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LM61
SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM61
SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8 Application and Implementation .......................... 8
2 Applications ........................................................... 1 8.1 Application Information.............................................. 8
3 Description ............................................................. 1 8.2 Typical Applications .................................................. 8
4 Revision History..................................................... 2 9 Power Supply Recommendations...................... 11
5 Pin Configuration and Functions ......................... 3 10 Layout................................................................... 11
6 Specifications......................................................... 3 10.1 Layout Guidelines ................................................. 11
6.1 Absolute Maximum Ratings ...................................... 3 10.2 Layout Examples................................................... 11
6.2 ESD Ratings.............................................................. 3 10.3 Thermal Considerations ........................................ 12
6.3 Recommended Operating Conditions....................... 3 11 Device and Documentation Support ................. 14
6.4 Thermal Information .................................................. 4 11.1 Related Documentation......................................... 14
6.5 Electrical Characteristics........................................... 4 11.2 Receiving Notification of Documentation Updates 14
6.6 Typical Characteristics .............................................. 5 11.3 Community Resources.......................................... 14
7 Detailed Description .............................................. 7 11.4 Trademarks ........................................................... 14
7.1 Overview ................................................................... 7 11.5 Electrostatic Discharge Caution ............................ 14
7.2 Functional Block Diagram ......................................... 7 11.6 Glossary ................................................................ 14
7.3 Feature Description................................................... 7 12 Mechanical, Packaging, and Orderable
7.4 Device Functional Modes.......................................... 7 Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Device Information table, Device Comparison Table, Pin Configuration and Functions section, Specifications
section, ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section ...................................................................................................................... 1
• Added Thermal Information table ........................................................................................................................................... 4
• Changed RθJA values for DBZ (SOT-23) From: 450°C/W To: 286.3°C/W and for LP (TO-92) From: 180°C/W To:
162.2°C/W .............................................................................................................................................................................. 4
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
+VS 1 Power Positive power supply pin.
VOUT 2 Output Temperature sensor analog output.
GND 3 Ground Device ground pin, connected to power supply negative terminal.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage 12 –0.2 V
Output voltage (+VS + 0.6) –0.6 V
Output current 10 mA
Input current at any pin (2) 5 mA
Maximum junction temperature, TJ 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > VS), the current at that pin must be limited to 5 mA.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
(3) The machine model is a 200-pF capacitor discharged directly into each pin.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The junction-to-ambient thermal resistance is specified without a heat sink in still air.
(1) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(2) Typical limits represent most likely parametric norm.
(3) Maximum and minimum limits apply for TA = TJ = TMIN to TMAX.
(4) Typical limits apply for TA = TJ = 25°C.
(5) Accuracy is defined as the error between the output voltage and 10 mV/°C multiplied by the device's case temperature plus 600 mV, at
specified conditions of voltage, current, and temperature (expressed in °C).
(6) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's
rated temperature range.
(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(8) For best long-term stability, any precision circuit gives best results if the unit is aged at a warm temperature, or temperature cycled for at
least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time
for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The drift after 1000 hours
does not continue at the first 1000-hour rate.
Figure 3. Thermal Response in Still Air with Heat Sink Figure 4. Thermal Response in Stirred Oil Bath
with Heat Sink
Figure 5. Thermal Response in Still Air without Heat Sink Figure 6. Quiescent Current vs Temperature
2 V/Div +VS
0V
0.2 V/Div
VO
0V
5 µs/Div
Figure 9. Supply Voltage vs Supply Current
7 Detailed Description
7.1 Overview
The LM61 is a precision integrated-circuit temperature sensor that can sense a –30°C to 100°C temperature
range using a single positive supply. The output voltage of the LM61 has a positive temperature slope of
10 mV/°C. A 600-mV offset is included, enabling negative temperature sensing when biased by a single supply.
The temperature-sensing element is comprised of a delta-VBE architecture. The temperature-sensing element is
then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage as
shown in Functional Block Diagram.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
VT1
R4 VT2
(4.1)R2
VT1 =
R2 + R1||R3
V+ LM61
VTemp (4.1)R2||R3
U2 VT2 =
R1 + R2||R3
10 Layout
Figure 18. Printed-Circuit Board Used for Heat Sink to Generate All Curves
+VS 1
3 GND
VO 2
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 6-Feb-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM61BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -25 to 85 T1B
LM61BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS SN Level-1-260C-UNLIM -25 to 85 T1B
& no Sb/Br)
LM61BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS SN Level-1-260C-UNLIM -25 to 85 T1B
& no Sb/Br)
LM61BIZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS SN N / A for Pkg Type LM61
& no Sb/Br) BIZ
LM61BIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN N / A for Pkg Type -25 to 85 LM61
& no Sb/Br) BIZ
LM61CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -30 to 100 T1C
LM61CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS SN Level-1-260C-UNLIM -30 to 100 T1C
& no Sb/Br)
LM61CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS SN Level-1-260C-UNLIM -30 to 100 T1C
& no Sb/Br)
LM61CIZ/LFT2 ACTIVE TO-92 LP 3 2000 Green (RoHS SN N / A for Pkg Type LM61
& no Sb/Br) CIZ
LM61CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN N / A for Pkg Type -30 to 100 LM61
& no Sb/Br) CIZ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA
0.95
3.04
1.9 2.80
3
2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01
0.25
GAGE PLANE 0.20
TYP
0.08
0.6
TYP SEATING PLANE
0 -8 TYP 0.2
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
(R0.05) TYP
(2.1)
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214838/C 04/2017
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
(R0.05) TYP
(2.1)
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN
0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION
2.67
3X
2.03 4.19
3.17
3 2 1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
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EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92
FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP
2X
METAL
(1.5) 2X (1.5)
2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING
METAL
2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
16.5
15.5
11.0 9.75
8.5 8.50
19.0
17.5
4215214/B 04/2017
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