Designation: B 32 – 96 An American National Standard

AMERICAN SOCIETY FOR TESTING AND MATERIALS

100 Barr Harbor Dr., West Conshohocken, PA 19428
Reprinted from the Annual Book of ASTM Standards. Copyright ASTM

Standard Specification for

Solder Metal1
This standard is issued under the fixed designation B 32; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (e) indicates an editorial change since the last revision or reapproval.

This standard has been approved for use by agencies of the Department of Defense.

1. Scope Determine Conformance with Specifications3

1.1 This specification covers solder metal alloys (commonly
known as soft solders), including tin-lead, tin-antimony, tin-
antimony-copper-silver, tin-antimony-coppersilver-nickel, tin-
silver, tin-copper-silver, and lead-tin-silver, used for the pur-
pose of joining together two or more metals at temperatures
below their melting points.
1.1.1 These solders include those alloys having a liquidus
temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid
bars, ingots, powder and special forms, and in the form of solid
and flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded
as the standard. The values given in parentheses are for
information only.
1.3 The following precautionary caveat pertains only to the
test method portion, Section 13, of this specification: This
standard does not purport to address all of the safety concerns,
if any, associated with its use. It is the responsibility of the user
of this standard to establish appropriate safety and health
practices and determine the applicability of regulatory limita-
tions prior to use. For specific precautionary statement, see
13.3.5.
2. Referenced Documents
2.1 ASTM Standards:
D 269 Test Method for Insoluble Matter in Rosin and Rosin
Derivatives2
D 464 Test Methods for Saponification Number of Naval
Store Products Including Tall Oil and Other Related
Products2
D 465 Test Methods for Acid Number of Naval Stores
Products Including Tall Oil and Other Related Products2
D 509 Test Methods of Sampling and Grading Rosin2
E 28 Test Method for Softening Point by Ring-and-Ball
Apparatus2
E 29 Practice for Using Significant Digits in Test Data to
1 3
This specification is under the jurisdiction of ASTM Committee B-2 on
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee
B02.02 on Refined Lead, Tin, Antimony, and Their Alloys.
Current edition approved May 10, 1996. Published June 1996. Originally
published as B 32 – 19 T. Last previous edition B 32 – 95b.
2
Annual Book of ASTM Standards, Vol 06.03.
E 46 Test Methods for Chemical Analysis of Lead- and
Tin-Base Solder4
E 51 Method for Spectrographic Analysis of Tin Alloys by
the Powder Technique5
E 55 Practice for Sampling Wrought Nonferrous Metals and
Alloys for Determination of Chemical Composition4
E 87 Methods for Chemical Analysis of Lead, Tin, Anti-
mony, and Their Alloys (Photometric Method)6
E 88 Practice for Sampling Nonferrous Metals and Alloys
in Cast Form for Determination of Chemical Composition4
2.2 Federal Standard:
Fed. Std. No. 123 Marking for Shipment (Civil Agencies)7
2.3 Military Standard:
MIL-STD-129 Marking for Shipment and Storage7
3. Terminology
3.1 Definition:
3.1.1 producer,, n—the primary manufacturer of the mate-
rial.
3.2 Definitions of Terms Specific to This Standard:
3.2.1 lot,, n—The term “lot” as used in this specification is
defined as follows:
3.2.1.1 Discussion—For solid solder metal, a lot consists of
all solder of the same type designation, produced from the
same batch of raw materials under essentially the same
conditions, and offered for inspection at one time.
3.2.1.2 Discussion—For flux–core solder, a lot consists of
all solder of the same core mixture, produced from the same
batch of raw materials under essentially the same conditions
and offered for inspection at one time.
3.2.2 lot number,, n—The term “lot number” as used in this
specification refers to a numerical designation for a lot which
is traceable to a date of manufacture.
Annual Book of ASTM Standards, Vol 14.02.
4
Annual Book of ASTM Standards, Vol 03.05.
5
Discontinued—See 1984 Annual Book of ASTM Standards, Vol 03.06.
6
Discontinued—See 1984 Annual Book of ASTM Standards, Vol 03.05.
7
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.

1
 B 32
4. Classification TABLE 2 Flux Type

4.1 Type Designation—The type designation uses the fol- Symbol Description

lowing symbols to properly identify the material: S Solid, no flux

R Rosin, nonactivated
4.1.1 Alloy Composition—The composition is identified by RMA Rosin, mildly activated
a two-letter symbol and a number. The letters typically indicate RA Rosin, activated
the chemical symbol for the critical element in the solder and OA Organic, water-soluble
OS Organic, organic solvent-soluble (other than R, RMA, or RA)
the number indicates the nominal percentage, by weight, of the IS Inorganic acids and salts
critical element in the solder. The designation followed by the
letters A or B distinguishes between different alloy grades of
similar composition (see Table 5). TABLE 3 Core Condition and Flux Percentage
4.1.2 Form—The form is indicated by a single letter in Condition
Condition
Symbol
accordance with Table 1.
4.1.3 Flux Type—The flux type is indicated by a letter or D Dry powder
P Plastic
combination of letters in accordance with Table 2.
Percentage
4.1.4 Core Condition and Flux Percentage (applicable only Symbol
Flux Percentage by Weight
to flux-cored solder)—The core condition and flux percentage
Nominal Min Max
is identified by a single letter and a number in accordance with 1 1.1 0.8 1.5
Table 3. 2 2.2 1.6 2.6
4.1.5 Powder Mesh Size and Flux Percentage (applicable 3 3.3 2.7 3.9
4 4.5 4.0 5.0
only to solder paste)—The powder mesh size and flux percent- 6A 6.0 5.1 7.0
age is identified by a single letter and a number in accordance A
Not applicable to flux types R, RMA, and RA.
with Table 4.
5. Ordering Information TABLE 4 Powder Mesh Size and Flux Percentage
5.1 Orders for material under this specification indicate the Size Symbol Powder Mesh Size
following information, as required, to adequately describe the A <325
desired material. B <200
C <100
5.1.1 Type designation (see 4.1),
Percentage Symbol Flux Percentage by Weight
5.1.2 Detailed requirements for special forms,
5.1.3 Dimensions of ribbon and wire solder (see 9.2), Min Max
1 1 5
5.1.4 Unit weight, 2 6 10
5.1.5 Packaging (see Section 18), 3 11 15
5.1.6 Marking (see Section 17), 4 16 20
5 21 25
5.1.7 ASTM specification number and issue, marked on (a) 6 26 30
purchase order and (b) package or spool, and 7 >30
5.1.8 Special requirements, as agreed upon between sup-
plier and purchaser.
7.2 Flux (applicable to flux-core ribbon, wire, and solder
6. Materials and Manufacture
paste):
6.1 The producer must have each lot of solder metal as 7.2.1 Type R—The flux is composed of Grade WW or WG
uniform in quality as practicable and of satisfactory appearance gum rosin of Test Methods D 509. The rosin shall have a
in accordance with best industrial practices. Each bar, ingot, or toluene–insoluble matter content of not more than 0.05
other form in which the solder is sold must be uniform in weight % in accordance with Test Method D 269, a minimum
composition with the entire lot. acid number of 160 mg KOH/1 g sample in accordance with
7. Chemical Composition Test Methods D 465, a minimum softening point of 70°C in
7.1 Solder Alloy—The solder alloy composition is as speci- accordance with Test Method E 28, and a minimum saponifi-
fied in Table 5. cation number of 166 in accordance with Test Methods D 464.
When solvents or plasticizers are added, they must be nonchlo-
NOTE 1—By mutual agreement between supplier and purchaser, analy- rinated.
sis may be required and limits established for elements or compounds not 7.2.2 Type RMA—The flux is composed of rosin conform-
specified in Table 5.
ing to 7.2.1. Incorporated additives provide a material meeting
TABLE 1 Form the requirements of 8.2 for type RMA. When solvents or
Symbol Form plasticizers are added, they must be nonchlorinated.
B Bar 7.2.3 Type RA—The flux is composed of rosin conforming
I Ingot to 7.2.1. Incorporated additives provide a material meeting the
P Powder
R Ribbon
requirements of 8.2 for Type RA. When solvents or plasticizers
S SpecialA are added, they must be nonchlorinated.
W Wire 7.2.4 Type OA—The flux is composed of one or more
A
Includes pellets, preforms, etc. water-soluble organic materials.
2
 B 32
TABLE 5 Solder Compositions
Composition, %A,B Melting RangeC
Alloy Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Se Solidus Liquidus UNS
Grade 1 2 3 4 5 6 7 8 9 10 11 12 13 Number
°F °C °F °C
Section 1: Solder Alloys Containing Less than 0.2 % Lead
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.01 0.02 0.005 ... ... 430 221 430 221 L13965
max max
Sn95 Rem 0.10 0.12 4.4–4.8 0.08 0.005 0.005 0.15 0.01 0.02 0.005 ... ... 430 221 473 245 L13967D
Sn94 Rem 0.10 0.12 5.4–5.8 0.08 0.005 0.005 0.15 0.01 0.02 0.005 ... ... 430 221 536 280 L13969D
Sb5 94.0 min 0.20 4.5–5.5 0.015 0.08 0.005 0.005 0.15 0.01 0.04 0.005 ... ... 450 233 464 240 L13950
EE Rem 0.10 0.05 0.25–0.75 3.0–5.0 0.005 0.005 0.02 0.05 0.02 0.005 ... ... 440 225 660 349 L13935D
HAE Rem 0.10 0.5–4.0 0.1–3.0 0.1–2.0 0.005 0.005 0.15 0.05 0.02 0.5–4.0 ... ... 420 216 440 227 L13955D
HBE Rem 0.10 4.0–6.0 0.05–0.5 2.0–5.0 0.005 0.005 0.15 0.05 0.02 0.01 0.05–2.0 ... 460 238 660 349 L13952D
HNE Rem 0.10 0.05 0.05–0.15 3.5–4.5 0.005 0.005 0.15 0.05 0.02 0.005 440 225 660 350 L13933D
ACE Rem 0.10 0.05 0.2–0.3 0.1–0.3 0.005 0.005 2.75– 0.01 0.02 0.005 0.001 ... 403 206 453 234 L13964D
3.75
E
OA Rem 0.10 0.05 0.09–0.10 2.8–3.2 0.005 0.005 0.9–1.1 0.01 0.02 0.005 ... ... 420 216 460 238 L13937D
AM Rem 0.10 0.8–1.2 0.4–0.6 2.8–3.2 0.005 0.005 0.15 0.01 0.02 0.005 ... ... 430 220 446 230 L13938D
TC Rem 0.20 0.05 0.015 4.0–5.0 0.005 0.005 0.05 0.05 0.04 0.005 0.005 0.04– 419 215 660 350 L13931D
0.20
WS Rem 0.10 1.0–1.5 0.2–0.6 3.5–4.5 0.005 0.005 0.02 0.05 0.02 0.005 ... ... 440 225 660 350 L13939
Section 2: Solder Alloys Containing Lead
Sn70 69.5–71.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 361 183 377 193 L13700
Sn63 62.5–63.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 361 183 361 183 L13630
Sn62 61.5–62.5 Rem 0.50 1.75–2.25 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 354 179 372 189 L13620D
Sn60 59.5–61.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 361 183 374 190 L13600
Sn50 49.5–51.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 ... 361 183 421 216 L55031
Sn45 44.5–46.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 ... 361 183 441 227 L54951
Sn40A 39.5–41.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 460 238 L54916
Sn40B 39.5–41.5 Rem 1.8–2.4 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 448 231 L54918
Sn35A 34.5–36.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 447 247 L54851
Sn35B 34.5–36.5 Rem 1.6–2.0 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 470 243 L54852
Sn30A 29.5–31.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 491 255 L54821
Sn30B 29.5–31.5 Rem 1.4–1.8 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 482 250 L54822
Sn25A 24.5–26.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 511 266 L54721
Sn25B 24.5–26.5 Rem 1.1–1.5 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 504 263 L54722
Sn20A 19.5–21.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 531 277 L54711
Sn20B 19.5–21.5 Rem 0.8–1.2 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 363 184 517 270 L54712
Sn15 14.5–16.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 437 225 554 290 L54560
Sn10A 9.0–11.0 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 514 268 576 302 L54520
Sn10B 9.0–11.0 Rem 0.20 1.7–2.4 0.08 0.001 0.005 0.03 0.02 0.02 0.005 ... 514 268 570 299 L54525
Sn5 4.5–5.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 586 308 594 312 L54322
Sn2 1.5–2.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 601 316 611 322 L54210
Ag1.5 0.75–1.25 Rem 0.40 1.3–1.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 ... 588 309 588 309 L50132
Ag2.5 0.25 Rem 0.40 2.3–2.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 ... 580 304 580 304 L50151
Ag5.5 0.25 Rem 0.40 5.0–6.0 0.30 0.001 0.005 0.25 0.02 0.02 0.005 ... 580 304 716 380 L50180
A
Limits are % max unless shown as a range or stated otherwise.
B
For purposes of determining conformance to these limits, an observed value or calculated value obtained from analysis shall be rounded to the nearest unit in the last
right-hand place of figures used in expressing the specified limit, in accordance with the rounding method of Practice E 29.
C
Temperatures given are approximations and for information only.
D
LXXXXX is a proposed number.
E
Grades E and OA are covered by U.S. patents held by Engelhard Corp, Mansfield, MA, and Oatey Co. Cleveland, OH respectively. Federated Fry Metals, Altoona, PA
and Taracorp Inc, Atlanta, GA have applied for patents on grades AC and TC respectively. Grades HA, HB, and HN are covered by patents assigned to J. W. Harris Co.,
Cincinnati, OH. Interested parties are invited to submit information regarding identification of acceptable alternatives to these patented items to the Committee on
Standards, ASTM Headquarters, 100 Barr Harbor Drive, West Conshohocken, PA 19428. Your comments will receive careful consideration at a meeting of the responsible
technical committee, which you may attend.

7.2.5 Type OS—The flux is composed of one or more
water-insoluble organic materials, other than Types R, RMA,
and RA, which are soluble in organic solvents.
7.2.6 Type IS—The flux is composed of one or more
inorganic salts or acids with or without an organic binder and
solvents.
8. Physical Properties and Performance Requirements
8.1 Solder Paste—Solder paste must exhibit smoothness of
texture (no lumps) and the absence of caking and drying.
8.1.1 Powder Mesh Size—The solder powder mesh size
shall be as specified (see 5.1.1 and 4.1.5) when the extracted
solder powder is tested as specified in 13.4.
8.1.2 Viscosity—The viscosity of solder paste and the
3
method used to determine the viscosity must be agreed upon
between the supplier and purchaser.
8.2 The following variables must be taken into account
when relating one viscosity measurement to another: type of
viscometer used, spindle size and shape, speed (r/min), tem-
perature of sample, and the use or non-use of a helipath.
8.3 Requirements for Flux—The flux must meet the physi-
cal and performance requirements specified in Table 6 as
applicable.
8.3.1 Solder Pool—When solder is tested as specified in
13.3.2, there must be no spattering, as indicated by the
presence of flux particles outside the main pool of residue. The
flux must promote spreading of the molten solder over the
 B 32
TABLE 6 Requirements for Flux
Test Type R Type RMA Type RA Other Flux Types Method Section
Weight of flux see Table 3 see Table 3 see Table 3 see Table 3 13.3.1
Solder poolA see 8.2.1 see 8.2.1 see 8.2.1 see 8.2.1 13.3.2
Spread factorB 80 min 80 min 80 min not required 13.3.3
DrynessC see 8.2.2 see 8.2.2 see 8.2.2 not required 13.3.4
Resistivity of water extract 100 000 min 100 000 50 000 not required 13.3.5
(V·cm)
Chlorides and bromidesD see 8.2.3 see 8.2.3 not required not required 13.3.6
Copper mirrorE pass pass not required not required 13.3.7
A
Applicable only to composition 60/40.
B
Applicable only to composition 60/40 in the form of flux-core wire or solderpaste.
C
Applicable only to composition 60/40 in the form of flux-core wire.
D
Applicable only to flux-core wire and solderpaste.
E
Applicable only to flux-core wire.

coupon to form integrally thereon a coat of solder that shall
feather out to a thin edge. The complete edge of the solder pool
must be clearly visible through the flux residue.
8.3.2 Dryness—When solder is tested as specified in 13.3.2,
the surface of the residue must be free of tackiness, permitting
easy and complete removal of applied powdered chalk.
8.3.3 Chlorides and Bromides Test—When the extracted
flux is tested as specified in 13.3.6, the test paper will show no
chlorides or bromides by a color change of the paper to
off-white or yellow white.
8.3.4 Copper Mirror Test—When tested as specified in
13.3.7, the extracted flux will have failed the test if, when
examined against a white background, complete removal of the
copper film is noted, as evidenced by the white background
showing through, and must be rejected. Discoloration of the
copper due to a superficial reaction or to only a partial
reduction of the thickness of the copper film is not cause for
rejection.
9. Dimensions and Unit Weight
9.1 Bar and Ingot Solder—The dimensions and unit weight
of bar and ingot solder will be as agreed upon between supplier
and purchaser.
9.2 Wire solder (solid and flux-cored)—The dimensions and
unit weight of wire solder are specified in 5.1.3 and 5.1.4. The
tolerance on the specified outside diameter shall be 65 % or
60.002 in. (0.05 mm), whichever is greater.
9.3 Other Forms:
9.3.1 Dimensions for ribbon and special forms will be
agreed upon between supplier and purchaser.
9.3.2 The unit weight of solder paste is specified in 5.1.4.
10. Workmanship, Finish, and Appearance
10.1 All forms of solder must be processed in such a manner
as to be uniform in quality and free of defects that will affect
life, serviceability, or appearance.
11. Sampling
11.1 Care must be taken to ensure that the sample selected
for testing is representative of the material. The method of
sampling consists of one of the following methods:
11.1.1 Samples taken from the final solidified cast or fabri-
cated product.
11.1.2 Representative samples obtained from the lot of
molten metal during casting. The molten sample is poured into
a cool mold, forming a bar approximately 1⁄4in. (6.4 mm) thick.
4
11.2 Frequency of Sampling—Frequency of sampling for
determination of chemical composition shall be in accordance
with Table 7. For spools and coils, the sample is obtained by
cutting back 6 ft (1.8 m) of wire from the free end and then
taking the next 6 ft for test. In other forms, an equivalent
sample is selected at random from the container.
11.3 Other Aspects of Sampling—Other aspects of sampling
conforms in the case of bar and ingots, to Practice E 88. For
fabricated solders the appropriate reference is Practice E 55.
12. Specimen Preparation
12.1 Flux-Cored Ribbon and Wire Solder and Solder
Paste—Each sample of flux-cored ribbon or wire solder or
solder paste is melted in a clean container under oil and mixed
thoroughly. After the flux has risen to the top, the alloy is
poured carefully into a cool mold (care should be taken to
allow the flux and alloy to separate completely), forming a bar
approximately 1⁄4in. (6.4 mm) thick. The bar is cleaned of flux
residue and sampled for analysis as specified in 12.3.
12.1.1 Flux Extraction Procedure:
12.1.1.1 Flux-Cored Solder—The flux core is extracted as
follows: Cut a length of the flux-cored solder weighing
approximately 150 g and seal the ends. Wipe the surface clean
with a cloth moistened with acetone. Place the sample in a
beaker, add sufficient distilled water to cover the sample, and
boil for 5 to 6 min. Rinse the sample with acetone and allow to
dry. Protecting the solder surface from contamination, cut the
sample into 3⁄8-in. (9.5 mm) (maximum) lengths without
crimping the cut ends. Place the cut lengths in an extraction
tube of a chemically clean soxhlet extraction apparatus and
extract the flux with reagent grade, 99 % isopropyl alcohol
until the return condensate is clear. The resistivity of water
extract, copper mirror, and chlorides and bromides tests are
performed using a test solution prepared by concentrating the
solids content in the flux extract solution to approximately
35 % by weight by evaporation of the excess solvent. The exact
solids content of the test solution are determined on an aliquot,
dried to constant weight in a circulating air oven maintained at
85 6 3°C.
TABLE 7 Frequency of Sampling
Number of Samples (spools,
Size of Lot, lb (kg)
coils, containers or pieces)
Up to 1000 (450), incl 3
Over 1000 to 10 000 (450 to 4500), incl 5
Over 10 000 (4500) 10
 B 32
12.1.1.2 Solder Paste—The flux is extracted as follows:
Place 200 mL of reagent grade, 99 % isopropyl alcohol in a
chemically clean Erlenmeyer flask. Add 40 6 2 g of solder
paste to the flask, cover with a watch glass, and boil for 10 to
15 min using medium heat. Allow the powder to settle for 2 to
3 min and decant the hot solution into a funnel containing filter
paper, collecting the flux extract in a chemically clean vessel.
NOTE 2—The solution in isopropyl alcohol does not necessarily have to
be clear. The resistivity of water extract and chlorides and bromides tests
shall be performed using a test solution prepared by concentrating the
solids content in the flux extract solution to approximately 35 % by weight
by evaporation of the excess solvent. The exact solids content of the test
solution shall be determined on an aliquot, dried to constant weight in a
circulating air oven maintained at 85 6 3°C.
12.2 Solid Ribbon and Wire Solder—Each sample of solid
ribbon and wire solder is prepared in accordance with 12.1, as
applicable.
12.3 Bar and Ingot Solder—Each sample piece is cut in half
and one half marked and held in reserve. The remaining half is
melted in a clean container, mixed thoroughly and poured into
a cool mold, forming a bar approximately 1⁄4 in. (6.4 mm)
thick. Sampling is performed by one of the following methods:
12.3.1 Sawing—Saw cuts are made across the bar at equal
intervals of not more than 1 in. (2.5 cm) throughout its length.
If it is impractical to melt the bar or ingot as specified above,
saw cuts are made across each piece at equal intervals of not
more than 1 in. (2.5 cm) throughout its length. No lubricants
are used during sawing. The specimen consists of not less than
5 oz (143 g) of mixed sawings.
12.3.2 Drilling—The bar is drilled at least halfway through
from two opposite sides. A drill of about 1⁄2 in. (12.7 mm) in
diameter is preferred. In drilling, the holes are placed along a
diagonal line from one corner of the pig to the other. The
drillings are clipped into pieces not over 1⁄2 in. (12.7 mm) in
length and mixed thoroughly. The specimen consists of not less
than 5 oz (143 g).
13. Test Methods
13.1 Visual and Dimensional Examination:
13.1.1 Ribbon and Wire Solder (Solid and Flux-Cored)—
Ribbon and wire solder must be examined to verify that the
dimensions, unit weight, and workmanship are in accordance
with the applicable requirements.
13.1.2 Solder Paste—Solder paste must be examined for
smoothness of texture (no lumps), caking, drying, unit weight,
and workmanship in accordance with the applicable require-
ments.
13.1.3 Bar and Ingot Solder—Bar and ingot solder must be
examined to verify that the unit weight, marking, and work-
manship are in accordance with the applicable requirements.
13.2 Alloy Composition—In case of dispute, the chemical
analysis is made in accordance with Test Methods E 46,
Method E 51, and Methods E 87.
13.3 Flux:
13.3.1 Determination of Weight Percent of Flux:
13.3.1.1 Select a minimum of 20 g of flux-core ribbon or
wire or solder paste. Weigh the sample in a clean porcelain
crucible determining the weight to the nearest 0.01 g. Heat
until the solder is completely molten. Carefully stir the molten
5
solder a few times to free any entrapped flux. Allow the solder
to cool until it solidifies; clean thoroughly of flux residues and
reweigh the solder.
13.3.1.2 Calculation—Calculate the weight percent of flux
as follows:
C2S
F 5 C 3 100 (1)
where:
F 5 weight percent of flux,
C 5 initial weight of solder sample, g, and
S 5 final weight of solder sample, g.
13.3.2 Solder Pool (applicable only to composition 60/
40)—For each sample being tested, three coupons 1.5 in. (38
mm) square shall be cut from 0.063 in. (1.6 mm) thick sheet
copper. For flux Type IA only, the coupons shall be cut from
cold-rolled commercial sheet steel, approximately 0.063 in.
thick. The coupons are degreased by immersion in
trichloroethylene or other suitable short-chain solvent. Both
surfaces of each coupon are cleaned to a bright finish, using a
10 % fluoroboric acid dip. The coupons are washed with tap
water and dried thoroughly with a clean cloth. Approximately
0.2 g of flux-core ribbon or wire or approximately 2 g of solder
paste is placed in the center of each coupon. (The area of the
solder paste must not exceed that of a 0.375 in. (9.5 mm)
diameter circle.) The solder is melted in an oven maintained at
315 6 15°C. The solder pool is visually examined for
thickness of edge. When the test is completed, each coupon is
inspected for evidence of spattering of flux.
13.3.3 Spread Factor (applicable only to composition Sn60,
flux Types R, RMA, and RA in the form of flux-core wire or
solder paste):
13.3.3.1 Preparation of Coupon—Five coupons 2 in. (12.9
cm2) square are cut from 0.005 in. (0.13 mm) thick electrolytic
copper sheets. The coupons are cleaned in a 10 % fluoroboric
acid dip. One corner of each coupon is bent upwards to permit
handling with tweezers. The coupons are not handled with bare
hands. The coupons are vapor-degreased and then oxidized for
1 h in an electric oven at 150 6 5°C for testing of flux Types
R and RMA and 205 6 5°C for testing of flux Types RA. All
coupons must be at the same level in the oven. All coupons are
removed from the oven and placed in tightly closed glass
bottles until ready for use.
13.3.3.2 Procedure:
(a) Flux-Cored Wire—Ten or more turns of 0.063-in. (1.6-
mm) diameter flux-cored solder are tightly wrapped around a
mandrel. The solder is cut through with a sharp blade along the
longitudinal axis of the mandrel. The rings are slid off the
mandrel and the helix removed by flattening each ring. The
diameter of the mandrel must be of such a size so as to produce
a ring weighing 0.500 6 0.025 g. Ten rings are prepared. A
solder ring is placed in the center of each one of the five
coupons. The coupons are placed horizontally on a flat
oxidized copper sheet in a circulating–air oven at 205 6 5°C
for 6 min + 10 s, with all coupons being at the same level. At
the end of − 0, 6 min, the coupons are removed from the oven
and allowed to cool. Excess flux residue is removed by
washing with alcohol. The height, H, of the solder spot is
measured to the nearest 0.001 cm, and the results averaged.
 B 32
Five additional solder-ring specimens are melted together in a
small, porcelain combustion boat on a hot plate. The molten
solder is stirred several times to free any entrapped flux. After
cooling, the solder slab is removed from the boat, the excess
flux removed by washing with alcohol, and the loss of weight
in water determined to the nearest 0.001 g.
(b) Solder Paste—The coupons are removed from the bottles
and weighed to the nearest 0.001 g. A metal washer with an
internal diameter of 0.250-in. (6.4-mm) is placed in the center
of each coupon and each opening is filled with solder paste.
The excess solder paste is wiped off the washer using a spatula
and then the washer is removed carefully. The coupons with
solder paste are reweighed to the nearest 0.001 g.
NOTE 3—The thickness of the washer is such that the solder weighs
from 0.45 to 0.55 g. The coupons are placed horizontally on a flat oxidized
copper sheet in a circulating–air oven at 205 6 5°C for 6 min + 10 s, with
all coupons being at the same level. At the end of 6 min, the coupons are
removed from the oven and allowed to cool. Excess flux residue is
removed by washing with alcohol. The height, H, of the solder spot is
measured to the nearest 0.001 cm, and the results averaged. An amount of
solder paste equal to the total weight of solder paste on the five coupons
is melted in a small, porcelain combustion boat on a hot plate. The molten
solder is stirred several times to free any entrapped flux. After cooling, the
solder slab is removed from the boat, the excess flux removed by washing
with alcohol, and the loss of weight in water determined to the nearest
0.001 g.
13.3.3.3 Calculation—The loss in weight of the solder slab
in water is divided by five. This is the volume, V, of the solder
to the nearest 0.001 cm3. The diameter, D, of the equivalent
sphere is 1.2407 3=V . The spread factor is calculated in
accordance with the following formula:
Spread factor ~%! 5 ~D 2 H!/D 3 100 (2)
13.3.4 Dryness (applicable only to composition Sn60, flux
Types R, RMA, and RA in the form of flux-core wire)—The
dryness test is performed on samples prepared in accordance
with 13.3.3.1 and 13.3.3.2(a) except that after heating the
coupons in the oven, the flux residue is not removed. The
coupons are allowed to cool for 1⁄2 h. Powdered chalk is dusted
onto the surface of the residual flux and the ability to remove
the chalk from the surface of the flux by light brushing is
observed.
13.3.5 Resistivity of Water Extract (applicable only to flux
Types R, RMA, and RA)—The resistivity of water extract is
determined using the flux test solution. Five watch glasses and
five acid/alkali resistant, tall form graduated beakers are
thoroughly cleaned by washing in hot water detergent solution,
rinsing several times with tap water followed by at least five
rinses with distilled water. CAUTION—All beakers must be
covered with the watch glasses to protect the contents from
contaminants. The beakers’ dimensions are such that when the
conductivity cell is immersed in 50 mL of liquid contained
therein, the electrodes are fully covered. Each cleaned beaker
is filled to the 50 mL mark with distilled water. The beakers are
immersed in a water bath maintained at 23 6 2°C. When
thermal equilibrium is reached, the resistivity of the distilled
water in each beaker is measured at this temperature with a
conductivity bridge using a conductivity cell with a cell
constant of approximately 0.1. The resistivity of the distilled
water in each beaker must not be less than 500 000 V·cm. If
6
the resistivity of the water in any beaker is less than 500 000
V·cm, the complete process above must be repeated. Two of
these beakers are retained as controls. Add 0.1006 0.005 cm3
of the flux test solution to each of the other three beakers by
means of a calibrated dropper or microlitre syringe. The
heating of all five beakers is started simultaneously. As the
contents of each beaker comes to a boil, the boiling time is for
1 min followed by quick cooling of the beakers, to the touch,
under running tap water or by immersing in ice water. The
cooled, covered beakers are placed in a water bath maintained
at 23 6 2°C. When the thermal equilibrium is reached, the
resistivity in each of the five beakers is determined at this
temperature as follows:
13.3.5.1 Thoroughly wash the conductivity cell with
distilled water and immerse it in the water extract of one
sample. Make instrument reading.
13.3.5.2 Thoroughly wash conductivity cell in distilled
water and immerse in a water control. Make instrument
reading.
13.3.5.3 Thoroughly wash conductivity cell in distilled
water and immerse in a water extract. Make instrument
reading.
13.3.5.4 Thoroughly wash conductivity cell in distilled
water and continue measuring resistivities of the remaining
control and water extract.
13.3.5.5 The resistivity of each of the controls must not be
less than 500 000 V·cm. If the control value is less than
500 000 V·cm, it indicates that the water was contaminated
with water–soluble ionized materials and the entire test must be
repeated. The mean of the specific resistivities of the water
extracts of the flux must be calculated.
13.3.6 Chlorides and Bromides Test (applicable only to flux
Types R and RMA)—One drop of the flux test solution
(approximately 0.05 mL/drop) is placed on a small dry piece of
silver chromate test paper. The drop shall remain on the test
paper for 15 s prior to immersing the test paper in reagent grade
99 % isopropyl alcohol for 15 s to remove residual organic
materials. The test paper is dried for 10 min. The test paper is
visually examined for color change.
13.3.7 Copper Mirror Test (applicable only to flux Types R
and RMA in the form of flux-core wire):
13.3.7.1 Preparation of the Control-Standard Flux—A
control-standard flux is prepared by using 35 % weight of
Grade WW gum rosin conforming to Test Methods D 509
dissolved in reagent grade 99 % isopropyl alcohol.
13.3.7.2 Preparation of Copper Mirror—A copper mirror
consists of a vacuum–deposited film of pure copper metal on
one surface of a flat sheet of clear, polished glass. The
thickness of the copper film must be uniform and must permit
10 6 5 % transmission of normal incident light of 5000 Å units
as determined with any suitable standard photoelectric
spectrophotometer. To prevent oxidation of the copper mirror,
it is recommended that the mirrors be stored in closed
containers which have been flushed with nitrogen. Immediately
prior to testing, the copper mirror is immersed in a 5 % solution
of ethylene diamine tetra acetic acid or similar chelating agent
for copper oxide, rinsed thoroughly in running water,
immersed in clean ethyl or methyl alcohol, and dried with
 B 32
clean, oil-free air. The copper film is examined in good light.
The copper mirror is acceptable if no oxide film is visible and
the copper film shows no visible damage.
13.3.7.3 Procedure—Approximately 0.05 mL of the flux
test solution and 0.05 mL of the control–standard flux is placed
adjacent to each other on the face of a flat, vacuum–deposited
copper mirror. The dropper must not be permitted to touch the
copper surface, and the mirror is protected at all times from
dirt, dust, and fingerprints. The mirror is placed in a horizontal
position at 23 6 2°C and 506 5 % relative humidity in a
dust–free cabinet for 246 1⁄2 h. At the end of the 24-h storage
period, the test flux and the control standard flux are removed
by immersing the copper mirror in clean isopropyl alcohol. The
clean mirror is examined visually for compliance of the test
flux and the control–standard flux with 8.2. If the
control–standard flux does not comply with 8.2, the test must
be repeated using a new copper mirror.
13.4 Powder Mesh Size (applicable only to solder paste)—
Place 200 mL of reagent grade, 99 % isopropranol in a
chemically clean beaker. Add 40 6 2 g of solder paste to the
beaker, cover with a watch glass and boil for 10 to 15 min
using medium heat. Allow the powder to settle for 2 to 3 min
and decant the hot solution. Wash the powder with
isopropranol until all of the flux is removed. Replace
isopropanol with deionized or distilled water for solder pastes
containing a water–soluble flux base. Completely dry the
solder powder at 110°C (230°F) so that all particles are
separated. A minimum of 80 % of the powder must pass
through the appropriate size sieve (see 4.1.5) in order to be
classified for that mesh size.
14. Inspection
14.1 Unless otherwise specified in the contract or purchase
order, the supplier is responsible for the performance of all
inspection requirements as specified herein. Except as
otherwise specified in the contract or order, the supplier may
use his own or any other facilities suitable for the performance
of the inspection requirements specified unless disapproved by
the purchaser. The purchaser reserves the right to perform any
of the inspections set forth in the specification where such
inspections are deemed necessary to ensure supplies and
services conform to prescribed requirements.
14.1.1 Test Equipment and Inspection Facilities—Test and
measuring equipment and inspection facilities of sufficient
accuracy, quality, and quantity to permit performance of the
required inspection must be established and maintained by the
supplier.
15. Rejection and Rehearing
15.1 Material that fails to conform to the requirements of
this specification may be rejected. Rejection must be reported
7
to the producer or supplier promptly and in writing. In case of
dissatisfaction with the results of the test, the producer or
supplier may make claim for a rehearing.
16. Certification
16.1 When specified in the purchase order or contract a
producer’s or supplier’s certification must be furnished to the
purchaser that the material was manufactured, sampled, tested,
and inspected in accordance with this specification and has
been found to meet the requirements. When specified in the
purchase order or contract, a report of the test results must be
furnished.
17. Product Marking
17.1 The producer’s name or trademark must be stamped or
cast on each bar or ingot. The alloy grade designation or
nominal composition, or both, must be stamped on each bar or
ingot for identification along with the specification number.
17.2 Each spool or container must be marked to show the
specification number, type designation, dimensions, and unit
weight of wire or other form and lot number. The producer’s
name or trademark must be marked on the spool or container.
18. Packaging and Package Marking
18.1 The material must be packaged to provide adequate
protection during normal handling and transportation. The type
of packaging and gross weight of containers will, unless
otherwise agreed upon, be at the producer’s or supplier’s
discretion, provided that they are such as to ensure acceptance
by common or other carriers for safe transportation to the
delivery point.
18.1.1 For bar and ingot solder a lot number must be marked
on each shipping container or inside package.
18.1.2 When special preservation, packaging and packing
requirements are agreed upon between purchaser and supplier,
marking for shipment of such material must be in accordance
with Fed. Std. No. 123 for civil agencies and MIL–STD–129
for military agencies.
18.2 Each shipping container must be marked with the
purchase order number, unit weight, and producer’s name or
trademark.
19. Keywords
19.1 bar; flux; flux cored solder; ingot; lead–silver alloys;
lead–tin alloys; lead–tin–silver alloys; powder; ribbon; solder
alloy; solder metal; solder uses; tin–antimony alloys;
tin–copper alloys; tin–silver alloys; wire
 B 32
ANNEX
(Mandatory Information)
A1. INTENDED USE
A1.1 Alloy Compositions:
A1.1.1 Sn96—This is a special–purpose solder with a
higher joint strength than tin–lead solders. It is intended for use
in the food processing industry because of its nontoxic
characteristic. It also provides a fairly good color match to
stainless steel.
A1.1.2 Sn95, Sn94, E, AC, AM, and WS—These alloys are
intended for use in soldering medical components and jewelry
applications, for joining copper pipe and tube intended for
potable water systems, and for applications in the food
industry. These alloys display excellent wetting and exhibit
relatively high heat resistance.
A1.1.3 Sn70—This is a special–purpose solder where a high
tin content is necessary. It is often used for soldering zinc and
for coating metals.
A1.1.4 Sn63—This tin–lead eutectic solder is commonly
used for soldering printed circuit boards where temperature
limitations are critical and in applications where an extremely
short melting range is required.
A1.1.5 Sn62—This is a special–purpose solder widely used
for soldering silver coated surfaces.
A1.1.6 Sn60—Similar to Sn63, this solder is preferred for
soldering electrical and electronic connections and for coating
metals.
A1.1.7 Sn50—This general purpose alloy can be used for
non-critical electrical soldering and applications such as
joining sheet metal, pipe, tubing and other structural shapes.
A1.1.8 Sn45—This is a general purpose alloy similar to
Sn50.
A1.1.9 Sn40A—This alloy can be used for the same
purposes as alloy Sn50, but it is not as workable in bit
soldering or sweating. It is frequently used for dip soldering
and as a wiping solder for joining lead pipes and cable sheaths.
A1.1.10 Sn40B—This alloy is similar to Sn40A, but it is not
recommended for use on galvanized iron.
A1.1.11 Sn35A—This is a plumber’s solder similar to alloy
Sn35B but with a lower antimony content.
A1.1.12 Sn35B—This is the customary wiping or plumber’s
solder. Higher antimony content in wiping solders promotes
fine grain size and greater strength.
A1.1.13 Sn30A—This alloy is used as an automobile–body
solder and for removing heat–strippable insulation during high
temperature (700 to 900°F) tinning of wires.
A1.1.14 Sn30B—This alloy is used as an automobile–body
solder for filling dents and seams.
A1.1.15 Sn25A and Sn25B—These alloys are for uses
similar to that for alloy Grades Sn20 and Sn30.
A1.1.16 Sn20A—This is an automobile–body solder with a
lower antimony content than alloy Sn20B.
A1.1.17 Sn20B—This is widely used automobile–body
solder for filling dents and seams, and for general purposes
8
such as protective coatings on steel sheet where a high tin
content alloy is not required.
A1.1.18 Sn15—This alloy is used for coating and joining
metals.
A1.1.19 Sn10A—This alloy is used for coating and joining
metals, and where soldered connections will be exposed to
high operating temperatures exceeding 400°F (204°C).
A1.1.20 Sn10B—Similar to Sn10A, this alloy minimizes the
leaching of silver from silver alloy coated surfaces. It is used in
hybrid microelectronic and automotive electronic applications
where a high service temperature is encountered.
A1.1.21 Sn5—This alloy is used for coating and joining
metals, and where soldered connections will be exposed to
high operating temperatures exceeding 475°F (246°C). Its
wetting ability is not as good as Sn10A.
A1.1.22 Sn2—This alloy has been used to solder
automobile radiator cores.
A1.1.23 Sb5—This alloy is used for electrical and
electronic connections subjected to peak temperatures of
approximately 465°F. It is also used for sweating of copper
tubing in solar heating, plumbing and refrigeration equipment.
A1.1.24 Ag1.5—This alloy is used interchangeably with
alloy Ag2.5, but has a better shelf life and does not develop a
black surface deposit when stored under humid environmental
conditions.
A1.1.25 Ag2.5—The alloy is for use on copper, brass and
similar metals with torch heating. It requires the use of a flux
having a zinc chloride base to produce a good joint on untinned
surfaces. A rosin flux is unsatisfactory on untinned surfaces.
This alloy is susceptible to corrosion under humid
environmental conditions.
A1.1.26 Ag5.5—This alloy will develop a shearing strength
of 1500 psi at 350°F (177°C). When soldering hard–drawn
brass or copper, the application temperature should not exceed
850°F (454°C). A typical application is on thermocouples for
aircraft engines where relatively high operating temperatures
will not affect strength of the solder. Precautions noted for
Ag2.5 also apply.
A1.1.27 HA and OA—A lead-free solder for joining copper
plumbing systems. It has a lower melting temperature than
Grade Sb5 and is suitable for filling connections with wider
clearances.
A1.1.28 HN, HB and TC—A lead-free solder for joining
copper plumbing systems. This solder has a wide liquidus/
solidus range making it useful for filling solder connections
that have wide clearances. It can also be used where service
conditions require a solder with a higher melting temperature.
A1.2 Soldering of Zinc and Cadmium—In as much as zinc
and cadmium appear to form intermetallic alloys with the
antimony in the solder, compositions Sn40B, Sn35B, Sn30B,
Sn25B, Sn20B and Sb5 should not be used for soldering zinc
 B 32
or cadmium, or zinc–coated or cadmium-coated iron or steel.
These intermetallic alloys have high melting points which
inhibit the flow of the solder, resulting in brittle joints.
A1.3 Flux Type :
A1.3.1 Type R—Type R is intended for use in the
preparation of soldered joints for high reliability electrical and
electronic applications.
A1.3.2 Type RMA—Type RMA provides a slightly more
active fluxing action than Type R and is intended for similar
uses.
A1.3.3 Type RA—Type RA provides more active fluxing
action than Type RMA. It should be used for soldering joints
which are readily accessible so that the residues can be
removed by cleaning agents and procedures commonly used in
industry. Since the fumes and particulates given off during
soldering may be corrosive and contaminate the area
surrounding the joint, this too must be susceptible to effective
cleaning by the combination of materials and procedures to be
used. There are many standard electrical soldering applications
that use this type of flux.
A1.3.4 Type OA—Type OA is used for general soldering
purposes on copper, nickel, brass, etc. Some fluxes of this type
can be used for electrical and electronic soldering applications
but complete removal of flux is necessary after soldering to
prevent corrosion and current leakage.
A1.3.5 Type OS—Type OS has uses similar to Type OA.
A1.3.6 Type IS—Type IS is intended for use, exclusive of
that in electrical or electronic circuits, in the preparation of
mechanical and structural joints for all solderable metals, other
than aluminum, magnesium and their alloys.

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