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Sikadur®-42 MP Normal HC
3-PART, MULTI-PURPOSE EPOXY GROUTING SYSTEM
PRODUCT INFORMATION
Chemical base Epoxy resin
Packaging 12 kg (A+B+C): pre-batched unit
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Storage conditions Stored properly in original and unopened, sealed and undamaged pack-
aging, in dry conditions at temperatures between +15 °C and +30 °C. Pro-
tect from direct sun light.
Density 2 130 kg/m3 (A+B+C)
TECHNICAL INFORMATION
Compressive Strength Curing Time +10 °C +23 °C +30 °C
1 days ~25 N/mm2 ~67 N/mm2 ~90 N/mm2
3 days ~75 N/mm2 ~89 N/mm2 ~104 N/mm2
7 days ~85 N/mm2 ~92 N/mm2 ~107 N/mm2
Product cured and tested at temperatures indicated.
Test specimen size: (50 x 50 x 50) mm
Modulus of Elasticity in Compression ~18 000 N/mm2 (ASTM D-695-96)
Modulus of Elasticity in Tension ~13 500 N/mm2 (Tangent modulus of elasticity in bending) (ASTM C-580)
Creep 4.14 N/mm2 (600 psi) / 31 500 N (+60 °C) 1.10 % (ASTM C1181)
2.76 N/mm2 (400 psi) / 21 000 N (+60 °C) 0.21 %
API requirements: 0.5 % with 2.76 N/mm2 load
Tensile Adhesion Strength ~9 N/mm2 (on steel) (ISO 4624, EN 1542 and EN
12188)
>2.0 N/mm2 (concrete failure over k400 con-
crete)
Thermal Compatibility No delamination / pass (ASTM C-884)
Coefficient of Thermal Expansion 2.1 x 10-5 mm/mm/°C (Temp. range -30 °C - +30 °C) (ASTM C531)
2.4 x 10-5 mm/mm/°C (Temp. range +24 °C - +100 °C) (ASTM C531)
2.7 x 10-5 mm/mm/°C (Temp. range -20 °C - +60 °C) (EN 1770)
Heat Deflection Temperature 7 days (+23 °C) HDT: +55 °C (ISO 75)
APPLICATION INFORMATION
Mixing Ratio Part A : B : C = 5 : 1 : 30 by weight (Standard)
Layer Thickness Minimum grout depth : 10 mm
Maximum grout depth : 150 mm
Temperature Layer thickness max.
10 °C - 20 °C 150 mm
20 °C - 30 °C 100 mm*
* no reduction of fillers; apply only with Mixing Ratio A : B : C = 5 : 1 : (30-36)
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Product Temperature Sikadur®-42 MP Normal HC must be applied at temperatures between +15
°C and +30 °C. Condition the material by also storing at this temperature
for 48 hours before use.
Ambient Air Temperature +15 °C min. / +30 °C max.
Dew Point Substrate temperature during application must be at least 3 °C above dew
point to avoid condensation
Substrate Temperature +15 °C min. / +30 °C max.
Substrate Moisture Content ≤ 4% pbw
Pot Life (200g, adiabatic testing)
+10 °C +23 °C
5 : 1 : 30 130 min 75-80 min
The potlife begins when the resin and hardener are mixed. It is shorter at
high temperatures and longer at low temperatures. The greater the quant-
ity mixed, the shorter the potlife. To obtain longer workability at high tem-
peratures, the mixed adhesive may be divided into portions. Another meth-
od is to condition parts A+B and C to lower temperature before mixing
them (i.e. only when application temperatures are above +20 °C).
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A grout box equipped with an inclined trough at- ▪ Avoid splitting pre-batched units to mix. Mix com-
tached to the form will enhance the grout flow and plete units if possible.
minimize air encapsulation. ▪ Cold ambient, substrate or material temperatures
Pour the mixed grout into the prepared forms from will influence the curing and flow characteristics of
one or two sides only, to eliminate air entrapment. Sikadur®-42 MP Normal HC. Do not subject cured
Maintain the liquid head to ensure intimate contact to epoxy grout to sudden temperature changes espe-
the base plate. Place sufficient epoxy grout in the cially during early curing stages. Contact Sika Technic-
forms to rise slightly above the underside (3 mm) of al Services for control joint spacing on large base
the base plate. The minimum void depth beneath the plate grouting projects.
base-plate shall be 12 mm. Where the void beneath ▪ Sikadur® resins are formulated to have low creep un-
the base plate is greater than 150 mm, place the epoxy der permanent loading. However due to the creep
grout in successive 150 mm lifts or less, once the pre- behavior of all polymer materials under load, the
ceding lift has cooled. long term structural design load must account for
Once hardened check the adhesion by tapping with a creep. Generally the long term structural design load
hammer. must be lower than 20-25% of the failure load.
▪ Please consult a structural engineer for load calcula-
CLEANING OF TOOLS tions for your specific application.
Sweep excess grout into appropriate containers for
disposal before it has hardened. Dispose of in accord- BASIS OF PRODUCT DATA
ance with applicable local regulations. All technical data stated in this Data Sheet are based
Uncured material can be removed with Sika Colma on laboratory tests. Actual measured data may vary
Cleaner or Xylene based solvent. Cured material can due to circumstances beyond our control.
only be removed mechanically.
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LEGAL NOTES
The information, and, in particular, the recommenda-
tions relating to the application and end-use of Sika
products, are given in good faith based on Sika's cur-
rent knowledge and experience of the products when
properly stored, handled and applied under normal
conditions in accordance with Sika's recommenda-
tions. In practice, the differences in materials, sub-
strates and actual site conditions are such that no war-
ranty in respect of merchantability or of fitness for a
particular purpose, nor any liability arising out of any
legal relationship whatsoever, can be inferred either
from this information, or from any written recom-
mendations, or from any other advice offered. The
user of the product must test the product’s suitability
for the intended application and purpose. Sika re-
serves the right to change the properties of its
products. The proprietary rights of third parties must
be observed. All orders are accepted subject to our
current terms of sale and delivery. Users must always
refer to the most recent issue of the local Product Data
Sheet for the product concerned, copies of which will
be supplied on request.
Sikadur-42MPNormalHC_en_ID_(08-2017)_1_1.pdf
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