Professional Documents
Culture Documents
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• Telecommunications Approvals
• Telecom Switching • UL Recognized Component: File E76270
• Tip/Ring Circuits • CSA Certified Component: Certificate 1172007
• Modem Switching (Laptop, Notebook, Pocket Size) • EN/IEC 60950-1 Certified Component:
• Hook Switch TUV Certificate B 13 12 82667 003
• Dial Pulsing
• Ground Start Ordering Information
• Ringing Injection
• Instrumentation Part # Description
• Multiplexers CPC1025N 4-Pin SOP (100/tube)
• Data Acquisition CPC1025NTR 4-Pin SOP (2000/reel)
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas) Pin Configuration
• Medical Equipment—Patient/Equipment Isolation
1 4
• Security + Control Load
• Aerospace
• Industrial Controls 2 3
– Control Load
Switching Characteristics
of Normally-Open Devices
Form-A
IF
90%
10%
ILOAD
ton toff
DS-CPC1025N-R09 www.ixysic.com 1
INTEGRATED CIRCUITS DIVISION CPC1025N
2 www.ixysic.com R09
INTEGRATED CIRCUITS DIVISION CPC1025N
PERFORMANCE DATA*
Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time
(N=50, IF=5mA) (N=50, IF=5mA, IL=120mA) (N=50, IF=5mA, IL=120mA)
35 25 25
30
20 20
Device Count (N)
20 15 15
15 10 10
10
5 5
5
0 0 0
1.17 1.19 1.21 1.23 1.25 0.50 0.60 0.70 0.80 0.90 1.00 1.10 0.21 0.22 0.23 0.24 0.25 0.26 0.27
LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)
Typical IF for Switch Operation Typical IF for Switch Dropout Typical On-Resistance Distribution
(N=50, IL=120mA) (N=50, IL=120mA) (N=50, IF=2mA, IL=120mA)
25 25 35
30
20 20
Device Count (N)
10 10 15
10
5 5
5
0 0 0
0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.45 0.50 0.55 0.60 0.65 0.70 0.75 23.5 24 24.5 25 25.5 26 26.5
LED Current (mA) LED Current (mA) On-Resistance (:)
30
Device Count (N)
25
20
15
10
0
420 425 430 435 440 445 450
Blocking Voltage (VP)
1.8
1.2
1.6 1.6
Turn-Off Time (ms)
Turn-On Time (ms)
1.4 1.0
1.4 1.2 0.8
I F =50mA
I F =30mA 1.0
1.2 I F =20mA 0.8 0.6
I F =10mA 0.6
I F =5mA 0.4
1.0 0.4
0.2
0.2
0.8 0 0
-40 -20 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50
Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
R09 www.ixysic.com 3
INTEGRATED CIRCUITS DIVISION CPC1025N
PERFORMANCE DATA*
Typical Turn-On Time vs. Temperature Typical Turn-Off Time vs. Temperature Typical On-Resistance vs. Temperature
(IL=80mA) (IL=80mA) (IF=10mA, IL=80mA)
2.0 1.0 60
0.9
50
0.8
On-Resistance (:)
1.5
0.7 40
IF=5mA
0.6
1.0 0.5 30
IF=10mA 0.4
20
0.3
0.5 I F =10mA
0.2 10
0.1
I F =5mA
0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC) Temperature (ºC)
2.0 2.0 50
1.5 1.5 0
0 0 -150
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -3 -2 -1 0 1 2 3
Temperature (ºC) Temperature (ºC) Load Voltage (V)
140
Load Current (mA)
445 0.012
Leakage (µA)
120
0.010
100 440
I F =5mA 0.008
80 435
0.006
60
I F =2mA 430
40 0.004
20 425 0.002
0 420 0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC) Temperature (ºC)
600
0.8
Load Current (A)
500 0.7
0.6
400
0.5
300 0.4
200 0.3
0.2
100 0.1
0 0
0 50 100 150 200 250 300 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Voltage (V) Time
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
4 www.ixysic.com R09
INTEGRATED CIRCUITS DIVISION CPC1025N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles
CPC1025N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
R09 www.ixysic.com 5
INTEGRATED CIRCUITS DIVISION CPC1025N
MECHANICAL DIMENSIONS
CPC1025N
4.089 ± 0.025 Recommended PCB Land Pattern
(0.161 ± 0.001)
0.203 Typ 0.55
(0.008 Typ) (0.022)
330.2 Dia
(13.00 Dia)
W=12.00
Top Cover B0=4.70 (0.472)
Tape Thickness (0.185)
0.102 Max
(0.004 Max)
Dimensions
Embossed mm
Carrier
(inches)
Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1025N-R09
©Copyright 2018, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/30/2018
6