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100323 Low Power Hex Bus Driver

July 1992

100323
Low Power Hex Bus Driver
General Description
The 100323 is a monolithic device containing six bus drivers nation supply is b2.0V and thus present a high impedance
capable of driving terminated lines with terminations as low to the data bus.
as 25X. To reduce crosstalk, each output has its own re-
spective ground connection. Transition times were designed
to be longer than on other F100K devices. The driver itself Features
performs the positive logic AND of a data input (D1 – D6) and Y 50% power reduction of the 100123
the OR of two select inputs (E and either DE1, DE2, or DE3). Y 2000V ESD protection
Enabling of data is possible in multiples of two, i.e., 2, 4 or Y b 4.2V to b 5.7V operating range
all 6 paths. All inputs have 50 kX pull-down resistors. Y Drives 25X load
The output voltage LOW level is designed to be more nega-
tive than normal ECL outputs (cut off state). This allows an
emitter-follower output transistor to turn off when the termi-

Logic Symbol
Pin Names Description
D1 –D6 Data Inputs
DE1 –DE3 Dual Enable Inputs
E Common Enable Input
O1 –O6 Data Outputs

TL/F/9877 – 7

Connection Diagrams
24-Pin DIP 24-Pin Quad Cerpak 28-Pin PCC

TL/F/9877 – 4

TL/F/9877 – 2
TL/F/9877 – 3

C1995 National Semiconductor Corporation TL/F/9877 RRD-B30M115/Printed in U. S. A.


Logic Diagram

TL/F/9877 – 1

Truth Table
E DEn Dn Dn a 1 On On a 1
L L X X Cutoff Cutoff
X H L L Cutoff Cutoff
X H L H Cutoff H
X H H L H Cutoff
X H H H H H
H X L L Cutoff Cutoff
H X L H Cutoff H
H X H L H Cutoff
H X H H H H

H e High
Cutoff e Lower-than-LOW state
L e Low
X e Don’t Care

2
Absolute Maximum Ratings (Note 1) Recommended Operating
If Military/Aerospace specified devices are required, Conditions
please contact the National Semiconductor Sales
Case Temperature
Office/Distributors for availability and specifications.
Commercial 0§ C to a 85§ C
Storage Temperature b 65§ C to a 150§ C Military b 55§ C to a 125§ C
Maximum Junction Temperature Supply Voltage (VEE) b 5.7V to b 4.2V
Ceramic a 175§ C
Plastic a 150§ C
VEE Pin Potential to Ground Pin b 7.0V to a 0.5V
Input Voltage (DC) VEE to a 0.5V
Output Current (DC Output High) b 50 mA
ESD t 2000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: ESD testing conforms to MIL-STD-883, Method 3015.

Commercial Version
DC Electrical Characteristics
VEE e b4.2V to b5.7V, VCC e VCCA e GND, TC e 0§ C to a 85§ C (Note 3)

Symbol Parameter Min Typ Max Units Conditions


VIH Input HIGH Voltage b 1165 b 870 mV Guaranteed High Signal for ALL Inputs
VIL Input LOW Voltage b 1830 b 1475 mV Guaranteed Low Signal for ALL Inputs
VOH Output HIGH Voltage b 1025 b 955 b 870 mV VIN e VIH (max) or VIL (min) Loading with 25X to
b 2.0V

VOHC Output HIGH Voltage b 1035 mV VIN e VIH (min) or VIL (max) Loading with 25X to
b 2.0V

VOLZ Cut-Off LOW Voltage b 1950 mV VIN e VIH (min) or VIL (max) Loading with 25X to
b 2.0V

IIL Input LOW Current 0.50 mA VIN e VIL (min)


IIH Input HIGH Current 240 mA VIN e VIH (max)
IEE Power Supply Current b 121 b 91 b 57 mA Inputs Open
Note 3: The specified limits represent ‘‘worst case’’ values for the parameter. Since these values normally occur at the temperature extremes, additional noise
immunity and guardbanding can be achieved by decreasing the allowable system operating ranges. Conditions for testing shown in the tables are chosen to
guarantee operation under ‘‘worst case’’ conditions.

DIP AC Electrical Characteristics


VEE e b4.2V to b5.7V, VCC e VCCA e GND

TC e 0§ C TC e a 25§ C TC e a 85§ C
Symbol Parameter Units Conditions
Min Max Min Max Min Max
tPZH Propagation Delay 1.90 3.60 1.90 3.60 2.00 3.80
ns
tPHZ Data to Output 1.30 2.70 1.30 2.70 1.50 2.70
tPZH Propagation Delay 1.90 3.60 1.90 3.60 2.00 3.90
ns
tPHZ Dual Enable to Output 1.60 3.00 1.60 3.00 1.70 3.40
Figures 1 and 2
tPZH Propagation Delay 1.80 3.50 1.80 3.50 2.00 3.80
ns
tPHZ Common Enable to Output 1.50 2.90 1.50 2.90 1.60 3.00
tTZH Transition Time 0.50 1.80 0.50 1.80 0.50 1.80
ns
tTHZ 20% to 80%, 80% to 20% 0.35 1.40 0.35 1.40 0.35 1.40

3
Commercial Version (Continued)
PCC and Cerpak AC Electrical Characteristics
VEE e b4.2V to b5.7V, VCC e VCCA e GND
TC e 0§ C TC e a 25§ C TC e a 85§ C
Symbol Parameter Units Conditions
Min Max Min Max Min Max
tPZH Propagation Delay 1.90 3.40 1.90 3.40 2.00 3.60
ns
tPHZ Data to Output 1.30 2.50 1.30 2.50 1.50 2.70
tPZH Propagation Delay 1.90 3.40 1.90 3.40 2.00 3.70
ns
tPHZ Dual Enable to Output 1.60 2.80 1.60 2.80 1.70 3.00
Figures 1 and 2
tPZH Propagation Delay 1.80 3.30 1.80 3.30 2.00 3.60
ns
tPHZ Common Enable to Output 1.50 2.70 1.50 2.70 1.60 2.80
tTZH Transition Time 0.50 1.70 0.50 1.70 0.50 1.70
ns
tTHZ 20% to 80%, 80% to 20% 0.35 1.30 0.35 1.20 0.35 1.30
Note: The specified limits represent the ‘‘worst case’’ value for the parameter. Since these values normally occur at the temperature extremes, additional noise
immunity and guard banding can be achieved by decreasing the allowable system operating ranges. Conditions for testing shown in the tables are chosen to
guarantee operation under ‘‘worst case’’ conditions.

4
Military VersionÐPreliminary
DC Electrical Characteristics
VEE e b4.2V to b5.7V, VCC e VCCA e GND, TC e b55§ C to a 125§ C
Symbol Parameter Min Max Units TC Conditions Notes
VOH Output HIGH Voltage b1025 b870 mV 0§ C to a 125§ C VIN e VIH (max) Loading with
1, 2, 3
b 1085 b 870 or VIL (min) 25X to b2.0V
mV b 55§ C

VOHC Output HIGH Voltage b1035 mV 0§ C to a 125§ C


b 1085 mV b 55§ C VIN e VIH (min) Loading with
1, 2, 3
VOLC Output LOW Voltage b 1610 mV 0§ C to a 125§ C or VIL (max) 25X to b2.0V

b 1555 MV b 55§ C

VOLZ Cut-Off LOW Voltage b 1950 0§ C to a 125§ C VIN e VIH (min) Loading with
mV 1, 2, 3
b 1850 b 55§ C or VIL (max) 25X to b2.0V

VIH Input HIGH Voltage Guaranteed HIGH Signal


b 1165 b 870 mV b 55§ C to a 125§ C 1, 2, 3, 4
for All Inputs
VIL Input LOW Voltage Guaranteed LOW Signal
b 1830 b 1475 mV b 55§ C to a 125§ C 1, 2, 3, 4
for All Inputs
IIL Input LOW Current 0.50 mA b 55§ C to a 125§ C VEE e 4.2V, VIN e VIL (min) 1, 2, 3
IIH Input HIGH Current 240 mA 0§ C to a 125§ C VEE e b5.7V, VIN e VIH (max)
1, 2, 3
340 mA b 55§ C

IEE Power Supply Current Inputs Open


b 145 b 55 VEE e b4.2V to b4.8V
mA b 55§ C to a 125§ C 1, 2, 3
b 150 VEE e b4.2V to b5.7V
Note 1: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals b 55§ C), then testing
immediately without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides ‘‘cold start’’ specs which can be
considered a worst case condition at cold temperatures.
Note 2: Screen tested 100% on each device at b 55§ C, a 25§ C, and a 125§ C, Subgroups 1, 2, 3, 7, and 8.
Note 3: Sample tested (Method 5005, Table I) on each manufactured lot at b 55§ C, a 25§ C, and a 125§ C, Subgroups A1, 2, 3, 7, and 8.
Note 4: Guaranteed by applying specified input condition and testing VOH/VOL.

5
Military VersionÐPreliminary (Continued)
AC Electrical CharacteristicsÐAll Packages
VEE e b4.2V to b5.7V, VCC e VCCA e GND
TC e b55§ C TC e a 25§ C TC e a 125§ C
Symbol Parameter Units Conditions
Min Max Min Max Min Max
tPZH Propagation Delay 1.70 4.00 1.70 4.00 1.80 4.20
ns
tPHZ Data to Output 1.10 3.10 1.10 3.10 1.30 3.10
tPZH Propagation Delay 1.70 4.00 1.70 4.00 1.80 4.30
ns
tPHZ Data Enable to Output 1.40 3.40 1.40 3.40 1.50 3.80
Figures 1 and 2
tPZH Propagation Delay 1.60 3.90 1.60 3.90 1.80 4.20
ns
tPHZ Common Enable to Output 1.30 3.30 1.30 3.30 1.40 3.40
tTZH Transition Time 0.40 2.20 0.40 2.20 0.40 2.20
ns
tTHZ 20% to 80%, 80% to 20% 0.25 1.80 0.25 1.80 0.25 1.80
Note 1: The specified limits represent the ‘‘worst case’’ value for the parameter. Since these ‘‘worst case’’ values normally occur at the temperature extremes,
additional noise immunity and guard banding can be achieved by decreasing the allowable system operating ranges.
Note 2: Conditions for testing shown in the tables are chosen to guarantee operation under ‘‘worst case’’ conditions.

Test Circuitry
Notes:
VCC, VCCA e a 2V, VEE e b 2.5V
L1 and L2 e equal length 50X impedance lines
RT e 50X terminator internal to scope
Decoupling 0.1 mF from GND to VCC and VEE
All unused outputs are loaded with 25X to GND
CL e Fixture and stray capacitance s 3 pF
Pin numbers shown are for flatpak; for DIP see
logic symbol

TL/F/9877 – 5
FIGURE 1. AC Test Circuit

6
Timing Waveform

TL/F/9877 – 6
FIGURE 2. Propagation Delay and Transition Times

Ordering Information
The device number is used to form part of a simplified purchasing code where a package type and temperature range are
defined as follows:

100323 D C QB

Device Number (Basic) Special Variation


QB e Military grade device with
Package Code environmental and burn-in
D e Ceramic DIP processing
F e Quad Cerpak
P e Plastic DIP Temperature Range
Q e Plastic-Leaded Chip Carrier (PLCC) C e Commercial (0§ C to a 85§ C)
M e Military (b55§ C to a 125§ C)

7
Physical Dimensions inches (millimeters)

24 Lead Ceramic Dual-In-Line Package (0.400× Wide) (D)


NS Package Number J24E

8
Physical Dimensions inches (millimeters) (Continued)

24 Lead Plastic Dual-In-Line Package (P)


NS Package Number N24E

28 Lead Plastic Chip Carrier (Q)


NS Package Number V28A

9
100323 Low Power Hex Bus Driver
Physical Dimensions inches (millimeters) (Continued) Lit. Ý 114909

24 Lead Quad Cerpak (F)


NS Package Number W24B

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.

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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
This datasheet has been download from:

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Datasheets for electronics components.


National Semiconductor was acquired by Texas Instruments.
http://www.ti.com/corp/docs/investor_relations/pr_09_23_2011_national_semiconductor.html

This file is the datasheet for the following electronic components:

100323 - http://www.ti.com/product/100323?HQS=TI-null-null-dscatalog-df-pf-null-wwe

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