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Background:
Theory
Electroplating is often also called "electrodeposition", a short version of “electrolytic
deposition”, and the two terms are used interchangeably. As a matter of fact,
"electroplating" can be considered to occur by the process of electrodeposition. It’s a
process using electrical current to reduce cations of a desired material from a solution and
coat that material as a thin film onto a conductive substrate surface. Figure 1 shows a
simple electroplating system for the deposition of copper from copper sulphate solution.
Figure 1. Electrolytic cell for the deposition of copper from copper sulphate solution.
The electrolytic solution contains positively charged copper ions (cations) and negatively
charged sulphate ions (anions). Under the applied external electric field, the cations migrate
to the cathode where they are discharged and deposited as metallic copper.
Cu2+ + 2e Cu (metal)
Copper from the anode dissolves into the solution to maintain the electrical neutrality.
Cu Cu2+ + 2e
The overall process is known as electrolysis. If some noble metal (such as platinum) is used
as the anode, the overall reaction at the anode is the oxidation of water.
2H2O 4H+ + O2 + 4e
The sulphate ions remain unchanged in quantity during the electrolysis. However, if noble
metal is used as the anode, the concentration of Cu2+ ions will decrease and that of H+ ions
will increase with time. Under this situation, extra copper sulphate must be added into the
solution from time to time and the hydrogen ions must be removed by neutralization with
an alkali or by using a buffering solution.
In practical electrodeposition processes, the chemical reaction around the electrode area
occurs in a more complicated way than that shown in Figure 1. Under the influence of an
applied potential, rearrangement of ions near the electrode surface results in an electrical
double layer called the Helmholtz double layer, followed by the formation of a diffusion
layer as shown in Figure 2. These two layers are
referred as the Gouy-Chapman layer. The process is as
follows:
• Migration: The hydrated metal ions in the solution
migrate towards the cathode under the influence of
impressed current as well as by diffusion and
convection.
• Electron transfer: At the cathode surface, a
hydrated metal ion enters the diffused double layer
where the water molecules of the hydrated ion are
aligned. Then the metal ion enters the Helmholtz
double layer where it is deprived of its hydrate
envelope.
• The dehydrated ion is neutralized and adsorbed on
the cathode suface.
• The adsorbed atom then migrates or diffuses to the
growth point on the cathode surface.
Applications:
Since its invention in 1805 by Italian chemist, Luigi Brugnatelli, electroplating has become
an extensively used industry coating technology. Its applications are mainly in the
following four groups:
1. Decoration: Coating a more expensive metal onto a base metal surface in order to
improve the appearance. Applications are jewellery, furniture fittings, builders’ hardware
and tableware.
2. Protection: Corrosion-resistant coatings such as chromium plating of automobile parts
and domestic appliances, zinc and cadmium plating of nuts, screws and electrical
components. Wear-resistant coatings such as nickel or chromium plating of bearing
surfaces and worn shafts and journals.
3. Electroforming: Manufacture of sieves, screens, dry shaver heads, record stampers,
moulds, and dies.
4. Enhancement: coatings with improved electrical and thermal conductivity, solderability,
reflectivity etc.
Properties of deposited film:
ADHESION: As one of the most important requirements, adhesion is mostly dependant
upon the substrate. For proper adhesion, the substrate must be thoroughly cleaned and free
of any surface films. It is desirable that the substrate and the deposited metal interdiffuse
with interlocking grains to give a continuous interfacial region. Alloy formation by the
interdiffusion of the substrate and the deposited metals provides good adhesion. However,
an intermetallic compound is undesirable since it behaves like inorganic salts and results in
poor adhesion.
Reference:
http://electrochem.cwru.edu/ed/encycl/art-e01-electroplat.htm
http://inventors.about.com/od/estartinventions/a/Electroplating.htm
Brian N. Chapman, J.C. Anderson, Science and Technology of Surface Coating, Academic
Press Inc. (London), 1974, p69
Alloy Electroplating, http://www.flipchips.com/tutorial46.html
Lab Procedure:
Samples: ITO coated corning 1737 glass, copper plates(need to be polished before use).
2. Electroplating
• Place the Nickel plating solution (Easyplate Nickel plating solution #C-2,
Dalmar Manufacturing Co.) onto a digital hot plate. Set the temperature to 90oC
and the rotating speed of magnetic stir bar to 150 rpm
• Place the cleaned sample into plating solution and connect it to the Cathode of
HP6217A power supply.
• Place the Nickel strip into plating solution and connect it to the Anode.
• Parameters that affect the electroplating process are:
Voltage: 2-4 volts
Temperature of plating solution: room temperature up to 80oC
Convection/circulation of plating solution: rotating speed 0-300 rpm
Electroplating time: 1-20 minutes.
3. Performance investigation
• Measure the thickness of the deposited nickel film using alpha-step profilometer.
• Using scotch tape to test the adhesion of deposited nickel film to the substrate
• X-ray diffraction on deposited nickel film to check the crystallinity
• Using SEM to evaluate the surface, cross-section, and microstructure of
deposited nickel film.
Lab Report:
Based on the performance test, the lab report should include the following:
• Results of thickness measurements, adhesion test, X-ray analysis and SEM
observation.
• Explain the influence of different processing parameter on the properties of the
deposited nickel film.