This document provides a thermal resistance table for various integrated circuit package styles. It lists the package type and code, number of leads, and the thermal resistance values of junction to case (Theta JC) and junction to ambient (Theta JA) in degrees Celsius per watt. It also specifies whether the thermal resistance is measured to the substrate, board, or specific pin of the package. The table contains data for over 60 different package styles including metal can, CERDIP, side brazed, LCC, flat pack, plastic TO, plastic DIP, and various surface mount packages.
This document provides a thermal resistance table for various integrated circuit package styles. It lists the package type and code, number of leads, and the thermal resistance values of junction to case (Theta JC) and junction to ambient (Theta JA) in degrees Celsius per watt. It also specifies whether the thermal resistance is measured to the substrate, board, or specific pin of the package. The table contains data for over 60 different package styles including metal can, CERDIP, side brazed, LCC, flat pack, plastic TO, plastic DIP, and various surface mount packages.
This document provides a thermal resistance table for various integrated circuit package styles. It lists the package type and code, number of leads, and the thermal resistance values of junction to case (Theta JC) and junction to ambient (Theta JA) in degrees Celsius per watt. It also specifies whether the thermal resistance is measured to the substrate, board, or specific pin of the package. The table contains data for over 60 different package styles including metal can, CERDIP, side brazed, LCC, flat pack, plastic TO, plastic DIP, and various surface mount packages.