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Order code VDS RDS(on) max. ID PTOT
STP5N105K5 1050 V 3.5 Ω 3A 85 W
Applications
Switching applications
Figure 1: Internal schematic diagram
Description
D(2, TAB)
This N-channel Zener-protected Power MOSFET
is designed using ST’s revolutionary avalanche-
rugged very high voltage MDmesh™ K5
technology, based on an innovative proprietary
vertical structure. The result is a dramatic
G(1) reduction in on-resistance, and ultra-low gate
charge for applications which require superior
power density and high efficiency.
Table 1: Device summary
Order code Marking Package Packaging
STP5N105K5 5N105K5 TO-220 Tube
S(3)
AM01476v1
Contents
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
2.1 Electrical characteristics (curves) ...................................................... 6
3 Test circuits ..................................................................................... 9
4 Package mechanical data ............................................................. 10
4.1 TO-220 package mechanical data .................................................. 11
5 Revision history ............................................................................ 13
1 Electrical ratings
Table 2: Absolute maximum ratings
Symbol Parameter Value Unit
VGS Gate- source voltage ± 30 V
ID Drain current (continuous) at TC = 25 °C 3 A
ID Drain current (continuous) at TC = 100 °C 2 A
IDM(1) Drain current (pulsed) 12 A
PTOT Total dissipation at TC = 25 °C 85 W
IAR Max current during repetitive or single pulse avalanche 1 A
Single pulse avalanche energy
EAS 85 mJ
(starting TJ = 25 °C, ID=IAS, VDD= 50 V)
dv/dt (2) Peak diode recovery voltage slope 4.5 V/ns
dv/dt (3) MOSFET dv/dt ruggedness 50 V/ns
Tj Operating junction temperature
- 55 to 150 °C
Tstg Storage temperature
Notes:
(1)Pulse width limited by safe operating area
(2)I
SD ≤ 3 A, di/dt ≤ 100 A/µs, VDS(peak) ≤ V(BR)DSS
(3)V
DS ≤ 840 V
2 Electrical characteristics
(TCASE = 25 °C unless otherwise specified).
Table 4: On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
Drain-source breakdown
V(BR)DSS VGS= 0, ID = 1 mA 1050 V
voltage
VGS = 0, VDS = 1050 V 1 µA
Zero gate voltage drain
IDSS VGS = 0, VDS = 1050 V,
current 50 µA
Tc=125 °C
IGSS Gate body leakage current VDS = 0, VGS = ± 20 V ±10 µA
VGS(th) Gate threshold voltage VDS = VGS, ID = 100 µA 3 4 5 V
Static drain-source on-
RDS(on) VGS = 10 V, ID= 1.5 A 2.9 3.5 Ω
resistance
Table 5: Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss Input capacitance - 210 - pF
VDS =100 V, f=1 MHz,
Coss Output capacitance - 16 - pF
VGS=0
Crss Reverse transfer capacitance - 0.5 - pF
Equivalent capacitance time
Co(tr)(1) - 26 - pF
related
VGS = 0, VDS = 0 to 840 V
Equivalent capacitance
Co(er)(2) - 10 - pF
energy related
RG Intrinsic gate resistance f = 1MHz open drain - 9 - Ω
Qg Total gate charge VDD = 840 V, ID = 3 A - 12.5 - nC
Qgs Gate-source charge VGS =10 V - 2 - nC
Figure 16: "Gate charge
Qgd Gate-drain charge test circuit" - 9.5 - nC
Notes:
(1)Timerelated is defined as a constant equivalent capacitance giving the same charging time as C oss when VDS
increases from 0 to 80% VDSS
(2)Energyrelated is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS
increases from 0 to 80% VDSS
Notes:
(1)Pulsed: pulse duration = 300µs, duty cycle 1.5%
The built-in back-to-back Zener diodes have specifically been designed to enhance the
device's ESD capability. In this respect the Zener voltage is appropriate to achieve an
efficient and cost-effective intervention to protect the device's integrity. These integrated
Zener diodes thus avoid the usage of external components.
10
is
RD rea
n)
ax a
(o
m his
S
by in t 100µs
1
ite tion
1ms
Lim era
d
p
O
10ms
0.1
Tj=150°C
Tc=25°C
Single pulse
0.01
0.1 1 10 100 1000 V DS(V)
1 7V 1
6V
0 0
0 5 10 15 20 V DS(V) 5 6 7 8 9 10 V GS(V)
8 800 3.5
3
6 600
2.5
4 400
2
2 200
1.5
0 0
0 2 4 6 8 10 12 Q g(nC) 1
0 1 2 3 4 ID(A)
1000
1
T J=-50°C
Ciss
100 0.9
0.8 T J=25°C
10
Coss
Crss 0.7
1
T J=150°C
0.6
0.1
0.1 1 10 100 V DS(V)
0.5
0 0.5 1 1.5 2 2.5 3 ISD(A)
1.1
0.9
0.8
0.7
0.6
0.5
0.4
-100 -50 0 50 100 150 T J(°C)
60
1.05
50
1 40
30
0.95
20
0.9 10
0
0.85 0 20 40 60 80 100 120 140 T J(°C)
-100 -50 0 50 100 T J(°C)
0
0 200 400 600 800 V DS(V)
3 Test circuits
Figure 15: Switching times test circuit for
resistive load Figure 16: Gate charge test circuit
Figure 19: Unclamped inductive waveform Figure 20: Switching time waveform
5 Revision history
Table 10: Document revision history
Date Revision Changes
17-Jul-2014 1 First release.
Document status promoted from preliminary to production data.
03-Sep-2014 2 Added Section 3.1: "Electrical characteristics (curves)"
Minor text changes.
Updated Figure 6: "Gate charge vs gate-source voltage"and Figure
15-Oct-2014 3
8: "Capacitance variations"
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