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STF20NF20, STP20NF20
N-channel 200 V, 0.10 Ω, 18 A DPAK, TO-220, TO-220FP
low gate charge STripFET™ Power MOSFET
Features
Type VDSS RDS(on) ID PW
STD20NF20 200 V < 0.125 Ω 18 A 110 W
STF20NF20 200 V < 0.125 Ω 18 A 30 W 2
3
2
3
1 1
STP20NF20 200 V < 0.125 Ω 18 A 110 W
TO-220FP TO-220
■ Exceptional dv/dt capability
■ Low gate charge
3
■ 100% avalanche tested 1
DPAK
Application
■ Switching applications
3
!-V
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1 Electrical ratings
2 Electrical characteristics
Drain-source
V(BR)DSS ID = 1 mA, VGS = 0 200 V
breakdown voltage
Zero gate voltage VDS = Max rating 1 µA
IDSS
drain current (VGS = 0) VDS = Max rating, TC = 125 °C 10 µA
Gate-body leakage
IGSS VGS = ± 20 V ±100 nA
current (VDS = 0)
VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 2 3 4 V
Static drain-source on
RDS(on) VGS = 10 V, ID = 10 A 0.10 0.125 Ω
resistance
Table 6. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Forward
gfs (1) VDS = 25 V, ID= 10 A - 13 S
transconductance
Input capacitance pF
Ciss 940
Output capacitance VDS = 25 V, f = 1 MHz, pF
Coss - 197
Reverse transfer VGS = 0 pF
Crss 30
capacitance
Source-drain current
ISD 18 A
Source-drain current -
ISDM(1) 72 A
(pulsed)
VSD(2) Forward on voltage ISD = 20 A, VGS = 0 - 1.6 V
trr Reverse recovery time ISD = 20 A, di/dt = 100A/µs 155 ns
Qrr Reverse recovery charge VDD = 50 V - 775 nC
IRRM Reverse recovery current (see Figure 20) 10 A
trr Reverse recovery time ISD = 20 A, di/dt = 100 A/µs 183 ns
Qrr Reverse recovery charge VDD = 50 V, Tj = 150 °C - 1061 nC
IRRM Reverse recovery current (see Figure 20) 11.6 A
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
Figure 4. Safe operating area for TO-220FP Figure 5. Thermal impedance for TO-220FP
AM03979v1
GFS
(S) TJ=-50°C
19
17
TJ=25°C
15
13
TJ=175°C
11
7
3 6 9 12 15 18 ID(A)
Figure 10. Gate charge vs gate-source voltage Figure 11. Capacitance variations
Figure 12. Normalized gate threshold voltage Figure 13. Normalized on resistance vs
vs temperature temperature
VGS(th) AM03980v1 RDS(on) AM03981v1
(norm) (norm)
1.10 2.4
2.2
1.00
2.0
0.90
1.8
0.80 1.6
0.70 1.4
1.2
0.60
1.0
0.50
0.8
0.40 0.6
-50 0 50 100 150 TJ(°C) -50 0 50 100 150 TJ(°C)
0.9
TJ=25°C
0.8
0.7
TJ=175°C
0.6
0.5
3 6 9 12 15 18 ISD(A)
3 Test circuits
Figure 15. Switching times test circuit for Figure 16. Gate charge test circuit
resistive load
VDD
12V 47kΩ
1kΩ
100nF
RL 2200 3.3
µF µF
VDD IG=CONST
VD Vi=20V=VGMAX 100Ω D.U.T.
VGS 2200
RG D.U.T. µF 2.7kΩ VG
PW
47kΩ
PW 1kΩ
AM01468v1 AM01469v1
Figure 17. Test circuit for inductive load Figure 18. Unclamped inductive load test
switching and diode recovery times circuit
L
A A A
D
FAST L=100µH VD
G D.U.T. DIODE 2200 3.3
µF µF VDD
S B 3.3 1000
B B µF µF
25 Ω VDD ID
D
RG S
Vi D.U.T.
Pw
AM01470v1 AM01471v1
Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform
90% 90%
IDM
10%
ID 10% VDS
0
mm
Dim
Min Typ Max
A 4.40 4.60
b 0.61 0.88
b1 1.14 1.70
c 0.48 0.70
D 15.25 15.75
D1 1.27
E 10 10.40
e 2.40 2.70
e1 4.95 5.15
F 1.23 1.32
H1 6.20 6.60
J1 2.40 2.72
L 13 14
L1 3.50 3.93
L20 16.40
L30 28.90
∅P 3.75 3.85
Q 2.65 2.95
0015988_Rev_S
mm.
DIM.
min. ty p ma x .
A 2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
b 0.64 0.90
b4 5.20 5.40
c 0.45 0.60
c2 0.48 0.60
D 6.00 6.20
D1 5.10
E 6.40 6.60
E1 4. 70
e 2.28
e1 4.40 4.60
H 9.35 10.10
L 1
L1 2.80
L2 0.80
L4 0.60 1
R 0.20
V2 0o 8o
0068772_G
DPAK FOOTPRINT
6 Revision history
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