RT9715

90mΩΩ, 2A/1.5A/1.1A/0.7A High-Side Power Switches

with Flag
General Description Features
The RT9715 is a cost-effective, low-voltage, single z 90mΩΩ (typ.) N-MOSFET Switch
N-MOSFET high-side Power Switch IC for USB application. z Operating Range : 2.7V to 5.5V
Low switch-on resistance (typ. 90mΩ) and low supply z Reverse Blocking Current
current (typ. 50uA) are realized in this IC. z Under Voltage Lockout
z Deglitched Fault Report (FLG)
The RT9715 integrates an over-current protection circuit,
z Thermal Protection with Foldback
a short fold back circuit, a thermal shutdown circuit and an
z Over Current Protection
under-voltage lockout circuit for overall protection. Besides,
z Short Circuit Protection
a flag output is available to indicate fault conditions to the
z UL Approved−E219878
local USB controller. Furthermore, the chip also integrates
z Nemko Approved−NO49621
an embedded delay function to prevent miss-operation from
z RoHS Compliant and Halogen Free
happening due to inrush-current. The RT9715 is an ideal
solution for USB power supply and can support flexible
Applications
applications since it is available in various packages such
z USB Peripherals
as SOT-23-5, SOP-8, MSOP-8 and WDFN-8L 3x3.
z Notebook PCs
Ordering Information
RT9715 Pin Configurations
Package Type (TOP VIEW)
B : SOT-23-5 VIN EN/EN VIN EN/EN
BG : SOT-23-5 (G-Type)
5 4
BR : SOT-23-5 (R-Type) 5 4

S : SOP-8 2 3
2 3
F : MSOP-8
QW : WDFN-8L 3x3 (W-Type) VOUT GND FLG VOUT GND NC
Lead Plating System SOT-23-5 SOT-23-5 (G-Type)
G : Green (Halogen Free and Pb Free) VOUT VIN
Output Current/EN Function
A : 2A/Active High 5 4 GND 8 VOUT
VIN 2 7 VOUT
B : 2A/Active Low 2 3 VIN 3 6 VOUT
C : 1.5A/Active High 4
EN/EN 5 FLG
D : 1.5A/Active Low FLG GND EN/EN
E : 1.1A/Active High SOP-8/MSOP-8
SOT-23-5 (R-Type)
F : 1.1A/Active Low
G : 0.7A/Active High
H : 0.7A/Active Low GND 1 8 VOUT
Note : VIN VOUT
GND

2 7
VIN 3 6 VOUT
Richtek products are : 9
EN/EN 4 5 FLG
` RoHS compliant and compatible with the current require-
WDFN-8L 3x3
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
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RT9715
Typical Application Circuit
Pull-Up Resistor (10K to 100K)
USB Controller

Supply Voltage Over -Current

2.7V to 5.5V VIN FLG
CIN RT9715
1uF
RT9715A/C/E/G
VOUT VBUS
Chip Enable EN/EN

+
COUT D+
GND 10uF 150uF D-
RT9715B/D/F/H GND
Chip Enable

Ferrite
Beads Data
Note : A low-ESR 150uF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to meet
the 330mV maximum droop requirement in the hub VBUS. (see Application Information Section for further details)

Functional Pin Description

Pin No.
SOT-23-5 SOT-23-5 SOP-8 / WDFN-8L Pin Name Pin Function
SOT-23-5
(G-Type) (R-Type) MSOP-8 3X3
1 1 5 6 , 7,8 6,7,8 VOUT Output Voltage.
2 2 2 1 1 GND Ground.
3 -- 1 5 5 FLG Fault FLAG Output.
4 4 3 4 4 EN/EN Chip Enable (Active High/Low).
5 5 4 2,3 2,3 VIN Power Input Voltage.
-- 3 -- -- -- NC No Internal Connection.
The exposed pad must be soldered to a large
9 (Exposed
-- -- -- -- PCB and connected to GND for maximum
Pad)
power dissipation.

Function Block Diagram

VIN

EN/EN Bias UVLO Current

Limiting

Gate
Charge
Oscillator Control
Pump

Output Voltage
Detection VOUT
Thermal
Protection Auto Discharge
FLG

Delay
GND

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 RT9715
Absolute Maximum Ratings (Note 1)
z Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 6V
z EN Voltage -------------------------------------------------------------------------------------------------------------- −0.3V to 6V
z FLAG Voltage ---------------------------------------------------------------------------------------------------------- 6V
z Power Dissipation, PD @ TA = 25°C
SOT-23-5 ---------------------------------------------------------------------------------------------------------------- 300mW
SOP-8 -------------------------------------------------------------------------------------------------------------------- 469mW
MSOP-8 ----------------------------------------------------------------------------------------------------------------- 469mW
WDFN-8L 3x3 ---------------------------------------------------------------------------------------------------------- 694mW
z Package Thermal Resistance (Note 2)
SOT-23-5, θJA ----------------------------------------------------------------------------------------------------------- 250°C/W
SOP-8, θJA -------------------------------------------------------------------------------------------------------------- 160°C/W
MSOP-8, θJA ------------------------------------------------------------------------------------------------------------ 160°C/W
WDFN-8L 3x3, θJA ----------------------------------------------------------------------------------------------------- 108°C/W
z Junction Temperature ------------------------------------------------------------------------------------------------- 150°C
z Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260°C
z Storage Temperature Range ---------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Mode) ------------------------------------------------------------------------------------------ 2kV
MM (Machine Mode) -------------------------------------------------------------------------------------------------- 200V

Recommended Operating Conditions (Note 4)

z Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 2.7V to 5.5V
z EN Voltage -------------------------------------------------------------------------------------------------------------- 0V to 5.5V
z Junction Temperature Range ---------------------------------------------------------------------------------------- −40°C to 100°C
z Ambient Temperature Range ---------------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VIN = 5V, CIN = 1uF, COUT = 10uF, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Input Quiescent Current IQ Switch On, V OUT = Open -- 50 70
uA
Input Shutdown Current ISHDN Switch Off, V OUT = Open -- 0.1 1
RT9715A/B VIN = 5V, IOUT = 1.5A -- 90 110
Switch On RT9715C/D VIN = 5V, IOUT =1.3A -- 90 110
R DS(ON) mΩ
Resistance RT9715E/F VIN = 5V, IOUT = 1A -- 90 110
RT9715G/H VIN = 5V, IOUT = 0.6A -- 90 110
RT9715A/B 2 2.5 3.2
Current RT9715C/D 1.5 2 2.8
ILIM VOUT = 4V A
Limit RT9715E/F 1.1 1.5 2.1
RT9715G/H 0.7 1 1.4
RT9715A/B -- 1.7 --
Short RT9715C/D VOUT = 0V, Measured Prior to -- 1.4 --
ISC_FB A
Current RT9715E/F Thermal Shutdown -- 1 --
RT9715G/H -- 0.7 --
To be continued
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RT9715
Parameter Symbol Test Conditions Min Typ Max Unit

EN/EN Logic_High Voltage V IH VIN = 2.7V to 5.5V 2 -- -- V

Threshold Logic_Low Voltage V IL VIN = 2.7V to 5.5V -- -- 0.8 V
EN/EN Input Current IEN/EN VEN = 5V -- 0.01 0.1 uA
Output Leakage Current ILEAKAGE VEN = 0V, RLOAD = 0Ω -- 0.5 1 uA
Output Turn-On Rise Time T ON_RISE 10% to 90% of V OUT Rising -- 200 -- us
FLG Output Resistance RFLG ISINK = 1mA -- 20 -- Ω
FLG Off Current IFLG_OFF VFLG = 5V -- 0.01 1 uA

FLG Delay Time TD From fault condition to FLG 5 12 20 ms

assertion
Shutdown Auto-Discharge VEN = 0V, VEN = 5V
R Discharge -- 100 150 Ω
Resistance
Under-Voltage Lockout V UVLO VIN Rising 1.3 1.7 -- V
Under-Voltage Hysteresis ΔVUVLO VIN Decreasing -- 0.1 -- V
VOUT > 1V -- 120 -- °C
Thermal Shutdown Protection T SD
VOUT = 0V -- 100 -- °C
Thermal Shutdown Hysteresis VOUT = 0V -- 20 -- °C

Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

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 RT9715
Typical Operating Characteristics
On Resistance vs. Input Voltage On Resistance vs. Temperature
108 125
IOUT = 2A VIN = 5V, IOUT = 2A
106 120
SOP-8
115
104
On Resistance (mΩ)

On Resistance (mΩ)
110
102
105
SOP-8
100 100
98 95
SOT-23-5
96 90
SOT-23-5
85
94
80
92 75
90 70
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 -40 -25 -10 5 20 35 50 65 80
Input Voltage (V) Temperature (°C)

Quiescent Current vs. Input Voltage Quiescent Current vs. Temperature

60 60
No Load VIN = 5V,No Load
58 59
56 58
Quiescent Current (uA)
Quiescent Current (uA)

54 57
52 56
50 55
48 54
46 53
44 52
42 51
40 50
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 -40 -25 -10 5 20 35 50 65 80 95 110
Input Voltage (V) Temperature (°C)

Shutdown Current vs. Input Voltage Shutdown Current vs. Temperature

1.0 1.0
No Load VIN = 5V
0.9 0.9
0.8 0.8
Shutdown Current (uA)

Shutdown Current (uA)

0.7 0.7
0.6 0.6
0.5 0.5
0.4 0.4
0.3 0.3
0.2 0.2
0.1 0.1
0.0 0.0
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 -40 -25 -10 5 20 35 50 65 80 95 110
Input Voltage (V) Temperature (°C)

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RT9715

Output Voltage vs. Output Current UVLO Threshold vs. Temperature

6.0 2.2
5.5
VIN = 5V
5.0 2.0
4.5

UVLO Threshold (V)

Output Voltage (V)

4.0 1.8
VIN = 3.3V Rising
3.5
3.0 1.6
2.5 Falling
2.0 1.4
1.5
1.0 1.2
0.5
0.0 1.0
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 -40 -25 -10 5 20 35 50 65 80 95 110
Output Current (A) Temperature (°C)

Current Limit vs. Input Voltage Current Limit vs. Temperature

2.4 2.40
VIN = 5V
2.3 2.35

2.2 2.30
Current Limit (A)

Current Limit (A)

2.1 2.25

2.0 2.20

1.9 2.15

1.8 2.10

1.7 2.05

1.6 2.00
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 -40 -25 -10 5 20 35 50 65 80 95 110
Input Voltage (V) Temperature (°C)

Short Current vs. Input Voltage Short Current vs. Temperature

2.0 2.00
VIN = 5V
1.9 1.90
1.8 1.80
1.7 1.70
Short Current (A)
Short Current (A)

1.6 1.60
1.5 1.50
1.4 1.40
1.3 1.30
1.2 1.20
1.1 1.10
1.0 1.00
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 -40 -25 -10 5 20 35 50 65 80 95 110
Input Voltage (V) Temperature (°C)

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 RT9715

FLG Delay Time vs. Input Voltage FLG Delay Time vs. Temperature
12 12.0
VIN = 5V
11 11.5

FLG Delay Time (ms)

FLG Delay Time (ms)

10 11.0

9 10.5

8 10.0

7 9.5

6 9.0

5 8.5

4 8.0
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 -40 -25 -10 5 20 35 50 65 80 95 110
Input Voltage (V) Temperature (°C)

Power On from VIN Power Off from VIN

EN = 0V, No Load EN = 0V, No Load

VIN VIN
(2V/Div) (2V/Div)

VOUT VOUT
(2V/Div) (2V/Div)

Time (25ms/Div) Time (25ms/Div)

Power On from EN FLG Response

VIN = 5V, RLOAD = 2.7Ω VOUT
(2V/Div)

VOUT I IN
(2V/Div) (1A/Div)

EN EN
(5V/Div) (5V/Div)

I IN FLG
(1A/Div) (5V/Div)
VIN = 5V, RLOAD = 0.5Ω

Time (100us/Div) Time (2.5ms/Div)

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RT9715
Applications Information
The RT9715 is a single N-MOSFET high-side power
switches with enable input, optimized for self-powered and
bus-powered Universal Serial Bus (USB) applications. The
RT9715 is equipped with a charge pump circuitry to drive
the internal N-MOSFET switch; the switch's low RDS(ON),
90mΩ, meets USB voltage drop requirements; and a flag
output is available to indicate fault conditions to the local
USB controller.
Input and Output
VIN (input) is the power source connection to the internal
circuitry and the drain of the MOSFET. VOUT (output) is
the source of the MOSFET. In a typical application, current
flows through the switch from VIN to VOUT toward the load.
If VOUT is greater than VIN, current will flow from VOUT to
VIN since the MOSFET is bidirectional when on.
Unlike a normal MOSFET, there is no parasitic body diode
between drain and source of the MOSFET, the RT9715
prevents reverse current flow if VOUT is externally forced to
a higher voltage than VIN when the chip is disabled (VEN <
0.8V or VEN > 2V).
D S
D S
G G
Normal MOSFET RT9715
Chip Enable Input
The switch will be disabled when the EN/EN pin is in a
logic low/high condition. During this condition, the internal
circuitry and MOSFET will be turned off, reducing the supply
current to 0.1uA typical. Floating the EN/EN may cause
unpredictable operation. EN should not be allowed to go
negative with respect to GND. The EN/EN pin may be
directly tied to VIN (GND) to keep the part on.
Soft Start for Hot Plug-In Applications
In order to eliminate the upstream voltage droop caused
by the large inrush current during hot-plug events, the “soft-
start” feature effectively isolates the power source from
extremely large capacitive loads, satisfying the USB voltage
droop requirements.
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Fault Flag
The RT9715 series provides a FLG signal pin which is an
N-Channel open drain MOSFET output. This open drain
output goes low when current limit or the die temperature
exceeds 120°C approximately. The FLG output is capable
of sinking a 10mA load to typically 200mV above ground.
The FLG pin requires a pull-up resistor, this resistor should
be large in value to reduce energy drain. A 100kΩ pull-up
resistor works well for most applications. In the case of an
over-current condition, FLG will be asserted only after the
flag response delay time, tD, has elapsed. This ensures
that FLG is asserted only upon valid over-current conditions
and that erroneous error reporting is eliminated.
For example, false over-current conditions may occur
during hot-plug events when extremely large capacitive
loads are connected and causes a high transient inrush
current that exceeds the current limit threshold. The FLG
response delay time tD is typically 12ms.
Under-Voltage Lockout
Under-voltage lockout (UVLO) prevents the MOSFET switch
from turning on until input the voltage exceeds
approximately 1.7V. If input voltage drops below
approximately 1.3V, UVLO turns off the MOSFET switch.
Under-voltage detection functions only when the switch is
enabled.
Current Limiting and Short-Circuit Protection
The current limit circuitry prevents damage to the MOSFET
switch and the hub downstream port but can deliver load
current up to the current limit threshold of typically 2A
through the switch of the RT9715A/B, 1.5A for
RT9715C/D, 1.1A for RT9715E/F and 0.7A for
RT9715G/H respectively. When a heavy load or short circuit
is applied to an enabled switch, a large transient current
may flow until the current limit circuitry responds. Once
this current limit threshold is exceeded, the device enters
constant current mode until the thermal shutdown occurs
or the fault is removed.
Thermal Shutdown
Thermal protection limits the power dissipation in RT9715.
When the operation junction temperature exceeds 120°C,
the OTP circuit starts the thermal shutdown function and
DS9715-03 April 2011

turns the pass element off. The pass element turn on again
after the junction temperature cools to 80°C. The RT9715
lowers its OTP trip level from 120°C to 100°C when output
short circuit occurs (VOUT < 1V) as shown in Figure 1.
V OUT Short to GND
1V
V OUT
IOUT
Thermal
Shutdown
120 ° C 100 C
°
OTP Trip Point
100 °C
IC Temperature 80 °C
Figure 1. Short Circuit Thermal Folded Back Protection
when Output Short Circuit Occurs (Patent)
Power Dissipation
The junction temperature of the RT9715 series depend on
several factors such as the load, PCB layout, ambient
temperature and package type. The output pin of the
RT9715 can deliver the current of up to 2A (RT9715A/B),
1.5A (RT9715C/D), 1.1A (RT9715E/F) and 0.7A (RT9715G/
H) respectively over the full operating junction temperature
range. However, the maximum output current must be
derated at higher ambient temperature to ensure the
junction temperature does not exceed 100°C. With all
possible conditions, the junction temperature must be within
the range specified under operating conditions. Power
dissipation can be calculated based on the output current
and the RDS(ON) of the switch as below.
PD = RDS(ON) x IOUT2
Although the devices are rated for 2A, 1.5A, 1.1A and 0.7A
of output current, but the application may limit the amount
of output current based on the total power dissipation and
the ambient temperature. The final operating junction
temperature for any set of conditions can be estimated by
the following thermal equation :
PD (MAX) = ( TJ (MAX) - TA ) / θJA
Where TJ (MAX) is the maximum junction temperature of
the die (100°C) and TA is the maximum ambient temperature.
DS9715-03 April 2011
RT9715
The junction to ambient thermal resistance (θJA) for
SOT-23-5/TSOT-23-5, SOP-8/MSOP-8 and WDFM-8L 3x3
packages at recommended minimum footprint are 250°C/
W, 160°C/W and 108°C/W respectively (θJA is layout
dependent).
Universal Serial Bus (USB) & Power Distribution
The goal of USB is to enable device from different vendors
to interoperate in an open architecture. USB features
include ease of use for the end user, a wide range of
workloads and applications, robustness, synergy with the
PC industry, and low-cost implementation. Benefits include
self-identifying peripherals, dynamically attachable and
reconfigurable peripherals, multiple connections (support
for concurrent operation of many devices), support for as
many as 127 physical devices, and compatibility with PC
Plug-and-Play architecture.
The Universal Serial Bus connects USB devices with a
USB host: each USB system has one USB host. USB
devices are classified either as hubs, which provide
additional attachment points to the USB, or as functions,
which provide capabilities to the system (for example, a
digital joystick). Hub devices are then classified as either
Bus-Power Hubs or Self-Powered Hubs.
A Bus-Powered Hub draws all of the power to any internal
functions and downstream ports from the USB connector
power pins. The hub may draw up to 500mA from the
upstream device. External ports in a Bus-Powered Hub
can supply up to 100mA per port, with a maximum of four
external ports.
Self-Powered Hub power for the internal functions and
downstream ports does not come from the USB, although
the USB interface may draw up to 100mA from its upstream
connect, to allow the interface to function when the
remainder of the hub is powered down. The hub must be
able to supply up to 500mA on all of its external
downstream ports. Please refer to Universal Serial
Specification Revision 2.0 for more details on designing
compliant USB hub and host systems.
Over-Current protection devices such as fuses and PTC
resistors (also called polyfuse or polyswitch) have slow
trip times, high on-resistance, and lack the necessary
circuitry for USB-required fault reporting.
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RT9715
The faster trip time of the RT9715 power distribution allows
designers to design hubs that can operate through faults.
The RT9715 provides low on-resistance and internal fault-
reporting circuitry to meet voltage regulation and fault
notification requirements.
Because the devices are also power switches, the designer
of self-powered hubs has the flexibility to turn off power to
output ports. Unlike a normal MOSFET, the devices have
controlled rise and fall times to provide the needed inrush
current limiting required for the bus-powered hub power
switch.
Supply Filter/Bypass Capacitor
A 1uF low-ESR ceramic capacitor from VIN to GND, located
at the device is strongly recommended to prevent the input
voltage drooping during hot-plug events. However, higher
capacitor values will further reduce the voltage droop on
the input. Furthermore, without the bypass capacitor, an
output short may cause sufficient ringing on the input (from
source lead inductance) to destroy the internal control
circuitry. The input transient must not exceed 6V of the
absolute maximum supply voltage even for a short duration.
Output Filter Capacitor
A low-ESR 150uF aluminum electrolytic or tantalum
between VOUT and GND is strongly recommended to meet
the 330mV maximum droop requirement in the hub VBUS
(Per USB 2.0, output ports must have a minimum 120uF
of low-ESR bulk capacitance per hub). Standard bypass
methods should be used to minimize inductance and
resistance between the bypass capacitor and the
downstream connector to reduce EMI and decouple voltage
droop caused when downstream cables are hot-insertion
transients. Ferrite beads in series with VBUS, the ground
line and the 0.1uF bypass capacitors at the power connector
pins are recommended for EMI and ESD protection. The
bypass capacitor itself should have a low dissipation factor
to allow decoupling at higher frequencies.
Voltage Drop
The USB specification states a minimum port-output voltage
in two locations on the bus, 4.75V out of a Self-Powered
Hub port and 4.40V out of a Bus-Powered Hub port. As
with the Self-Powered Hub, all resistive voltage drops for
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the Bus-Powered Hub must be accounted for to guarantee
voltage regulation (see Figure 7-47 of Universal Serial
Specification Revision 2.0 ).
The following calculation determines VOUT (MIN) for multi-
ple ports (NPORTS) ganged together through one switch (if
using one switch per port, NPORTS is equal to 1) :
VOUT (MIN) = 4.75V − [ II x ( 4 x RCONN + 2 x RCABLE ) ] −
(0.1A x NPORTS x RSWITCH ) − VPCB
Where
RCONN = Resistance of connector contacts
(two contacts per connector)
RCABLE = Resistance of upstream cable wires
(one 5V and one GND)
RSWITCH = Resistance of power switch
(90mΩ typical for RT9715)
VPCB = PCB voltage drop
The USB specification defines the maximum resistance
per contact (RCONN) of the USB connector to be 30mΩ and
the drop across the PCB and switch to be 100mV. This
basically leaves two variables in the equation: the
resistance of the switch and the resistance of the cable.
If the hub consumes the maximum current (II) of 500mA,
the maximum resistance of the cable is 90mΩ.
The resistance of the switch is defined as follows :
RSWITCH = { 4.75V − 4.4V − [ 0.5A x ( 4 x 30mΩ + 2 x
90mΩ) ] − VPCB } ÷ ( 0.1A x NPORTS )
= (200mV − VPCB ) ÷ ( 0.1A x NPORTS )
If the voltage drop across the PCB is limited to 100mV,
the maximum resistance for the switch is 250mΩ for four
ports ganged together. The RT9715, with its maximum
100mΩ on-resistance over temperature, can fit the demand
of this requirement.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum operation junction temperature. The maximum
power dissipation depends on the thermal resistance of IC
package, PCB layout, the rate of surroundings airflow and
temperature difference between junction to ambient. The
DS9715-03 April 2011
 RT9715
maximum power dissipation can be calculated by following PCB Layout Guide
formula : In order to meet the voltage drop, droop, and EMI
PD(MAX) = (TJ(MAX) − TA) / θJA requirements, careful PCB layout is necessary. The
following guidelines must be followed :
Where T J(MAX) is the maximum operation junction
temperature 100°C, TA is the ambient temperature and the ` Locate the ceramic bypass capacitors as close as
θJA is the junction to ambient thermal resistance. possible to the VIN pins of the RT9715.

For recommended operating conditions specification of ` Place a ground plane under all circuitry to lower both
RT9715, where T J(MAX) is the maximum junction resistance and inductance and improve DC and transient
temperature of the die (100°C) and TA is the maximum performance (Use a separate ground and power plans if
ambient temperature. The junction to ambient thermal possible).
resistance θ JA is layout dependent. For SOT-23-5 ` Keep all VBUS traces as short as possible and use at
packages, the thermal resistance θJA is 250°C/W on the least 50-mil, 2 ounce copper for all VBUS traces.
standard JEDEC 51-3 single-layer thermal test board. And
` Avoid vias as much as possible. If vias are necessary,
for SOP-8 and MSOP-8 packages, the thermal resistance
make them as large as feasible.
θJA is 160°C/W. The maximum power dissipation at TA =
25°C can be calculated by following formula : ` Place cuts in the ground plane between ports to help
reduce the coupling of transients between ports.
P D(MAX) = (100°C - 25°C) / (250°C/W) = 0.3W for
SOT-23-5 packages ` Locate the output capacitor and ferrite beads as close to
the USB connectors as possible to lower impedance
PD(MAX) = (100°C - 25°C) / (160°C/W) = 0.469W for
(mainly inductance) between the port and the capacitor
SOP-8/MSOP-8 packages
and improve transient load performance.
PD(MAX) = (100°C - 25°C) / (108°C/W) = 0.694W for
` Locate the RT9715 as close as possible to the output
WDFN-8L 3x3 packages
port to limit switching noise.
The maximum power dissipation depends on operating
The input capacitor should
ambient temperature for fixed TJ(MAX) and thermal resistance be placed as close as
θJA. For RT9715 packages, the Figure 2 of derating curves possible to the IC.
V BUS V OUT V IN
allows the designer to see the effect of rising ambient
temperature on the maximum power allowed.

0.8
Single Layer PCB
WDFN-8L 3x3
Maximum Power Dissipation (W)

0.7 GND

0.6

0.5 SOP-8/MSOP-8
GND_BUS FLG EN
0.4
SOT-23-5 V IN
0.3

0.2 Figure 3

0.1

0
0 10 20 30 40 50 60 70 80 90 100
Ambient Temperature (°C)

Figure 2. Derating Curves for RT9715 Package

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RT9715
Outline Dimension

H
D
L

C B

A
A1
e

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 0.889 1.295 0.035 0.051
A1 0.000 0.152 0.000 0.006
B 1.397 1.803 0.055 0.071
b 0.356 0.559 0.014 0.022
C 2.591 2.997 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024

SOT-23-5 Surface Mount Package

www.richtek.com DS9715-03 April 2011

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 RT9715

H
A

J B

C
I
D

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 3.988 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.508 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.050 0.254 0.002 0.010
J 5.791 6.200 0.228 0.244
M 0.400 1.270 0.016 0.050

8-Lead SOP Plastic Package

DS9715-03 April 2011 www.richtek.com

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RT9715

D
L

E E1

A A2
A1
b

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 0.810 1.100 0.032 0.043
A1 0.000 0.150 0.000 0.006
A2 0.750 0.950 0.030 0.037
b 0.220 0.380 0.009 0.015
D 2.900 3.100 0.114 0.122
e 0.650 0.026
E 4.800 5.000 0.189 0.197
E1 2.900 3.100 0.114 0.122
L 0.400 0.800 0.016 0.031

8-Lead MSOP Plastic Package

www.richtek.com DS9715-03 April 2011

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 RT9715

D2
D

E E2

SEE DETAIL A
1

e
b 2 1 2 1
A
A3
A1 DETAIL A
Pin #1 ID and Tie Bar Mark Options

Note : The configuration of the Pin #1 identifier is optional,

but must be located within the zone indicated.

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.200 0.300 0.008 0.012
D 2.950 3.050 0.116 0.120
D2 2.100 2.350 0.083 0.093
E 2.950 3.050 0.116 0.120
E2 1.350 1.600 0.053 0.063
e 0.650 0.026
L 0.425 0.525 0.017 0.021

W-Type 8L DFN 3x3 Package

Richtek Technology Corporation Richtek Technology Corporation

Headquarter Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City 5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com

Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,
specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed
by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.

DS9715-03 April 2011 www.richtek.com

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