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Chemical Vapour Deposition Coverages
Chemical Vapour Deposition Coverages
Reaction chambers
Wafer 200x5mm (∅ x H)
3D / batch 200x170mm (∅ x H)
3D / batch 450x500mm (∅ x L)
Powder 70x100mm (∅ x H)
Process features:
Pressure 0.1-5 mbar
Temperature 60-500ºC
Gas flow 0.3-1.0 SLM
Reaction chamber
Substrate
Modular construction
Qr
Qc
T (°C)
L (m)
December 2007 Beneq © 2007 7
Reaction Chamber Design
150ºC
400ºC
400ºC
400ºC
Features
Excellent flow dynamics
Excellent flow distribution
Low pressure drop
Benefits
High speed: < 1s cycle times
Excellent uniformity
Excellent precursor efficiency
Gas source
For O2, O3, NH3, Si2H6, WF6...
Fast and highly repeatable operation
without slow MFC’s
Gas from facility systems or
separate container (excluded)
Liquid source
For H2O, TMA, DEZ, TiCl4...
Cooled and temperature stabilized
for maximum accuracy and
200ml container included (600ml as
option)
Container with 3-way valves for
complete line purging
Own vapor pressure or carrier gas
assisted pulsing
Benefits of HS 200
Lower temperature for given precursor
Use of lower vapor pressure precursors
Fast, reliable and safe operation
Easy inert loading in a glove box
Benefits of HS 500
Use of very low vapor pressure
precursors
Minimized wetted parts - very efficient
in precursor testing and development
Semi-inert loading in a glove box
Features:
Adjustable electrode
distance
Adjustable grid distance
Minimal remote plasma
source distance
No grid for direct plasma
Several gas flow direction
options
Rapid plasma pulsing or
continuous mode
Wafer face down – Electrode
alternative in TFS 500 Grid
Wafer
Features
Deposited on polystyrene with Beneq TFS 500 by Micronova (Helsinki University of Technology)
120.2
120.2
350
Thickness (nm)
300
250
y = 0,104x + 4,278
200
R 2 = 1,000
150
100
50
0
0 1000 2000 3000 4000
Number of Cycles
Safety
No out-hanging components
All chemicals in ventilated
hood
Over-pressure safe vacuum
chamber construction
Easy maintenance
Easy access for maintenance
Good visibility to all
connections
All cover sheets easy to open
Hinged back flange with
heaters on sliding rails
Datalogging (p,T,flow)
December 2007 Beneq © 2007 28
TFS 500 User Interface