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STD38NH02L-1
N-channel 24V - 0.011Ω - 38A - DPAK/IPAK
STripFET™ III Power MOSFET
General features
Type VDSS RDS(on) ID
STD38NH02L-1 24V <0.0135Ω 38A
STD38NH02L 24V <0.0135Ω 38A
( s ) 3 3
l e t d u
Description
s o r o
O b
This device utilizes the latest advanced design
Internal
e P
schematic diagram
-
rules of ST’s proprietary STripFET™ technology.
l e t
( s )
This is suitable fot the most demanding DC-DC
o
be achieved.
c b s
converter application where high efficiency is to
t
Applications d u - O
r o s )
■
P
Switching application
e c t (
l e t d u
s o r o
b
OOrder codes e P
l e t
s o
O b Part number
STD38NH02L-1
Marking
D38NH02L
Package
IPAK
Packaging
Tube
STD38NH02LT4 D38NH02L DPAK Tape & reel
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................. 6
4
s )
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
(
c t
5 u
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
d
r o s )
6
P (
Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
e c t
7
l e t d u
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
s o r o
O b e P
- l e t
( s ) o
c t b s
d u - O
r o s )
e P c t (
l e t d u
s o r o
O b e P
l e t
s o
O b
2/16
STD38NH02L - STD38NH02L-1 Electrical ratings
1 Electrical ratings
( s ) 38 A
ID
c t
Drain current (continuous) at TC = 100°C 27 A
IDM (2) Drain current (pulsed)
d u 152 A
Ptot
r o
Total dissipation at TC = 25°C
s )
40 W
EAS (3)
Derating Factor
e P
Single pulse avalanche energy
c t ( 0.27 W/°C
t
250 mJ
Tstg
l e
Storage temperature
d u
Tj
s o r o
Max. operating junction temperature
-55 to 175 °C
b P
1. Garanted when external Rg=4.7 Ω and tf < tfmax.
O e
- t
2. Pulse width limited by safe operating area.
l e
( s )
3. Starting Tj = 25 °C, ID = 19A, VDD = 18V
o
Table 2.
c t b
Thermal data s
Rthj-case
d u - O
Thermal resistance junction-case max 3.75 °C/W
r o
Rthj-amb
)
Thermal resistance junction-ambient max
s
100 °C/W
e PTJ
c t (
Maximum lead temperature for soldering purpose 275 °C
l e t d u
s o r o
O b e P
l e t
s o
O b
3/16
Electrical characteristics STD38NH02L - STD38NH02L-1
2 Electrical characteristics
Drain-source
V(BR)DSS ID = 25mA, VGS =0 24 V
breakdown voltage
Zero gate voltage VDS = 20V 1 µA
IDSS
drain current (VGS = 0)
Gate-body leakage
( s )
VDS = 20V, TC = 125°C 10 µA
IGSS
current (VDS = 0)
c t
VGS = ± 20V ±100 nA
RDS(on)
Static drain-source on
r o s )
VGS = 10V, ID = 19A 0.011 0.0135 Ω
resistance
e P c t (
VGS = 5V, ID = 9.5A 0.015 0.025 Ω
Table 4. Dynamic
l e t d u
Symbol
s o
Parameter
r o Test conditions Min. Typ. Max. Unit
gfs (1)
Forward
O b e P
-
transconductance
Ciss
( ) o
Input capacitance
s 1070 pF
Coss
c t s
Output capacitance
b
Reverse transfer
VDS = 25V, f = 1MHz,
VGS = 0
305 pF
Crss
d u O
capacitance
-
45 pF
r o s ) f = 1 MHz Gate
e P RG
c t (
Gate Input Resistance DC Bias = 0 Test Signal
Level = 20 mV Open
1 Ω
l e t d
td(on)u Turn-on delay time
Drain
7 ns
s o r o
tr Rise time
VDD = 10V, ID = 19A
62 ns
l e t tf Fall time
0.44V ≤VDD ≤10V,
12 ns
s o Qg
Qgs
Total gate charge
Gate-source charge
ID = 38A,
18
4
24 nC
nC
4/16
STD38NH02L - STD38NH02L-1 Electrical characteristics
Source-drain current
ISD 38 A
Source-drain current
ISDM (1) 152 A
(pulsed)
VSD (2) Forward on voltage ISD = 19A, VGS = 0 1.3 V
trr Reverse recovery time ISD = 38A, di/dt = 100A/µs, 27 ns
Qrr Reverse recovery charge VDD = 18V, Tj = 150°C 22 nC
IRRM Reverse recovery current (see Figure 15) 1.6 A
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
( s )
c t
d u
r o s )
e P c t (
l e t d u
s o r o
O b e P
- l e t
( s ) o
c t b s
d u - O
r o s )
e P c t (
l e t d u
s o r o
O b e P
l e t
s o
O b
5/16
Electrical characteristics STD38NH02L - STD38NH02L-1
( s )
c t
d u
Figure 3. Output characterisics Figure 4. r o s )
Transfer characteristics
e P c t (
l e t d u
s o r o
O b e P
- l e t
( s ) o
c t b s
d u - O
r o s )
e P c t (
Figure 5.
l e t d u
Transconductance Figure 6. Static drain-source on resistance
s o r o
O b e P
l e t
s o
O b
6/16
STD38NH02L - STD38NH02L-1 Electrical characteristics
( s )
c t
Figure 9. Normalized gate threshold voltage
d u
Figure 10. Normalized on resistance vs
vs temperature
r o )
temperature
s
e P c t (
l e t d u
s o r o
O b e P
- l e t
( s ) o
c t b s
d u - O
r o s )
e P c t
characteristics (
Figure 11. Source-drain diode forward Figure 12. Normalized breakdown voltage vs
temperature
l e t d u
s o r o
O b e P
l e t
s o
O b
7/16
Test circuit STD38NH02L - STD38NH02L-1
3 Test circuit
Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit
resistive load
( s )
c t
d u
r o s )
e P c t (
Figure 15. Test circuit for inductive load
l
switching and diode recovery times
e t d u
Figure 16. Unclamped Inductive load test
circuit
s o r o
O b e P
- l e t
( s ) o
c t b s
d u - O
r o s )
e P c t (
l e t d u
s o r o
Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform
O b e P
l e t
s o
O b
8/16
STD38NH02L - STD38NH02L-1 Appendix A
4 Appendix A
( s )
c t
d u
r o s )
P t (
The power losses associated with the FETs in a synchronous buck converter can be
e c
l e t
estimated using the equations shown in the table below. The formulas give a good
d u
approximation, for the sake of performance comparison, of how different pairs of devices
s o r o
affect the converter efficiency. However a very important parameter, the working
temperature, is not considered. The real device behavior is really dependent on how the
b P
heat generated inside the devices is removed to allow for a safer working junction
O e
temperature.
- l e t
●
( s )
The low side (SW2) device requires:
o
●
●
c b s
Very low RDS(on) to reduce conduction losses
t
Small Qgls to reduce the gate charge losses
●
d u O
Small Coss to reduce losses due to output capacitance
-
●
r o )
Small Qrr to reduce losses on SW1 during its turn-on
s
●
●
e P c t (
The Cgd/Cgs ratio lower than Vth/Vgg ratio especially with low drain to source
voltage to avoid the cross conduction phenomenon;
l e●t d u
The high side (SW1) device requires:
s o ●
r o
Small Rg and Ls to allow higher gate current peak and to limit the voltage feedback on
O b ●
e P
the gate
Small Qg to have a faster commutation and to reduce gate charge losses
s o
O b
9/16
Appendix A STD38NH02L - STD38NH02L-1
Pconduction
R DS(on)SW1 * I 2L * δ R DS(on)SW2 * I 2L * (1 − δ )
IL
Pswitching Vin * (Q gsth(SW1) + Q gd(SW1) ) * f * Zero Voltage Switching
Ig
Recovery
(1) Not applicable
( s ) Vin * Q rr(SW2) * f
Pdiode
c t
*I u
Conductio
n V
o d
Not applicable
*t *f
)
f(SW2) L deadtime
P r ( s
* Vct* f
Pgate(QG)
e t e Q g(SW1) * Vgg * f
Q
u gls(SW2) gg
o l o d
PQoss
b s P r
Vin * Q oss(SW1) * f Vin * Q oss(SW2) * f
- O e t e 2 2
) l
1. Dissipated by SW1 during turn-on
s o
Table 7.
c t ( b s
Paramiters meaning
d u
Parameter
- O Meaning
r o d
s ) Duty-cycle
e P Qgsth
c t ( Post threshold gate charge
l e t d u
Qgls Third quadrant gate charge
s o r o
Pconduction On state losses
l e t Pdiode
Pgate
Conduction and reverse recovery diode losses
Gate drive losses
O b
10/16
STD38NH02L - STD38NH02L-1 Package mechanical data
( s )
c t
d u
r o s )
e P c t (
l e t d u
s o r o
O b e P
- l e t
( s ) o
c t b s
d u - O
r o s )
e P c t (
l e t d u
s o r o
O b e P
l e t
s o
O b
11/16
Package mechanical data STD38NH02L - STD38NH02L-1
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A3 0.7 1.3 0.027 0.051
B
B2
0.64
5.2
( s )
0.9
5.4
0.025
0.204
0.031
0.212
B3
c t 0.85 0.033
B5
B6
0.3
d u 0.95
0.012
0.037
C 0.45
r o )
0.6
s
0.017 0.023
P (
C2 0.48 0.6 0.019 0.023
D 6
b P
L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047
L2
s ) o l
c t ( b s H
u O
C
o d ) -
A
P r ( s
t
A3
C2
t e c
A1
l e d u
o
L
o
L2 D
b s P r
B3
B6
B5
B
O t e
3
l e
=
=
B2
G
E
o
2
=
b s
1
O L1
0068771-E
12/16
STD38NH02L - STD38NH02L-1 Package mechanical data
mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.9 0.025 0.035
b4 5.2 5.4 0.204 0.212
C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019
( s ) 0.023
t
D 6 6.2 0.236 0.244
D1
E 6.4
5.1
6.6 0.252
u c0.200
0.260
E1
e
4.7
2.28
o d 0.185
0.090
)
e1 4.4 4.6
r
0.173
P ( s 0.181
H
L
9.35
1
10.1
t e
0.368
0.039
c t 0.397
(L1)
L2
2.8
0.8
l e d u 0.110
0.031
L4 0.6
s o 1
r o
0.023 0.039
b P
R 0.2 0.008
V2 0° 8° 0° 8°
- O e t e
s ) o l
c t ( b s
d u - O
r o s )
e P c t (
l e t d u
s o r o
O b e P
l e t
s o
O b 0068772-F
13/16
Packing mechanical data STD38NH02L - STD38NH02L-1
DPAK FOOTPRINT
( s )
All dimensions are in millimeters
c t
d u
r o s )
e P c t (
TAPE AND REEL SHIPMENT
o
mm inch
s o r
DIM.
MIN. MAX. MIN. MAX.
O b e P A
B 1.5
330
0.059
12.992
( s ) o
D 20.2 0.795
c t b s G
N
16.4
50
18.4 0.645 0.724
1.968
d u - O T 22.4 0.881
r o )
TAPE MECHANICAL DATA
s
BASE QTY BULK QTY
P (
2500 2500
t
mm inch
DIM.
e t e A0
u cMIN.
6.8
MAX.
7
MIN. MAX.
0.267 0.275
o l B0
b s P rB1
D 1.5
12.1
1.6
0.476
0.059 0.063
O t e D1 1.5 0.059
o l e E
F
1.65
7.4
1.85
7.6
0.065 0.073
0.291 0.299
b s K0
P0
2.55
3.9
2.75
4.1
0.100 0.108
0.153 0.161
O P1
P2
R
7.9
1.9
40
8.1
2.1
0.311 0.319
0.075 0.082
1.574
W 15.7 16.3 0.618 0.641
14/16
STD38NH02L - STD38NH02L-1 Revision history
7 Revision history
( s )
c t
d u
r o s )
e P c t (
l e t d u
s o r o
O b e P
- l e t
( s ) o
c t b s
d u - O
r o s )
e P c t (
l e t d u
s o r o
O b e P
l e t
s o
O b
15/16
STD38NH02L - STD38NH02L-1
( s )
Please Read Carefully:
c t
d u
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- l e t
s )
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