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Warm Greetings

From
Prof. Vishal V. Mehtre
Lecture No. 24 (Unit No. 4)
Electroplating-Objectives, Operations and Processes
(Utilization of Electrical Energy)
Department of
Electrical Engineering
BHARATI VIDYAPEETH
(DEEMED TO BE UNIVERSITY)
COLLEGE OF ENGINEERING, PUNE
Department of Electrical Engineering

What is Electroplating?
 Electroplating is basically the process of plating a metal
onto the other by hydrolysis mostly to prevent corrosion
of metal or for decorative purposes.

 The process uses an electric current to reduce dissolved


metal cations to develop a lean coherent metal coating on
the electrode.

Electroplating is often applied in the electrical oxidation


of anions on a solid substrate like the formation of silver
chloride on silver wire to form silver chloride electrodes.
Department of Electrical Engineering

What is Electroplating?
 Electroplating is majorly applied to modify the surface
features of an object (e.g corrosion protection, lubricity,
abrasion), but the process can also be used to build
thickness or make objects by electro forming.

 Electroplating is widely used in industry and decorative


arts to improve the surface qualities of objects such as
resistance
to abrasion and corrosion, lubricity, reflectivity, electrical
conductivity, or appearance.
Department of Electrical Engineering

Objectives of Electroplating
 To increase the resistance to corrosion of the coated
metal.

 To improve the hardness and physical appearance of the


article.

 To increase the decorative and commercial values of the


article.

 To increase resistance to chemical attack.

 To improve the properties of the surface of the article.


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Operations in Electroplating
1. Cleaning process
2. Deposition of metal

Cleaning process:

 The object to be electroplated is thoroughly cleaned


degreased.

 If the electroplating is done on an unclean and greased


surface, the metal deposited will not be well adherent to
the base metal and is likely to peel off.
Department of Electrical Engineering

Operations in Electroplating
Deposition of metal:
 The electrolyte used in the electrolytic bath depends
upon the nature of the metal to be deposited.
 For copper plating solution is made of 150 – 200 gm of
copper sulphate and 20 to 30 gms of sulphuric acid per
1000 cc of solution. For silver plating 24 gms of silver
cyanide, 24 gm of potassium carbonate and 36 gm of
potassium cyanide per 1000 cc is used. For chromium
180 – 300 gm of chromic acid 2 – 3 gm H2SO4 per 1000
cc. For nickel plating 180 – 300 gm of chromic acid 2 – 3
gm H2SO4 per 1000 cc.
Department of Electrical Engineering

Processes involved in Electroplating


Copper Plating:
 It is mostly used for plating iron articles to prevent them
from rusting.

 It is also used as a base coating for silver and nickel


plating.

 The surface of the article to be electroplated should be


perfectly clean.

 The electrolyte is an acid bath solution made of copper


sulphate and sulphuric acid, Anode of pure copper.
Department of Electrical Engineering

Processes involved in Electroplating


 Time required for plating is 2 to 3 seconds.

 Voltage required is 4 to 10 volts.

 Current density 200 – 400 amp/ m2 and temperature of


electrolyte 30 – 50°C.

 The deposit obtained is rough and thick and requires


polishing.

For getting thin and smooth deposit, a cyanide bath


solution made of copper cyanide, sodium cyanide, sodium
carbonate and sodium bisulphate is used.
Department of Electrical Engineering

Processes involved in Electroplating


Nickel Plating:

 Nickel does not stick well on iron and steel articles.

 Therefore, the article is first coated with a film of


copper and then nickel is deposited on the copper
plating.

 The electrolyte used is a nickel bath solution made of


nickel sulphate, nickel chloride and boric acid.
Department of Electrical Engineering

Processes involved in Electroplating


 Time for plating is 30 minutes, voltage 5 – 7 volts,
current density 250 – 500 Amps/m2 and temperature of
electrolyte is 40 – 60°C.

 Anode is of pure nickel.

 Nickel life depends upon the copper coating under neat


the nickel coating.

 The filtration and agitation plant is only used in nickel


plating.
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Processes involved in Electroplating


Chromium Plating:

 Steel tanks with lead busing are used. Lead electrodes


are used as anodes.

 The electrolyte must be heated and the fumes should be


exhaust by exhaust fans.

 The article is first nickel plated and then chromium


plated and the life of chromium depends upon the nickel
coating under the chromium plating.
Department of Electrical Engineering

Processes involved in Electroplating

The chromium bath solution is made of chromic acid and


sulphuric acid. Current density required is 600 to 5000
amps/m2, time 4 – 8 second, voltage 6 – 10 volts and
temperature 50 – 70°C.

Dry Out:

After copper, nickel or chromium plating the article is


buffed with fine polishing mops made of cotton rotating at
high speeds.
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Processes involved in Electroplating


Rinses:

 The articles are rinsed or water dipped between every


process of cleaning such as physical cleaning, chemical
cleaning, acid dips in order to prevent the carrying over of
one processing solution to the other.

 To meet this requirement in every plating shop, special


rinsing tanks with running water are extensively used.

 So ample supply of water, as well as drainage facilities are


to be provided in a plating shop.
Department of Electrical Engineering

Processes involved in Electroplating


Reverse Current Process of Electroplating:
 It is the latest development in electroplating.

In this process the plating current is reversed for a


second or so at regular intervals to get following
advantages:

1. Inferior metal is depleted during reverse current period.

2. Flat level surface is produced.


Department of Electrical Engineering

Processes involved in Electroplating


3. Metal surface brightened due to reversal of current
periodically and it eliminates the buffing or polishing
operations.

4. Polarization effect is reduced without affecting the quality


of deposit.

Earthing:
 It is essential that positive side of dc supply to the vats
(plating tank) should be effectively connected to earth so
that any leakage current deposits the plating material on to
the work which is the cathode.
Department of Electrical Engineering

Processes involved in Electroplating

If negative of the dc supply is earthed, the leakage


current will be from anode to vat.

This will deposit the metal on the inner lining of


the vat.

Moreover by earthing vat i.e. positive side of d.c.


supply, the operator is also protected from electric
shock.
THANK YOU

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