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2SK3532-01MR 200304

FUJI POWER MOSFET N-CHANNEL SILICON POWER MOSFET


Super FAP-G Series Outline Drawings [mm]
Features TO-220F

High speed switching


Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DC converters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item Symbol Ratings Unit
Drain-source voltage V DS 900 V
VDSX *5 900 V
Continuous drain current ID ±6 A Equivalent circuit schematic
Pulsed drain current ID(puls] ±24 A
Gate-source voltage VGS ±30 V Drain(D)
Repetitive or non-repetitive IAR *2 6 A
Maximum Avalanche Energy EAS *1 244 mJ
Maximum Drain-Source dV/dt dVDS/dt *4 40 kV/µs
Peak Diode Recovery dV/dt dV/dt *3 5 kV/µs
Gate(G)
Max. power dissipation PD Ta=25°C 2.16 W
Tc=25°C 70 Source(S)
Operating and storage Tch +150 °C
temperature range Tstg -55 to +150 °C
Isolation Voltage VISO *6 2 kVrms
*1 L=12.4mH, Vcc=90V, Tch=25°C See to Avalanche Energy Graph *2 Tch < =150°C
*3 IF<= -ID, -di/dt=50A/µs, Vcc <
= BVDSS, Tch <
= 150°C *4 VDS<= 900V *5 VGS=-30V *6 t=60sec, f=60Hz
Electrical characteristics (Tc =25°C unless otherwise specified)
Item Symbol Test Conditions Min. Typ. Max. Units
Drain-source breakdown voltaget V(BR)DSS ID= 250µA VGS=0V 900 V
Gate threshold voltage VGS(th) ID= 250µA VDS=VGS 3.0 5.0 V
VDS=900V VGS=0V Tch=25°C 25 µA
Zero gate voltage drain current IDSS
VDS=720V VGS=0V Tch=125°C 250
Gate-source leakage current IGSS VGS=±30V VDS=0V 100 nA
Drain-source on-state resistance RDS(on) ID=3A VGS=10V 1.92 2.50 Ω
Forward transcondutance gfs ID=3A VDS=25V 3.7 7.4 S
Input capacitance Ciss VDS =25V 750 1125 pF
Output capacitance Coss VGS=0V 100 150
Reverse transfer capacitance Crss f=1MHz 7 11
Turn-on time ton td(on) VCC=600V ID=3A 21 32 ns
tr VGS=10V 8 12
Turn-off time toff td(off) RGS=10 Ω 42 63
tf 11 16.5
Total Gate Charge QG V CC=450V 21.5 32 nC
Gate-Source Charge QGS ID=6A 3 4.5
Gate-Drain Charge QGD VGS=10V 7 10.5
Avalanche capability IAV L=12.4mH Tch=25°C 6 A
Diode forward on-voltage V SD IF=6A VGS=0V Tch=25°C 0.90 1.50 V
Reverse recovery time t rr IF=6A VGS=0V 1.1 µs
Reverse recovery charge Qrr -di/dt=100A/µs Tch=25°C 5.5 µC
Thermalcharacteristics
Item Symbol Test Conditions Min. Typ. Max. Units
Rth(ch-c) channel to case 1.560 °C/W
Thermal resistance
Rth(ch-a) channel to ambient 58.0 °C/W
1
2SK3532-01MR FUJI POWER MOSFET
Characteristics

Allowable Power Dissipation Typical Output Characteristics


PD=f(Tc) ID=f(VDS):80 µs pulse test,Tch=25°C
100
10V
20V
8 8.0V
7.0V
80 6.5V

6 6.0V
60

ID [A]
PD [W]

4
40

2 VGS=5.5V
20

0 0
0 25 50 75 100 125 150 0 5 10 15 20

Tc [°C] VDS [V]

Typical Transfer Characteristic Typical Transconductance


ID=f(VGS):80 µ s pulse test,VDS=25V,Tch=25°C gfs=f(ID):80 µ s pulse test,VDS=25V,Tch=25°C

10

10
ID[A]

gfs [S]

1
0.1

0 1 2 3 4 5 6 7 8 9 10 0.1 1 10
VGS[V] ID [A]

Typical Drain-Source on-state Resistance Drain-Source On-state Resistance


RDS(on)=f(ID):80 µ s pulse test,Tch=25°C 7
RDS(on)=f(Tch):ID=3A,VGS=10V
2.6
VGS=5.5V 6.0V 6.5V
7.0V
8.0V
2.5 6
10V
20V
2.4
5
RDS(on) [ Ω ]

RDS(on) [ Ω ]

2.3
4

2.2
max.
3
2.1
typ.
2
2.0

1
1.9

1.8 0
0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150

ID [A] Tch [°C]

2
2SK3532-01MR FUJI POWER MOSFET

Gate Threshold Voltage vs. Tch Typical Gate Charge Characteristics


VGS(th)=f(Tch):VDS=VGS,ID=250µ A VGS=f(Qg):ID=6A,Tch=25°C
7.0 14

6.5

6.0 12
Vcc= 180V
5.5
450V
5.0 max. 10 720V
VGS(th) [V]

4.5

4.0 8

VGS [V]
3.5

3.0 min. 6

2.5

2.0 4

1.5

1.0 2

0.5

0.0 0
-50 -25 0 25 50 75 100 125 150 0 5 10 15 20 25 30 35

Tch [°C] Qg [nC]

Typical Capacitance Typical Forward Characteristics of Reverse Diode


1 C=f(VDS):VGS=0V,f=1MHz IF=f(VSD):80 µs pulse test,Tch=25°C
10

10
Ciss
0
10
IF [A]
C [nF]

-1
10
Coss
1

-2
10
Crss

10
-3 0.1
10
0
10
1
10
2 0.00 0.25 0.50 0.75 1.00 1.25 1.50

VDS [V] VSD [V]

Typical Switching Characteristics vs. ID Maximum Avalanche Energy vs. starting Tch
3
t=f(ID):Vcc=600V,VGS=10V,RG=10 Ω 800
E(AS)=f(starting Tch):Vcc=90V
10
IAS=2A

tf
600
2
10
td(off)
EAS [mJ]
t [ns]

400 IAS=4A

td(on)
1 IAS=6A
10

tr 200

0
10 0
-1 0 1
10 10 10 0 25 50 75 100 125 150

ID [A] starting Tch [°C]

3
2SK3532-01MR FUJI POWER MOSFET

Maximum Avalanche Current Pulsewidth


2
IAV=f(tAV):starting Tch=25°C,Vcc=90V
10
Avalanche Current I AV [A]

1 Single Pulse
10

0
10

-1
10

-2
10
-8 -7 -6 -5 -4 -3 -2
10 10 10 10 10 10 10

tAV [sec]

Maximum Transient Thermal Impedance


1
Zth(ch-c)=f(t):D=0
10

0
10
Zth(ch-c) [°C/W]

-1
10

-2
10

-3
10
-6 -5 -4 -3 -2 -1 0
10 10 10 10 10 10 10

t [sec]

http://www.fujielectric.co.jp/denshi/scd/

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