Crimp Connector Inspection

& Quality Control

Bob Willis
Electronics Academy Webinar Presenter

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 FREE Electronics Academy Webinar Series 
The Electronics Academy Webinar Series takes an in‐depth look at the issues affecting
PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. Understand
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defects – improving quality and reducing costs

Learn expert tips to identify quality issues

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A convenient and quick way to update your skills

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Bob Willis

Bob Willis has been involved with the introduction and imple menta tion of lea d‐free process technology for the last seven years. He
received A SOLDERTE C/Tin Technology Global Lea d‐Free Award for his contribution to the industry, helping impleme ntation of the
technology. Bob has bee n a m onthly contributor to Globa l SMT magazine for the las t six years. He was responsible for co‐ordina tion and
introduction of the First series of hands‐on lead‐free training workshops in Europe for Cookson Electronics during 1999‐2001. T hese
events were run in France, Italy and the UK and involved lead‐free theory, hands‐on pas te printing, reflow, wave and hand soldering
exercises. Each non commercial event provide d the firs t opportunity for e nginee rs to get first hand e xpe rience in the use of lead‐free
production processes and m oney raised from the events was prese nted to loca l charity. More recently he co‐ordinate d the SMART
Group Lead‐Free Hands On Experience at Nepcon E lectronics 2003. This gave the opportunity for over 150 engineers to process four
diffe rent PCB solder finis hes, with two differe nt lead‐free pastes through convection and vapour phase reflow. He a lso organised Lea d‐
Free Experience 2, 3 + 4 in 2004‐2006.

He has also run tra ining workshops with research groups like ITTF, SINTEF, NPL & IVF in Europe. Bob has organise d and run three lea d‐
free production lines a t international exhibitions Productronica, Hanover Fair a nd Nepcon E lectronics in Germany and England to
provide an insight to the practical use of lead‐free s oldering on BGA Ball Grid Array, CSP Chip Scale Package, 0210 chip and through hole
intrusive reflow connectors. This res ulte d in many te chnical pape rs being publishe d in Germa ny, USA and the United Kingdom. Bob als o
define d the process and assiste d with the se t‐up and running of the first Simultaneous Double Side d Lea d‐Free Reflow process us ing
tin/silver/copper for reflow of through hole and surface mount products.
Bob als o had the pleasure of contributing a sma ll section to the first Lead‐Free Solde ring text book “E nvironment ‐ Friendly Ele ctronics:
Lead‐Free Technology” written by Je nnie Hwang in 2001. The section provided examples of the type of lead‐free defects companies may
experience in production. Further illus trations of lea d‐free joints have been featured in he re most rece nt publication “Impleme nting
Lead‐Free Ele ctronics” 2005. He has he lped produce bookle ts on x‐ray ins pection and lead‐free defects with DAGE Industries, Balve r Zinn
and SMART Group

Find out more at: Mr Willis led the SMART Group Lead‐Free Miss ion to Ja pan a nd with this team produced a re port a nd organised several conference
Bobwillis.co.uk presentations on the ir findings. The m ission was supported by the DTI and visite d ma ny com panies in Ja pan as well as presenting a
seminar in Tokyo at the British Em bassy to over 60 technologists and senior ma nagers of ma ny of Japans leading produce rs. Bob was
bob@bobwillis.co.uk responsible for the Lead‐Free Assembly & Solde ring "CookBook" CD‐ROM conce pt in 1999, the world’s first inte ractive training resource.
He implemented the concept and produced the inte ractive CD in partne rship with the National Physical Laboratory (NPL), drawing on
the ma ny resources available in the industry including valuable work from NPL a nd the DTI. This incorporated many inte rviews with
leading engineers involved with lead‐free research and process introduction; the CD‐ROM is now in its 3rd edition.
 Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a
specialist for companies implementing Surface Mount Technology Mr Willis provid es train ing and consultancy in most areas of electronic manufacture.
He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companie s and prio r to
that he was Senior Process Control Engineer with Marconi Communication Syste ms, where he had worked since his apprenticeship. Following his time
with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy
division.

As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating
materials; this also involved obtain ing company approval on a wide range of Marconi's processes and products including printed circuit board
manufacture. Durin g the period with Marconi, experie nce was gained in methods and equip ment for environmental testing of components, prin ted
boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of
surface mounted assembly, both at production and quality level and during that time has been in volved in training staff and other engineers in many
aspects of modern production.

Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of
electronics and lecturin g on ele ctronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best
technical paper durin g their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for
Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsib le for trainin g courses run
by the PC IF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition
organisers World Wide and is known for being an entertain ing presenter and the only presenter to use unique process video clips during his workshops
to demonstrate each poin t made. Bob has written two book which are free to downlo ad on line, Design & Assembly with Pin In Hole Intrusive Reflow
& Package On Package Design, Assembly and Inspection

Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President
and currently hold s the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute
Find out more at: Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently
Bobwillis.co.uk writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Asse mbly the US magazine. He also is responsible for writing each of
bob@bobwillis.co.uk the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the
SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordin ator of the LEADOUT
Project for SMART Group. LEADOU T was one of the largest EU funded projects, currently he is coordin ating European projects TestPEP, uBGA and
ChipCheck

In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago

Electronics Academy Webinar Series
Printed Circuit Board Inspection & Quality Control
2.30pm GMT Wednesday 12th October

Inspection of Conductive Adhesive Joints
2.30pm GMT Thursday 10th November

Future webinars may cover

Bare PCB inspection
Solder paste and stencil inspection
Crimp connector and wire inspection
Component inspection and recognition
Microsection inspection
Inspection of conductive adhesive joints
Inspection of underfill and staked components
Destructive solder joint assessment and inspection

Register on line at http://www.visioneng.com/electronics‐academy‐webinar‐series
 Crimping Inspection & Quality Control Webinar

Topics covered:

Introduction to crimping
Cable types and stripping
Stripping tools
Establishing strip lengths
Crimp types
Compatibility of crimp terminations and wires
Crimping tool operation

Standards & Text Books

IPC/WHMA-A-620
 International and National Standards
UL 486A/486B www.ul.com
USCAR 21 www.uscar.org
IPC/WHMA-A-620 www.ipc.org
SAE AS7928 www.sae.org
MOD 59-71
NASA Std 8739
Mil C 22520
BS7609 & BS7727

What is a Crimp Connection

A crimp connection is a semi gas tight joint formed by compression between
a single or multi stranded cable and a specifically designed crimp
termination. All strands in a multi stranded wire are deformed to create a
low resistance connection which may also form a cold weld.

Crimp terminations have been successfully used in commercial and military

applications as far back as the 1940s. Surface finish depends on mating
surfaces but is most commonly tin, nickel/gold or gold on copper

Provided the correct wire preparation, termination type, tooling and setting
are maintained the crimp has proven to be a very reliable connection.

Can be unreliable if the correct procedures are not followed!!!!!

 What is a Crimp Connection

What is a Crimp Connection

Insulation barrel Wire barrel

Wire barrel
Insulation barrel

Inspection hole

Wire barrel
The crimp barrel surface topography can be seen on the surface of the wire strands, right
image, under high magnification SEM (Scanning Electron Microscope) analysis. This
illustrates the compression forces present on the surface of the stranded wires

What is a Crimp Connection

Cu – Copper
Zn - Zinc
Ag - Silver

Surface analysis using SEM shows metal being transferred between surfaces during
compression of the wire and the crimp barrel surfaces
 Crimping Process Requirements

Wire
Crimp Terminations
Calibrated Crimping Tool
Manual (retaining ratchet)
Semi/fully Automatic (powered)
Crimping Procedures
Trained production staff

Crimping Process
Crimping Process

Crimping Process
Crimping Process

Crimping Process
Crimping Process

Crimping Process
 Satisfactory Crimp Terminations

Microsections of the wire barrel showing the outer wall of the crimp contact and the copper wire strands

Satisfactory Crimp Terminations

Microsections of the wire barrel showing the outer wall of the crimp contact and the copper wire strands
 Satisfactory Crimp Terminations

Microsections of the wire barrel showing the outer wall of the crimp contact and the copper wire strands

Example Crimp Terminations

Single copper wire strand under crimped Satisfactory single copper wire strand crimped

Microsections of the wire barrel showing the outer wall of the crimp contact and the single copper wire strand. The retention
of force of the wire would be less on the first example, the voltage drop across the joint may not be seen initially
 Crimp Termination Inspection Guide

Electronic Production magazine1988

Unacceptable Crimp Terminations

Incorrect wire being used in the crimp

 Unacceptable Crimp Terminations

Incorrect wire being used in the crimp

Unacceptable Crimp Terminations

Incorrect crimp tool or setting used. Using undersize wire may have also been the issue
 Unacceptable Crimp Terminations

Incorrect wire size being used in the crimp

Unacceptable Crimp Terminations Using X-Ray

 Unacceptable Crimp Terminations
Defects caused by poor design
Incorrect crimp tool settings
Incorrect wire size
Damaged wire strands
Damaged crimp tool
Crimping a contact twice

Untrained production staff

Crimping Process Control

Evaluation of crimping applications
Minimise the number of crimp types used
Assembly Instructions
Calibration of tooling
Certification of operators (Selected applications)
Process control methods
Crimp impression marks
Crimp heights
Crimp pull testing
Resistance measurements
 Crimping Process Control

Crimping Process Control

Crimp Height
 Crimp Height Measurement

AMP Corporation

PCB Mechanical Inspection

Calibrated steel pins are used for measurement of crimp tool sets. The crimp
tool and die are fully compressed and the go and no go pin size as specified
by the supplier are inserted in the opening. These pins are also used in PCB
manufacture for finished hole size measurement

The pin set is very accurate and expensive do not crimp on to the pins
 Crimp Height Measurement

Please make sure any solder wire is removed from the surface of the crimp die

Crimping Process Control

Measurement of the pull strength of a particular wire, crimp and crimp tool setting combination are tested
manually or semi automatically
 Crimping Process Control

Measurement of the pull strength of a particular wire, crimp and crimp tool setting combination are tested
manually or semi automatically. Most testing systems will interface with PC software, the example is from
Mecmesin

Voltage Drop Test

Test often specified by the MOD

 Voltage Drop Test

Measurement is conducted between the wire and the crimped barrel after any form
of environmental testing procedure
It can also be conducted from the wire to the interconnecting crimp for the total change in
resistance, in this case it is not just an assessment of the crimping performance

Voltage Drop Test Results Example

Wire Barrel Wire Size (AWG) Test Current Max. Voltage Drop (mV)

12 12 23 3.0
14 17 3.5
16 16 13 3.5
18 9.0 4.0
20 7.5 4.0
20 20 7.5 4.0
22 5.0 4.0
24 3.0 4.0
22 22 5.0 4.0
24 3.0 4.0
26 2.0 4.0
24 24 3.0 4.0
 Voltage Drop Test

Tensile Strength Curve

Voltage Drop Curve – Initial

Voltage Drop Curve – after use

Crimping Process Control

Always state failure mode:

Broken wire
Wire break in crimp
Wire pulled out:

Typical form for operator/process approval

 Wire Preparation

Insulation and wire strip length

Always allow for re-termination
Damage to insulation
PTFE (Polytetraflouroethylene)
Damage to conductors
Broken or missing strands

Wire Preparation

? mm
Wire Preparation

Wire Preparation
Wire Preparation

Wire Preparation
 Wire Preparation

Wire Preparation
The contact/terminal conductor range is usually specified in AWG
(American Wire Gauge) or by the cross sectional area in square
millimetres (mm 2).

SWG (Standard Wire Gauge)

All crimp types have a maximum and minimum crossectional area

capability. Too small a wire size there will be under crimping, too
large an area cracking of the connector can occur
 Wire Preparation
SWG gauge No. Diameter Inches Diameter mm Imperial Standard American
Wire Number
10 0.128 3.251 Wire Gauge Wire Gauge
gauge ins. dia. ins. dia.
11 0.116 2.946
9 0.144 0.1144
12 0.104 2.642
10 0.128 0.1019
13 0.092 2.337
11 0.116 0.0907
14 0.08 2.032
12 0.104 0.0808
15 0.072 1.8288 13 0.092 0.072
16 0.064 1.6256 14 0.08 0.0641
17 0.056 1.4224 15 0.072 0.0571
18 0.048 1.2192 16 0.064 0.0508
19 0.04 1.016 17 0.056 0.0453
20 0.036 0.9144 18 0.048 0.0403
21 0.032 0.8128 19 0.04 0.0359
22 0.028 0.7112 20 0.036 0.032
23 0.024 0.6096 21 0.032 0.0285
24 0.022 0.5588 22 0.028 0.0253
25 0.02 0.508 23 0.024 0.0226
26 0.018 0.4572 24 0.022 0.0201
25 0.02 0.0179
27 0.0164 0.4166
26 0.018 0.0159
28 0.0148 0.3759
27 0.0164 0.0142
29 0.0136 0.3454
28 0.0148 0.0126
30 0.0124 0.315
29 0.0136 0.0113
30 0.0124 0.01

Wire Preparation
 Wire Preparation/Stripping

Crimping Process

Hold insulation to support terminations

Compress wires to form a gas tight joint
Provide high strength connection
Repeatable termination process
Crimping Tools

Crimping Tools
Crimp Terminal Types

Crimp Terminal Types

Crimp Terminal Types

Crimp Terminal Types

Crimp Terminal Types

Crimp Terminal Types

Crimped Terminations

Crimped Terminations
Crimped Terminations

Crimped Terminations
Crimped Terminations

Crimped Terminations
Crimped Terminations

Crimped Terminations
Crimped Terminations

Crimped Terminations
Crimped Terminations

Crimped Terminations
 Crimped Terminations

Poor Crimped Terminations

 Poor Crimped Terminations

Poor wire preparation, cut

Wire outside of crimp barrel:
and re-strip the cable

Bent or distorted crimp

termination

Poor Crimped Terminations

? No wire visible at the end of

the barrel before crimping:

Maximum wire visible at the

end of the crimp barrel:
 Poor Crimped Terminations

Limited wire visible at the end

of the crimp barrel: No wire visible of solder joint
in the inspection window:

No insulation visible at the

end of the barrel:

Co-Axial/Shielded Wire Preparation

Insulation, braid and wire strip length
Damage to insulation
Damage to braid
Broken or missing wire strands
Co-Axial/Shielded Wire Preparation

Co-Axial/Shielded Wire Preparation

 Coaxial Centre Pin Connection

From IPC/WHMA-A-620

Coaxial Ferrule Crimp

From IPC/WHMA-A-620
 Do you have any questions ?

Bobwillis.co.uk

Crimping Process Control

Inspection

The process of crimping; terminals to wire(s) or braid is semiautomatic, and provided the process
procedures are properly carried out with tools which are in good adjustment and condition, acceptable
joints will be produced

Inspection will be in 5 phases

Calibration of tools
Certification of tools
Certification of operator
Process Control
Final Inspection
 Crimping Process Control
Calibration of tools

The tool will be inspected for loose, bent, misaligned, or broken parts. Any one of these is considered a
defect

The tool in the closed position shall conform to GO/NO-GO gauges, the sizes are given by the supplier

The tool shall be used for crimping 2 connectors on suitable lengths of wire and these crimps shall then
be measured and the dimensions recorded. They shall conform to the manufacturers figures

The crimps shall be visually examined for correctness of form. They shall be regular and free from burrs,
cracks or flash

Samples must be subjected to a tensile test. A record of test results shall be kept by the Inspector

Crimping Process Control

A tool which passes all the above tests shall be certified as suitable for use.

A tool which fails on one or more of the above tests shall be withheld from production until
repair/adjustment has been carried out. After correction a full complement of tests must be satisfactorily
completed before the tool can be certified as suitable for use.

Certification of tools

Each new tool when received into the Company shall be given a serial number and have a history card
opened for it. Each new tool will be calibrated and certified before being issued for use in production.

Tools being used in production will be re-calibrated and re-certified at intervals of not more than one
month. Each hand tool will carry in its box a log card giving the date on which re-certification is required
or alternatively the last date on which certification took place. Each machine tool will have a similar log
card attached to it.
 Crimping Process Control
Certification of operator

This shall be at the discretion of the Senior Inspector. However all multi termination connectors like coaxial
parts with inner solder or crimp connections and outer braid and ferrules do require certification

Process control

It is the responsibility of Inspection to see that the crimping process is being carried out in accordance with
this Workshop Practice. This supervision will be carried out by visiting at irregular intervals the operators
carrying out the process. the rate at which these visits are made will depend on the skill and experience of
the operator. In any case at least one visit each shift will be made to each operator

The inspector will particularly note that the tool in use has a valid certificate and check also that the tool is
not obviously damaged. The tool/die set/locator combination being used must be that one suitable for the
terminal in use, the terminal and wire must be those specified in the schedule

Crimping Process Control

Check that the wire ends are being stripped in accordance with instructions and verify that
strands are not being nicked in the stripping operation. The stripped end must not be given any
additional twist, it is only necessary to lightly dress the cut end to remove any distortion of the
lay due to stripping

The finished crimped terminal should have a regular appearance, it should not be bent or
otherwise distorted. The conductor must be correctly positioned i.e. the terminal must have
been located correctly in the tool. The end of the conductor must be visible at the end of the
conductor crimp unless the design precludes this view