FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET

FDP18N50 / FDPF18N50 / FDPF18N50T

N-Channel UniFETTM MOSFET
500 V, 18 A, 265 mΩ
Features
• RDS(on) = 220 mΩ (Typ.) @ VGS = 10 V, ID = 9 A Description
• Low Gate Charge (Typ. 45 nC) UniFETTM MOSFET is ON Semiconductor’s high voltage
• Low Crss (Typ. 25 pF) MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
• 100% Avalanche Tested
provide better switching performance and higher avalanche
Applications energy strength. This device family is suitable for switching
power converter applications such as power factor correction
• LCD/LED/PDP TV (PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
• Lighting
• Uninterruptible Power Supply

G G
D G
S TO-220 D
S TO-220F

S
Absolute Maximum Ratings TC = 25°C unless otherwise noted.
FDPF18N50 /
Symbol Parameter FDP18N50 Unit
FDPF18N50T
VDSS Drain-Source Voltage 500 V
ID Drain Current - Continuous (TC = 25°C) 18 18 * A
- Continuous (TC = 100°C) 10.8 10.8 * A
IDM Drain Current - Pulsed (Note 1) 72 72 * A
VGSS Gate-Source voltage ±30 V
EAS Single Pulsed Avalanche Energy (Note 2) 945 mJ
IAR Avalanche Current (Note 1) 18 A
EAR Repetitive Avalanche Energy (Note 1) 23.5 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
PD Power Dissipation (TC = 25°C) 235 38.5 W
- Derate Above 25°C 1.88 0.3 W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
TL Maximum Lead Temperature for Soldering,
300 °C
1/8” from Case for 5 Seconds
* Drain current limited by maximum junction temperature

Thermal Characteristics
FDPF18N50 /
Symbol Parameter FDP18N50 Unit
FDPF18N50T
RθJC Thermal Resistance, Junction-to-Case, Max. 0.53 3.3 °C/W
RθJA Thermal Resistance, Junction-to-Ambient, Max. 62.5 62.5 °C/W

©2012 Semiconductor Components Industries, LLC. Publication Order Number:

November-2017, Rev 3 FDPF18N50T/D
 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
Package Marking and Ordering Information
Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity
FDP18N50 FDP18N50 TO-220 Tube N/A N/A 50 units
FDPF18N50 FDPF18N50 TO-220F Tube N/A N/A 50 units
FDPF18N50T FDPF18N50T TO-220F Tube N/A N/A 50 units

Electrical Characteristics TC = 25°C unless otherwise noted.

Symbol Parameter Conditions Min. Typ. Max Unit

Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 μA 500 -- -- V
ΔBVDSS Breakdown Voltage Temperature
ID = 250 μA, Referenced to 25°C -- 0.5 -- V/°C
/ ΔTJ Coefficient
IDSS Zero Gate Voltage Drain Current VDS = 500 V, VGS = 0 V -- -- 1 μA
VDS = 400 V, TC = 125°C -- -- 10 μA
IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 μA 3.0 -- 5.0 V
RDS(on) Static Drain-Source
VGS = 10 V, ID = 9 A -- 0.220 0.265 Ω
On-Resistance
gFS Forward Transconductance VDS = 40 V, ID = 9 A -- 25 -- S
Dynamic Characteristics
Ciss Input Capacitance VDS = 25 V, VGS = 0 V, -- 2200 2860 pF
f = 1 MHz
Coss Output Capacitance -- 330 430 pF
Crss Reverse Transfer Capacitance -- 25 40 pF
Switching Characteristics
td(on) Turn-On Delay Time VDD = 250 V, ID = 18 A, -- 55 120 ns
VGS = 10 V, RG = 25 Ω
tr Turn-On Rise Time -- 165 340 ns
td(off) Turn-Off Delay Time -- 95 200 ns
(Note 4)
tf Turn-Off Fall Time -- 90 190 ns
Qg Total Gate Charge VDS = 400 V, ID = 18 A, -- 45 60 nC
Qgs Gate-Source Charge VGS = 10 V -- 12.5 -- nC
(Note 4)
Qgd Gate-Drain Charge -- 19 -- nC
Drain-Source Diode Characteristics and Maximum Ratings
IS Maximum Continuous Drain-Source Diode Forward Current -- -- 18 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 72 A
VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 18 A -- -- 1.4 V
trr Reverse Recovery Time VGS = 0 V, IS = 18 A, -- 500 -- ns
dIF/dt =100 A/μs
Qrr Reverse Recovery Charge -- 5.4 -- μC

Notes:
1. Repetitive rating: pulse-width limited by maximum junction temperature.
2. L = 5.2 mH, IAS = 18 A, VDD = 50 V, RG = 25 Ω, starting TJ = 25°C.
3. ISD ≤ 18 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, starting TJ = 25°C.
4. Essentially independent of operating temperature typical characteristics.

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 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
Typical Performance Characteristics

Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics

2
10
VGS
2
10 Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
ID, Drain Current [A]

ID, Drain Current [A]

1 6.0 V
10 Bottom : 5.5 V

o
10
1
150 C

0 o
10 25 C
o
-55 C
* Notes :
* Notes :
1. 250μs Pulse Test
-1 1. VDS = 40V
10 o
2. TC = 25 C 2. 250μs Pulse Test
0
-1 0 1
10
10 10 10 2 4 6 8 10 12

VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V]

Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage

Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue

2
RDS(ON) [Ω], Drain-Source On-Resistance

0.6 10
IDR, Reverse Drain Current [A]

0.5
VGS = 10V

0.4
1
10

0.3
VGS = 20V
150oC
0.2 o * Notes :
25 C
1. VGS = 0V
o
* Note : TJ = 25 C 2. 250μs Pulse Test
0
0.1 10
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4

ID, Drain Current [A] VSD, Source-Drain voltage [V]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

5000
12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
4000 10 VDS = 100V
Coss
VGS, Gate-Source Voltage [V]

VDS = 250V
Capacitances [pF]

8 VDS = 400V
3000 Ciss

6
2000

4
* Note :
1. VGS = 0 V
1000 Crss 2. f = 1 MHz
2

* Note : ID = 18A
0 0
-1 0 1
10 10 10 0 10 20 30 40 50

VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]

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 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
Typical Performance Characteristics (Continued)

Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation

vs. Temperature vs. Temperature

1.2 3.0
Drain-Source Breakdown Voltage

2.5

Drain-Source On-Resistance
1.1
BVDSS, (Normalized)

RDS(ON), (Normalized)
2.0

1.0 1.5

1.0
0.9 * Notes :
1. VGS = 0 V
2. ID = 250μA * Notes :
0.5
1. VGS = 10 V
2. ID = 9 A
0.8
-100 -50 0 50 100 150 200 0.0
-100 -50 0 50 100 150 200
o
TJ, Junction Temperature [ C] o
TJ, Junction Temperature [ C]

Figure 9-1. Maximum Safe Operating Area Figure 9-2. Maximum Safe Operating Area
- FDP18N50 - FDPF18N50 / FDPF18N50T

2 2
10 10
10 μs
10 μs
100 μs
100 μs
ID, Drain Current [A]

ID, Drain Current [A]

1 1 ms 1
10 10 1 ms
10 ms
100 ms 10 ms
Operation in This Area DC Operation in This Area 100 ms
0 is Limited by R DS(on) 0 is Limited by R DS(on)
10 10 DC

-1 -1
10 * Notes : 10 * Notes :
o o
1. TC = 25 C 1. TC = 25 C
o o
2. TJ = 150 C 2. TJ = 150 C
3. Single Pulse 3. Single Pulse
-2 -2
10 10
0 1 2 0 1 2
10 10 10 10 10 10

VDS, Drain-Source Voltage [V] VDS, Drain-Source Voltage [V]

Figure 10. Maximum Drain Current vs. Case Temperature

20

15
ID, Drain Current [A]

10

0
25 50 75 100 125 150
o
TC, Case Temperature [ C]

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 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
Typical Performance Characteristics (Continued)

Figure 11-1. Transient Thermal Response Curve - FDP18N50

0
10

Response[ C/W]
Response o D = 0 .5

-1 0 .2
10

0 .1
Thermal

PDM
Thermal

0 .0 5
t1
0 .0 2 * N o te s :
t2
Z (t),(t),

o
0 .0 1 1 . Z θ J C ( t) = 0 .5 3 C /W M a x .
θJC

-2
10 2 . D u ty F a c to r , D = t 1 /t 2
ZθJC

s in g le p u ls e 3 . T J M - T C = P D M * Z θ J C ( t)

-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10

t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ]

Figure 11-2. Transient Thermal Response Curve - FDPF18N50 / FDPF18N50T

Thermal Response [oC/W]

D = 0 .5
Z (t), Thermal Response

0
10
0 .2
0 .1

0 .0 5
PDM
-1
10 0 .0 2 t1
0 .0 1
* N o te s :
t2
o
1 . Z θ J C ( t) = 3 .3 C /W M a x .
θJC
ZθJC(t),

2 . D u ty F a c to r , D = t 1 /t 2
-2 s in g le p u ls e 3 . T J M - T C = P D M * Z θ J C ( t)
10

-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10

t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ]

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 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
IG = const.

Figure 12. Gate Charge Test Circuit & Waveform

RL VDS
VDS 90%

VGS VDD
RG

10%
VGS
V
10V
GS
DUT
td(on) tr td(off)
tf
t on t off

Figure 13. Resistive Switching Test Circuit & Waveforms

VGS

Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms

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 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
DUT +

VDS

I SD
L

Driver
RG
Same Type
as DUT VDD

VGS • dv/dt controlled by RG

• ISD controlled by pulse period

Gate Pulse Width

VGS D = --------------------------
Gate Pulse Period 10V
( Driver )

IFM , Body Diode Forward Current

I SD
( DUT ) di/dt

IRM

Body Diode Reverse Current

VDS
( DUT ) Body Diode Recovery dv/dt

VSD VDD

Body Diode
Forward Voltage Drop

Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms

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 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
Mechanical Dimensions

Figure 16. TO220, Molded, 3-Lead, Jedec Variation AB

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any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to
verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and
conditions, specif-ically the warranty therein, which covers ON Semiconductor products.

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 FDP18N50 / FDPF18N50 / FDPF18N50T — N-Channel UniFETTM MOSFET
Mechanical Dimensions

Figure 17. TO220, Molded, 3-Lead, Full Pack, EIAJ SC91, Straight Lead
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in
any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to
verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and
conditions, specif-ically the warranty therein, which covers ON Semiconductor products.

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