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1 s2.0 0026269295000844 Main PDF
1 s2.0 0026269295000844 Main PDF
(, S . . /
Copyright O 1996 Elsevier Science Limited
Printed in Great Britain. All rights reserved
0026-2692/96/$15.00
ELSEVIER
0026-2692(95)00084-4
Simulation of
power
semiconductor
systems as an
educational tool
Jaroslav 2:fi ek
Department of Electrotechnology, Faculty of ElectricalEngineering, Czech Technical
University, Technickfi 2, I66 27 Praha 6, Czech Republic.
Tel: +422 2435 2198. Fax: +422 311 1786. E-mail: zacek@feld.cvut.cz
The paper presents a brief overview of methods and tools techniques. Such evolution must also be
used for modelling of power semiconductor systems in reflected in advancement o f the content and
educational practice. Sinmlated phenomena, models of
semiconductor devices, and software tools are classified; form o f educational methods for power
mutual availabilityis discussed. Special attention is given to semiconductor systems. The experimental
the simplified device models applied to the simulation of portion o f teaching makes heavy demands on
complicated phenomena, combining commutation and laboratory equipment and is, therefore, very
control processesof power semiconductor converters. Two often substituted by or complemented with
principal sets of simulation tools are recommended--non-
linear static models in po:rt diagram and switch models in computer-aided simulation techniques. The
block diagram. Both cases are illustrated by the examples availability o f computer technology and suitable
solved. Some possible applications in educational practice software contribute to making the use o f this
are outlined. fast, effective and economical method o f system
analysis quite common.
1. Introduction
Modelling o f power semiconductor systems and
p ower semiconductor systems--converters
and s w i t c h e s - - are very effective and, until
simuhtion of different operational
extraordinary phenomena are now considered
or
now, have been indispensable equipment for the quite usual educational tools. There are some
conversion and control o f electrical energy. The relevant reasons for this. Such a method provides:
increasing demands on the compatibility o f such
systems are best solved by ingenious control (1) facilities for demonstration o f phenomena in
modes using modern, fully controlled power a maximally objective form, free o f any
semiconductor devices and microprocessor distortive secondary effects;
149
J. Zabek/Simulation of power semiconductor systems
(2) facilities for different parameter variations 2.1 Simulation of internal processes in power
and for investigation of their influence; semiconductor devices
The simulated processes, the internal transients
(3) facilities for modelling of such systems and inside the semiconductor structure of the device,
simulation of such phenomena, which are are very fast, within the time range of
unrealizable on real equipment either for approximately 10-9s to 10-6s. Such processes
economical or for safety reasons; are analysed mostly to prove static and dynamic
behaviour of newly designed semiconductor
(4) facilities for individual, independent and safe structures. The analysis is limited to one
experimentation by students. structure only, in most cases without any
influence of the external circuit. The model of a
A modelled power semiconductor system is power semiconductor device gives an account of
assembled from power semiconductor devices, its internal construction; it operates with
with their typical non-linear static and dynamic technological, geometrical and other internal
characteristics, and from additional circuit parameters of certain semiconductor structures.
elements (resistors, capacitors and reactors) with Special models are often used for simulating only
either linear or non-linear characteristics. For a certain group of analysed phenomena. Such
simulation purposes, the system model is models have a very limited application range and
completed with the models of sources, loads and are hardly qualified for power semiconductor
control equipment. system analysis.
The fundamental problem here is that a 2.2 Simulation of internal processes in power
modelling method for power semiconductor semiconductor systems
systems' circuits must be chosen which is This task deals with the modelling of
compatible with the choice of software support semiconductor system circuits assembled from
and which corresponds with the simulated power semiconductor devices and from the other
phenomena. The demands on these tools when elements with coupled source and load circuits.
applied for educational purposes are a bit special: With such a model, it is possible to simulate
they should support the understanding of the electrical processes inside the system which are
substance of the simulated problem; they should connected with the commutation among the
be easy to learn to use and not distract the devices and which form the output variables of the
student's attention from the simulated problem converter. These simulated processes are limited,
to the simulation technique; and they should be as a rule, to a few periods of the working
as universal as possible for application for a very frequency, within a time range of approximately
broad class of problems in different courses. 10-5s to 10-2s. The model serves mostly to
analyse the designed circuit and to prove its
functions in standard as well as in non-standard
2. Simulation tasks
(transient and breakdown) processes. Due to the
The characteristic feature of power semi- time range, these processes may be studied
conductor systems, which causes many problems separately from the internal processes inside the
in modelling and simulation, is the considerable device on the one hand, and from the processes in
difference of transient speed in particular parts of load circuits on the other hand. The system model
the system. Therefore, it is very advantageous to is constructed as a model of an electrical circuit
be able to analyse each of such transients that contains power semiconductor devices in
separately so that different simulation tasks can addition to the usual electrical elements. Models of
be distinguished. semiconductor devices represent their substantial
150
Microelectronics Journal, Vol. 27, Nos 2-3
static and dynamic chLaracteristics and are usually cannot be neglected due to their substantial
assembled in the library of simulation program as influence on simulated phenomena. Some
macromodels. The simulation tools for such examples are: the simulation of a dc motor with
purposes are well known and often used. Typical rectifier during starting and braking when the
examples of such means are programs like PSPICE intermittent current is respected; the simulation
and its family. of speed fluctuations of an ac motor fed by non-
sinusoidal voltage or current from an inverter;
2.3 Simulation of ex~ternal processes of power the simulation of the transient effects in a
semiconductor systems converter with PWM, etc. The c o m m o n
The simulation of electromechanical or character of all of these tasks is the simulation of
electrothermal processes in the load circuits of a effects which influence one another and which
power semiconductor system is a very c o m m o n have a mutually incommensurable rate of
task in automated technological systems. In such running. The simulation of a very long time
a way, the time response of motor torque and interval is r e q u i r e d - - w i t h many tens, hundreds
speed on control or disturbance signals, and the or even thousands of repeating c o m m u t a t i o n s - -
time response of thermal processes excited by at relatively slowly varying parameters of load or
control of supply converter, etc. may be verified. control. Such a task is both frequently required
Some phenomena on the input side of the and, at the same time, very difficult. The model
system (e.g. the course of active, reactive and of the converter must be assembled from
distortion power or of power factor as a response separate devices modelled as simply as possible,
to the control or disturbance signal) can also be the goal of which is maximum speed in
included in this task. As compared with previous obtaining a solution by computer. Classical
cases, these effects are relatively slow, within the simulation tools seem to be insufficient for such
time range of approximately 10-3s to 102s. purposes from this point of view, even solved
Therefore, the internal processes of the analysed with up-to-date computer techniques. The
semiconductor system may often be neglected possibilities for such problem solving are
and the converter modelled as a controlled analysed in the following sections of this paper.
source, either of direct voltage (current) or of
fundamental harmonic of alternating voltage
3. Models of power semiconductor
(current) at output frequency. The system model
devices
is then assembled from a model of a motor,
models of technological equipment, controllers, The models of power semiconductor devices are
etc. The power semiconductor converter is applied in two different tasks of power
modelled as a controlled voltage or current semiconductor system analysis mentioned in the
source; power semiconductor devices are not foregoing part of the paper: for simulation of
modelled in any w~ty. The software tools for internal processes in the power semiconductor
modelling of electrical circuits are used, as a rule, system and for simulation of combined
for simulation of this type of problem. Electro- processes, i.e. processes including internal and
mechanical, electro-thermal, electro-hydraulic external system phenomena. These models can
and other analogies are exploited. The converter be classified according to the level of
figures as a macromodel, in addition to the simplification in several groups.
models of the other circuit elements.
3.1 Non-linear dynamic models
2.4 Simulation of combined processes The non-linear dynamic model is the most
In some systems, contrary to the above case, the accurate, but, at the same time, the most
internal processes in the semiconductor system complicated representation of the real
151
J. Z bek/Simulation of power semiconductor systems
semiconductor device specified by its definite junction, respecting the influence o f real
producer and type specification. Such a model resistances in the forward and reverse directions.
includes m a x i m u m static and dynamic The curve (see Fig. 1) is then assembled from
parameters and characteristics o f the device, as three smoothly connected parts:
well as their dependence u p o n operational
conditions --voltage, current, temperature, (i) for 0 ~ u ~ U(TO)the curve is exponential
control signals, etc. A set of such models is
available as a model library, which is a substantial i=A(e13"-1) u = ~ l n 1( /) 1+~ (1)
part of a simulation tool. As an example, the
library o f SPICE (U.C. Berkeley) models can
contain even more than 1000 device m o d e l s - -
(ii) for u < 0 the curve is linearized: i = U/RR;
one model of a bipolar transistor has about 40
(iii) for u > U(TO) the curve is linearized:
adjustable parameters. It is obvious that models
of this group are well suited for exact and i= u/RF.
detailed analysis of commutation effects, snubber
Obtaining a smooth connection of these three
functions, etc., that is, for analysis of relatively
parts, one can determine the constants of the
short time intervals within one or a few periods
non-linear model (1) including only the
o f operational frequency, for tasks mentioned in
parameters of static characteristic curve:
Section 2.2. Their exactness can hardly be
evaluated in the case of combined process A = U(TO) B _ __1 In RR__ (2)
simulation, where the dynamic parameters of
RR ln(RR/RF) U(ro) RF
power devices can be neglected, and, in addition,
such models would cause the simulation run of T h e model of a power semiconductor diode is
long time intervals to be unremuneratively slow. so represented by a voltage controlled current
source or a current controlled voltage source; see
3.2 Non-linear static models Fig. 1.
These simplified device models with neglected
dynamic parameters are based on the static non- The model of a controlled device (power
linear volt/ampere characteristic curve and its switching transistor, thyristor, GTO-thyristor)
analytic expression. Such models employ contains, in addition, the forward off-state
external parameters accessible to any user. characteristic, which is defined by the off-state
resistance RD = RR; see Fig. 2. T h e model of
T h e model of a power diode is formed by the the controlled device can be created by serial
static volt/ampere characteristic curve o f the p-n connection o f the diode model and a controlled
R. Ucro}
Fig. 1. Characteristic curve and model of power diode.
152
Microelectronics Journal, Vol. 27, Nos 2-3
U~, y
I3,,o,
Fig. 2. Characteristiccurve and model of a controlleddevice.
resistance R. At the switch mode of devices, this complicated. The computer program, in such a
controlled resistance changes its value case, automatically shortens the integration step,
discontinuously from 0 to RD and back. and the calculation then continues in such time
intervals in an inadequately slow manner.
The control of this resistance is derived for a
transistor from the binary value of either the base 3.3 Switch models
current (for bipolar transistor) or the gate voltage The simultaneous neglecting of threshold
(for MOSFET or IGBT): voltage, on-state resistance and off-state
conductances
a = a D :¢ [(i > 0) A (UG ~ 0)1 (3)
U/TO/ = R~ = 1/Re. = 1 / R D --- 0
where the logical expression in brackets may be
0 or 1. Similarly, for a thyristor: is an extreme simplification of the device's
model. The function of a power semiconductor
a ~- a D * [(i > 0) A (i < IL) A (iG < IGT)] (4) device is then reduced to an ideal switching
element. The problem of small time constants is
and for a gate turned-off thyristor
thus removed completely: all circuit branches
with switched-off devices are deleted from the
R = RD * [(i > 0) A {(i < IL) A (iG < leT)
(5) converter model. Thereby, the model of a power
V (ic ~< --IGQ)}] semiconductor system is maximally reduced.
Neither the solving of the non-linear expressions We can expect that the simulation with such a
in eq. (1) nor the solving of the logical simplified system model will be time saving.
expressions (3)-(5) creates any difficulties with This type of model will be advantageous, namely
up-to-date computers used for simulation; the for the simulation of combined processes, i.e.
rate of computing run is quite satisfactory. But, the solving of relatively long time intervals with
the so-called problem of small time constants is a lot of commutations; see Section 2.4.
substantially more difficult. The discontinuous
changes of the device's resistance give rise to The fundamental problem of such a model is the
strongly damped transient effects with extremely varying structures of the modelled circuit, caused
small time constants or extremely high by the switching of semiconductor devices. As
frequency. These effects are quite insignificant each device switches on, it creates a new branch
for the converter operation, but make the in the circuit or merges two nodes into a single
mathematical solving of model equations more one. On the other hand, by its switching-off, the
153
J. Zabek/Simulation of power semiconductor systems
original branch will be deleted from the circuit the graphic editing of a simulated system as well:
or the original node will be split into twin nodes. the circuit is assembled on the screen by
The algorithm of the solution must follow these dislocating separate icons representing the circuit
changes of circuit structure and adapt the elements and by interconnecting them with
mathematical model. lines.
154
Microelectronics Journal, Vol. 27, Nos 2-3
155
J. Zabek/Simulation of power semiconductor systems
The effect of commutation failure is caused by This is an example of the combined process
an increase in the firing angle after the first (Section 2.4) where rapid internal processes in
successful commutation. The simulation results, the semiconductor system, i.e. its modulation,
the currents of both commutation groups, are must not be separated from the slow external
shown in Fig. 3. process in the load circuit--voltage changes on
the output capacitor. Then, the switch model of
The output dc current, the input ac currents or power semiconductor devices is used (Section
the thyristor voltages can be presented as well. 3.3), and the system is represented by a block
Such results serve as a very useful basis for diagram (Section 4.2).
understanding and for giving a detailed analysis
of this phenomenon. The simulating run of the
Both ways of system model editing are
whole transient with one successful, two
sampled in the next section. The content of
unsuccessful and one double commutation takes
the short samples is the model of a three-
about 130 s without any graphic interpretation.
phase bridge converter with ac voltages UA,
UB, U C and dc voltage UD. The modulating
5.2 Pulse width modulated ac/dc converter
signals AMOD, B M O D , C M O D are not
The simulation is used for analysis of the PWM
presented.
voltage stiff transistor rectifier. Feedback
modulation of input phase currents with
sampling is applied. Output dc load current is The text editing, as it is used in the program
constant; the object of analysis is the transient PSI/c (Delft University of Technology, BOZA,
response of the output dc voltage on the input The Netherlands), is presented in the first
current step. sample:
5o0- [A]
400--
300--
200--
i2 /
i4
I00
[s]
i
I ' I I ' I ' I ' I
0.002 0.004 0.006 0.008 0.01
[A]
400-~
300-~ _.iL
. _3 i51
75
[s]
' I ' I ' I ' I ' I ' I
r 0.002 0.004 0.006 0.008 0.01
Fig. 3. Commutation failure of the thyristor rectifier.
156
Microelectronics Journal, Vol. 27, Nos 2-3
157
J. 2~bek/Simulation of power semiconductor systems
60-- • " ic
-
40--
20--
20-
40--
Is]
60
0.01 0.02 0.03 0.04 0.[
300--
200--
lO0--
[s]
0
. . . . I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' I
0.00 0.01 0.02 0.03 0.04 0.05
Fig. 5. Control transient o f P W M voltage stiff rectifier.
[A] iA iA~
30-
20-
10-
S/H
!!!I!!!III!NI
00019 0.0020
[v] Uh
200-
100-
-I00-
-200--
0
' I
0.0019
I irI l [
0.0020
Fig. 6. M o d u l a t i o n o f ac c u r r e n t w i t h sampling•
I
l[s]
' I
158
Microelectronics Journal, Vol. 27, Nos 2-3
159