CDSOD323

MF-PSMF075X USB Port

CDSOT23 Vbus Vbus
D+ D+
RT
D- D-
RT
Gnd
CDSC706-0504F
CT CT
USB
Controller
USB Port
CT CT Vbus
D+ D+
RT
D- D-
RT
Gnd Gnd

Figure 6. Single Multifuse® device with Multiple Ports

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USB Port Protection: Superior Solutions with Bourns® Multifuse® Devices and ChipGuard® ESD Suppressors

Conclusion
MF-NSMF Protection of USB interfaces can be made simple by choosing Bourns® Multifuse®
and ChipGuard® devices for overcurrent and overvoltage protection. Since the USB
MF-MSMF
standard operating voltage is always 5 V, the Bourns® Multifuse® device voltage rating
of 6 V provides a full 20 % margin over the USB standard’s required voltage for an
additional cushion of protection. Bourns has the capability to customize a Multifuse®
MF-PSMF device as well. Adjusting the mix ratio of ingredients within the composition or
changing the size of the punchout are two options for customizing a Multifuse®
device to the exact specifications of a designer. Details such as these ensure that the
CG0402 overcurrent portion of the protection solution will be ideal from the fundamental level
of design. Remaining up to date with the most stringent ESD requirements, the Bourns®
CG0603
ChipGuard® ESD Suppressor surpasses the level of overvoltage protection required
for USB electronics. The remarkably low capacitance of the device helps reduce data
distortion even in the Gbps range of transmission. As USB interface standards have
evolved and changed, Bourns continues its commitment to providing a comprehensive
CG0805
range of protection solutions that help designers speed development and reduce total
cost of ownership for end customers as well.

CDSOD323

CDSOT23

For more information on USB port protection

and other products from Bourns, please visit
www.bourns.com

COPYRIGHT© 2009 • BOURNS, INC. • e/K0921

“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.

Americas: Tel +1-951 781-5500 Europe: Tel +41-(0)41 768 55 55 Asia-Pacific: Tel +886-2 256 241 17
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