Sony Icd-Px312 px312d px312f px312m

ICD-PX312/PX312D/
PX312F/PX312M
SERVICE MANUAL E Model
ICD-PX312/PX312M
Ver. 1.0 2011.02 Chinese Model
ICD-PX312M
Latin American Model

ICD-PX312D/PX312F
Note:
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
Photo: ICD-PX312
SPECIFICATIONS
IC recorder section FM radio section (ICD-PX312F only) Playback speed control (DPC)
Capacity (User available capacity) Frequency range (ICD-PX312F only) 2.00 times - 0.50 times
2 GB 87.50 MHz - 108.00 MHz
(approx. 1.80 GB = 1,932,735,283 Byte) IF 128 kHz Power output
A part of the memory capacity is used as a 300 mW
management area. Antenna (ICD-PX312F only)
Stereo headphones cord antenna Power requirements
Frequency range Two LR03 (size AAA) alkaline batteries (sup-
SHQ: 75 Hz - 20,000 Hz plied): 3.0 V DC
z
General
zHQ: 75 Hz - 17,000 Hz ICD-PX312/PX312D/PX312F:
Speaker Two NH-AAA-B2KN rechargeable batteries
zSP: 75 Hz - 14,000 Hz
Approx. 28 mm (1 1/8 in) dia. (not supplied): 2.4 VDC
zLP: 75 Hz - 3,500 Hz
ICD-PX312M:
Input/Output Two NH-AAA rechargeable batteries
Bit rate and sampling frequencies for z Microphone jack (minijack, stereo) (not supplied): 2.4 VDC
MP3 files*1
– input for plug in power, minimum input
Bit rate: 32 kbps - 320 kbps, VBR
level Operating temperature
Sampling frequencies:
– 0.6 mV 5˚C - 35˚C (41˚F - 95˚F)
16/22.05/24/32/44.1/48 kHz z Headphone jack (minijack, stereo)
File extension: .mp3
– output for 8 ohms - 300 ohms impedance – Continued on next page –
*1 The playback of MP3 files recorded using headphones
the IC recorder is also supported. Not all • USB connector (USB Mini-B jack)
encoders are supported. – High-Speed USB compatible
• Memory Stick MicroTM (M2TM)/ microSD
memory card slot
IC RECORDER
9-893-081-01
2011B04-1 Sony Corporation
© 2011.02 Published by Sony Techno Create Corporation
ICD-PX312/PX312D/PX312F/PX312M
Dimensions (w/h/d) (not incl. projecting • Microsoft, Windows, Windows Vista and Windows
parts and controls) (JEITA)*2 Media are registered trademarks or trademarks of
Approx. 37.5 mm × 114 mm × 20.9 mm Microsoft Corporation in the United States and/or
(1 1/2 in. × 4 1/2 in. × 27/32 in.) other countries.
• Macintosh and Mac OS are trademarks of Apple
Mass (JEITA)*2 Inc., registered in the USA and other countries.
Approx. 74 g (2 5/8 oz)including LR03 alkaline batteries • Pentium is a registered trademark of Intel
Corporation.
*2 Measured value by the standard of JEITA • MPEG Layer-3 audio coding technology and
(Japan Electronics and Information patents licensed from Fraunhofer IIS and Thomson.
Technology Industries Association) • microSD and microSDHC logos are trademarks of
SD-3C, LLC.
Supplied accessories
IC Recorder (1)
• “Memory Stick Micro,” “M2” and are

trademarks or registered trademarks of Sony
Corporation.
• “MagicGate” is a trademark of Sony Corporation.
Remove the film on the display window • Nuance, the Nuance logo, Dragon, Dragon
before you use the IC recorder. NaturallySpeaking, and RealSpeak are trademarks
Stereo headphones (1) and/or registered trademarks of Nuance
(ICD-PX312: E, Korea/PX312F/PX312M only) Communications Inc., and/or its affiliates in the
United States and/or other countries.
All other trademarks and registered trademarks are

trademarks or registered trademarks of their
respective holders. Furthermore, “TM ” and “®” are
USB connecting cable (1) not mentioned in each case in this manual.
The “Sound Organizer” uses software modules as

shown below:
Windows Media Format Runtime
To connect the IC recorder to a computer,
make sure to use the supplied USB
connecting cable.
Stereo microphone with shirt-clip

(ICD-PX312M only)
LR03 (size AAA) alkaline batteries (2)

P Note (ICD-PX312/PX312D/PX312F only)
When you charge batteries, purchase
NH-AAA-B2KN rechargeable batteries
(not supplied).
P Note (ICD-PX312M only)
When you charge batteries, purchase
commercially-available NH-AAA
rechargeable batteries (not supplied).
Carrying pouch (1)

(Except Latin American model only)
Application software, Sound

Organizer (CD-ROM) (1)
Application software, Dragon

NaturallySpeaking (DVD-ROM)*
(ICD-PX312D only)
Operating Instructions
The operating instructions are stored as PDF
files in the built-in memory of the IC recorder.
* The application software, Dragon

NaturallySpeaking (DVD-ROM) is supplied
with some models in some regions only.
You are cautioned that any changes or

modifications not expressly approved in this
manual could void your authority to operate
this equipment.
Design and specifications are subject to

change without notice.
2
CAUTION TABLE OF CONTENTS

Risk of explosion if battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions. 1. DISASSEMBLY
1-1. Battery Case Lid ............................................................. 4
NOTES ON CHIP COMPONENT REPLACEMENT 1-2. Case Front Assy, Speaker (SP101).................................. 5
• Never reuse a disconnected chip component. 1-3. Complete Main Board ..................................................... 6
• Notice that the minus side of a tantalum capacitor may be dam- 1-4. Liquid Crystal Display Panel (LCD101),
aged by heat. Main Board ..................................................................... 6
FLEXIBLE CIRCUIT BOARD REPAIRING 2. TEST MODE ............................................................ 7

• Keep the temperature of soldering iron around 270 °C during
repairing.
3. DIAGRAMS
• Do not touch the soldering iron on the same conductor of the
3-1. Block Diagram –Main Section– ..................................... 13
circuit board (within 3 times).
3-2. Block Diagram –Power/Display Section– ...................... 14
• Be careful not to apply force on the conductor when soldering
3-3. Printed Wiring Board –Main Section (1/2)– ................... 16
or unsoldering.
3-4. Printed Wiring Board –Main Section (2/2) ..................... 17
3-5. Schematic Diagram –Main Section (1/6)–...................... 18
UNLEADED SOLDER 3-6. Schematic Diagram –Main Section (2/6)–...................... 19
Boards requiring use of unleaded solder are printed with the lead- 3-7. Schematic Diagram –Main Section (3/6)–...................... 20
free mark (LF) indicating the solder contains no lead. 3-8. Schematic Diagram –Main Section (4/6)–...................... 21
(Caution: Some printed circuit boards may not come printed with 3-9. Schematic Diagram –Main Section (5/6)–...................... 22
the lead free mark due to their particular size) 3-10. Schematic Diagram –Main Section (6/6)–...................... 23
: LEAD FREE MARK 4. EXPLODED VIEWS

Unleaded solder has the following characteristics. 4-1. Case (Front) Section ....................................................... 33
• Unleaded solder melts at a temperature about 40 °C higher 4-2. Case (Rear) Section ........................................................ 34
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be 5. ELECTRICAL PARTS LIST .............................. 35
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTE FOR REPLACEMENT OF THE MAIN BOARD

When the main board are exchanged, it is necessary to write the
firmware newly.
Refer to each service headquarters about details.
3
SECTION 1
DISASSEMBLY
• This set can be disassembled in the order shown below.
SET
1-1. BATTERY CASE LID

(Page 4)
1-2. CASE FRONT ASSY,

SPEAKER (SP101)
(Page 5)
1-3. COMPLETE MAIN BOARD

(Page 6)
1-4. LIQUID CRYSTAL DISPLAY PANEL (LCD101),

MAIN BOARD
(Page 6)
Note: Follow the disassembly procedure in the numerical order given.
1-1. BATTERY CASE LID
3 battery case lid
1 claw
2 claw
4
1-2. CASE FRONT ASSY, SPEAKER (SP101)
0 case front assy
9 two claws
8 claw
5 claw
3 claw
7 two claws
6 claw 2 claw
4 claw
1 two screws
qa two tapping screws

(B 2.0)
black
red
qd speaker (SP101)
case front assy
qs Remove the two solders.
5
1-3. COMPLETE MAIN BOARD
3 two screws
1 screw
5 COMPLETE MAIN board
4 Remove the two solders.
case (rear) assy
1-4. LIQUID CRYSTAL DISPLAY PANEL (LCD101), MAIN BOARD
3 connector
4 liquid crystal display panel liquid crystal display panel
(LCD101) (LCD101)
5 holder (LCD)
7 electret cap (MIC) microphone

(MIC101)
2 Remove the solder.
8 MAIN board
6 Remove the two solders.
6
SECTION 2
TEST MODE
[Test Mode] Operation of the Test Mode
The following checks can be implemented using the Test Mode. Select the desired item by using the [>]/[.] button, and press
the [N/ ENT] button to set the selection.
How to Enter the Test Mode
1. Turn the power on. (by inserting batteries) START
2. Slide for HOLD to the [HOLD/POWER] switch while press- After turn on power
ing the [VOL –] button and [x] button at the same time. stop or sleep condition
(NORMAL MODE)
How to Exit the Test Mode
Exit the test mode by turning OFF the power. (by removing the
batteries) Center to the
[HOLD/POWER ON/OFF]switch.
Pressing the [VOL-] and

[x] button at the same time.
Hold to the
[HOLD/POWER ON/OFF] switch.
SERVICE MODE start

MENU display
Release the [VOL-] and

[x] button at the same time.
> <SERVICE MENU>

VERSION
J KEY CHECK
AUDIO LOOP
SIN
BEEP
LCD CONT
LCD PATTERN
RTC TEST
BATT A/D
ZLOAD
LOW DET
VBUS
FM TEST
KEY COUNT
SLEEP
BATT LIFE
CHG LOG
j MENU INIT
. <SERVICE MENU>
Turn off the power

(Remove the batteries)
END
TEST MODE
7
1. Version test • [x]/[– .]/[> +]/[N ENTER]/[z]/[ A-B]/

• Version of the respective modules are verified. [ERASE]/[VOL –]/[VOL +]/[DISP/MENU]/
LCD DISPLAY [ ]/[SCENE]/[T-MARK]/[HOLD ON/OFF]/
[POWER ON/OFF]/[NOISE CUT ON/OFF]
<VERSION> • Key inputs may be done in any desired order.
Please Eenter When a key input is confirmed, the name of the key and the
number of undetected keys are indicated.
B ENTER • Once all the key inputs are confirmed, “ACCESS” is displayed
ICD-PX312/U Model Name starting initialization. After the initialization has been complet-
MAINFW : 1.00.00
Destination ed, the system is rebooted. (The POWER ON state is held.)
FW Version • The status is held with the message “ERROR” displayed. (The
system is not rebooted.)
> + • The transition from this mode to other mode is inhibited.
L : US C0M1R0 Initial Ward • To exit this mode, disconnect power (unplug the battery).
eMMC 15 02GB Charge:
C0(Without)/C1(With) 3. Audio Loop test
• Execute the AUDIO LOOP BACK.
> + Memory Slot:
M0(Without)/M1(With) LCD DISPLAY
FM(AM) Radio: <AUDIO LOOP>
R0(Without)/R1(With)
Please Enter
eMMC Marker Code
eMMC Capacity B ENTER AGC
IPL2FW:1.00.00 IPL2 Version AGC : ON VOR Level

LSI 4252 CPU Version VOR:00000000
VOR value
> +
External microphone:
• Press the [x] button to return to the test mode screen. 10 /00 00:MIC IN
01:AUDIO IN
2. Key Check test
• Perform the key check by pressing the keys.
Internal microphone:
LCD DISPLAY
<KEY CHECK> H M L
Please Enter
• The Audio Loop Back operation is executed.
B ENTER Initial Value: Play VOL = 20/fs = 44.1 kHz/Stereo
The number of keys and slide
switches that are not pressed Microphone Sensitivity: H
<KEY CHECK>
after the transition to KEY External microphone: MIC IN
CHECK is indicated. • When the set is operating, the recording level for VOR is con-
stantly acquired and indicated.
(The level is sampled and held at intervals of 1 second.)
The red LED illuminates when the level is greater than the
19 / VOR set value.
• During operation, change the setting by using the following
key inputs:
The last key that has been pressed [VOL +]: Volume up
is indicated. [VOL –]: Volume down
<KEY CHECK> [REC]: Change microphone sencitivity
KEY : ERASE
(M t L t H t.......)
The counter is decreased by 1 since [PLAY]: External microphone sencitivity
the ERASE key is pressed for the (MIC IN t AUDIO IN t MIC IN t.......)
first time. Thereafter , it will not be
[REW]: ALC operation (ONtOFFtONt.......)
decreased even when the ERASE key
18 / is pressed.
• Other operation by the external microphone jack and head-
phone jack insert/extract signals is based on the operation of
Where 19 is counted down to 0 by
pressing of other keys. The setting is the set.
formatted to the factory setting. • Press the [x] button to return to the test mode screen.
8
4. Sin test 6. LCD Contrast test

• A sine wave output is produced. • Adjust the LCD contrast.
LCD DISPLAY LCD DISPLAY

<SIN> <LCD CONT>
Please Enter Please Enter
B ENTER B ENTER
<LCD CONT>
<SIN>
Vol : E2

key inputs:
10 / [FF]: The contrast value is increased by 1.
(Immediately reflected)
[REW]: The contrast value is decreased by 1.
(Immediately reflected)
[PLAY]: The current value is written to the eMMC.
• A sine wave is outputted. (The default value is updated.)
Initial Value: Play VOL = 20/fs = 44.1 kHz/Stereo • Press the [x] button to return to the test mode screen.
key inputs: Note: When the setting is rewritten, the changed value will be retained.
[VOL +]: Volume up
[VOL –]: Volume down
• Other operation by the headphone jack insert/extract signal is
based on the operation of the set.
• Press the [x] button to return to the test mode screen.
5. Beep test
• Beep sound of 1.3 kHz is output.
LCD DISPLAY
<BEEP>
Please Enter
B ENTER
<BEEP>
1.3KHz ON
VOL value
10 / [ VOL+ ] : UP
[ VOL – ] : DOWN
• When “Beep Test” is entered, a beep sound of 1.3 kHz is out-

putted from the speaker or the headphone jack. (The destina-
tion where the sound is sent to and the output level are based
on the operation of the set.)
9
7. LCD Pattern test • Press the [x] button to return the test mode screen.
• LCD and LED on/off checks and LCD contrast adjustment are
performed. 8. RTC test
• Perform the self test of the RTC module.
LCD DISPLAY
<LCD PATTERN> LCD DISPLAY
Please Enter <RTC TEST>
Please Enter
B ENTER
B ENTER
<RTC TEST>
Please wait.....
The LED is
illuminated orange. 0.9~1.1 sec
<RTC TEST>
OK
• At power-on, optionally an R/W test on the clock register is set

> + and either an interrupt updated by the second or a 1-sec fixed-
cycle interrupt to the RTC module is set. And it is verified that
the interrupt signal is produced.
• If an interrupt occurs in between 0.9 and 1.1 second after the
B c DXLOCAL REC interrupt is enabled to the timer on the main side, it is deter-
. > SCAN HL
The LED is mined to be OK.
188 188
NEW VOR
88
b B
illuminated red. • If no interrupt occurs after the elapse of 2 seconds, a timeout is
set and it is determined to be NG.
9. BATT A/D
• The A/D values related to voltage and temperature are ob-
> +
tained.
LCD DISPLAY
<BATT A/D>
Please Enter
The LED is
illuminated red. B ENTER
, m
EASY-S SHQSPLP AC : 66 2AC : 00
LCF b FULL u
e BC : 65 4BC : 00
> + > +
TEMP : 71
B c DXLOCAL REC
. > SCAN HL
188 188
NEW VOR The LED is AC :Voltage of 2 sell
/
b B
88 illuminated red. BC :Voltage of 1 sell for battery
2AC :Charge X2 amplifier output value
, m 2BC :Charge X4 amplifier output value
EASY-S SHQSPLP TEMP :Temperature
LCF b FULL u
e
• At power-on the relevant A/D value is obtained and indicated.
> + The indicated value is in 8-bit format (2 bits are cut off on the
LSB side and then the bits are shifted.)
• The indicated value is continually updated.
> + The LED is

illuminated green.
10
10. ZLOAD test (Not used in this set) 13. FM test

• A battery load check is forcedly executed. • Operation of the FM tuner is checked.
LCD DISPLAY LCD DISPLAY

<ZLOAD> <FM TEST>
Please Enter Please Enter
B ENTER B ENTER
<ZLOAD> FM : OK DX
ZLOAD : ON 076.00 Lv : 00.50
• The OFF state is set at power-on. • At power-on, optionally the 00h (DeviceID) value of the FM
[FF]: Each time the key is pressed, ZLOAD_CTL switches IC register is obtained and compared.
between ON and OFF. OK: DeviceID, the acquired value is OK.
• Press the [x] button to return to the test mode screen. NG: DeviceID, the acquired value is NG.
• If OK, a transition to the FM receiving mode is made and the
11. LOW DET test (Not used in this set) receiver sensitivity is indicated.
• The H/W low battery level detection signal LOWBATT_ Receiver sensitivity: Register 0 Ah bit [7:0]
XDET is checked. (Value of RSS [7:0] )
Initial value: 80.0 MHz/DX mode
LCD DISPLAY [FF]: The receive step value is increased by 1.
<LOW DET> [REW]: The receive step value is decreased by 1.
Please Enter [PLAY]: Each time the key is pressed, change of receive
sensitivity. (DX t LOCAL t DX t......)
B ENTER • Press the [x] button to return to the test mode screen.
<LOW DET> 14. Key Count test

• The count value is indicated for the key slide switch endurance
LOW DET : OFF test.
• This set is normally off. LCD DISPLAY

• Press the [x] button to return to the test mode screen. <KEY COUNT>
Please Enter
12. VBUS test
• The VBUS signal is checked. B ENTER
LCD DISPLAY <KEY COUNT>

<VBUS> 00000
Please Enter
B ENTER • The count value is increased by 1 each time the following sig-
nal change is detected after power-on. The type of a key slide
<VBUS> switch pressed is not discriminated.
• All buttons (Also the production of the WakeUP signal is
OFF checked.)
OFF : VBUS_XDET=1(H) • Operate all the slide switches from ON to OFF and then OFF
ON : VBUS_XDET=0(L) to ON.
• Card insertion signal (Plus 1 only when the card is inserted.)
• At power-on, the acquired value of VBUS_XDET is indicated. • HP/MIC jack detection signal (Plus 1 only when the jack is
(Constantly updated) inserted.)
• Press the [x] button to return to the test mode screen. Initial value: 00000
Upper limit value: 99999
• If a key is pressed when the counter arrives at the upper limit
of 99999, it is get back to 00000 and continues the count-up
operation.
• To exit this mode, disconnect power unplug the battery.
11
15. Sleep test 18. MENU INIT lnit

• A transition to the sleep state is made for measurement of the • The menu setting is reset to the factory setting.
standby current.
LCD DISPLAY
LCD DISPLAY <MENU INIT>
<SLEEP> Please Enter
Please Enter
B ENTER
B ENTER
<MENU INIT>
<SLEEP> Formatting...
SLEEP : NORMAL
B ENTER Formatting...
SET UP
<MENU INIT>
• A transition to SLEEP state selection is made after power-on.
Succes
[PLAY]: The mode is determined. A transition to SLEEP is
made.
• The transition from this mode to other mode is inhibited. • A transition to the initialization wait state is made after MENU
• To exit this mode, disconnect power (unplug the battery.) INIT.
• When the WakeUP signal is detected, the system is rebooted. [PLAY]: The mode is determined.
The initialization is executed.
16. BATT Lift test • An OK/NG result is displayed.
• A result of measurement made through the battery life mea- • Press the [x] button to return to the test mode screen.
surement F/W is indicated on the LCD.
• It is impossible to check this in service because the measure-
ment FW is required.
17. CHG LOG test (Not used in this set)

• A log for charging held in the SRAM is copied to the eMMC.
LCD DISPLAY
<CHG LOG>
Please Enter
B ENTER
<CHG LOG>
Success
• After power-on, a log for charging is copied to the eMMC.

• An OK/NG result is displayed.
12
SECTION 3
DIAGRAMS
3-1. BLOCK DIAGRAM – MAIN Section –
PX312F
DIGITAL AUDIO CODEC,AMP

IC301
SPP 20 SP101
SPN 19 (SPEAKER)
BROADCAST FM RADIO
TUNER FRONT END HPL 22
IC601
HPR 23
2 FMI LOUT 13 32 LIN3

ROUT 12 33 RIN3
SYSTEM CONTROL
IC104 (1/2)
SDIO 7 5 CSN/SDA TIOCB0/GPIO02/ 96 HP_XDET

SCLK 6 6 CCLK/SCL DMCK0/EXTINT12
RST 4 4 PDN 87 DIN/GPIO1B J302

SDTO 11
RCLK 9 SDTI 8 88 DOUT/GPIO1C i
BICK 10 83 BCK/GPIO19
MCKI 14 82 MCLK/GPIO18
LRCK 9 86 LRCK/GPIO1A
MIC101 2 LIN1/DMDAT
(MIC)
1 MPWR1 POWER
SECTION A VBUS
J301
(Page 14)
34 LIN2
CN801
m 35 RIN2
1 VBUS
PLUG IN
POWER USBDDM 36 2 D–
36 MPWR2 USBDDP 37 3 D+
5 GND
(USB)
CARD_XDET
EXTINT02/GPIO2D 7
I2C-SDA
81 SDA/GPIO08/EXTINT18 CN701
I2C-SCL 1 MS_BS
79 SCL/GPIO07/EXTINT17
AU_TU_XRST SDAT11/DATA1/GPIO25 16 2 MS_VCC/DATA1
99 SDI0/GPIO1E
SDAT10/DATA0/GPIO24 15 3 MS_SDIO/DATA0
32K_CKL 55 PHI/GPIO06/EXTINT16 SDAT12/DATA2/GPIO26 18 4 MS_DATA2
EXTMIC_XDET 5 MS_INS
106 RXD2/GPIO0C/EXTINT1C
SDAT13/DATA3/GPIO27 19 6 MS_DATA3
M2/PLFUR SD
FLASH MEMORY SDCLK1/SCLK/GPIO22 20 7 MS_SCLK
IC204 8 MS_VCC
12 SD_DATA2
13 SD_DATA3
SLJQDO PDWK SDCMD1/BS/GPIO23 14 14 SD_CMD
CMD M5 24 SDCMD0 15 SD_VDD
: AUDIO (ANALOG) Q701
CLK M6 23 SDCLK0 16 SD_CLK
: AUDIO (DIGITAL)
DAT0 A3 25 SDAT00 VDD_REGMSSD 18 SD_DATA0
: MIC 19 SD_DATA1
DAT1 A4 26 SDAT01
: FM DAT2 A5 28 SDAT02
: USB DAT3 B2 29 SDAT03 SDCD1/GPIO20 12 1 MS DETECT
IC701 4
2
13 13
3-2. BLOCK DIAGRAM – POWER/DISPLAY Section –
VDD_REGIO31
LCD_XCS
LCD101 103 SDI1/GPIO0E/EXTINT1E
LCD_A0 OVER VOLTAGE
LIQUID 104 SDO1/GPIO0F/EXTINT1F PROTECT SWITCH
CRYSTAL SPIO_SCLK IC961
98 SCK0/GPIO1D
DISPLAY SPIO_MOSI
101 SDO0/SPIO1F
PANEL CPU_XRST
4
D962 VCONT
MAIN
VDD_REGANA29 SECTION A VBUS 2 VIN VOUT 7
(Page 13)
SYSTEM CONTROL
D101,102 IC104 (2/2)
(OPERATION)
VBUS DETECT
LED 94 RXD1/GPIO05/EXTINT15 Q961 IC962
CONTROL VBUS_XDET BATTERY VOLTAGE
EXTFIQ/GPIO2A 3 1 VOUT VDD 2 SWITCH
Q101,102 93 TXD1/GPIO04/EXTINT14
Q905
VDD_SP
DRY BATTERY
SIZE"AAA"
(IEC DESIGNATION LR03)
2PCS,3V
POWER
CONTROL DC/DC CONVERTER
IC911 IC902
VOLTAGE DETECT REGRTC+1.0V REG +3.1V REG BAT 3

KEY0_AD VDD_REGRTC 10 VOUT
126 AN0 IC103 IC904 IC903
KEY MATRIX LX 2
RTC_VDET
S402-S414 KEY1_AD VDET 71 4 OUT VIN 2 8 FB
125 AN1
EN
XOUT1 46
X102 4
48MHz
KEY WAKEUP XIN1 48 LOW BATTERY
KEY WAKUP VOLTAGE DETECT
SWITCH 5 EXTINT00/GPIO2B
Q401 REGANA+2.9V REG IC901
VDD_REGANA29
IC906
XOUT32K 70
X101 SWITCH
Q903,904 1 VOUT VIN 2
32.768kHz
XIN32K 68 REGADA+1.8V REG
VDD_REGADA18 IC908
AU_PWR_CTL
SCK1/GPIO0D/EXTINT1D 102
REGMSSD+3.1V REG
VDD_REGMSSD
IC910
ON NR SD_PWR_CTL
S401 6 EXTINT01/GPIO2C SDWP1/INS/GPIO21 13
NOISE CUT D965
OFF
D901
REGCORE+1.0V REG VB2
VDD_REGCORE IC905
S941
(HOLD/POWER) VDD_REGADA31
KEY_XHOLD HOLD ON REGIO31+3.1V REG
TCLKA/GPIO00/MPMCADDR11/EXTINT10 53 VDD_REGIO31
IC909
VDD_REGIO31 Q941
HOLD OFF
RESET KEY_POFF_XDET
IC101 59 NTRST TCLKB/GPIO01/MPMCADDR12/EXTINT11 54 POWER ON/OFF
Q942
D944 POWER
VDD_REGIOCORE 61 NRES Q943 SWITCH
D943 Q944,945
RESET RTCINT 72
IC102 73 BACKUPB
PWR_ON D942
SDWP0/GPIO28 31 VDD_REGIO31
HP_MUTE D941
EXTINT04/GPIO2F 9
BATTERY
BATT_AD DETECT
AN2 124
Q902
14 14
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. • Waveforms
(In addition to this, the necessary note is printed in each block.)
– MAIN Board –
For Printed Wiring Boards. For Schematic Diagrams.
Note: Note:
• X : Parts extracted from the component side. • All capacitors are in μF unless otherwise noted. (p: pF) 50 1 IC104 rh (XOUT1)
• Y : Parts extracted from the conductor side. WV or less are not indicated except for electrolytics and
• : Pattern from the side which enables seeing. tantalums.
(The other layers' patterns are not indicated.) • All resistors are in Ω and 1/4 W or less unless otherwise
specified. 0.2 Vp-p
Caution: • f : internal component.
Pattern face side: Parts on the pattern face side seen • C : panel designation.
(SIDE B) from the pattern face are indicated. • A : B+ Line. 48 MHz
Parts face side: Parts on the parts face side seen from • Power voltage is dc 3.0V and fed with regulated dc power
(SIDE A) the parts face are indicated. supply from battery terminal. 0.1 V/DIV, 0.1 ȝsec/DIV
• Voltages are dc with respect to ground under no-signal
• Indication of transistor. (detuned) conditions.
no mark : REC 2 IC104 yk (XIN32K)
(D) C C ( ): PLAY
Q These are Q These are
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 MΩ).
(G) B E (S) omitted. omitted.
B E Voltage variations may be noted due to normal production 0.5 Vp-p
tolerances.
• Waveforms are taken with a oscilloscope.
• Lead layouts Voltage variations may be noted due to normal production 32.768 kHz
surface tolerances.
• Circled numbers refer to waveforms. 0.2 V/DIV, 20 ȝsec/DIV
• Signal path.
F : AUDIO (ANALOG)
L : MIC
g : FM
J : AUDIO (DIGITAL)
c : USB
E : M2/SD
Lead layout of conventional IC CSP (Chip Size Package)
15 15
3-3. PRINTED WIRING BOARD – MAIN Section (1/2) – • : Uses unleaded solder.
14 13 12 11 10 9 8 7 6 5 4 3 2 1
MAIN BOARD (SIDE A)

R942
JL902
IC101 CL908 Q905 B
C963
R943 R949
CL910 Q941 IC103 D963
3 2
C927 C919
IC908 1 6 MIC101
C101
4 C106 S409
1 3 2 C309 (MIC)
1 R106 4 R913 3 4
Q942 2 3 D902
1 CL901 CL802 CL801
C148
S404 B ENTER 3 2 4 5 4 CL303
C965
C102
C103 PLAY/STOP
R944
D944 1 CL111 R105 R912
4
Q944 IC962
C146
–. R104 8 CL301
S408 IC102 4 3
1 CL961 CL302
R407
R103
D962
C702
X101
R962
1 2 IC961 R120
C114
R409 CL904 R702
R411
D941
CL306
C
R946
R117
R405 16 Q961 C139
R964 C302
CL962
3 4 X102
C961
C401
C149
CL966 C941 CL109 CL106
C962
R947
CL304 CL965 C921 Q701
R401 CL112 CL104 CL110 CL105 R301 R329
R210 C136
C137
D966 CN451
Q945 R116 C135
R945
R115
R965 C118
R212
CL107
C914
IC909 5 CL108 C301 R302
R205
D965
C207
SP101
R211
CL401 1 C201
(SPEAKER) R453 10
CL305
R121
R206
R452
D102
3 4
LCD101
R451
S402 C906 R972 S412 C202
C128
R201
R202
R204
R207
R203
R208
R209
C452
R948 LIQUID
IC901 CRYSTAL
D
R973 IC701 SCENS
R119
x DISPLAY
D101
4 3 D964 4 3 PANEL
C454
R416
1 2 CL903 1
C905
DRY BATTERY 51
SIZE “AAA” Q903 R906
R413
R968
R969
R921
D942 CL102 R603 D101,102
C453
R907
R908
C705
IEC DESIGNATION C318 (OPERETION)
C606
LR03 CL907 C925 C605
2PCS,3V Q904 D943
IC204
R414
13 9
R332
4
C917
CL964 1 CL906
C602
C601
C907
R604
S410 2 3 R111
E
R910
Q943 REC/PAUSE L601 1 5

IC906
R904
R902
CL905 CL101
IC601
C203
C928
C327
R122
C208
R911 Q902
R918
S406 C916
IC905
C604
IC911 L602
S411 3 2 Q101
C932
3 2 6 4 R602 R333
>+
R403
1
R412
C147
R410
4 1 3 S407 R601
1 CL103 C603
T-MARK C904 4 R923
C924 IC910 R328 CL601
R905
C901
C920 CL402 CL602

R404
CL909 11
D601
C930
FB303
C913
C104 CL307
JL901 DISP/ MENU C105 R101
1-883-445- (11) F
D901
Note: When IC204, IC601 and IC910 on the Main board are damaged, exchange
the new Main board for the Main board which IC damaged.
16 16
3-4. PRINTED WIRING BOARD – MAIN Section (2/2) – • : Uses unleaded solder.
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A
MAIN BOARD CN801
S941
(SIDE B)
(HOLD/POWER)
(USB)
HOLD > . POWER ON/OFF
CN701
M2/micro SD
S941
R305
1 2 4 5 3
2 CN801
4 J301 12 13 14 15 16 17 18 19 R941
J301 5 1
C304
m
R801
PULUG R309
R803
IN C120
POWER R112
R802
R114
3 R113
C129
C 1
C121
C134 C130 C124
C127
CN701
C320
C122
C322 C117 64 33
C303
R320
C308
C319
65 32
R308
C113
R914
R915
C908
R304
18 10 R108
19 9 R916
R314 R107
6 5
L901
R967
IC301
C325
D IC902
R324
C316
C910
R317 27 1 1 2 3 4 5 6 7 8 9 10 11 (20)(21) 10 1
R315 28 36 R110 IC104
D305
C317 R716
C912
R109 C701 R701
C315
C313 R709 C911
C126
C314
R707
R318 C312 PX312F C915
C306
R712 R704
C307
FB302 FB304 IC904
C909
R708
R713 R703 3 2
C140
C311
R123
R325 C326
2 CL603 Q102 R125 R711 R705 1
CL604 4
4
E J302 C125
R715
R706 D903
1 4
VDR145
96 1 R710
i R418 IC903
C109
97
VDR401
128
R922
2 3
C929
C404 Q401 C405
R319
R336 C107 VDR402

R335 C403
C931
3 VDR143 C138 C131 C110 R402
J302
C704
C922
S414 S405 S403 S413
D304 1 1 2 3
R321
R417
R406
C402
R415
C903
R408
F FB301
S401 11
(11)
FB304 S414
S405 S403
S413 1-883-445-
SHORT CHIP:PX312/PX312D/PX312M ERASE A–B
+ VOL — S401
FERRITE:PX312F
NOISE CUT
ON T OFF
Note: When IC104, IC301 andIC902 on the Main board are damaged, exchange
17 17
3-5. SCHEMATIC DIAGRAM – MAIN Section (1/6) – • See page 15 for Waveforms. See page 24 for IC Block Diagrams. • See page 29 for IC Pin Function Description of IC104.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
(Page 20)
MAIN BOARD (3/6)
4
A
AU_TU_XRST
PCM_MCLK
PCM_DADT
PCM_ADDT
PCM_LRCK
PCM_BCK
I2C_SDA
I2C_SCL
DGND
MAIN BOARD (1/6)
C120 C121
22p 22p
X101
B R112
32.768kHz
220
100
0
R113
4.7M R121
R109
R110
R119
470 2200
CL101 CL102 C117

0.01u C122
SML-D12M8WT86SM
0.1u
SML-D12V8WT86SN
D101
D102
220
220
470
D101,102
VDR145 (OPERATION)
R107
R108
R111
C Q102
0 LSK3541FS8T2L
CL103
3.1
S R123
1.6 1M
3.1
3.1
0.8
1.2
1.6
3.1
1.7
3.1
3.1
3.1
3.1
0.5
0.4
3.1
3
1
0
1
1
1
Q101 0
96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
LSK3541FS8T2L
S R122
TIOCB0
/GPIO02
/DMCK0
/EXTINT12
Vdd1
RXD1/GPIO05/EXTINT15
TXD1/GPIO04/EXTINT14
Vss
Vdd2
TIOCA1/GPIO0A/EXTINT1A
TIOCA0/GPIO09/EXTINT19
DOUT/GPIO1C
DIN/GPIO1B
LRCK/GPIO1A
Vdd2
Vss
BCK/GPIO19
MCLK/GPIO18
SDA/GPIO08/EXTINT18
Vss
SCL/GPIO07/EXTINT17
BMODE2
TEST
Vdd2
Vss
Vdd1
BACKUPB
RTCINT
VDET
XOUT32K
VssRTC
XIN32K
VddRTC
Vdd2
Vss
1M Q101,102
LED CONTROL
TIOCB1
/GPIO03
/DMDIN CL105
D TCK
128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
/EXTINT13
3.1
SPI0_SCLK
3.1
SCK0/GPIO1D
SDI0/GPIO1E
2 TMS
TDI
CL106
CL107
CL111
3.1 MAIN
MAIN 3.1
Vss NRES
1
CPU_XRST
12 BOARD (Page 22)
BOARD
(5/6)
9 SPI0_MOSI
3.1
SDO0/GPIO1F Vdd1
3.1
R115
0
C129
(5/6)
SCK1/GPIO0D/EXTINT1D NTRST CL108
0.01u MAIN
(Page 22) LCD_XCS
3.1
SDI1/GPIO0E/EXTINT1E Vss 32K_CLK 5 BOARD (Page 20)
3.1 (3/6)
LCD_A0 SDO1/GPIO0F/EXTINT1F TDO CL109
TXD2/GPIO0B/EXTINT1B RTCK CL110
3.1 0
EXTMIC_XDET RXD2/GPIO0C/EXTINT1C PHI/GPIO06/EXTINT16 RTC_XINT
3.1 3 MAIN
Vdd2 KEY_POFF_XDET
E VDR143
Vss
TCLKB/GPIO01/MPMCADDR12/EXTINT11
TCLKA/GPIO00/MPMCADDR11/EXTINT10
2.8
KEY_XHOLD 18 BOARD
(6/6)
3.1
HP_XDET AVssDAMPR Vdd2
C124 R120 C146
VDD_VBUS
(Page 23)
ROUT AVssPLL1 0.1u 100 0.1u
C109
0.1u
1
1
AVddDAMPR IC104 VCNT1
0.1
1
MAIN AVddDAMPL IC104 AVddPLL1
0.5 C135 8p
BOARD
(3/6)
8 LOUT
LC823425-12G-H
SYSTEM CONTROL XIN1
R116 X102
AVssDAMPL VssXT1
(Page 20) C110 0.1u
AVssPLL2 1 XOUT1
0.5 1M 48MHz
1 1 R117 100 C136 8p

VCNT2 VddXT1 VDD_REGCORE
R101 3.1
C104 220 MAIN
F 1u AVddPLL2
Vss
AVssUSBPHY
AVddUSBPHY1
1
17 BOARD
(6/6)
C105 1 3.1
VDD_REGIO31
0.01u 3.1
Vdd1 AVddUSBPHY2
0 R114
VDD_REGIO31
(Page 23)
AVddADC USBDEXT12 12k C127
(Page 23) AN5 AVssUSBPHY
0.5% 0.1u
MAIN AU_PWR_CTL AN4 AVssUSBPHY 5 GND CN801
BOARD
(6/6)
15 BATT_AD AN3 AVddUSBPHY2
3.1
R801 R802
CL801
4 ID
1.5 0.1 1M 0
AN2 USBDDP 3 D+
MAIN 3.1 0.1
KEY1_AD AN1 USBDDM 2 D-
BOARD
(5/6)
10 KEY0_AD
3.1
AN0 AVssUSBPHY
R803
0 1 VBUS (USB)
CL802
(Page 22) SDAT10/DATA0/GPIO24
SDAT11/DATA1/GPIO25
SDAT12/DATA2/GPIO26
SDAT13/DATA3/GPIO27
CN801
G AVssADC AVssUSBPHY
SDCLK1/SCLK/GPIO22
3.1 1
SDCMD1/BS/GPIO23
C107 5P
SDWP1/INS/GPIO21
Vdd2 AVddUSBPHY1
EXTINT01/GPIO2C
EXTINT02/GPIO2D
EXTINT00/GPIO2B
EXTINT03/GPIO2E
EXTINT04/GPIO2F
0.1u
EXTFIQ/GPIO2A
SDWP0/GPIO28
SDCD1/GPIO20
SDCD0/GPIO29
C137 C139
VDD_REGIO31 0.1u 0.1u
BMODE0
BMODE1
SDCMD0
SDCLK0
SDAT00
SDAT01
SDAT02
SDAT03
VddSD1
VddSD0
IC101
Vdd2
Vdd1
Vss
Vss
Vss
Vss
IC B/D IC101
PST8428UL RESET
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
3.1 R106
Vss Vout
1
10k
0.1
3.1
3.1
3.1
3
0
3
3
0
3
0
0
0
0
0
0
0
1
0
0
3.1
3.1
3.1
3.1
3.1
3.1
3.1 1.6
Vdd Cd
2
C106
0.0022u
C101
H MAIN
0.1u
C128 C131 C134
BOARD
(5/6)
13 R125
470k
0.1u 0.1u 0.1u
(Page 22) IC102

IC B/D IC102
PST8208UL
RESET
R103 CL112 CL104
3.1 470k
C118
Vout Vss 0.1u
1
3.1 R104 C113

Vin NC
2
220k 0.1u
C149 C125 C126 C130 C138 C140 C147
10u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u
C102 R105
0.1u 0
DGND
I C114
0.1u
IC103 IC B/D
VOLTAGE DETECT
1
GND IC103 OUT
1
1 PST8308UL 0.5
MAIN VDD_REGRTC VIN CD
2
BOARD
(6/6)
14 C103
0.1u
C148
0.01u
DGND
(Page 23)
J
HP_MUTE
SD_PWR_CTL
PWR_ON
VBUS_XDET
KEY_WAKE
KEY_XNR
CARD_XDET
CARD_SDXMS
SD1_CMD
SD1_DATA0
SD1_DATA1
SD1_DATA2
SD1_DATA3
SD1_CKO
SD0_CKO
SD0_CMD
SD0_DATA0
SD0_DATA1
SD0_DATA2
SD0_DATA3
PWR_ON
DGND
VDD_REGIO31
16 11 2
MAIN MAIN
MAIN BOARD (4/6)
1 Note: When IC104 on the Main board are damaged, exchange the new
BOARD BOARD MAIN BOARD (2/6)
(6/6) (5/6) (Page 21) Main board for the Main board which IC damaged.
(Page 23)(Page 22) (Page 19)
18 18
Note: When IC204 on the Main board are damaged, exchange the
new Main board for the Main board which IC damaged.
3-6. SCHEMATIC DIAGRAM – MAIN Section (2/6) –
1 2 3 4 5 6 7 8 9 10
MAIN BOARD (2/6) R212

0
A C201 C202 C203 C208 C207

0.1u 0.1u 0.1u 1u 0.1u
R207 R208 R209 R210 R211
47k 47k 47k 47k 10k
R201 100 SD0_CMD
R202 100 SD0_DATA0
R203 100 SD0_DATA1
R204 100 SD0_DATA2
R205 100 SD0_DATA3
R206 100 SD0_CKO
B 3.1 3.1
M6 M5 A3 A4 A5 B2 B3 B4 B5 B6 C6 P3 P5 M4 N4 J10 K9 E6 F5 C2 H10 K8 E7 P6 G5 N5 C4 P4 N2 A1 A2 A6 A7 A8 A9 A10 A11 A12 A13

CLK
CMD
DAT0
DAT1
DAT2
DAT3
DAT4
DAT5
DAT6
DAT7
VDD
VDD
VDD
VDD
VDD
VDDF
VDDF
VDDF
VDDF
VDDI
Vss
Vss
Vss
Vss
Vss
Vss
Vss
Vss
Vss
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
E14 E13 E12 E10 E9 E8 E5 E3 E2 E1 D14 D13 D12 D4 D3 D2 D1 C14 C13 C12 C11 C10 C9 C8 C7 C5 C3 C1 B14 B13 B12 B11 B10 B9 B8 B7 B1 A14
NC
L2 L3 L12 L13 L14 M1 M2 M3 M7 M8 M9 M10 M11 M12 M13 M14 N1 N3 N6 N7 N8 N9 N10 N11 N12 N13 N14 P1 P2 P7 P8 P9 P10 P11 P12 P13 P14
NC NC
C NC
NC
NC
NC
NC NC
NC NC
NC NC
NC NC
NC NC
NC NC
NC NC
NC NC
D NC
NC
NC
NC
NC NC
NC NC
NC NC
NC
NC
IC204 NC
NC
IC204
NC KLM2G1DEHE-B101T NC
FLASH MEMORY
NC NC
NC NC
CSP
E NC
NC
(CHIP SIZE PACKAGE)
NC
NC
NC NC
NC NC
NC NC
NC NC
NC NC
NC NC
NC NC
VDD_REGIO31
NC NC
F NC
NC
NC
NC PWR_ON
NC NC
NC NC
DGND
NC NC MAIN
NC NC
SD0_DATA0
1 BOARD
(1/6)
SD0_DATA0
SD0_DATA1 (Page 18)
SD0_DATA1
SD0_DATA2
SD0_DATA2
SD0_DATA3
SD0_DATA3
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
SD0_CMD
G
SD0_CMD
SD0_CKO
L1 K14 K13 K12 K10 K7 K6 K5 K3 K2 K1 J14 J13 J12 J5 J3 J2 J1 H14 H13 H12 H5 H3 H2 H1 G14 G13 G12 G10 G3 G2 G1 F14 F13 F12 F10 F3 F2 F1 SD0_CKO
19 19
Note: When IC301 and IC601 on the Main board are damaged, exchange
3-7. SCHEMATIC DIAGRAM – MAIN Section (3/6) – • See page 24 for IC Block Diagrams. • See page 32 for IC Pin Function Description of IC301.
1 2 3 4 5 6 7 8 9 10 11 12 13 14
MAIN BOARD (3/6) R328 R329

VDD_REGIO31
470k 470k MAIN

A EXTMIC_XDET 8 BOARD
(1/6)
CL306
HP_XDET (Page 18)
CL307
3
R317 J302
2.2 FB301 1
FB302 2
R318 4
2.2
R332
10k FB303
EDZFJ-TE61-3.6B
EDZFJ-TE61-3.6B
R324 R325
B 2.2 2.2
D304
D305
C325 C326 C327 R333
0.22u 0.22u 0.1u 0
CL304
SP101
(SPEAKER)
CL305
CL603
C VDD_REGANA29
MAIN
R603 C605
PX312F
7 BOARD (Page 23)
0 0.1u (6/6)
VDD_REGADA31
CL604 MAIN
L601
2.2uH IC B/D 32K_CLK
5 BOARD
2.9
(1/6)
C601
13 12 11 10 9 R604
0
(Page 18)
LOUT
ROUT
GND
VD
RCLK
10u
C606
0.1u
CL601 C602
D 0.001u
2.9 IC601 3.1
VA VIO
16 15 14
8
IC601 3.1
GPO SDIO
7
SI4708-B-GMR
0
NC BROADCAST FM RADIO SCLK
6
CL602 TUNER FRONT END
RFGND
SEN
RST
FMI
NC
1 2 3 4 5
2.9
3.1
E
C604
220p
C603 R602
0.001u 0
R601 L602
2200 270nH
R314 C316
100 0.22u
D601
PX312F JDP2S02AFS, L3SOF(T
F R315
100
C317
0.22u C318
2.2u
C314
2.2u
C319
0.1u
1.8
0.1
0.1
0
0
0
0
0
PX312
/PX312D 27 26 25 24 23 22 21 20 19
/PX312M
CN
CP
VSS3
PVEE
HPR
HPL
DVDD
SPP
SPN
FB304
0
C322
G FB304
C313
1u 2.9 AVDD
0.1u
MAIN
VSS4 VDD_REGADA18
10 11 12 13 14 15 16 17 18
36 35 34 33 32 31 30 29 28
PX312F VSS1 SVDD

3
VDD_SP 6 BOARD
(6/6)
C311 2.2u 2.5 3.1
REGFIL
J301
R302
10k PX312F C312 2.2u 1.2
VCOM IC301
I2C
MCKO
(Page 23)
3
R304 C306 1u 1.2 IC301 0
0 LIN3 AK4953AEN-L MCKI PCM_MCLK
m
1 1u
C307 0.1 DIGITAL AUDIO CODEC,AMP C320 0.1u
2 RIN3 VSS2
1.2 3.1
PLUG IN POWER 4 R305 LIN2 TVDD
0 C308 1u 0.1 1.2 R320 220
RIN2 SDTO PCM_ADDT
C309 1u 0 1.7
R308 R309 MPWR2 BICK PCM_BCK
H C303 C304
4700 4700 CL303
CDTIO/CAD0
C301
LIN1/DMDAT
0.1u 0.001u 0.001u

CCLK/SCL
RIN/MCLK
CSN/SDA
MPWR1
LRCK
SDTI
PDN
1 2 3 4 5 6 7 8 9
0.8
1.6
0
2.3
1.2
2.9
3.1
PCM_LRCK MAIN
PCM_DADT 4 BOARD
(1/6)
I (Page 18)
C315
0.022u R319 R321
R301 2200 2200
2200
I2C_SCL
R335
CL301 0
MI101 I2C_SDA
(MIC) R336
CL302 C302 0
0.001u AU_TU_XRST
J DGND
20 20
3-8. SCHEMATIC DIAGRAM – MAIN Section (4/6) – • See page 24 for IC Block Diagrams.
1 2 3 4 5 6 7 8 9
MAIN BOARD (4/6)

VDD_REGIO31
A R702
470
Q701
RW1A025ZPT2R
0 6 MS POWER SWITCH MAIN
5
2 4
0
VDD_REGMSSD 3 BOARD
(6/6)
1
(Page 23)
C704
3 1u
0 DGND
R701
47k
B CN701
8P IC701 IC B/D
MS_BS 1 IC701
MS_VCC/DATA1 2 TC7SH08FU
MS DETECT R715
MS_SDIO/DATA0 3 OUTY 470k
0
MS_DATA2 4 4 GND 3
3
MS_INS 5 INA 2 CARD_SDXMS
0 3
MS_DATA3 6 5 INB 1
R709 R710 R711 R712 R713 VCC
MS_SCLK 7 47k 47k 47k 47k 47k C705
0.1u
MS_VCC 8
C CN701
MS_VSS
Reserved
9
10
C701
0.1u
R703 220
SD1_DATA0 MAIN
M2/microSD Reserved 11
R704 220
SD1_DATA1 2 BOARD
(1/6)
R705 220
SD_DATA2 12 SD1_DATA2 (Page 18)
R706 220
SD_DATA3 13 SD1_DATA3
R707 220
SD_CMD 14 SD1_CMD
R708 220
SD_VDD 15 SD1_CKO
SD_CLK 16 CARD_XDET
C702
SD_VSS 17 0.1u
SD_DATA0 18
D SD_DATA1 19
(20)
R716
1M
(21)
21 21
3-9. SCHEMATIC DIAGRAM – MAIN Section (5/6) –
1 2 3 4 5 6 7 8 9 10
MAIN BOARD (5/6) Q401

DRA3114Y0L
KEY WAKE UP SWITCH
A R401
10k C403
3.1
R405 R407 R409 R411 R413 R415 R417
CL401 1k 1k 2200 2200 4700 10k 22k 0.1u 3.1
KEY0_AD
VDR401
C401
0.1u
MAIN
BOARD 10 S402 S404 S406 S408 S410 S413 S414
(1/6) R418 C405
(Page 18) - + ENTER A-B ERASE 10k 0.001u
R402 PLAY/STOP REC/PAUSE
10k R410 C404
CL402 R406 R408 R412 R414 R416 0.1u
2200
B KEY1_AD
1k 1k 2200 4700 10k
VDR402
C402
0.1u
S403 S405 S407 S409 S411 S412
- VOL + DISP/ MENU T-MARK SCENS
C
KEY_WAKE
MAIN
BOARD 11 R403
(1/6) 470k S401
(Page 18)
NOISE CUT
D KEY_XNR
R404
1
ON
1k 2
3 OFF
CN451
E C453 1u
10P
1 VG
C454 1u
MAIN 2 XVO
BOARD
(1/6)
12 CPU_XRST
3 V0
(Page 18) 4 VSS LCD101
5 AVDD LIQUID
R451 220 CRYSTAL
SPI0_MOSI 6 SDA DISPLAY
R452 220 PANEL
SPI0_SCLK 7 SCLK
MAIN R453 220
BOARD 9 LCD_A0 8 A0
(1/6) 9 RSTB
(Page 18)
F LCD_XCS 10 CSB
C452
0.1u
MAIN VDD_REGIO31
BOARD
(1/6)
13 DGND
(Page 18)
22 22
3-10. SCHEMATIC DIAGRAM – MAIN Section (6/6) – • Refer to page 24 for IC Block Diagrams.
1 2 3 4 5 6 7 8 9 10 11 12 13 14
MAIN BOARD (6/6) 3.3

VOUT IC911 GND IC911 IC B/D
4
3.3 PST8117UL
VDD NC POWER CONTROL
A
3
C932
CL966 0.1u
TOTAL CURRENT
IC902 IC B/D
PLAY:10.5mA
REC:11mA
DC/DC CONVERTER IC903 IC B/D
STOP:5.8mA C908 10u 16V 3.3 +3.1V REG
FF:13mA PGND VOUT R914
10
C912
1
FR:13mA
3 0 10p 100k 3.3 3.3 D903
Lx IC902 MODE 0.5% CE IC903 VDD
4
JL901 VDD_BATT L901 4.7uH 3 0.5 2.8
DA2J10100L
XC9129D45CDR MM3273BURE
BAT FB GND VOUT
3
2.8 R915 R922
EN AGND 330k C922 100 C929 C931
7
GND
R967 0.5% 1u 100u 47u
NC NC 0 6.3V 6.3V
6
R905
100k R906 C906 11 R916
0.5% 220u C909 C911 68k
B C904
10k 10V 22u
16V
C910
10u
16V
10u
16V
0.5%
0.1u
Q902
LSK3541FS8T2L
Q904
RZM002P02T2L 2.8 2.8
IC904 IC B/D CL903
D964
BATTERY DETECT SWITCH CE IC904 VDD REGRTC +1V REG
4
DRY BATTERY
R902
1.4
IC901 IC B/D 2.8 2.8
RR264M-400
GND MM3271AURE VOUT
1
VDD_REGRTC
( ) MAIN
3
SIZE AAA 100 3.1 S
IC901
14
C901 C915
IEC DESIGNATION 0.1u PST8216UL R907 R910 1u BOARD
S 15k 1M CL964 (1/6)
RB160M-30TR
LR03 LOW BATTERY VOLTAGE DETECT 0 DGND
2PCS,3V C905 (Page 18)
D966
1.4 0.1u 3 R908 C907 R911
NC VIN
2
47k 0.1u 470k
VSS VOUT
3 3
IC909 IC909 IC B/D
1
R973 R972 RP114N311D-TR-FE CL904
C903 S REGIO +3.1V REG
0.1u Q903 10k 0
VOUT
C LSK3541FS8T2L D901 3.3
VCC
3.1
VDD_REGIO31
5
R904 SWITCH DB2J31700L
R923
100k GND
2
0.5% 2.8 C921 0
CL965 C914
D965 CE 1u 47u
4
NC 6.3V
JL902 RR264M-400
MAIN
IC905 IC B/D 17 BOARD
VB2
(1/6)
REGCORE +1V REG
(Page 18)
D 2.8 2.8
CL905
CE IC905 VDD
4
MM3404A10URE 1
GND VOUT VDD_REGCORE
3
C916 C924
1u 1u
BATT_AD
IC906 IC B/D
HP_MUTE
KEY_XHOLD
PWR_ON
RTC_XINT
KEY_POFF_XDET
REGANA +2.9V REG

Q945 3.1 3.3
CL906
R943 R944 CE VDD
RZM002P02T2L IC906
4
1M 470k
E R941
R945
REGULATOR ENABLE SWITCH
GND MM3404A29URE VOUT
2.9
VDD_REGANA29
3
1k 10k 2.8 2.8 LDO_EN
S C917 C925
3.1 1u 1u
S941 Q941
LSK3541FS8T2L D941
(HOLD/POWER) 3.1 0
HOLD DETECT 2.8
DA2J10100L
R947 MAIN
7
6
HOLD ON
1 0 Q943 1M BOARD
2 DRA3114Y0L R968 D942 (3/6)
4 R949 S INVERTER 0
47k DA2J10100L
HOLD OFF
5
3
1k
R942 CL907
(Page 20)
1M 3
POWER ON/OFF R969 D943
0
7
47k DA2J10100L VDD_REGADA31

Q942
DRC3144E0L Q944
CL910 RUM002N02T2L
POWER SWITCH DETECT
F D944
DA2J10100L
SWITCH
2.8
0
R948
C941 R946 S 1M
0.1u 1M
IC908 IC B/D
REGADA +1.8V REG
3.1 3.3
CL908
CE IC908 VDD
4
AU_PWR_CTL MM3404A18URE 1.8
IC961 IC B/D GND VOUT VDD_REGADA18
MAIN
3
OVER VOLTAGE PROTECT SWITCH IC962 IC B/D C919
1u
C927
1u
6 BOARD
(3/6)
CL961 IC962 VDD_SP
D962
NC NC R962
PST8134UL
R965
R921
(Page 20)
G
1
DB2J31700L VBUS DETECT 470k

0 0 0 470k
VDD_VBUS Vin IC961 Vout IC910 IC910 IC B/D
2
0 0 S-1137A31-I6T2G CL909
GND TK77335AM4 NC Q961
REGMSSD +3.1V REG
3
0 0 2 1 LSK3541FS8T2L
C961 Vcont Np INVERTER VDD_REGMSSD
4
CL962
VDD
VOUT
0.1u 3 0 0
C965 3 2 1
0.1u 0
SSC
VSS
VOUT
C913 C920
C962 1u 10u
GND
S
R964
NC
0.1u D963 C963

DA2J10100L 0.47u 470k
VSS
C930 MAIN
VIN
CE
3 4
MAIN
BOARD 18
0.01u
4 5 6 3 BOARD
(4/6)
(1/6)
H (Page 18) SD_PWR_CTL 0 3.3
(Page 21)
VBUS_XDET
R918 C928
470k 1u
DGND
VDD_REGIO31
KEY_XHOLD
KEY_XHOLD
KEY_POFF_XDET Q905
KEY_POFF_XDET
RTC_XINT R912 RW1A025ZPT2R
RTC_XINT 0 BATTERY VOLTAGE SWITCH CL901
1
MAIN BATT_AD 3 2 3
BATT_AD
BOARD 15 AU_PWR_CTL
AU_PWR_CTL
5
6
4
I (1/6)
(Page 18) HP_MUTE
3
0
HP_MUTE
MAIN PWR_ON R913 D902
PWR_ON
BOARD
(1/6)
16 VBUS_XDET
VBUS_XDET
470k RR264M-400
SD_PWR_CTL
(Page 18) SD_PWR_CTL
Note: When IC902 and IC908 on the Main board are damaged, exchange
23 23
• IC Block Diagrams
IC101 PST8428UL (MAIN Board (1/6)) IC601 SI4708-B-GMR (MAIN Board (3/6))
GPO
NC
VA
VSS 1
16 15 14
VREF GPIO
LOW-IF
NC 1
+
–
I
DAC 13 LOUT
FMI 2 ADC
4 VOUT LNA PGA DSP
RFGND 3 Q
VDD 2 3 CD DAC 12 ROUT
ADC
AGC
11 GND
0/90
REG
10 VD
AFC TUNE 9 RCLK
IC102 PST8208UL (MAIN Board (1/6)) RST

CONTROL
IC901 PST8216UL (MAIN Board (6/6)) RST 4 INTERFACE
SEN 5
2 VIN
6 7 8
VIO
SDIO
SCLK
1 VOUT
Vref
NC 3
VSS 4 IC701 TC7SH08FU (MAIN Board (4/6))
INB 1 5 VCC
INA 2
GND 3 4 OUTY
IC103 PST8308UL (MAIN Board (1/6))
GND 1
VIN 2
RD
–
+ 4 OUT
VREF
3 CD
24 24
IC902 XC9129D45CDR (MAIN Board (6/6))
6 NC
7 AGND
8 FB
9 MODE
PHASE CURRENT SENSE,

COMPENSATION LIMIT,PFM
ERROR AMP PWM 10 VOUT

NC 5 COMPARATOR
PWM/PFM BUFFER
CONTROLLER,LOGIC DRIVER
VREF WITH
SOFT START RAMP WAVE
OSC MODE
GENERATOR
EN.
EN 4
THERMAL SHUTDOWN
BAT 3
LX 2
PGND 1
IC903 MM3273BURE (MAIN Board (6/6))
4 VDD
3 VOUT
CE 1 BIAS
–
+
VREF CURRENT
LIMIT
GND 2
25
IC904 MM3271AURE (MAIN Board (6/6))
4 VDD
3 VOUT
CE 1 BIAS
–
+
VREF CURRENT
LIMIT
GND 2
IC905 MM3404A10URE (MAIN Board (6/6))

4 VDD
CE 1 BIAS
VOLTAGE
–
REFERENCE
+
CURRENT
LIMIT 3 VOUT
GND 2
IC909 RP114N311D-TR-FE (MAIN Board (6/6))
VCC 1 5 VOUT
GND 2
VREF
CURRENT
LIMIT
4 NC
CE 3
26
IC910 S-1137A31-I6T2G (MAIN Board (6/6))
6 VIN
VOUT 1
OVERCURRENT
PROTECT CIRCUIT
POWER OFF
CIRCUIT
VSS 2
SOFT START 5 VSS

SSC 3
CIRCUIT
REFERENCE
VOLTAGE
CIRCUIT
4 CE
VOUT 1
VDD 2
–
+
VREF
4 GND
3 NC
27
IC961 TK77335AM4 (MAIN Board (6/6))
NC 1
8 NC
VIN 2 7 VOUT
VREF
ON/OFF
CONTROL 6 NC
GND 3
THERMAL
&
OVER CURRENT
PROTECTION
Nȍ 5 NP
VCONT 4
VOUT 1
VDD 2
–
+
VREF
4 GND
3 NC
28
• IC Pin Function Description
MAIN BOARD (1/6) IC104 LC823425-12G-H (SYSTEM CONTROL)

Pin No. Pin Name I/O Description
1 BMODE0 — Boot mode select terminal
3 EXTFIQ/GPIO2A I Interrupt signal input from VBUS detect
4 VSS — Ground terminal
5 EXTINT00/GPIO2B I Interrupt signal input from Key detect
6 EXTINT01/GPIO2C I Interrupt signal input from Low battery detect
7 EXTINT02/GPIO2D I Interrupt signal input from MS/SD card detect
8 EXTINT03/GPIO2E I Interrupt signal input from Key (DPC) detect
9 EXTINT04/GPIO2F O Headphone muting signal output
10 VDD2 — Power supply terminal (+3.1V)
12 SDCD1/GPIO20 I SD card detect signal input
13 SDWP1/INS/GPIO21 O SD card power control signal output
14 SDCMD1/BS/GPIO23 O SD CMD/MS BS signal output
SDAT10/DATA0/
15 I/O SD/MS data bit0 input/output
GPIO24
SDAT11/DATA1/
GPIO25
17 VDDSD1 — Power supply terminal (+3.1V)
SDAT12/DATA2/
GPIO26
SDAT13/DATA3/
GPIO27
SDCLK1/SCLK/
20 O SD/MS clock output
GPIO22
22 VDD1 — Power supply terminal (+1V)
23 SDCLK0 O FLASH Memory clock output
24 SDCMD0 O FLASH Memory command data output
25 SDAT00 I/O FLASH Memory data bit0 input/output
27 VDDSD0 — Power supply terminal (+3.1V)
30 SDCD0/GPIO29 — Not used. (Open)
31 SDWP0/GPIO28 O POWER control signal output
33 AVDDUSBPHY1 — Power supply terminal (+1V)
34 AVSSUSBPHY — Ground terminal
36 USBDDM I/O USB port serial data input/output
37 USBDDP I/O USB port serial data input/output
38 AVDDUSBPHY2 — Power supply terminal (+3.1V)
41 USBDEXT12 — USB-PHY reference resister terminal
42 AVDDUSBPHY2 — Power supply terminal (+3.1V)
43 AVDDUSBPHY1 — Power supply terminal (+1V)
45 VDDXT1 — Power supply terminal (+1V)
46 XOUT1 O Crystal output for main clock (48MHz)
47 VSSXT1 — Ground terminal
48 XIN1 I Crystal input for main clock (48MHz)
49 AVDDPLL1 — Power supply terminal (+1V)
50 VCNT1 I PLL1 VCO control signal input
51 AVSSPLL1 — Ground terminal
29

TCLKA/GPIO00/
53 MPMCADDR11/ I HOLD switch signal input
EXTINT10
TCLKB/GPIO01/
54 MPMCADDR12/ I POWER switch signal input
EXTINT11
PHI/GPIO06/
55 O TUNER 32kHz clock output
EXTINT16
56 RTCK — Not used. (Open)
57 TDO — Not used. (Open)
59 NTRST I System reset signal input
61 NRES I System reset signal input
62 TDI — Not used. (Open)
63 TMS — Not used. (Open)
64 TCK — Not used. (Open)
67 VDDRTS — Power supply terminal (+1V)
68 XIN32K I Crystal input for sub clock (32.768kHz)
69 VSSRTS — Ground terminal
70 XOUT32K O Crystal output for sub clock (32.768kHz)
71 VDET I RTC power detect signal input
72 RTCINT O RTC interrupt signal output
73 BACKUPB I BACKUP signal input
77 TEST — Not used. (Connected to ground.)
SCL/GPIO07/
79 O I2C clock output to TUNER/CODEC
EXTINT17
SDA/GPIO08/
81 I/O I2C data input/output to TUNER/CODEC
EXTINT18
82 MCLK/GPIO18 O Master clock output
83 BCK/GPIO19 O Bit clock output to CODEC
86 LRCK/GPIO1A O Channel clock output
87 DIN/GPIO1B I Audio serial data input
88 DOUT/GPIO1C O Audio serial data output
TIOCA0/GPIO09/
89 O ZLOAD control signal output Not used. (Open)
EXTINT19
TIOCA1/GPIO0A/
90 O LCD Back light control signal output Not used. (Open)
EXTINT1A
TXD1/GPIO04/
93 O OPT LED (RED) drive control signal output
EXTINT14
RXD1/GPIO05/
94 O OPT LED (GRN) drive control signal output
EXTINT15
TIOCB0/GPIO02/
96 I Headphone detect signal input
DMCK0/EXTINT12
TIOCB1/GPIO03/
97 O ZLOAD control signal output Not used. (Open)
DMDIN/EXTINT13
98 SCK0/GPIO1D O LCD serial clock output
99 SDI0/GPIO1E O TUNER/CODEC reset signal output
101 SDO0/GPIO1F O LCD serial data output
30

SCK1/GPIO0D/
102 O POWER control signal output
EXTINT1D
SDI1/GPIO0E/
103 O LCD chip select signal output
EXTINT1E
SDO1/GPIO0F/
104 O LCD A0 data output
EXTINT1F
TXD2/GPIO0B/
105 O Charge enable clock output Not used. (Open)
EXTINT1B
RXD2/GPIO0C/
106 I EXT MIC detect signal input
EXTINT1C
109 AVSSDAMPR — Ground terminal
110 ROUT O DAMP R-CH signal output Not used. (Open)
111 AVDDDAMPR — Power supply terminal (+1V)
112 AVDDDAMPL — Power supply terminal (+1V)
113 LOUT O DAMP L-CH signal output Not used. (Open)
114 AVSSDAMPL — Ground terminal
115 AVSSPLL2 — Ground terminal
116 VCNT2 I PLL2 VCO control signal input
117 AVDDPLL2 — Power supply terminal (+3.1V)
120 AVDDADC — Power supply terminal (+3.1V)
121 AN5 I Not used. (Open)
124 AN2 I Battery level input
125 AN1 I KEY1 AD signal input
126 AN0 I KEY0 AD signal input
127 AVSSADC — Ground terminal
31
MAIN BOARD (3/6) IC301 AK4953AEN-L (DIGITAL AUDIO CODEC, AMP)

1 MPWR1 O MIC Power supply output
2 LIN1/DMDAT I INT MIC L-CH Analog signal input
3 RIN/MCLK I INT MIC R-CH Analog signal input Not used. (Open)
4 PDN I Reset signal input
5 CSN/SDA I/O Control serial data input/output
6 CCLK/SCL I Control serial clock input
7 CDTIO/CAD0 — Not used. (connected to ground.)
8 SDTI I Audio serial data input
9 LRCK I/O Channel clock input/output
10 BICK I/O Audio serial data clock input/output
11 SDTO O Audio serial data output
12 TVDD — Power supply terminal (+3.1V)
13 VSS2 — Ground terminal
14 MCKI I External Master clock input
15 MCKO — Not used. (Open)
16 I2C — Not used. (Connected to VDD.)
17 SVDD — Power supply terminal (+3V)
19 SPN O Speaker-AMP output
20 SPP O Speaker-AMP output
21 DVDD — Power supply terminal (+1.8V)
22 HPL O Headphone-AMP output
23 HPR O Headphone-AMP output
24 PVEE O Charge-Pump circuit negative voltage output
26 CP O Charge-Pump capacitor terminal
27 CN I Charge-Pump capacitor terminal
28 AVDD — Power supply terminal (+2.9V)
30 REGFIL O Regulator ripple filter terminal
31 VCOM O Common voltage output
32 LIN3 I Tuner L-CH Analog signal input
33 RIN3 I Tuner R-CH Analog signal input
34 LIN2 I EXT MIC L-CH Analog signal input
35 RIN2 I EXT MIC R-CH Analog signal input
36 MPWR2 O MIC Power supply outout
32
SECTION 4
EXPLODED VIEWS
Note:
• -XX and -X mean standardized parts, so • The mechanical parts with no reference • Abbreviation
they may have some difference from the number in the exploded views are not sup- CH : Chinese model
original one. plied. KR : Korea model
• Items marked “*” are not stocked since • Color Indication of Appearance Parts Ex- LA : Latin American model
they are seldom required for routine ser- ample:
vice. Some delay should be anticipated KNOB, BALANCE (WHITE) . . . (RED)
when ordering these items. ↑ ↑
Parts Color Cabinet’s Color
4-1. CASE (FRONT) SECTION
SP101
3
case (rear) section
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 9-885-154-69 CASE (FRONT) ASSY (for SERVICE) 4 3-034-792-11 SCREW, TAPPING (B2.0)
2 4-258-796-11 BUTTON (FRONT) 5 3-254-083-01 SCREW
3 4-258-805-11 BUTTON (TRACK MARK) SP101 1-858-034-13 SPEAKER (2.8 cm)
33
4-2. CASE (REAR) SECTION
65
68
LCD101
66
69
65 67
70
62
64 51
MIC101
63
61
60
52
59
58
53
54
56
57
55
51 4-266-327-01 CUSHION (MIC) 64 9-885-154-86 MAIN BOARD, COMPLETE (for SERVICE) (E)
52 4-258-795-11 BUTTON (VOL) 64 9-885-154-87 MAIN BOARD, COMPLETE (for SERVICE) (KR)
53 4-258-798-11 KNOB (NOISE CUT) 64 9-885-154-88 MAIN BOARD, COMPLETE (for SERVICE)
54 4-258-791-21 CASE (REAR) (PX312/PX312D/PX312M: E) (PX312: LA/PX312D)
54 4-258-791-31 CASE (REAR) (CH) 64 9-885-154-89 MAIN BOARD, COMPLETE (for SERVICE) (CH)
64 9-885-154-92 MAIN BOARD, COMPLETE (for SERVICE)
54 4-258-791-41 CASE (REAR) (PX312F) (PX312F)
55 4-258-792-11 LID, BATTERY CASE
56 4-279-755-01 CUSHION (BATTERY CASE LID) 65 3-254-083-01 SCREW
57 4-258-801-01 TERMINAL (+), BATTERY 66 4-258-803-01 HOLDER (LCD)
58 4-258-800-01 TERMINAL (+/–), BATTERY 67 4-270-488-01 SHEET (INSULATING)
68 4-258-797-01 PLATE, LIGHT GUIDE
59 4-258-802-01 TERMINAL (–), BATTERY 69 4-270-487-01 SHEET (LEAF, COPPER)
60 4-258-794-11 KNOB (POWER)
61 4-258-799-11 LID, SLOT 70 4-275-383-01 SHEET (INSULATING) (B)
62 4-261-485-01 CHASSIS LCD101 1-811-336-11 DISPLAY PANEL, LIQUID CRYSTAL
63 4-261-340-01 SHEET (NOISE CONTROL) (PX312F) MIC101 1-542-866-11 MICROPHONE, ELECTRET CAP (MIC)
34
SECTION 5
MAIN
ELECTRICAL PARTS LIST
Note:
• Due to standardization, replacements in • COILS
When indicating parts by reference num-
the parts list may be different from the uH: μH
ber, please include the board name.
parts specified in the diagrams or the com- • RESISTORS
ponents used on the set. All resistors are in ohms. • Abbreviation
• -XX and -X mean standardized parts, so METAL: Metal-film resistor. CH : Chinese model
they may have some difference from the METAL OXIDE: Metal oxide-film resistor. KR : Korea model
original one. F: nonflammable LA : Latin American model
• Items marked “*” are not stocked since • SEMICONDUCTORS
they are seldom required for routine ser- In each case, u: μ, for example:
vice. Some delay should be anticipated uA. . : μA. . , uPA. . , μPA. . ,
when ordering these items. uPB. . : μPB. . , uPC. . , μPC. . ,
• CAPACITORS uPD. . : μPD. .
uF: μF
9-885-154-86 MAIN BOARD, COMPLETE (for SERVICE) (E) C202 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
9-885-154-87 MAIN BOARD, COMPLETE (for SERVICE) (KR) C203 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
9-885-154-88 MAIN BOARD, COMPLETE (for SERVICE) C207 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
(PX312: LA/PX312D) C208 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
9-885-154-89 MAIN BOARD, COMPLETE (for SERVICE) (CH) C301 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
9-885-154-92 MAIN BOARD, COMPLETE (for SERVICE)
(PX312F) C302 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
******************** C303 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C304 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
< CAPACITOR > C306 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
(PX312F)
C101 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V C307 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C102 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V (PX312F)
C104 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C308 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C105 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V C309 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C311 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C106 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 50V C312 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C107 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V C313 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C120 1-164-858-11 CERAMIC CHIP 22PF 5% 50V C319 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C121 1-164-858-11 CERAMIC CHIP 22PF 5% 50V C320 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
* C453 1-112-298-91 CERAMIC CHIP 1uF 10% 16V
C135 1-164-848-11 CERAMIC CHIP 8PF 0.5PF 50V C454 1-114-246-11 CERAMIC CHIP 1uF 20% 25V
C136 1-164-848-11 CERAMIC CHIP 8PF 0.5PF 50V C601 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
(PX312F)
C147 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V C604 1-164-933-11 CERAMIC CHIP 220PF 10% 50V
C149 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V C605 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
(PX312F)
35
MAIN
C606 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V D964 6-501-119-01 DIODE RR264M-400
(PX312F) D965 6-501-119-01 DIODE RR264M-400
C701 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V D966 8-719-081-34 DIODE RB160M-30TR
C704 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V < FERRITE BEAD >
FB301 1-469-084-21 INDUCTOR, FERRITE BEAD (1005)
C901 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V FB302 1-469-084-21 INDUCTOR, FERRITE BEAD (1005)
C903 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V FB303 1-481-466-11 BEAD, FERRITE (1608)
C904 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V FB304 1-218-990-81 SHORT CHIP 0 (PX312/PX312D/PX312M)
C905 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V FB304 1-469-084-21 INDUCTOR, FERRITE BEAD (1005) (PX312F)
C906 1-126-923-91 ELECT 220uF 20% 10V
< IC >
C908 1-137-910-11 TANTAL. CHIP 10uF 20% 16V IC101 6-715-659-01 IC PST8428UL
C911 1-137-910-11 TANTAL. CHIP 10uF 20% 16V IC104 (Not supplied) IC LC823425-12G-H
IC204 (Not supplied) IC KLM2G1DEHE-B101T
C912 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
C913 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC301 (Not supplied) IC AK4953AEN-L
C914 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC601 (Not supplied) IC SI4708-B-GMR (PX312F)
C915 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC701 6-706-487-01 IC TC7SH08FU
C916 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC901 6-715-605-01 IC PST8216UL
IC902 (Not supplied) IC XC9129D45CDR
C917 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C919 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC903 6-713-367-01 IC MM3273BURE
C920 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V IC904 6-716-440-01 IC MM3271AURE
C921 1-100-539-91 TANTAL. CHIP 47uF 20% 6.3V IC905 6-716-443-01 IC MM3404A10URE
C922 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC906 6-716-442-11 IC MM3404A29URE
IC908 6-714-743-01 IC MM3404A18URE
C924 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C925 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC909 6-715-803-01 IC RP114N311D-TR-FE
C927 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC910 (Not supplied) IC S-1137A31-I6T2G
C928 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V IC911 6-716-896-01 IC PST8117UL
C929 1-128-964-91 TANTAL. CHIP 100uF 20% 6.3V IC961 6-711-822-01 IC TK77335AM4
IC962 6-716-909-01 IC PST8134UL
C931 1-100-539-91 TANTAL. CHIP 47uF 20% 6.3V < JACK >
C941 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V J301 1-822-040-21 JACK (m PLUG IN POWER)
C961 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V J302 1-822-040-31 JACK (i)
C962 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V < COIL >
C965 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V L601 1-481-537-21 INDUCTOR 2.2uH (PX312F)
L602 1-481-197-21 INDUCTOR 270nH (PX312F)
< CONNECTOR > L901 (Not supplied) INDUCTOR 4.7uH
CN451 1-573-919-61 CONNECTOR, FFC/FPC (ZIF) 10P < TRANSISTOR >

CN701 (Not supplied) CONNECTOR, CARD MS-MICRO/SD-MICRO 19P
(M2/microSD) Q101 6-551-346-01 FET LSK3541FS8T2L
CN801 1-822-903-21 CONNECTOR, SQUARE TYPE (USB) 5P (USB) Q102 6-551-346-01 FET LSK3541FS8T2L
Q401 6-552-342-01 TRANSISTOR DRA3114Y0L
< DIODE > Q701 6-552-662-01 FET RW1A025ZPT2R
Q902 6-551-346-01 FET LSK3541FS8T2L
D101 6-502-197-01 LED SML-D12M8WT86SM (OPERATION)
D102 6-502-193-01 LED SML-D12V8WT86SN (OPERATION) Q903 6-551-346-01 FET LSK3541FS8T2L
D304 6-501-523-01 DIODE EDZFJ-TE61-3.6B Q904 6-552-322-01 FET RZM002P02T2L
D305 6-501-523-01 DIODE EDZFJ-TE61-3.6B Q905 6-552-662-01 FET RW1A025ZPT2R
D601 6-503-331-01 DIODE JDP2S02AFS,L3SOF(T (PX312F) Q941 6-551-346-01 FET LSK3541FS8T2L
* Q942 6-552-354-01 TRANSISTOR DRC3144E0L
D901 6-503-058-01 DIODE DB2J31700L
D902 6-501-119-01 DIODE RR264M-400 Q943 6-552-342-01 TRANSISTOR DRA3114Y0L
D903 6-502-961-01 DIODE DA2J10100L * Q944 6-552-493-01 FET RUM002N02T2L
D941 6-502-961-01 DIODE DA2J10100L Q945 6-552-322-01 FET RZM002P02T2L
D942 6-502-961-01 DIODE DA2J10100L Q961 6-551-346-01 FET LSK3541FS8T2L
D943 6-502-961-01 DIODE DA2J10100L < RESISTOR >

D944 6-502-961-01 DIODE DA2J10100L
D962 6-503-058-01 DIODE DB2J31700L R101 1-218-945-11 METAL CHIP 220 5% 1/16W
D963 6-502-961-01 DIODE DA2J10100L R103 1-218-985-11 METAL CHIP 470K 5% 1/16W
Note: When IC104, IC204, IC301, IC601, IC902 and IC910 on the Main board are
damaged, exchange the new Main board for the Main board which IC damaged.
36
MAIN
R104 1-218-981-91 METAL CHIP 220K 5% 1/16W R408 1-218-953-11 METAL CHIP 1K 5% 1/16W
R105 1-218-990-81 SHORT CHIP 0 R409 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R106 1-218-965-11 METAL CHIP 10K 5% 1/16W R410 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R107 1-218-945-11 METAL CHIP 220 5% 1/16W R411 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R111 1-218-949-11 METAL CHIP 470 5% 1/16W R415 1-218-965-11 METAL CHIP 10K 5% 1/16W
R112 1-218-990-81 SHORT CHIP 0 R416 1-218-965-11 METAL CHIP 10K 5% 1/16W
R113 1-243-975-11 METAL CHIP 4.7M 5% 1/16W R417 1-218-969-11 METAL CHIP 22K 5% 1/16W
R114 1-208-709-11 METAL CHIP 12K 0.5% 1/16W R418 1-218-965-11 METAL CHIP 10K 5% 1/16W
R115 1-218-990-81 SHORT CHIP 0 R451 1-218-945-11 METAL CHIP 220 5% 1/16W
R116 1-218-989-11 METAL CHIP 1M 5% 1/16W R452 1-218-945-11 METAL CHIP 220 5% 1/16W
R117 1-218-941-81 METAL CHIP 100 5% 1/16W R453 1-218-945-11 METAL CHIP 220 5% 1/16W
(PX312F)
R120 1-218-941-81 METAL CHIP 100 5% 1/16W
R121 1-218-957-11 METAL CHIP 2.2K 5% 1/16W R602 1-218-990-81 SHORT CHIP 0 (PX312F)
R122 1-218-989-11 METAL CHIP 1M 5% 1/16W R603 1-218-990-81 SHORT CHIP 0 (PX312F)
R123 1-218-989-11 METAL CHIP 1M 5% 1/16W R604 1-218-990-81 SHORT CHIP 0 (PX312F)
R702 1-218-949-11 METAL CHIP 470 5% 1/16W
R201 1-218-941-81 METAL CHIP 100 5% 1/16W
R707 1-218-945-11 METAL CHIP 220 5% 1/16W
R206 1-218-941-81 METAL CHIP 100 5% 1/16W
R207 1-218-973-11 METAL CHIP 47K 5% 1/16W R708 1-218-945-11 METAL CHIP 220 5% 1/16W
R712 1-218-973-11 METAL CHIP 47K 5% 1/16W
R211 1-218-965-11 METAL CHIP 10K 5% 1/16W
R301 1-218-957-11 METAL CHIP 2.2K 5% 1/16W R715 1-218-985-11 METAL CHIP 470K 5% 1/16W
R302 1-218-965-11 METAL CHIP 10K 5% 1/16W R716 1-218-989-11 METAL CHIP 1M 5% 1/16W
R304 1-218-990-81 SHORT CHIP 0 R801 1-218-989-11 METAL CHIP 1M 5% 1/16W
R802 1-218-990-81 SHORT CHIP 0
R305 1-218-990-81 SHORT CHIP 0
R308 1-218-961-11 METAL CHIP 4.7K 5% 1/16W R803 1-218-990-81 SHORT CHIP 0
R309 1-218-961-11 METAL CHIP 4.7K 5% 1/16W R902 1-218-941-81 METAL CHIP 100 5% 1/16W
R314 1-218-941-81 METAL CHIP 100 5% 1/16W R904 1-208-935-11 METAL CHIP 100K 0.5% 1/16W
R315 1-218-941-81 METAL CHIP 100 5% 1/16W R905 1-208-935-11 METAL CHIP 100K 0.5% 1/16W
R906 1-218-965-11 METAL CHIP 10K 5% 1/16W
R317 1-244-161-81 METAL CHIP 2.2 5% 1/16W
R318 1-244-161-81 METAL CHIP 2.2 5% 1/16W R907 1-218-967-11 METAL CHIP 15K 5% 1/16W
R320 1-218-945-11 METAL CHIP 220 5% 1/16W R910 1-218-989-11 METAL CHIP 1M 5% 1/16W
R912 1-218-990-81 SHORT CHIP 0
R324 1-244-161-81 METAL CHIP 2.2 5% 1/16W
R325 1-244-161-81 METAL CHIP 2.2 5% 1/16W R913 1-218-985-11 METAL CHIP 470K 5% 1/16W
R328 1-218-985-11 METAL CHIP 470K 5% 1/16W R914 1-208-935-11 METAL CHIP 100K 0.5% 1/16W
R918 1-218-985-11 METAL CHIP 470K 5% 1/16W
R333 1-218-990-81 SHORT CHIP 0
R336 1-218-990-81 SHORT CHIP 0 R922 1-218-941-81 METAL CHIP 100 5% 1/16W
R401 1-218-965-11 METAL CHIP 10K 5% 1/16W R923 1-216-864-11 SHORT CHIP 0
R942 1-218-989-11 METAL CHIP 1M 5% 1/16W
R403 1-218-985-11 METAL CHIP 470K 5% 1/16W
R947 1-218-989-11 METAL CHIP 1M 5% 1/16W
37
MAIN
R948 1-218-989-11 METAL CHIP 1M 5% 1/16W ACCESSORIES
R949 1-218-953-11 METAL CHIP 1K 5% 1/16W ************
R962 1-218-990-81 SHORT CHIP 0
R964 1-218-985-11 METAL CHIP 470K 5% 1/16W 1-542-638-41 MICROPHONE (ECM-J3SL) (PX312M)
R965 1-218-985-11 METAL CHIP 470K 5% 1/16W 1-542-783-11 HEADPHONE (MDR-E706I)
(PX312: E, KR/PX312F/PX312M)
R967 1-218-990-81 SHORT CHIP 0 1-838-704-11 CORD, CONNECTION (USB)
R968 1-218-973-11 METAL CHIP 47K 5% 1/16W (USB connecting cable)
R969 1-218-973-11 METAL CHIP 47K 5% 1/16W 2-059-703-02 POUCH, CARRYING (EXCEPT LA)
R972 1-218-990-81 SHORT CHIP 0 4-267-135-02 SOFT, APPLICATION
R973 1-218-965-11 METAL CHIP 10K 5% 1/16W (Sound Organizer (CD-ROM))
< SWITCH > 4-273-970-01 SOFT (DRAGON), APPLICATION

(Dragon Naturally Speaking (DVD-ROM))
S401 1-572-922-11 SWITCH, SLIDE (NOISE CUT) (PX312D)
S402 1-786-914-31 SWITCH, TACTILE (x) 4-274-080-21 MANUAL (QSG), INSTRUCTION (ENGLISH,
S403 1-798-119-11 SWITCH, TACTILE (VOL –) SPANISH) (E)
S404 1-786-914-31 SWITCH, TACTILE (– .) 4-274-080-31 MANUAL (QSG), INSTRUCTION
S405 1-798-119-11 SWITCH, TACTILE (VOL +) (SIMPLIFIED CHINESE,
TRADITIONAL CHINESE) (E)
S406 1-786-914-31 SWITCH, TACTILE (> +) 4-274-080-41 MANUAL (QSG), INSTRUCTION (POLISH,
S407 1-786-914-31 SWITCH, TACTILE (DISP/MENU) ARABIC) (E)
S408 1-786-914-31 SWITCH, TACTILE (N PLAY/STOP•ENTER) 4-274-080-51 MANUAL (QSG), INSTRUCTION (KOREAN) (E)
S409 1-786-914-31 SWITCH, TACTILE ( )
S410 1-786-914-31 SWITCH, TACTILE (zREC/PAUSE) 4-274-080-61 MANUAL (QSG), INSTRUCTION (ENGLISH,
KOREAN) (KR)
S411 1-786-914-31 SWITCH, TACTILE (T-MARK) 4-274-080-71 MANUAL (QSG), INSTRUCTION (ENGLISH,
S412 1-786-914-31 SWITCH, TACTILE (SCENE) SIMPLIFIED CHINESE) (CH)
S413 1-798-119-11 SWITCH, TACTILE ( A-B) 4-274-080-91 MANUAL (QSG), INSTRUCTION (ENGLISH,
S414 1-798-119-11 SWITCH, TACTILE (ERASE) SPANISH) (LA)
S941 1-798-361-11 SWITCH, SLIDE (HOLD/POWER)
< VARISTOR >
VDR143 1-802-090-21 VARISTOR, CHIP

< VIBRATOR >
X101 1-813-202-11 VIBRATOR, CRYSTAL (32.768kHz)

X102 1-814-451-11 QUARTZ CRYSTAL UNITS (48MHz)
*************************************************************
MISCELLANEOUS
**************
LCD101 1-811-336-11 DISPLAY PANEL, LIQUID CRYSTAL

MIC101 1-542-866-11 MICROPHONE, ELECTRET CAP (MIC)
SP101 1-858-034-13 SPEAKER (2.8 cm)
*************************************************************
38
MEMO
39
REVISION HISTORY
Checking the version allows you to jump to the revised page.

Also, clicking the version at the top of the revised page allows you to jump to the next revised page.
Ver. Date Description of Revision
1.0 2011.02 New

Sony Icd-Px312 px312d px312f px312m

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Sony Icd-Px312 px312d px312f px312m

Uploaded by

Copyright:

Available Formats

ICD-PX312/PX312D/

Latin American Model

• “Memory Stick Micro,” “M2” and are

All other trademarks and registered trademarks are

The “Sound Organizer” uses software modules as

Stereo microphone with shirt-clip

LR03 (size AAA) alkaline batteries (2)

Carrying pouch (1)

Application software, Sound

Application software, Dragon

* The application software, Dragon

You are cautioned that any changes or

Design and specifications are subject to

CAUTION TABLE OF CONTENTS

FLEXIBLE CIRCUIT BOARD REPAIRING 2. TEST MODE ............................................................ 7

: LEAD FREE MARK 4. EXPLODED VIEWS

NOTE FOR REPLACEMENT OF THE MAIN BOARD

1-1. BATTERY CASE LID

1-2. CASE FRONT ASSY,

1-3. COMPLETE MAIN BOARD

1-4. LIQUID CRYSTAL DISPLAY PANEL (LCD101),

Note: Follow the disassembly procedure in the numerical order given.

1-1. BATTERY CASE LID

3 battery case lid

1-2. CASE FRONT ASSY, SPEAKER (SP101)

0 case front assy

qa two tapping screws

case front assy

qs Remove the two solders.

1-3. COMPLETE MAIN BOARD

5 COMPLETE MAIN board

4 Remove the two solders.

case (rear) assy

1-4. LIQUID CRYSTAL DISPLAY PANEL (LCD101), MAIN BOARD

7 electret cap (MIC) microphone

6 Remove the two solders.

Pressing the [VOL-] and

SERVICE MODE start

Release the [VOL-] and

> <SERVICE MENU>

Turn off the power

1. Version test • [x]/[– .]/[> +]/[N ENTER]/[z]/[ A-B]/

IPL2FW:1.00.00 IPL2 Version AGC : ON VOR Level

4. Sin test 6. LCD Contrast test

LCD DISPLAY LCD DISPLAY

• During operation, change the setting by using the following

• When “Beep Test” is entered, a beep sound of 1.3 kHz is out-

• At power-on, optionally an R/W test on the clock register is set

> + The LED is

10. ZLOAD test (Not used in this set) 13. FM test

LCD DISPLAY LCD DISPLAY

<LOW DET> 14. Key Count test

• This set is normally off. LCD DISPLAY

LCD DISPLAY <KEY COUNT>

15. Sleep test 18. MENU INIT lnit

17. CHG LOG test (Not used in this set)

• After power-on, a log for charging is copied to the eMMC.

DIGITAL AUDIO CODEC,AMP

2 FMI LOUT 13 32 LIN3

SDIO 7 5 CSN/SDA TIOCB0/GPIO02/ 96 HP_XDET

RST 4 4 PDN 87 DIN/GPIO1B J302

3-2. BLOCK DIAGRAM – POWER/DISPLAY Section –

VOLTAGE DETECT REGRTC+1.0V REG +3.1V REG BAT 3

IPL2FW:1.00.00 IPL2 Version AGC : ON VOR Level