Memory Module Specifications

HX421C14FB2K4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR4-2133
DDR4 2133 CL14 288
288-Pin
Pin DIMM

SPECIFICATIONS
CL(IDD) 14 cycles
Row Cycle Time (tRCmin) 46.5ns(min.)
Refresh to Active/Refresh 350ns(min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 32.75ns(min.)
Maximum Operating Power TBD W*
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.

DESCRIPTION FEATURES
HyperX HX421C14FB2K4/32 is a kit of four 1G x 64-bit (8GB) • Power Supply: VDD = 1.2V Typical
DDR4-2133 CL14 SDRAM (Synchronous DRAM) 1Rx8, memory • VDDQ = 1.2V Typical
module, based on eight 1G x 8-bit FBGA components per module. • VPP - 2.5V Typical
Each module kit supports Intel® Extreme Memory Profiles • VDDSPD = 2.2V to 3.6V
(Intel® XMP) 2.0. Total kit capacity is 32GB. Each module has • Nominal and dynamic on-die termination (ODT) for
been tested to run at DDR4-2133 at a low latency timing of 14-14-14 data, strobe, and mask signals
at 1.2V. Additional timing parameters are shown in the • Low-power auto self refresh (LPASR)
Plug-N-Play (PnP) Timing Parameters section below. The • Data bus inversion (DBI) for data bus
JEDEC standard electrical and mechanical specifications are • On-die VREFDQ generation and calibration
as follows: • Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
Note: The PnP feature offers a range of speed and timing options to support • 16 internal banks; 4 groups of 4 banks each
the widest variety of processors and chipsets. Your maximum speed will • Fixed burst chop (BC) of 4 and burst length (BL) of 8
be determined by your BIOS.
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
JEDEC/XMP TIMING PARAMETERS • Fly-by topology
• Terminated control command and address bus
• JEDEC/PnP: DDR4-2133 CL14-14-14 @1.2V • Height 1.340” (34.04mm), w/heatsink
• XMP Profile #1: DDR4-2133 CL14-14-14 @1.2V

Continued >>

hyperxgaming.com Document No. 4807663-001.A00 03/18/16 Page 1

 continued

MODULE WITH HEAT SPREADER

7.08 mm
133.35 mm
34.04 mm

MODULE DIMENSIONS

133.35

129.55

2.10±
±0.15
31.25

3.00
11.00
14.60

Detail A Detail B Detail D Detail E Detail C

17.60
2.70±0.15

8.00

Pin 1 Pin 35 Pin 47 Pin 105 Pin 117

3.35
64.60 56.10
28.90 22.95

FOR MORE INFORMATION, GO TO HYPERXGAMING.COM

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
thethe published
published HyperX
HyperX memory
memory speeds
speeds andand timing
timing settings.
settings. Kingston
Kingston does
does notnot recommend
recommend that
that any
any user
user attempt
attempt to to
runrun their
their computers
computers
faster
faster than
than thethe published
published speed.
speed. Overclocking
Overclocking or or modifying
modifying your
your system
system timing
timing may
may result
result in in damage
damage to to computer
computer components.
components.

HyperX is a division of Kingston. Document No. 4807663-001.A00 Page 2

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