This document provides the specifications for an S3 package in a 3-lead plastic SOT-23 format. It details the key dimensions for the package in millimeters, including the lead widths and spacing, as well as recommended solder pad layout. Notes provide additional information on controlling dimensions, plating thickness, mold flash limits, and the JEDEC reference.
This document provides the specifications for an S3 package in a 3-lead plastic SOT-23 format. It details the key dimensions for the package in millimeters, including the lead widths and spacing, as well as recommended solder pad layout. Notes provide additional information on controlling dimensions, plating thickness, mold flash limits, and the JEDEC reference.
This document provides the specifications for an S3 package in a 3-lead plastic SOT-23 format. It details the key dimensions for the package in millimeters, including the lead widths and spacing, as well as recommended solder pad layout. Notes provide additional information on controlling dimensions, plating thickness, mold flash limits, and the JEDEC reference.
(.022) (.008 – .010) (.070 – .081) S3 SOT-23 REV D 0910 REF NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE 4. DIMENSIONS ARE INCLUSIVE OF PLATING 5. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 6. MOLD FLASH SHALL NOT EXCEED .254mm 7. PACKAGE JEDEC REFERENCE IS TO-236 VARIATION AB