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alloy grades. The alloys are often used in thin sections to strength and toughness, through to macroscale effects
with the wall thicknesses of a typical turbine blade often of direct concern to the engineer, for evaluating the most
being only a few millimetres and new techniques need to appropriate constitutive behaviour for use in finite
be developed and evaluated for assessing the degrada- element (FE) modelling of structural components. The
tion of thin walled turbine blades after service exposure. nanoscale in particular has attracted much attention in
Clearly microscale testing has a role to play in this recent years, with considerable research directed at the
respect. The very high test temperatures required need techniques of nanoindentation and micropillar testing.
specific attention to the design of grips and strain A selective list of references4–27 is included for the
measurement techniques; the use of conventional interested reader as it provides complementary insight
methods can be expensive and time consuming. for many of the issues discussed in the current paper,
Another example is the development of advanced highlighting mechanistic topics such as dislocation
technical ceramics, which are being employed in a wide source characteristics, dislocation generation, multi-
range of mechanical and electronic/functional applica- plication and annihilation mechanisms and testpiece
tions, and usually as device critical components. Often preparation methods and surface conditions that under-
the size of such products, such as chip capacitors, is as pin and affect the interpretation of these very small scale
small as 1 mm. Understanding the mechanical proper- tests. Despite the research effort there are still consider-
ties of such small components, especially in relatively able metrological issues to resolve and there is scope for
weak and brittle materials, is essential to maintaining an extensive review of nanoscale testing that brings
performance. Testing for design and quality assurance together much of the recent research published in a
requires new approaches compared with the more range of Physics, Materials and Engineering journals.
traditional approaches that have been adopted for Complementary modelling studies are especially
engineering-scale components. required to evaluate crystal plasticity effects and load
Optimising the test conditions for relevant miniature sharing between different phase constituents in multi-
tests is an important objective as the requirement for phase materials.28–32
correlating the results with data generated from full size The current article concentrates, however, on the
samples. The subject matter is extensive and draws the testing situation at the intermediate scale (in the range
attention of dedicated, focused meetings; for example, 0?5–5 mm) where testpieces are small compared with the
the ASTM extended series of conferences on small scale size of engineering components and in the range where
tests, with the most recent at Reno, Nevada in 2000 and representative mechanical behaviour of the underlying
Anaheim, California in 2007.1,2 The ASTM meetings microstructure must be considered. This viewpoint
have covered a wide range of topics, and particularly document is necessarily selective due to the wide range
emphasise miniature toughness tests. As such, discussion of definitions used to describe ‘microscale’ effects. For
of toughness has been omitted from the present paper example, tensile tests for microelectromechanical sys-
and the reader’s attention is directed to the ASTM tems and very thin films have been discussed in recent
references and a recent detailed review by Hyde et al.3 reviews33,34 highlighting problems such as accurate
that also covers the assessment of creep properties. This testpiece fabrication, gripping and strain measurement.
latter review highlights a number of generic issues The emphasis in the present paper is particularly aimed
associated with using miniature tests, which include: at discussing aspects of strain measurement and
(i) the requirement to have sufficient representative associated flow stress characterisation. Specific test
volume elements within the gauge volume methods discussed include miniature uniaxial, small
(ii) the necessity to ensure the effects of constraint punch, bend and microindentation, and all are evaluated
features (such as notches, edges and corners) are with case studies of ongoing research, both at National
addressed Physical Laboratory (NPL) and elsewhere, to highlight
(iii) the increased likelihood of probabilistic events some important metrological items. Many of the issues
from small heterogeneities impinging on gross relating to specimen preparation, representative cross-
mechanical behaviour sections, resolution and accuracy of the instrumentation
(iv) the lack of standardisation supported by inter- and test equipment still merit further assessment.
national round robins to validate microscale
test procedures.
To these can be added several more topics that are
Non-contact techniques for strain
touched upon in the current article: measurements
(i) the importance of specimen geometry, prepara- Strain measurement in microscale testing is particularly
tion and surface finish challenging, as the specimen dimensions, gauge lengths
(ii) the possibility of surface residual stresses influenc- and test fixtures are small. In most cases conventional
ing measured gross mechanical behaviour extensometry and strain gauges cannot be used and
(iii) the challenge of accurate strain measurement at other techniques must be investigated. Current solutions
these length scales include the use of line scan cameras and optical tech-
(iv) the utility of mechanical modelling to optimise niques, laser and digital speckle pattern interferometry,
testpiece geometries linear variable differential transformers (LVDTs), capa-
(v) the need to assess the statistical variation in citance gauges, and the change in electrical resistance.
data. Many of these techniques do not measure strain directly,
Scale effects in the mechanical behaviour of materials but measure displacement. Some make direct measure-
have long interested the material scientists, from ments on the testpiece but others such as LVDTs and
nanoscale physical metallurgy, understanding the con- capacitance gauge probes are usually integrated with the
tribution that dislocation generation and motion makes test fixture or load train and measure displacement
remotely. A summary of some of candidate displace- Figure 1 shows examples of typical full field strain
ment and strain measurement techniques being consid- distributions that can be measured using non-contact
ered for miniaturised testing are shown in Table 1. A techniques, a shear band captured during the tensile
general introduction and overview of some of these testing of an aluminium alloy, and strain distribution in
techniques is given by Sharpe35 and Eaton-Evans et al.36 a weld subjected to four-point flexure. In this case there
Most of the traditional techniques measure an average is a superimposed strain due to the bending, but the
strain value over a fixed gauge length and cannot technique can highlight local differences in strain
discriminate or resolve local behaviour. A significant associated with the heat affected zone and different
advantage of using non-contact optical techniques parts of the weld.
within the test system is the potential for full field The images in Fig. 1 were measured using digital
measurement, enabling local variations and non- image correlation (DIC), which is a full field non-contact
uniformity in the strain field due to stress concentra- strain measurement technique. It was first developed in
tions, defects, different phases, or orientations of the the 1980s38,39 but has seen significant development and
grains to be identified. uptake in recent years due to the availability of higher
Non-contact optical methods have other advantages; resolution cameras and increased computer power. It is
for example, remote sensing does not affect the a versatile tool and is being used extensively in con-
compliance of the system, as it would do if strain gauges ventional experimental mechanics in a diverse range of
or transducers were attached to small samples. They also applications for characterising material behaviour,
have the potential to provide high rates of data capture measuring the evolution and uniformity of strain,
and high precision with potential resolution in the sub mapping of strain fields around features and defects,
micrometre range. For example, a gauge length of 1 mm crack tip and crack propagation studies, dynamic
would require a displacement resolution of 0?5 mm to vibrational analyses, high temperature strain measure-
ensure strain accuracy of 0?05%, i.e. typically 50–100 ment, deformation of large structures, structural health
data points in the elastic region before yield in a low monitoring and FE validation.40 Digital image correla-
strength aluminium alloy. LaVan and Sharpe37 used a tion is already being used in a range of microscale
laser interferometric system to measure both sides of a testing.41–55
small sample and obtained reasonably accurate Young’s Digital image correlation works by comparing images
modulus values for a ferrous alloy. Obvious drawbacks of a component or testpiece at different stages of
with the optical methods are the requirement for line of deformation and tracking blocks of pixels to measure
sight to the testpiece, which for some test setups may not surface displacement and build up full field two- and
be possible. three-dimensional deformation vector fields and strain
Table 1 Advantages and disadvantages of some candidate strain and displacement measurement techniques for
miniaturised test systems
LVDT (linear transducers) Readily available, sub micrometre resolution Measures displacement cf. strain, requires point
point displacement. contact.
Electrical resistance Cheap and direct method with simple analysis Only possible with electrically conducting
to provide plastic strain values. Excellent at materials. Only measures plastic strain values.
high temperatures right up to solidus. Requires additional calibration if phase changes
occur during the test to alter intrinsic resistivity
values.
Capacitance gauges High resolution displacement measurement. Average displacement measurement, requires
some physical contact, drift.
Line scan cameras Cheap, high resolution measurement. Two-dimensional mapping only possible with a
scanning system.
Moiré interferometry Non-contact, full field, real time. High High level of skill required. Grating must be
resolution displacement measurement. applied to the testpiece. Sensitive to environment
and rigid body motion.
Laser interferometry High resolution displacement and strain Reflective targets required. Sensitive to vibration
measurement (5 me). and rigid body motion.
Digital speckle pattern Full field, non-contact, measurement. High Expensive, sensitive to vibration. Requires a
interferometry sensitivity and spatial resolution. Two- and diffuse surface. Not suitable for large deformations
three-dimensional measurement capability. or rigid body motion.
High temperature capability.
Digital image correlation Full field, non-contact, two- and three- Modest strain resolution (0.01 pixel/100 me)
dimensional implementations available, wide depending on camera resolution and field of view,
range of cameras and suppliers. Can be used testpiece may require some surface pattern or
on SEM images. preparation.
Photoelastic stress analysis Full field, non-contact, direct measurement of Photoelastic coatings must be applied. Limited
stress and strain. temperature range, stress level may saturate.
Thermoelastic stress analysis Full field, non-contact, small scale applications. Requires cyclic load, only applicable to linear
elastic loading.
1 Examples of DIC strain mapping: shear band in aluminium alloy tensile sample (left), distribution of strain in weld
under four-point bending (right)
maps. The position of the centre of the pixel blocks is property measurement. The absolute strain resolution
determined to subpixel accuracy over the whole image depends on the camera resolution, field of view, scale of
using sophisticated correlation functions, from which the image relative to the pattern on the surface, the
the vector and strain components can be calculated. uniformity of strain in the testpiece, the number of pixels
Different DIC analysis solutions have been developed to in each pixel block, and the gauge length over which the
obtain subpixel resolution based on non-linear optimi- strain is calculated. Choices must be made about the size
sation techniques, intensity interpolation, Fourier trans- of the pixel blocks (also described as ‘facets’, ‘windows’,
form analyses, gradient based methods, correlation and ‘subsets’) as this effectively defines the gauge length
coefficient curve fitting, Newton–Raphson iteration for strain measurement and has an important influence
methods, genetic algorithms and neural networks. The on the spatial resolution and accuracy of the strain and
accuracy and sensitivities of the different approaches displacement measurement. Generally for uniform dis-
reported in the literature range from 0?5 to 0?01 pixel. placement fields, larger windows give better strain
Pan et al.42 carried out a systematic study of three types accuracy, while smaller windows give better spatial
of subpixel registration algorithms using the translation resolution. Table 2 (Ref. 43) summarises the calculated
of synthetically generated images. They concluded that errors and uncertainties that might be expected with
the Newton–Raphson methods are generally the most different window sizes.
accurate, but are very computer intensive and much An advantage of analysing the images with DIC is
slower than some of the other approaches. Also the that once the images have been captured they can be
gradient based methods are better than the curve fitting reprocessed using different window sizes and DIC para-
approach in terms of accuracy and sensitivity. meters to highlight different features on the testpiece.
For many applications the DIC analysis is carried out Digital image correlation requires a random pattern
off line, so the computing power required might not be on the sample, and different approaches can be used to
an issue, but with increasingly higher resolution cameras generate this including conventional polishing and
being available the processing of large image file sizes etching of the sample to reveal grain structure and
becomes more difficult and might be a factor in choosing texture, the application of a pattern to the testpiece
which approach to take. using a fine airbrush or applying light, random scratches
As noted above, depending on the subpixel algorithms to the surface. The scale of the pattern relative to the
used, the claimed resolution for two-dimensional DIC pixel size is important, and a consideration for measure-
approaches 0?01 pixel for displacement measurement. In ments made under the microscope or SEM where the
practice however, factors associated with the experi- application of a very fine random pattern is difficult.
mental setup, such as the quality of lighting, camera Uniform illumination is also essential and a dedicated
noise, lens distortion, the scale and type of pattern or local light source should be used to ensure consistency of
coating on the testpiece etc., will degrade the images and illumination throughout the test. LED ringlights offer a
affect the accuracy of the DIC calculations, so 0?1 pixel good solution particularly in combination with a macro
is probably more realistic. This means that for a or telecentric lens.
miniature testpiece with a gauge length of 10 mm and It should be noted that using a conventional small
a camera resolution of 1 megapixel, if the gauge length scale test machine with a fixed crosshead can lead to
fills the field of view, DIC will be able to resolve difficulties with DIC as the original part of the image
displacements to between 0?1 and 1 mm resolution. For can move out of the field of view and the correlation
full field studies the strain resolution is typically 100 me, breaks down. This can be overcome using a larger field
so is good for plastic deformation studies but less of view, multiple cameras that overlap, or designing a
reliable at small strain values, and challenging for elastic test machine where both grips move and the central
Table 2 Effect of DIC ‘window’ size on calculated accuracy of displacement and strain measurements43
2 Real time DIC measurements on miniaturised tensile 4 Comparison of strain measured by image correlation
specimen in NPL ETMT, showing linear fit to data for and resistance changes
elastic modulus calculation
loads taken during the four-point bend testing of a small
gauge length of the testpiece remains at the centre of the 40 mm long graphite beam. Because of the size of the
image. testpiece and nature of the material it was not possible to
Digital image correlation is generally used as a full apply strain gauges or an LVDT (linear transducer) to
field application, but some variants of DIC software use monitor beam deflection, so DIC was used, focusing the
the tracking of discrete markers or features for measur- cameras on the side of the specimen. In combination
ing displacement and strain. Because the processing with FE modelling, the full field displacement data have
power required is much reduced there is scope for real been used successfully to measure the elastic modulus of
time measurement of displacement and strain over the graphite and also identify local variations in
several pairs of markers on the testpiece. Measure- properties associated with the structure of the material.
ments have been made on miniaturised tensile specimens Some researchers44,45 have used DIC to examine the
in NPL’s version (the electrothermal mechanical tester, constitutive properties of weld materials, generating
ETMT) of the mechanical system used by Peterson discrete stress–strain relationships for the parent metal,
et al.41 to examine the potential of the DIC technique for heat affected zone and weld zone all from a single
measuring elastic modulus. Figure 2 shows results from testpiece, and the variation of proof stress across a
a series of tests on a stainless steel 304 alloy. Although weld46 by monitoring the strain in discrete locations of
there is some scatter and noise in the data, due in part to the sample. Further examples of using the technique to
the load control, the fit through the data gives values of measure plastic deformation and local strain distribu-
modulus of 185 and 187 GPa for the two specimens, and tions include work to correlate strain measurements with
reasonable strain resolution (10 me) below that typically grain orientation in polycrystalline Al alloys,47 the
expected for full field DIC. examination of strain distributions in dual phase
Full field non-contact techniques open up the steels,48 strain localisation in thin sheet samples49
potential for a wide range of novel measurements and and an investigation of shear band formation and
applications. Figure 3 shows the x and y displacement development in Al alloys.50 A variation of the method
maps and series of displacement profiles at increasing by Moulart et al.51 combines white light interferometry
measurements in combination with the grid method
and DIC to study strain distributions in microscale
testpieces.
Images of testpiece deformation can be obtained from
a wide variety of sources and a range of scales, including
conventional charge coupled device or consumer digital
cameras, high speed video, microscopes, macroscopes,
the SEM and atom force microscopy. Good quality
measurements in the SEM are particularly challenging
due to the limited contrast, charging of the specimen,
noise and potential drift of images, but has been applied
successfully52–54 in combination with in situ loading
stages, for studying local strain fields, microplasticity
and strain heterogeneity in Ti alloys.53
Digital image correlation has been used successfully
for tracking markers on the testpiece with the NPL
ETMT at temperatures up to 800uC without special
cameras or infrared filters (Fig. 4). At high temperatures
there is an increased likelihood that thermal currents
and airflow in front of the lens will lead to distortion of
3 Displacement fields (x: top; y: middle) and mean dis- the image and breakdown of the correlation; techniques
placement profile (with increasing load) of miniaturised are being developed based on high speed sampling to
four-point bend test on graphite overcome this. Oxidation should be avoided by testing
in vacuum or inert atmosphere as this will lead to calculate applied stresses accurately. Sharpe62 also
changes in the surface appearance and a breakdown in advocates the use of grips mounted in linear air bearings
the correlation. Normally with DIC the images are to reduce friction, particularly with low strength
compared relative to the initial (unloaded/starting) state, testpieces. Some of the work reported was on 3?5 mm
but if there large deformations or changes to the surface thick polysilicon film and 200 mm thick electroplated
condition it is possible to do the correlation between nickel samples. Gauge lengths for strain measurement
successive images and generate cumulative strain fields. are necessarily short and lead to severe problems with
Potential issues with oxidation of testpieces or surface conventional extensometry for measuring displacement
diffusion effects changing the appearance of the testpiece and changes in shape. Considerable innovation is needed
surface with time can be overcome to some extent using to derive reliable strain values.
a robust and frequent monitoring regime to ensure that Microstructural features (e.g. the distribution of grain
the correlation does not break down between images. shape, phase, orientation, texture, precipitate distribu-
This may not work in all cases however. tion) and their size relative to the dimensions of the
Recent work examining the influence of specimen testpiece can have significant effects on flow stress.
dimensions and strain measurement methods on the Hoefnagels et al.63 used a non-contact optical strain
tensile stress–strain behaviour of bulk nanostructured measurement technique to examine the influence of
materials55 showed significant differences in the grain boundaries and grain statistics in pure Al by
stress–strain behaviour and ductilities. Results showed testing a range of miniaturised testpieces of different
that the post-yield elongation increased significantly as cross-sections. Results showed widely different deforma-
the gauge length was reduced and specimen thickness tion behaviour depending on the microstructure and
increased. The authors reiterate the use of accurate number of grains present, with inhomogeneous defor-
strain measurement techniques such as DIC and laser mation and localised slip bands occurring throughout
interferometry as the strains derived solely from the the tensile test on the thinnest testpieces, and more
crosshead displacement lead to significant errors. They homogeneous behaviour with the thicker testpieces due
also note the requirement for standardised test proce- to the greater number of grains and plane strain
dures to allow meaningful comparisons of data from conditions offering a greater level of constraint at the
different laboratories. grain boundaries. For a set value of grain size, because
grains close to the surface are under less constraint than
Miniature uniaxial tests those within the central regions of the testpiece, the
Microscale uniaxial tests are not yet standardised, except global flow stress of the sample will decrease as the
for the specific requirements for testing foil materials sample width and thickness decrease.56,57,60,66 This is
given in ASTM E345-93, but have the potential to opposite in effect to that found in the nanoindentation
provide uniaxial stress–strain data that is representative and micropillar tests where single orientation behaviour
of macro behaviour. It is important to be aware, is often being measured and a reduced scale of test is
however, of a number of metrological issues that can associated with increasing strength. Typically a thick-
have a significant influence on the quality and accuracy ness to grain size ratio of less than 10–12 has a
of the results,37,41,56–73 including: sample preparation; significant effect on measured properties,56 but currently
microstructural considerationsalignment; ductility; and there are no clear recommendations available on the
resolution of load cells and transducers. number of grains that should be sampled in the testpiece
Sample preparation methods, by their nature, result in cross-section. It is an important consideration but is
testpiece surfaces that may not be representative of the often specific to, and may be even limited by, the
underlying material. The volume of affected material is particular material under investigation.
clearly dependent on the method of preparation; i.e. Even in tensile tests for large samples, ductility is
grinding, polishing, electrodischarge machining, etc. and recognised to be sensitive to testpiece geometry, and
can be a significant percentage of the testpiece cross- standards such as ASTM E8M and ISO 6892 recom-
sectional area. Any damage or defects introduced during mend proportional geometries for round specimens
preparation may have a significant influence on the where the ratio of the gauge length to area (L/A1/2) is
behaviour and premature failure. typically set at 5?64 to enable comparability in ductility
Uniaxial tensile testing poses alignment challenges for values from samples ranging in diameter from 4 to
brittle or low ductility materials at the best of times, and 12?5 mm. It is likely that similar requirements will hold
these generally become worse as the scale is reduced, for smaller samples although this has yet to be system-
with the result that uniaxial testing is rarely performed, atically evaluated. More attention has generally been
since results are often unsatisfactory. Recourse is paid to strength values as opposed to measurements of
generally made to some form of flexural testing, ductility. For example, it was noted in a study of
although one novel example of indirect tension testing nanostructured materials that the strength/hardness
is described later in the section on ceramics. Misalign- correlation was significantly affected by material ducti-
ment of small samples can be particularly important if lity and work hardening rates, especially if ductilities
elastic properties are to be measured and it is advant- were ,5%.5
ageous to measure strain on two sides of a sample if For uniaxial microtensile tests for metals the bow tie
precautions to avoid bending strains have not been shaped testpiece (Fig. 5) is often used. LaVan and
taken. Errors of up to 100% in flow stress can result at Sharpe37 showed that it has considerable advantages
plastic strains close to yield, i.e. below 1%.37 with regard to gripping when the bow tie ends are
Small testpieces require low loads to break them and located into a cut-out in the grip, even for samples as
extra care must be taken in calibrating load cells and small as 360?260?2 mm in the gauge section. The
measuring the dimension of the testpiece in order to drawing in Fig. 5 has been simplified for ease of
(a) (b)
6 a type I stress–strain curve at 280uC (Al alloy) and b type II stress–strain curve from resistance plot showing ‘pseudo’
elasticity in test at 950uC (superalloy single crystal material)
assuming constant volume during deformation and room temperature. Miniature tensile testpieces were
negligible changes in resistivity from increased disloca- prepared by electrodischarge machining and light
tion densities, and neglects elastic strains. Tests analysed diamond grinding followed by annealing at 1100uC for
by this method fall into two types, dependent on the 30 min. The testpieces were waisted (Fig. 5) in order to
material under test: provide gentle strain gradients within a single sample
Type I: the assumptions are taken in full and the curve following deformation. The tensile test was performed at
of stress against plastic strain is more or less vertical a loading rate of 10 N s21, and conducted in two parts.
initially (Fig. 6a). Proof stress is then obtained by The testpiece was first deformed in tension to a plastic
drawing a vertical line at the required offset strain. strain of ,15% and then unloaded. It was then retested
Type II: it has been observed in some tests at elevated to give a total strain of ,35%. Before the test a 36100
temperatures, particularly on single crystal Ni based array of microhardness indents was made on the surface
alloys, that stress–strain plots obtained by this method of the testpiece using a scanning microhardness test
of analysis have a pseudo elastic region (Fig. 6b), machine (see later section), at a load of 1 N and spacing
possibly because the material’s intrinsic resistivity is of 0?2 mm. The spacing of the indents was measured
dependent on applied elastic strain. Further work is after the deformation test in order to calculate local
needed to explore this latter possibility. However, the strain and its variation along the tapered testpiece.
plot can still be used to define a proof stress by drawing Plastic strain in the central 2 mm region of the testpiece
a line parallel to the ‘pseudo’ elastic region at a suitable was also measured using the resistance method. The
offset plastic strain. tensile test results are shown in Fig. 8a plotted as stress
Because the use of resistance changes for measuring against strain. Plastic strain was calculated from the
strain is unconventional, a series of comparison tests resistance data. Elastic strain was calculated assuming a
were carried out on a BCR nimonic 75 tensile reference Young’s modulus value of 195 GPa and added to the
material75 for validation and comparison purposes. The plastic strain to give a total strain value. The results are
results of the ETMT miniature uniaxial tests at 600uC shown in two parts corresponding to the first and second
are shown in Fig. 7 compared with the results of three cycles of the test.
tests on conventional macroscopic testpieces that had
used extensometers to measure strain. The agreement is
good and confirms that plastic strain measurement
through changes in resistance is an acceptable method.
It is also interesting to note that the resistance method
accurately resolves a serrated yield process in the
nimonic 75. The steps in the flow stress–strain curve
are not noise in the signal but reflect real material
behaviour. Further work is needed to develop an
understanding of the pseudo-elastic region particularly
observed in tests in some Ni superalloys. For this
purpose research is under way at NPL to develop an
optical system to measure strain in the central 2 mm of
the hot zone using non-contact strain measurement tech-
niques based on the DIC process described previously.
To further confirm the validity of the approach of 7 Comparison of miniature uniaxial tests with macro-
obtaining the plastic strain from the resistance, a waisted scopic tests at 600uC on BCR nimonic 75 reference
sample of 304 stainless steel was deformed in tension at material
(b)
(a)
(c)
8 a tensile stress–strain curve from waisted 304 stainless steel testpiece (measured from the resistance changes) and
variation of plastic strain along testpiece measured from changes in indent spacing after b initial loading to 18% strain
and c further testing to 35% strain
The variation of strain along the testpiece as measured obtained from 406261 mm rectangular testpieces of
by the spacing (initially 100 mm) of the microhardness an austenitic stainless steel at 600uC tested in the NPL
indents is shown in Fig. 8b and c respectively for the first ETMT. One sample was annealed at 1200uC for 5 min
and second parts of the deformation cycle. The strain before testing, the other sample was tested under the as
values were calculated using sequential gauge lengths of supplied condition, probably diamond ground. The
200, 400, 800 and 400, 800 and 1200 mm respectively. It process of specimen machining will generally introduce
can be seen that locally there was considerable point-to- a layer of deformed material around the edges of the
point variation although this variation is smoothed out testpiece, with different microstructures and properties
for larger values of the gauge length. from the bulk material, and may introduce residual
The local variation is not simply an uncertainty stresses in the testpiece. The extent of the damaged layer
associated with the measurement of strain but reflects and magnitude of the residual stresses can significantly
the heterogeneous variability in local deformation in a affect the bulk material behaviour, particularly in small
fairly coarse grain sized material. The central (averaged testpieces, which have not been annealed. Although the
over 3000–4000 mm) strain values of 17?5 and 35% residual stress distribution will be balanced across the
agreed well with those shown in Fig. 8a that were whole testpiece (assuming equal treatment on opposing
measured using the resistance method (which were faces), local variations at the surface, combined with the
averaged over 3 mm). presence of the highly deformed material can dominate
Another example confirming the utility of resistance the behaviour and lead to significant changes in the
changes for the measurement of plastic strain was stress–strain behaviour. For this reason it is recom-
obtained in a tensile test conducted on 304 stainless mended that careful consideration be made to the
steel at 600uC where strain was measured using DIC
concurrently with the measurement of change in resis-
tance. Figure 4 shows an excellent agreement between
the two methods, confirming that DIC has good pro-
spects as a non-contact method at elevated temperatures
and that resistance changes can be taken to be an
accurate technique for assessing strains. In further sup-
port of using resistance changes for measuring strain it
should be noted that typical increases in resistivity due
to high dislocation densities are very small (0?1 nVm for
10% strain in nickel)76 compared with the resistivities
usually measured in elevated temperature tests
(500 nVm at 600uC for steels).
The influence of the damage and residual stresses
introduced to the surface layers during specimen pre-
paration are illustrated in Fig. 9 where there are clear
differences in the shape of the stress–strain curve and 9 Effect of heat treatment and surface condition on early
yield behaviour of material tested in the as received and stages of yield in test on austenitic stainless steel
annealed conditions. The stress–strain curves have been micro tensile testpiece
strongly in recent years, and this has stimulated research to a shift in the neutral axis. This can lead to an
to evaluate suitable tests. indeterminate stress distribution unless substantial
For flexural strength testing, Lube et al.89 have quantities of test data are deconvoluted to derive the
examined the potential errors involved in reducing the stress/strain rate relationships (e.g. Chuang’s analysis).95
size of conventional testpieces, and conclude that they
rise rapidly once the testpiece loading span is less than
Biaxial flexural testing
,20 mm. Such errors accumulate from issues such as It has long been argued that biaxial testing, using, for
parallelism of surfaces, measurement errors, and align- example, a concentric ring-on-ring geometry, is highly
ment, twist and frictional errors in the loading system. advantageous for ceramic materials because it avoids the
With weaker materials there is also an increased risk of issue of edge chamfers; edges being remote from the
high local stresses under loading contacts causing highly stressed region and thus unlikely to be fracture
damage. origins.96 The biaxiality of the stress field within the
Standardised testing also requires that the long edges inner loading ring is also more probing of surface
of testpieces are chamfered. This process removes edge defects, and the average strength data are generally
damage that can arise during testpiece preparation. lower, and are considered to be more realistic than
Provided that the chamfers are small in relation to the uniaxial data. Compared with the beam flexure test,
there are other limitations for accuracy, including
testpiece cross-sectional dimensions, their effect on the
greater problems in controlling frictional effects, and a
flexural moment of inertia can be ignored. However, as
need for flat test surfaces. This geometry has been
the testpiece becomes smaller, scaling the chamfers
employed in ISO 6474 for alumina ceramics for
equivalently means that they might lose their effective-
orthopaedic devices for some years (Table 3). In this
ness, while maintaining their size means that moment of
case, it has been found to be necessary to use rubber and
inertia corrections become applicable.90,91 Such correc-
paper interlayers between testpiece and loading ring in
tions require measurement of the chamfers.
order to reduce frictional effects and take up some out-
In experiments to directly injection mould miniature of-flatness. More flexible dimensions are allowable in
(160?260?2 mm) testpieces directly in zirconia, achiev- ASTM C1499, which also permits the use of square
ing good shape precision has proved difficult.92 They are testpieces, such as electronic substrates.
too small to be remachined, and so this is probably the Attempts have been made to apply this geometry to
principal factor leading to the illustrated corner failures very thin test material, such as fuel cell laminae, but
in three-point bend testing and to a high scatter in immediately there is a problem that once the central
results. More recent work by the same group93 has deflection at fracture is more than half the thickness,
shown that the moulding technique is critical in produc- non-linearity of the force/deflection response develops,
ing rounded edges on the mouldings, with evidence that with the occurrence of so called membrane stresses in
deliberately allowing edge rounding improves strength addition to bending stresses. Kao et al.97 provided some
and reduces scatter in testing. analysis of this situation, which can be reduced to the
As noted above, strain is seldom measured directly. results in Fig. 14.96 This approach has been satisfacto-
The principal area where it has been employed at NPL is rily employed by Kübler et al.,98 for example.
in the flexural testing of long-fibre ceramic composites, Various other biaxial testing methods have been
with successful use of surface strain gauges up to strain attempted, but the one that shows most promise for
levels of typically 1–2%. scaling downward in size is the ball on three balls (B3B)
High temperature flexural strength testing using test. This geometry, which is a simplification of the
refractory test jigs has also been standardised punch on three balls method originally developed by
(Table 3). For the purposes of materials comparison, Wachtman et al.99 using a stress distribution computed
flexural creep testing has also been widely used. Strain is analytically by Kirstein and Wooley100 and applied to
typically measured from mechanically determined cur- thin ceramic substrates for electronics, has been
vature measurement, but unless the materials behave extensively researched by Börger et al.101,102 The peak
viscously i.e. the stress exponent of strain rate is unity, biaxial tensile stress is over a small area on the opposite
the maximum nominal stress is overestimated to an face to the central loading ball. Figure 15 shows the
extent dependent on that stress exponent.94 An added practical implementation of the test, which can be scaled
complication is that creep rates may be different on the appropriately to the size of the testpiece. Its advantage is
tensile side compared with the compression side, leading that non-flat, non-parallel surfaces can be used, and the
Three or four-point flexure, bars ISO 14704 (room temperature) 3646.45 (40 span)
ISO 17565 (high temperature) 3646.35 (30 span)
EN 843-1 (room temperature) A: 262.56.25 (20 span)
EN 821-1 (high temperature) B: 3646.45 (40 span)
ASTM C1161 (room temperature) A: 1.5626.25 (20 span)
ASTM C1211 (high temperature) B: 3646.45 (span)
Ring on ring flexure of discs ISO 6474 (room temperature){ Outer ring dia.: 30; inner ring dia.:
12; testpiece, 36 (dia.)62 (thickness)
ASTM C1499 (room temperature) Flexible
{Different test spans reflect different historical developments, notably in the US and Japan, and have not yet been rationalised.
{This test is also employed in similar specifications for ceramics for orthopaedic applications other than high purity alumina.
Microindentation tests
The most common applications of microindentation
tests have been to map local heterogeneities, such as
those common in welds and damaged or heat treated
surfaces,106 or in tests to assess the high temperature
deformation characteristics of local variations in micro-
structure through indentation creep studies.107–115 The
indentation, or as it is sometimes known, impression 18 Stepped stress indentation creep tests at 600uC on
creep method has substantial advantages because it is CrMoV steel (courtesy Dr S. Brett, RWE npower)
relatively easy to apply and correlates reasonably well
with uniaxial data. Two kinds of indenter have generally constraint on measurement of low strain rates in tests
been selected for these tests, either circular or rectan- lasting several weeks. Typically displacement measure-
gular, and the use of both has been carefully supported ment resolutions of ,1 mm are required. However, the
by FE studies to assess the impact of geometrical impression creep test method is limited by its inability to
factors, such as indenter and specimen sizes, associated study the final (tertiary) stages of creep deformation that
with test metrology. Indenters typically have widths (or lead to fracture in tensile creep studies. There is some
diameters) of ,1 mm and are well suited for in situ evidence that minimum creep rates obtained by this
measurements of different zones in the weld. The method can be correlated with failure times in uniaxial
constraint factors associated with the indenter/punch tests by a Monkman–Grant expression but this observa-
are typically about 3 and have to be ascertained for each tion requires further experimental investigation before it
method of interest before direct comparison can be can be wholeheartedly recommended. The method does,
made with uniaxial data. The use of the reference stress however, lend itself to step or ramp experiments whereby
approach to correlate indenter displacement rates and data under several conditions can be generated from a
nominal applied stresses with their uniaxial equivalents single testpiece (Fig. 18). This is quite important because
has been summarised recently108 with a recommendation it accelerates the process of data acquisition and this is
for ‘standardising’ the test procedure using square vital since single condition tests can tie up expensive
specimens, typically 1061062?5 mm in dimension experimental kit for long periods. This use of stepped
indented with a 1 mm wide rectangular punch covering tests, whether step-up or step-down, make some assump-
the full width of the testpiece. Smaller proportional tions that the measured secondary creep rates are
specimens could be used but at some stage care has to be dependent only on levels of accumulated strain and are
taken that the indenter covers a representative element not strain history dependent. There is evidence both for
of the underlying microstructure. Indenters have to be and against this assumption116–118 and further research
strong compared with the indented material and would be very welcome. The use of miniature uniaxial
typically ceramic or superalloy compositions would be tensile testpieces is an alternative approach, since the
chosen. The deformations also need to be small stress states are relevant to the tertiary deformation stage
compared with indenter dimensions, which puts some in macroscopic testpieces that lead to fracture. Figure 19
(a) (b)
19 Comparative creep data on P11 steel (both as received, P11ar, and thermally exposed, P11exp), from miniature ETMT
testpiece with a strain/time data and b minimum creep rate/time to failure
21 Examples of microindentation hardness maps in welded superduplex steel plate (left) and spot welded aluminium
alloy sheet (right)
hardness obtained by SIMM is related to the conven- point to point variation, as microindentation indents are
tional microhardness by often within individual grains and therefore highlight
orientation differences in deformation response.
HðSIMMÞ~0:93 HV (7) Depth sensing microhardness measurements on a 316
For loads less than ,1 N, small imperfections in the stainless steel were compared with values obtained in a
indenter tip geometry can give rise to significant conventional microhardness machine. The calibration
discrepancies with regard to hc, usually manifested as procedure involved measurement of SIMM indents in
an indentation size effect with increased values of the centre of the samples (away from the influence of
nominal hardness compared with that which would be residual stress and surface deformation effects) by
expected from a perfect geometry. These discrepancies optical microscopy, for direct comparison with the
generally have to be calibrated by experiment. In these depth sensing values. A standard Leitz Miniload micro-
circumstances the nominal SIMM hardness values are hardness machine was used to place five indents in the
significantly higher than the conventional microhardness centre of an annealed sample at a range of loads (0?5,
HV value. 0?2, 0?1, 0?05, 0?025 and 0?01 kgf; equivalent to 4?9,
Gradients in microhardness can be used to map 1?96, 0?98, 0?49, 0?25 and 0?1 N). The diameter of the
differences in internal deformation.129 Microhardness indents was measured using an optical image analysis
mapping measurements show that the technique pro- system at a magnification of 6500 to improve resolution
vides good repeatability in plots of mean values of of the smallest indents, which were ,20 mm in size. The
linescans through work hardened surface layers SIMM indents were also measured using the same
(Fig. 22), but it must be noted that there is considerable optical system and used to calculate HV (optical) values
22 Microhardness indent arrays (,20 mm spacings) through two ground surfaces of stainless steel sample mounted back
to back; and associated microhardness map of one of arrays
23 Load dependence of microhardness (left) and indent diameters (right) for conventional and SIMM measurements in
316 stainless steel
for comparison with the depth sensing values and the in the 316 stainless steel alloy of grain size ,30 mm all
conventional HV microhardness values. The individual indents below ,1?0 N will be within individual grains
values of conventional microhardness are plotted against and should therefore be interpreted appropriately depen-
load in Fig. 23 to illustrate the level of scatter. It is likely dent on the position and number of indents.
that this scatter reflects local differences in plasticity It is worth noting that depth sensing hardness values
arising from grain to grain orientation differences since are often quoted as Martens Hardness in units of
the grain size of the material is ,20 mm and thus greater N mm–2 and thus a factor of 9?81 greater than the
than or equal to most of the indent sizes. SIMM depth sensing values discussed here, where
The SIMM was then used to place 363 indent arrays correspondence with conventional Vickers microhard-
with indents separated by 100 mm at loads of 2, 1, 0?5, 0?2, ness numbers was sought.
0?1, 0?05 and 0?02 N. The SIMM microhardness values
(Fig. 23) show a much stronger dependence on load than Generic issues and future needs
the conventional microhardness values. The results for While it is clear that the challenge of miniature test
both SIMM and conventional microhardness tests are method development has been addressed by a number of
also plotted as indent diameters against load in Fig. 23. A different approaches (SP tests, bend tests, microuniaxial
linear fit through the log–log plot for the conventional tests, microindentation tests) there are some common
microhardness values gives a slope very close to 0?5, as features that are worth noting and areas where future
would be expected from HV51?844P/d2. However, the research activities would be welcomed. The following
load dependence of the indent diameter calculated from points can be summarised from the present paper.
the depth sensing microhardness values has an exponent 1. Digital image correlation is a powerful non-contact
of 0?635. This is thought to be due to a rounding of the tip method for quantifying strain distributions and local
or a chip from the bottom of the SIMM Vickers indenter, heterogeneities associated with different phases, grain
of magnitude 0?5 mm. Thus microhardness maps orientations and textures in the testpiece and further
obtained below ,1 N on typical engineering materials intensive research is expected.
should be used in a comparative sense, in that each 2. Measurement uncertainties clearly increase as test-
indenter has to be individually calibrated with respect to piece size decreases; consequently, it is good practice to
the material of interest and the specific load applied to
generate fully calibrated maps.
The depth sensing hardness data show a greater
sensitivity to the applied load than conventional mea-
surements and this may be an advantage in profiling
plasticity gradients. A typical microhardness profile
through a diamond ground surface is shown in Fig. 22
where it can be seen that the deformed surface layer was
about 100–200 mm thick as discussed in the section on
uniaxial microtensile test characterisation. Furthermore,
statistical measurements of load dependence of indent
diameter can provide useful guidelines on the size of area
probed by specific SIMM indents. A series of reference
plots of indent diameter for average microhardness values
for a range of engineering materials is shown in Fig. 24,
and this can be used for assessing the statistical relevance 24 Representative reference plots of SIMM indent diameters
of particular indents at selected load values. For example, as function of load in various engineering materials
pay specific attention to statistical measures of uncer- 5. I. Brooks, P. Lin, G. Palumbo, G. D. Hibbard and U. Erb:
‘Analysis of hardness-tensile strength relationships for electro-
tainty, choice in the number of specimens examined, and
formed nanocrystalline materials’, Mater. Sci. Eng. A, 2008, A491,
evaluation of how uncertainties in input data, from experi- 412–419.
ment or analysis, propagate through model predictions. 6. E. Demir, D. Raabe, N. Zaafarani and S. Zaefferer: ‘Investigation
3. The testpiece dimensions used should contain repre- of the indentation size effect through the measurement of the
sentative microstructures of the material being examined. geometrically necessary dislocations beneath small indents of
different depths using EBSD tomography’, Acta Mater., 2009, 57,
4. Specimen preparation techniques should be con- 559–569.
sidered carefully and aimed at minimising damage and 7. M. Rester, C. Motz and R. Pippan: ‘Indentation across size scales
residual stresses in surface layers. Quantification of this – A survey of indentation-induced plastic zones in copper {111}
damage due to different preparation methods would be single crystals’, Scr. Mater., 2008, 59, 742–745.
very useful. 8. M. D. Nix and H. Gao: ‘Indentation size effects in crystalline
materials: A law for strain gradient plasticity’, J. Mech. Phys.
5. The utility of finite element studies to assess the Solids, 1998, 46, (3), 411–425.
importance of geometrical features so that tests can be 9. M. Zhao, W. S. Slaughter, M. Li and S. X. Mao: ‘Material-length-
optimised for the determination of key parameters. scale-controlled nanoindentation size effects due to strain-
Typical examples were outlined in the small punch test gradient plasticity’, Acta Mater., 2003, 51, 4461–4469.
and microindentation sections. Additional research on 10. J. B. Pethica, R. Hutchings and W. C. Oliver: ‘Hardness
measurement at penetration depths as small as 20 nm’, Philos.
other test geometries is needed. Mag. A, 1983, 48A, (4), 593–606.
6. Validation with full scale tests should be used 11. F. Diologent, R. Goodall and A. Mortensen: ‘Surface oxide in
where possible to quantify potential size effects. replicated microcellular aluminium and its influence on the
7. The use of reference materials for validation, plasticity size effect’, Acta Mater., 2009, 57, 286–294.
particularly of finite element model predictions, is 12. A. Iost and R. Bigot: ‘Indentation size effect: Reality or artefact?’
J. Mater. Sci., 1996, 31, 3573–3577.
encouraged. 13. T. Chudoba, P. Schwaller, R. Rabe, J.-M. Breguet and J. Michler:
8. For oxidation sensitive materials it is essential to ‘Comparison of nanoindentation results obtained with Berkovich and
conduct elevated temperature miniature tests in an inert cube-corner indenters’, Philos. Mag., 2006, 86, (33–35), 5265–5283.
environment, such as high purity argon or a vacuum. 14. X. D. Hou, A. J. Bushby and N. M. Jennett: ‘Study of the
The use of miniaturised test methods is expected to interaction between the indentation size effect and Hall–Petch
effect with spherical indenters on annealed polycrystalline
grow quickly and contributions in the fields of copper’, J. Appl. Phys. D, 2008, 41D, 074006–074012.
durability, fatigue (including thermomechanics), ele- 15. J. R. Greer: ‘Bridging the gap between computational and
vated temperature and dynamic testing will be very experimental length scales: a review on nano-scale plasticity’,
welcome and expected to provide the required engineer- Rev. Adv. Mater. Sci., 2006, 13, 59–70.
ing insights that will promote safe, efficient and 16. J. R. Greer, W. C. Oliver and W. D. Nix: ‘Size dependence of
mechanical properties of gold at the micron scale in the absence of
sustainable use of resources and contribute to cost strain gradients’, Acta Mater., 2005, 53, 1821–1830.
effective practices in both materials and equipment. In 17. R. Maab, S. van Petegem, J. Zimmermann, C. N. Borca and
addition to the laboratory based systems described, the H. van Swygenhoven: ‘On the initial microstructure of metallic
future demand and challenges lies in transferring some micropillars’, Scr. Mater., 2008, 59, 471–474.
of the methodologies to provide real time, in situ 18. H. Bei, S. Shim, G. M. Pharr and E. P. George: ‘Effects of pre-
strain on the compressive stress–strain response of Mo-alloy
measurement of properties on components in the field. single-crystal micropillars’, Acta Mater., 2008, 56, 4762–4770.
19. D. Kiener, C. Motz and G. Dehm: ‘Micro-compression testing: a
Acknowledgements critical discussion of experimental constraints’, Mater. Sci. Eng.
A, 2009, A505, 79–87.
Metrology research on materials testing at NPL is 20. C. P. Frick, B. G. Clark, S. Orso, A. S. Schneider and E. Arzt: ‘Size
supported by the UK Government’s National Measure- effect on strength and strain hardening of small-scale111 nickel
compression pillars’, Mater. Sci. Eng. A, 2008, A489, 319–329.
ment System Programme. Members of various industrial
21. S. I. Rao, D. M. Dimiduk, T. A. Parthasarathy, M. D. Uchic,
advisory groups are thanked for their steer in develop- M. Tang and C. Woodward: ‘Athermal mechanisms of size-
ing appropriate test methods and providing suitable dependent crystal flow gleaned from three-dimensional discrete
engineering materials for test method development. dislocation simulations’, Acta Mater., 2008, 56, 3245–3259.
Colleagues M. G. Gee, M. Stewart, M. S. Loveday 22. C. Motz, D. Weygand, J. Senger and P. Gumbsch: ‘Micro-
bending tests: a comparison between three-dimensional discrete
and M. Brooks at NPL are acknowledged for their
dislocation dynamics simulations and experiments’, Acta Mater.,
contributions to some of the unique test methods 2008, 56, 1942–1955.
described in the paper. The authors would also like to 23. J. Senger, D. Weygand, P. Gumbsch and O. Kraft: ‘Discrete
acknowledge that the final content and structure of the dislocation simulations of the plasticity of micro-pillars under
paper were constructively influenced through detailed uniaxial loading’, Scr. Mater., 2008, 58, 587–590.
24. D. Kiener, W. Grosinger, G. Dehm and R. Pippan: ‘A further step
comments during the refereeing process.
towards an understanding of size-dependent crystal plasticity: in
situ tension experiments of miniaturized single-crystal copper
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