Moto One Action Service Manual - 20190916

Motorola One Action
Lenovo Motorola One Action

Level 2 – Service and Repair Manual
REVISION HISTORY
Revision Date Notes
1 07/18/2019 Initial Release.
2 08/02/2019 Coax Cable Assembly Update.
3 09/16/2019 Battery Assembly Update.
Lenovo Confidential Restricted:

PAGE 2 Do not share without consent from Lenovo
TABLE OF CONTENTS
Revision History.................................................................................................................................. 2
List of Tables ....................................................................................................................................... 6
Table of Figures .................................................................................................................................. 6
Safety Information .............................................................................................................................. 7
Cautions and Warnings ....................................................................................................................... 7
Battery Safety Guidelines .................................................................................................................... 7
Introduction ......................................................................................................................................... 8
External Views..................................................................................................................................... 8
Main Exploded Views ........................................................................................................................ 10
Disassembly and Recovery ............................................................................................................. 12
Disassembly and Recovery Map....................................................................................................... 12
Tools Required for Disassembly ....................................................................................................... 13
SIM Tray Removal ............................................................................................................................ 15
IMEI Label Removal .......................................................................................................................... 16
Water Detection Label Inspection ..................................................................................................... 17
Battery Inlay Removal ....................................................................................................................... 18
Finger Print Sensor Flex Removal .................................................................................................... 27
Top Carrier Removal ......................................................................................................................... 29
Rear-Facing Camera Lens Removal ................................................................................................ 30
NFC FPC Removal ........................................................................................................................... 31
Main PCB Removal ........................................................................................................................... 32
Finger Print Sensor Foam Removal .................................................................................................. 33
Rear-Facing Camera Removal ......................................................................................................... 35
Front-Facing Camera Removal ......................................................................................................... 36
Headset Jack Grommet Removal ..................................................................................................... 37
Secondary MIC Grommet Removal .................................................................................................. 38
Earpiece Speaker Removal .............................................................................................................. 39
Main PCB Graphite Removal ............................................................................................................ 40
Main PCB Copper Removal .............................................................................................................. 41
Bottom Carrier Removal .................................................................................................................... 42
Sub Board Removal .......................................................................................................................... 44
Vibrator Removal .............................................................................................................................. 46
USB Grommet Removal .................................................................................................................... 47
Primary MIC Grommet Removal ....................................................................................................... 48
Battery Removal ................................................................................................................................ 49

RF Cable Line Mylar Removal .......................................................................................................... 51

Coax Cable Removal ........................................................................................................................ 52
Main Flex Removal ........................................................................................................................... 53
Parts Refresh ..................................................................................................................................... 54
Tools Required for Parts Refresh ..................................................................................................... 54
Battery Inlay Cleaning ....................................................................................................................... 55
Front Housing Cleaning .................................................................................................................... 56
Assembly ........................................................................................................................................... 57
Assembly Map ................................................................................................................................... 57
Tools Required for Assembly ............................................................................................................ 58
Primary MIC Grommet Assembly...................................................................................................... 60
Secondary MIC Grommet Assembly ................................................................................................. 61
Water Detection Label Assembly ...................................................................................................... 62
Front-Facing Camera Assembly ....................................................................................................... 63
Rear-Facing Camera Foam Assembly .............................................................................................. 64
4M Rear-Facing Camera Assembly .................................................................................................. 65
Main PCB Graphite Assembly........................................................................................................... 66
Main PCB Copper Assembly............................................................................................................. 67
Headset Jack Grommet Assembly .................................................................................................... 68
Secondary MIC Grommet Adhesive Assembly ................................................................................. 70
Thermal Silica Assembly ................................................................................................................... 71
Main PCB Assembly ......................................................................................................................... 72
Earpiece Speaker Assembly ............................................................................................................. 73
USB Grommet Assembly .................................................................................................................. 74
Vibrator Assembly ............................................................................................................................. 75
Primary MIC Grommet Adhesive Assembly ...................................................................................... 76
Sub Board Assembly......................................................................................................................... 77
Coax Cable Assembly ....................................................................................................................... 78
RF Cable Line Mylar Assembly ......................................................................................................... 80
Rear-Facing Camera Assembly ........................................................................................................ 81
Main Flex Assembly .......................................................................................................................... 82
Bottom Carrier Assembly .................................................................................................................. 84
Battery Assembly .............................................................................................................................. 85
Rear-Facing Camera Adhesive Assembly ........................................................................................ 88
Rear-Facing Camera Lens Assembly ............................................................................................... 89
Finger Print Sensor Foam Assembly ................................................................................................ 90
NFC FPC Assembly .......................................................................................................................... 91

Top Carrier Assembly ....................................................................................................................... 92

Finger Print Sensor Assembly........................................................................................................... 93
Battery Inlay Assembly...................................................................................................................... 95
IMEI Label Assembly ........................................................................................................................ 98
Sim Tray Assembly ........................................................................................................................... 99

LIST OF TABLES
Table 1. External Views Parts List ........................................................................................................ 9
Table 2. Assembly Exploded View Parts List ..................................................................................... 10
TABLE OF FIGURES
Figure 1. External Views ....................................................................................................................... 8
Figure 2. Assembly Exploded View .................................................................................................... 10

SAFETY INFORMATION
Cautions and Warnings
Electrostatic Discharge
The phone components may be damaged by electrostatic discharge (ESD). Always use an ESD mat and ground strap
when working with internal components.
Battery Safety Guidelines

Handle Battery with care. Ensure Battery edges and surfaces are not dented or deformed. If the Battery Pack is dropped
to the floor, it may be internally damaged and must be scrapped.
Ensure all surfaces, fixtures, and phone components contacting the Battery are smooth and clean.
Ensure Battery and its insulation are not damaged (e.g. scratched, dented, punctured) prior to and throughout assembly.
Prior to assembly, ensure Battery edges and surfaces are not dented or deformed, and that fixtures and parts that will
contact the Battery are free of foreign material.
Ensure screws and screwdrivers do not contact the Battery.
Failure to adhere to Safety Critical Note(s) may increase risk of rupture, burning, or failure to function safely when used
by the customer.

INTRODUCTION
External Views
Figure 1. External Views

Table 1. External Views Parts List
Reference # Description
1 Headset Jack
2 Earpiece Speaker
3 Volume Key
4 Power Key
5 Camera Deco
6 Rear-Facing Camera Lens
7 Rear-Facing Camera
8 Flash Lens
9 Fingerprint Sensor (FPS)
10 Battery Inlay
11 Loud Speaker
12 USB Port
13 Front housing
14 Main Lens
15 SIM Door
16 Front-Facing Camera

Main Exploded Views

Figure 2. Assembly Exploded View
9B
Table 2. Assembly Exploded View Parts List
Reference # Description Recovery Part

Troika TP LCM ASSY_GR&HQ31608574000CS
1 Troika TP LCM ASSY_WH&HQ31608575000CS Yes
Troika TP LCM ASSY_MG&HQ31609539000CS
XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
2 XT2013-2 MB 4+64 DS&HQ31608580000CS Yes
ASSY,BD KIT,XT2013-1 BR 4+64G DS PLT
3 HQ+HQ20321076002+REC AAC No
4 MDL,CAMR,12M,L12AF20 Yes
5 MDL,CAMR,4M,A16V11C-1 Yes
6 MDL,CAMR,12M+5M,OGS1539 Yes
7 HQ21941713002+CAM Conductive cloth HZTY No
8 HQ22231764002+cable line mylar HZTY No
9 HQ+HQ22110434002+Screws BLACK PG No
10 HQ+HQ22110433002+Screws SILVER PG No

Reference # Description Recovery Part

11 XT2013 Screw M1.2-3.0&HQ22110529000CS No
12 HQ21404896002+SUB MIC rubber GL Yes
13 HQ22211583002+SUBMICAdhesive HZTY No
14 HQ21404898002+Audio rubber GL Yes
HQ20714531002+B cover GRY GL
15 HQ20714534002+B cover SL GL Yes
HQ20714655002+Bcover Mermaid GL
16 HQ22261416002+FPS FOAM LS No
17 HQ21212614000+1882A rear lens_black_cut Yes
Troika Battcover_GR&HQ31608576000CS
18 Troika Battcover_WH&HQ31608577000CS Yes
Troika Battcover_MG&HQ31609540000CS
19 HQ20900718002+FPS BTB spring GL Yes
20 HQ21404837002+FPS rubber GL Yes
HQ21404843002+SIM DS SL HL
HQ21404844002+ SIM DS GRY HL
HQ21404845002+SIM SS SL HL
21 Yes
HQ21404838002+ SIM SS GRY HL
HQ21405035002+DS Mermaid HL
HQ21405037002+ SIM SS Mermaid HL
22 HQ+HQ20330550002 BOX AAC Yes
23 HQ21404895002+MAIN MIC rubber GL Yes
24 HQ21404897002+USB rubber GL Yes
25 ACCY,BAT ACCY,BAT ACCY,BAT,3500mAh,KR40; No
26 HQ+HQ22002592002+link FPC XINLI Yes
27 HQ22211582002+mianMICAdhesive HZTY No
Troika Flash Board&HQ3120AE29000CS
28 Yes
XT2013-1 BR 4+64G DS FLB
29 HQ22261406002+Thermal silica LS No
30 HQ22202396002+FPS FOAM HZTY No
31 HQ20604073002+NFC RX No
MDL,FNGRPRT,Robusta 2 Play,Deep Tide,Ofi
32 MDL,FNGRPRT,Robusta 2 Play,WHT,Ofilm Yes
FINGERPRT SCANNER,ET536,Mermaid,Ofilm
HQ+HQ21300269002+cable line 105 BIYING
33 Yes
HQ+HQ21300271002 +cable line 102BIYING
34 HQ+HQ20401137002+Motor AWA No
Troika Sub Board&HQ31608582000 CS
35 Yes
XT2013-1 BR 4+64G DS KB

DISASSEMBLY AND RECOVERY

Disassembly and Recovery Map
*Shaded parts may be eligible for parts recovery.

Tools Required for Disassembly

The following tools are required to disassemble the Motorola One Action phone.
Description Part # Picture/Drawing
Battery Inlay/Display Removal Fixture MR-M2-001
Battery Inlay Removal Insert MR-M2-001-041
Heating Plate 3-00-Y2-10000
3 mm Allen Wrench --
Hot Plate --
Thin Plastic Spudger 0-00-00-40826

SIM/SD Tray Removal Tool --
Black Stick --
Torque Driver --
Shim 4-00-5L-10000
PH00 Bit --
Plastic Tweezers -- --
ESD Mat -- --
Wrist Strap -- --
Gloves -- --

SIM Tray Removal

NOTE
The SIM Tray can be recovered and
reused after removal.
1. Power off the device before beginning with the

procedure. Use the SIM Tray Removal pin to
push into the SIM Tray hole.
2. Press the SIM Tray removal tool to make it pop-

out as shown.
3. Use fingers to take out the SIM Tray.

IMEI Label Removal

NOTE
Remove the IMEI Label only if
necessary. After you remove it, you
cannot reuse it.
Use the Plastic Tweezer to remove the IMEI Label

from the SIM tray.

Water Detection Label Inspection

NOTE
If the Water Detection Label (WDL) has been
activated, the phone’s warranty no longer applies.
Inspect the WDL inside the SIM Tray Slot for signs of
activation. Use external light if needed.
NOTE
For SIM related and electrical malfunction, please
check this WDL.

Battery Inlay Removal

Preheating for Battery Inlay Removal
NOTE
The Battery Inlay can be recovered
and reused after removal.
NOTE
Battery Inlay Removal Methods A and B have
the same preheating steps, as shown below.
// CAUTION //
Do not set the Hot Plate temperature higher than
80°C (176°F). Damage to the phone may occur.
1. Set the Hot Plate to 80°C (176°F).
NOTE
Preheating with an oven is also acceptable if the
oven is set to the same temperature.
2. Place the phone on the Heating Plate, with the

Battery Inlay side down.
3. Wait 10 minutes for the Battery Inlay Adhesive

to warm up.

4. Remove the phone from the Heating Plate or

the oven.
// CAUTION //
Wear protective gloves when handling heated
phones.
NOTE
Perform the Battery Inlay removal procedure
before the phone starts to cool off.

Battery Inlay Removal Method A

1. Use the 3 mm Allen Wrench to loosen the
screws holding the side rails on the Battery Inlay
Fixture. Do not remove the rails.
2. Use the 3 mm Allen Wrench to remove the two

center screws.
3. Orient the Battery Inlay Removal Insert MR-M2-

001-041 in relation to the Display Removal
Fixture as shown. Place the Insert in the Battery
Removal Fixture.
4. Use an alignment pin to lock the Battery Inlay

Removal Insert and the Display Removal
Fixture as shown.

5. Use the 3 mm Allen Wrench on the two center

screws to tighten the Display/Battery Inlay
Removal Insert into position.
6. Slide both side rails on the Display Removal

Fixture firmly against the Battery Inlay Insert.
Use the 3 mm Allen Wrench to tighten the four
outside screws on the underside of the Display
Removal Fixture.
7. Follow preheating steps described on Page 16.
8. Slide the phone into the Battery Removal

Fixture as shown. Center the phone in the
Fixture.
9. Use an alignment pin to lock the phone and the

Battery Inlay Removal Insert as shown.

10. Firmly press the phone into the Insert, face

down.
11. Set the heating temperature on the heat gun to

80°C (176°F). Allow the Heat Gun to warm up
for 2-3 minutes.
//CAUTION//
Do not set the Heat Gun temperature higher than
80°C (176 °F). Damage to phone may occur.
//CAUTION//
Wear protective gloves while handling heated
phones.
12. Use the Heat Gun to warm the phone edges for
about 3 minutes. Keep the Heat Gun in motion
to avoid damaging the phone.

NOTE
Begin this step before the phone starts to cool
off.
13. As the Battery Inlay begins to release from the

phone, use the Thin Plastic Spudger to cut off
the Battery Inlay Adhesive along the edges of
the phone.
// CAUTION //
Do not insert the Thin Plastic Spudger more
than 10 mm to prevent damaging internal
components.
14. Use the Thin Plastic Spudger to gently cut the

adhesive from the bottom of the Battery Inlay as
shown.
15. Use the Thin Plastic Spudger to break the

suction on the suction cups attached to the
Battery Inlay.
16. Use an alignment pin to release the phone from

the Battery Inlay Removal Insert as shown.

17. After all the suction cups have been released,

carefully slide the phone out of the Battery
Removal Fixture.
18. Carefully lift the Battery Inlay from the Front

Housing.

Battery Inlay Removal Method B

1. Use the Suction Cup tool on the top-right
corner of the phone to create gap between the
Battery Inlay and the phone. Use the thin
plastic spudger to disengage the Battery Inlay
as shown.
2. Use the Thin Plastic Spudger to disengage the

Battery Inlay from all the sides of the phone.
//CAUTION//
Do not insert the Thin Plastic Spudger more than
10 mm to prevent damaging internal
components.

3. Move the Thin Plastic Spudger in the direction

1 to 4.
//CAUTION//
The highlighted frame is a weak area. Do not
disassemble at this location.
4. Split the Battery Inlay from the phone.
/// WARNING ///

Use care not to disconnect the Fingerprint
Sensor (FPS) Flex from the Battery Inlay when
removing the Front Housing.

Finger Print Sensor Flex Removal

NOTE
The Finger Print Sensor Flex can be
recovered and reused after removal.
1. Use the Plastic Tweezer to remove the rubber

from the location.
2. Use the Plastic Tweezer to remove the steel

sheet from the location.
3. Use the Plastic Tweezer to gently remove the

Finger Print Sensor Flex.
4. Use the pointed end of the Black Stick to push

out the Finger Print Sensor Flex from the
Battery Inlay.

// CAUTION //
Examine the gasket adhesive on the Finger Print
Sensor Flex. The Finger Print Sensor cannot be
recovered and reused if the gasket is broken.

Top Carrier Removal

NOTE
The Top Carrier can be recovered and
1. Use the Torque Driver with PH00 Bit to remove

the 12 screws.
/// WARNING ///

The screws cannot be reused after removal.
2. Use the flat end of the Black Stick to lift the Top
Carrier from the location as shown.
NOTE
Be careful with the NFC Flex.

Rear-Facing Camera Lens Removal

NOTE
The Rear-Facing Camera Lens can be
Use the pointed end of the Black Stick to carefully

disengage and push out the Rear-Facing Camera
Lens from the Top carrier.

NFC FPC Removal

NOTE
Remove the NFC FPC only if
cannot reuse it.
1. Use the Plastic Tweezer to remove the NFC

from the location as shown.
2. Use the flat end of the Black Stick to carefully

disengage and remove the NFC FPC from the
location as shown.

Main PCB Removal

NOTE
The Main PCB can be recovered and

disengage the P/L Sensor Flex BtB Connector,
Display Flex BtB Connector, Battery Flex BtB
Connector, and Main Flex BtB Connector from
the Main PCB.
2. Use the Plastic Tweezer to remove the Coax

Cables from the Main PCB.

the screw shown.
/// WARNING ///

The screw cannot be reused after removal.
4. Use the flat end of the Black Stick to lift the

Main PCB from the location as shown.

Finger Print Sensor Foam Removal

NOTE
The Finger Print Sensor Foam cannot
be recovered and reused.
Use the Plastic Tweezer to remove the Finger Print

Sensor Foam from the Main PCB.


NOTE
1. Inspect the WDL, which is visible on the Front

Housing. Examine it for signs of activation.
NOTE
For Front-Facing Camera and electrical
malfunction, please check this WDL.
2. Inspect the WDL, which is visible on the Main

PCB. Examine it for signs of activation.

Rear-Facing Camera Removal

NOTE
The Rear-Facing Camera can be
1. Use the flat end of the Black Stick to disengage the

Rear-Facing Camera Flexs from the Main PCB.
2. Use the flat end of the Black Stick to disengage the

Rear-Facing Camera Flex from the Main PCB.

Front-Facing Camera Removal

NOTE
The Front-Facing Camera can be
1. Use the Plastic Tweezer to remove the

Conductive Cloth on the Main PCB.
2. Use the flat end of the Black Stick to gently

remove the Front-Facing Camera as shown.

Headset Jack Grommet Removal

NOTE
The Headset Jack Grommet can be
Use the Plastic Tweezer to remove the Headset Jack

Grommet from the Main PCB.

Secondary MIC Grommet Removal

NOTE
The Secondary MIC Grommet can be
Use the Plastic Tweezer to remove the Secondary MIC

Grommet from the location as shown.

Earpiece Speaker Removal

NOTE
Remove the Earpiece Speaker only if
cannot reuse it.
Use the Plastic Tweezer to remove the Earpiece

Speaker from the location as shown.

Main PCB Graphite Removal

NOTE
After you remove the Main PCB
Graphite, you cannot reuse it.
Use the Plastic Tweezer to remove the Main PCB

Graphite from the Main PCB as shown.

Main PCB Copper Removal

NOTE
After you remove the Main PCB Copper
you cannot reuse it.
Use the Plastic Tweezer to remove the Main PCB

Copper from the Main PCB as shown.

Bottom Carrier Removal

NOTE
The Bottom Carrier can be recovered

the seven screws as shown.
/// WARNING ///

The screws cannot be reused after removal.
2. Use the flat end of the Black Stick to lift the

Bottom Carrier as shown.


NOTE
Inspect the WDL, which is visible on the Bottom

Carrier. Examine it for signs of activation.
NOTE
For USB, speaker, and electrical malfunction,
please check this WDL.

Sub Board Removal

NOTE
The Sub Board can be recovered and
1. Use the Plastic Tweezer to remove the Coax

Cables as shown.

disengage the Main Flex BtB Connector from
the location on the Sub Board as shown.

the white screw as shown.
/// WARNING ///

The screw cannot be reused after removal.

4. Use the flat end of the Black Stick to gently lift

the Sub Board from the location as shown.

Vibrator Removal
NOTE
Remove the Vibrator only if necessary.
After you remove it, you cannot reuse it.
Use the pointed end of the Black Stick to gently

disengage the Vibrator from the location as
shown.

USB Grommet Removal

NOTE
The USB Grommet can be
Use the Plastic Tweezer to remove the USB

Grommet from the Sub Board as shown.

Primary MIC Grommet Removal

NOTE
The Primary MIC Grommet can be
Use the Plastic Tweezer to remove the Primary MIC

Grommet from the location as shown.

Battery Removal
/// WARNING /// // CAUTION //
Failure to adhere to Safety Critical Note(s) may Handle the Battery Pack with care. If dropped on the
increase risk of rupture, burning, or failure to floor, it may be internally damaged and must be
function safely when used by the customer. scrapped.
Refer to the Battery Safety Guidelines.
Ensure Battery and its insulation are not damaged (e.g.
scratched, dented, punctured) prior to and through
NOTE assembly.
Prior to assembly, ensure Battery edges and surfaces
Remove the Battery only if it is are not dented or deformed, and that fixtures and parts
defective or damaged. After you that will contact the Battery are free of foreign material.
remove it, you cannot reuse it.
Ensure screws and screwdrivers do not contact the
Battery.
1. Set the temperature of the Hot Plate to 80°C

(176°F).
// CAUTION //
Do not set the Hot Plate temperature higher than
80°C (176°F). Damage to the phone may occur.
NOTE
Preheating with an oven is also acceptable if the
oven is set to the same temperature.
2. Place the phone on the Hot Plate, with the

Display side down.
3. Wait 10 minutes for the adhesive to warm up.

4. Use the Thin Plastic Spudger to cut the

adhesives from the top of the Battery.
5. Use the Thin Plastic Spudger to cut the

adhesives from the bottom of the Battery.
6. Use fingers to carefully lift and remove the

Battery from the phone.

RF Cable Line Mylar Removal

NOTE
After you remove the RF Cable Line
Mylar Film you cannot reuse it.
Use the Plastic Tweezer to remove the RF cable

line mylar film on the Coax Cable as shown.

Coax Cable Removal

NOTE
The Coax Cables can be recovered
Use the Plastic Tweezer to remove two Coax

Cables from the pocket on the recess of the
phone.

Main Flex Removal

NOTE
After you remove the Main Flex you
cannot reuse it.
Use fingers to gently peel off the Main Flex as

shown.

PARTS REFRESH
Tools Required for Parts Refresh
The following tools are required for parts refresh of the Motorola One Action phone.
Description Part # Image

Black Stick --
ESD Mat -- --
Wrist Strap -- --
Isopropyl (ISP) Alcohol -- --
Cotton Swabs -- --
Cleaning Pads -- --
Gloves or Finger Collets -- --

Battery Inlay Cleaning

Use the ISP Alcohol and Cotton Swabs to remove
all the adhesive on the Battery Inlay as shown.
/// CAUTION ///

Remove the adhesive carefully to avoid
damage to the Battery Inlay.

Front Housing Cleaning

Use the Cotton Swabs with ISP Alcohol to remove
all the adhesive from the location as shown.

ASSEMBLY
Assembly Map

Tools Required for Assembly

The following tools are required to assemble the Motorola One Action phone.
Black Stick --
Torque Driver --
PH00 Bit --
Battery Inlay Press 3-00-Y1-10000
Fixture Press 19501980
Manual Roller --
Tweezers -- --


Gloves or Finger Collets -- --

Primary MIC Grommet Assembly

Description Reference #
Troika TP LCM ASSY_WH&HQ31608575000CS 1
HQ21404895002+MAIN MIC rubber GL 23
Use the Plastic Tweezer to place the Primary MIC

Grommet on the Bottom Carrier.

Secondary MIC Grommet Assembly

HQ21404896002+SUB MIC rubber GL 12
Use the Plastic Tweezer to place and secure the

Secondary MIC Grommet on the Front Housing.

Water Detection Label Assembly

21
Use the Plastic Tweezer to place the Water

Detection Labels (WDL) near the Front-Facing
Camera.

Front-Facing Camera Assembly

MDL,CAMR,12M,L12AF20 4
1. Use fingers to place the Front-Facing Camera

on the Main PCB as shown.
2. Use the Plastic Tweezer to place the

Conductive Cloth on the Main PCB.

Rear-Facing Camera Foam Assembly

XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ22202393002+rear cam foam HZTY -

Rear-Facing Camera Foam on the Main PCB.

4M Rear-Facing Camera Assembly

MDL,CAMR,4M,A16V11C-1 5
MDL,CAMR,12M+5M,OGS1539 6
Use fingers to place and secure the 4M Rear-

Facing Camera on the Main PCB.

Main PCB Graphite Assembly

XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ22261415002+TOPgraphite LS -

Graphite on the Main PCB.

Main PCB Copper Assembly

XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ22261409002+btmCopper foil LS -

Copper Foil on the Main PCB.

Headset Jack Grommet Assembly

XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ21404898002+Audio rubber GL 14
Use the Plastic Tweezer to place the Headset

Jack Grommet on the Main PCB.


XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ+HQ60407417002+Water laber HG -

Detection Label (WDL) on the Main PCB.

Secondary MIC Grommet Adhesive Assembly

XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ22211583002+SUBMICAdhesive HZTY 13
1. Use fingers to place the Secondary MIC

Grommet Adhesive on the location as shown.
2. Use the Plastic Tweezer to peel off the liner


Thermal Silica Assembly

XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ22261406002+Thermal silica LS 29

Thermal Silica on the Main PCB.

Main PCB Assembly

HQ+HQ22110433002+Screws SILVER PG 10
XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
1. Use fingers to place the Main PCB on the

Front Housing.
2. Use Torque Driver with PH00 Bit to tighten the

screw (0.75±0.05 kgf-cm).
3. Use fingers to place and secure the Display

Flex BtB Connector and P/L Flex BtB
Connector on the Main PCB.

Earpiece Speaker Assembly

HQ+HQ20321076002+REC AAC 3
HQ+HQ20330550002 BOX AAC 22
Use the Plastic Tweezer to place the Earpiece

Speaker on the location aligning with the pins as
shown.

USB Grommet Assembly

HQ21404897002+USB rubber GL 24
35
XT2013-1 BR 4+64G DS KB

USB Grommet on the Sub Board.

Vibrator Assembly
HQ+HQ20401137002+Motor AWA 34

Vibrator on the Front Housing.

Primary MIC Grommet Adhesive Assembly

XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
HQ21404895002+MAIN MIC rubber GL 23
1. Use fingers to place the Primary MIC

Grommet Adhesive on the location as shown.
2. Use the Plastic Tweezer to peel off the liner


Sub Board Assembly

HQ+HQ22110433002+Screws SILVER PG 10
35
XT2013-1 BR 4+64G DS KB
1. Use fingers to place the Sub Board on the

Front Housing.
2. Use the Torque Driver with PH00 Bit to

tighten the white screw (0.75±0.05 kgf-cm).

Coax Cable Assembly

33
XT2013-1 MB 4+64 SS&HQ31608579000CS
XT2013-1 MB 4+64 DS&HQ31608578000CS
XT2013-2 MB 4+64 DS&HQ31608580000CS 2
35
XT2013-1 BR 4+64G DS KB
1. Use the Plastic Tweezer to place the white

Coax Cable on the Main PCB and Sub Board as
shown.
2. Use the Plastic Tweezer to place the black

Coax Cable on the Main PCB and Sub Board.

3. Ensure the Coax Cable hoop is pressed into the

wire groove and cannot be lifted.
4. Use fingers to place and secure the two Coax

Cables in the pocket on the recess of the
phone.
NOTE
Make sure the Black Coax Cable is placed above
the White Coax Cable.

RF Cable Line Mylar Assembly

33
HQ22231764002+cable line mylar HZTY 8
Use the Plastic Tweezer to place the RF cable line

mylar film on the Coax Cable as shown.

Rear-Facing Camera Assembly

MDL,CAMR,4M,A16V11C-1 5
MDL,CAMR,12M+5M,OGS1539 6
Use fingers to place and secure the Rear-Facing

Camera on the Main PCB.

Main Flex Assembly

1. Use fingers to carefully place the Main Flex on

the phone as shown, sticky side down.
2. Use fingers to place and secure the Main Flex

BtB Connector on the Main PCB and the Sub
Board.


35
XT2013-1 BR 4+64G DS KB

Detection Label (WDL) on the Sub Board.

Bottom Carrier Assembly

HQ+HQ22110434002+Screws BLACK PG 9
35
XT2013-1 BR 4+64G DS KB
1. Use fingers to place the Bottom Carrier on the

Front-Housing.
2. Use Torque Driver with PH00 Bit to tighten the

seven screws (0.75±0.05 kgf-cm).

Battery Assembly
18
Troika Battcover_WH&HQ31608577000CS
ACCY,BAT ACCY,BAT ACCY,BAT,3500mAh,KR40 25
/// WARNING /// // CAUTION //

Failure to adhere to Safety Critical Note(s) may Handle the Battery Pack with care. If dropped to the
increase risk of rupture, burning, or failure to floor, it may be internally damaged and must be
function safely when used by the customer. scrapped.
Refer to the Battery Safety Guidelines.
Ensure Battery and its insulation are not damaged (e.g.
scratched, dented, punctured) prior to and throughout
assembly.
Prior to assembly, ensure Battery edges and surfaces
are not dented or deformed, and that fixtures and parts
that will contact the Battery are free of foreign material.
Ensure screws and screwdrivers do not contact the
Battery.
1. Use fingers to place the Battery on the Front

Housing.
2. Use fingers to press and secure the Battery

BtB Connector on the Main PCB.

3. Use the Manual Roller to roll over the Battery

for 10 cycles to secure the Battery as shown.
NOTE
For each cycle roll the Manual Roller from top to
bottom of the Battery and vice versa.
NOTE
Each cycle should last for 3 seconds.
4. Use finger to buckle the battery BTB connector

on the Main PCB.
5. Use fingers to press left thumb on the battery

connector ,put right thumb under the FPC,
move right thumb under left thumb.

6. Use fingers to push up with your right thumb.
7. Connector reinforcement plate position FPC

bent. Check the connector reinforcement plate
cannot be raised.

Rear-Facing Camera Adhesive Assembly

HQ20714534002+B cover SL GL 15
XT2013 Camrea Lens AHD&HQ22280546000CS -
Use Plastic Tweezer to place the Rear-Facing
Camera Adhesive on the location as shown and
peel off the liner.

Rear-Facing Camera Lens Assembly

HQ21212614000+1882A rear lens_black_cut 17
Use the Plastic Tweezer to place the Rear-Facing

Camera Lens as shown.

Finger Print Sensor Foam Assembly

HQ22202396002+FPS FOAM HZTY 30
Use the Plastic Tweezer to place the Finger Print

Sensor Foam as shown.

NFC FPC Assembly

HQ20604073002+NFC RX 31
1. Use Plastic Tweezer to press the NFC FPC

connector to the Top Carrier as shown.
2. Use Plastic Tweezer to place the NFC on the

Top Carrier.

Top Carrier Assembly

HQ+HQ22110434002+Screws BLACK PG 9
1. Use fingers to place the Top Carrier on the

Front Housing.
2. Use the Torque Driver with PH00 Bit to tighten

the 11 screws (0.75±0.05 kgf-cm).
3. Use the Torque Driver with PH00 Bit to tighten

the screw (0.75±0.05 kgf-cm).
NOTE
The screw used at this position is white screw.
Inspect the color of this screw. Be careful to use
the same color screw while repairing the phones.

Finger Print Sensor Assembly

HQ+HQ22002592002+link FPC XINLI 26
MDL,FNGRPRT,Robusta 2 Play,Deep Tide,Ofi
MDL,FNGRPRT,Robusta 2 Play,WHT,Ofilm 32
FINGERPRT SCANNER,ET536,Mermaid,Ofilm
HQ21404837002+FPS rubber GL 20
HQ20900718002+FPS BTB spring GL 19
1. Use fingers to place the Finger Print Flex on

the location as shown.
2. Use the Plastic Tweezer to place the steel

sheet on the Finger Print Flex as shown.

3. Use the Plastic Tweezer to place the rubber

on the location as shown.
4. Use fingers to press and secure the rubber

firmly in the gap as shown.

Battery Inlay Assembly

Troika Battcover_WH&HQ31608577000CS 18
Troika Battcover_MG&HQ31609540000CS
1. Use the Plastic Tweezer to position the Battery

Inlay Adhesive on the lower part of the Battery
Inlay Press Fixture as shown.
2. Use fingers to place the Battery Inlay on the

top part of the Battery Inlay Press Fixture and
then attach the Finger Print Sensor Flex and
Rear-Facing Camera adhesive as shown.
3. Place both the Battery Inlay Press Fixtures in

the Fixture Press as shown.

4. Press down the handle of the Fixture Press for

5 minutes to secure the Battery Inlay firmly on
the phone.
5. Take the Battery Inlay out from the Fixture

Press.
6. Use fingers to peel off the liner.
7. Use fingers to attach the Finger Print Sensor

Flex to the Battery Inlay, aligning with the pins
as shown.

8. Place the phone with another set of Battery

Inlay Press Fixture, display side down.
NOTE
Use care not to break the Finger Print Sensor
Flex.
9.
10. Press down the handle of the Fixture Press for

5 minutes to secure the Battery Inlay firmly on
the phone.
11. Take the phone out from the Fixture Press.

IMEI Label Assembly

21
Use the Plastic Tweezer to place the IMEI Label
on the SIM tray as shown.

Sim Tray Assembly

21
1. Insert the SIM Tray in the transceiver as

shown.
2. Use finger to press the SIM Tray until it secures

into the transceiver.


Moto One Action Service Manual - 20190916

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Moto One Action Service Manual - 20190916

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Motorola One Action

Lenovo Motorola One Action

Lenovo Confidential Restricted:

Lenovo Confidential Restricted:

RF Cable Line Mylar Removal .......................................................................................................... 51

Lenovo Confidential Restricted:

Top Carrier Assembly ....................................................................................................................... 92

Lenovo Confidential Restricted:

Lenovo Confidential Restricted:

Battery Safety Guidelines

Lenovo Confidential Restricted:

Lenovo Confidential Restricted:

Table 1. External Views Parts List

Lenovo Confidential Restricted:

Main Exploded Views

Table 2. Assembly Exploded View Parts List

Reference # Description Recovery Part

Lenovo Confidential Restricted:

Reference # Description Recovery Part

Lenovo Confidential Restricted:

DISASSEMBLY AND RECOVERY

Lenovo Confidential Restricted:

Tools Required for Disassembly

Description Part # Picture/Drawing

Battery Inlay/Display Removal Fixture MR-M2-001

Battery Inlay Removal Insert MR-M2-001-041

Heating Plate 3-00-Y2-10000

Thin Plastic Spudger 0-00-00-40826

Lenovo Confidential Restricted:

Description Part # Picture/Drawing

SIM/SD Tray Removal Tool --

Lenovo Confidential Restricted:

SIM Tray Removal

1. Power off the device before beginning with the

2. Press the SIM Tray removal tool to make it pop-

3. Use fingers to take out the SIM Tray.

Lenovo Confidential Restricted:

IMEI Label Removal

Use the Plastic Tweezer to remove the IMEI Label

Lenovo Confidential Restricted:

Water Detection Label Inspection

Lenovo Confidential Restricted:

Battery Inlay Removal

1. Set the Hot Plate to 80°C (176°F).

2. Place the phone on the Heating Plate, with the

3. Wait 10 minutes for the Battery Inlay Adhesive

Lenovo Confidential Restricted:

4. Remove the phone from the Heating Plate or

Lenovo Confidential Restricted:

Battery Inlay Removal Method A

2. Use the 3 mm Allen Wrench to remove the two

3. Orient the Battery Inlay Removal Insert MR-M2-

4. Use an alignment pin to lock the Battery Inlay

Lenovo Confidential Restricted:

5. Use the 3 mm Allen Wrench on the two center

6. Slide both side rails on the Display Removal

7. Follow preheating steps described on Page 16.

8. Slide the phone into the Battery Removal

9. Use an alignment pin to lock the phone and the

Lenovo Confidential Restricted:

10. Firmly press the phone into the Insert, face

11. Set the heating temperature on the heat gun to

Lenovo Confidential Restricted: