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HBM
ESD
MM Experts in EMI
CDM EMC
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Materials – Charge
• Analyze your process and materials
used in your process
+ Acetate
Glass
Nylon
Wool
• Select materials of trays, bags, Lead
Aluminum
containers, covers, etc. such that Paper
Cotton
Wood
they are close to your materials on a Steel
Hard Rubber
tribocharge chart MYLAR
Nickel
Copper
• Create a list of “no-no” materials and Brass
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- Si Rubber
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YES!
discharge
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Discharges to Dissipative
Materials
• Discharges to dissipative materials have slower rise
time – good
• Discharges to dissipative materials have longer
discharge time, i.e. more energy – bad
• When selecting dissipative materials, don’t settle just
for resistivity data – this could be misleading
©2009 BestESD Technical Services
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Qualification of Materials
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dimensions
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Materials: Resistivity
Uniformity
• Due to the nature of vacuum forming
and injection molding processes the
materials may not have required
uniformity, especially in corners and
in bends
• This may render ESD properties of
the tray useless
©2009 BestESD Technical Services
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Mats: Construction
• Solid mat material
• The worst kind – provides uneven
and too high resistive path to
ground
• Conductive middle
• Good uniform resistive path to
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Mats: Properties
• A good-quality mat should provide ~109 Ohms
dissipative path to ground
• Surface of the mat is critical
• Keep it clean
• Surface loses its resistive properties with time
©2009 BestESD Technical Services
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Why Packaging?
• To protect devices against physical elements
– Shock
– Humidity
• To protect devices against direct discharge
• To protect device against charging to prevent
eventual discharge
©2009 BestESD Technical Services
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Tubes
• What do you think is
happening on this picture:
a) Proper packaging of the
devices
b) Extremely bad ESD
practice
• How do you test your
©2009 BestESD Technical Services
tubes?
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Bags
• Several Main Types
– Dissipative Poly Bags (pink)
– Conductive Poly Bags (black)
– Static Shielding Bags (metal inside)
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items
• For materials that will be in close
proximity to static sensitive devices
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ESD exposure
• Not recommended
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during handling
• Devices usually don’t come
in direct contact with the
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JEDEC Trays
• Supposed to provide dissipation of
charges from the devices
• This is often not the case
• Devices may lay in the tray in a
way where their pins do not contact
the tray
• The tray may be too conductive
and the charged device may
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Missing Link
• What is often missed in qualification and specification of
static-dissipative materials, including packaging, is proper
tribocharge properties
• Before charges can be dissipated, they need to be created
somehow, and difference in material properties between
encapsulation of your devices and the packaging materials
may cause undesirable charges
©2009 BestESD Technical Services
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Tribocharge Test
• Such tests can be highly
unrepeatable due to the nature
of friction
• Nevertheless, such tests are
very important
• When conducting such tests,
use the model of contact The sample to be tested is positioned alongside the sample carrier
resembling the actual use system that moves the test specimen to the front of the rubbing wheel.
Over-Packaging
• ICs in a tube in a bag in a bag in a box –
sounds familiar?
• For ESD purposes an IC in a proper
tube is adequately protected to travel
outside of ESD protected area (EPA)
• The only benefit of a bag in this case is
a moisture barrier
• Cardboard box is not an ESD threat –
cardboard material of a typical brown
©2009 BestESD Technical Services
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Importance of Encapsulation
Material
• Usually, encapsulation is selected based on such
properties as
– Mechanical strength
– Temperature conductivity
– Temperature expansion
– Molding properties
• One critical parameter, however, is seldom considered
©2009 BestESD Technical Services
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Encapsulation and
Tribocharge Properties
• In a course of IC manufacturing and of board assembly
encapsulation comes in contact with a variety of materials,
most of which are supposed to protect the device from ESD
• Tribocharge properties of encapsulation, however, are
seldom considered
• At any given IC manufacturer one can find several different
materials of encapsulation used for different devices
©2009 BestESD Technical Services
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Harmonizing Encapsulation
Materials
• If you are in any degree of control of + Acetate
Glass
which materials can be used for Nylon
Wool
Gold
Acrylic
Polyurethane
much easier to select and specify all the Polyethylene
PVC
materials used in your process, including Silicon
TEFLON
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packaging
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©2009 BestESD Technical Services
Q&A
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Contact Information
Vladimir Kraz
BestESD Technical Services
Tel. 831-824-4052 FAX 206-350-7458
E-mail vkraz@bestesd.com
Web site http://www.bestesd.com
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