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Description
RFIN
1
8 7 6
tributed power amplifier die which operates
from DC to 20 GHz. The amplifier delivers
greater than 12 dB of gain with a correspond-
ing output 1 dB compression point of +29 dBm
and output IP3 of 38 dBm at 10 GHz. The
CMD201 is a 50 ohm matched design which
eliminates the need for RF port matching. The
CMD201 offers full passivation for increased
reliability and moisture protection.
Electrical Performance - Vdd = 10.0 V, Vgg1 = -0.55 V, Vgg2 = 5.0 V , TA = 25 oC, F = 10 GHz
Parameter Min Typ Max Units
Frequency Range DC - 20 GHz
Gain 12 dB
Noise Figure 3.4 dB
Input Return Loss 16 dB
Output Return Loss 17 dB
Output P1dB 29 dBm
Supply Current 400 mA
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
DC-20 GHz Distributed Power Amplifier
Specifications
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
DC-20 GHz Distributed Power Amplifier
Typical Performance
10 6
S11
S22
5 S21 5
NF
Noise Figure/dB
Response/dB
0 4
-5 3
-10 2
-15 1
-20 0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Frequency/GHz
Narrow-band Performance, Vdd = 10 V, Vgg1 = -0.55 V, Vgg2 = 5 V, Idd = 400 mA, T=25 oC
15 7
10 6
S11
S22
5 S21 5
NF
Noise Figure/dB
Response/dB
0 4
-5 3
-10 2
-15 1
-20 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
DC-20 GHz Distributed Power Amplifier
Typical Performance
14
13
12
11
10
9
Gain/dB
7
+25C
+85C
6 -55C
5
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Frequency/GHz
+25C
9 +85C
-55C
8
7
Noise Figure/dB
0
3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Frequency/GHz
ver 1.4 0218
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
DC-20 GHz Distributed Power Amplifier
Typical Performance
31
30
29
28
Response/dBm
27
26
25
24
23
22
21
20
19
18
17
16
15
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Frequency/GHz
26
25
24
23
22
21
20
19
18
17
16
15
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Frequency/GHz
ver 1.4 0218
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
DC-20 GHz Distributed Power Amplifier
Typical Performance
35
Output IP3/dBm
30
25
20
15
10
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Frequency/GHz
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
DC-20 GHz Distributed Power Amplifier
Mechanical Information
114.00
3 4
5
1550.00
1384.00 2
863.00
728.00
1
411.00
8 7 6
162.00
1781.00
2058.50
2185.50
2820.00
Notes:
1. No connection required for unlabeled pads
2. Backside is RF and DC ground
3. Backside and bond pad metal: Gold
4. Die is 85 microns thick
5. DC bond pads are 78 microns square
6. RF bond pads are 108 x 193 microns
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
RF in
RF in RF out
45 deg
Port B
Port A
Vgg Vdd Vdd VggVdd
(-) (+)
45 deg
Vgg (-)
Vdd
4 Port A 5 Vctl Vgg 3
Vdd
4
LFT2
Vgg
Vgg (-)
LFT1 400 ohm
RF in To Gat
eg Vdd GND
Vgg
LFT2
20 ohm
For CMD146
Vctl
1
RF out Ven RF inVdet
4 5
0.01 uF
Vdd LFT3
45LO
deg RF
4 dB 8 7 6
Vgg Vgg GB
LFT4 RF out & Vdd ACG3
Port B
4 RF out Vgg
Vdd ACG4
Functional Description 3 bit
5
Ven Vdet
Port A
0.01 uF LO RF 400 oh
4 dB 45 deg RF in T
IF
GND Vctl
Vgg RF in 20 ohm
0.01 uF Pad Function Description
GB Vgg
Schematic
Vgg Vctl Vgg Vdd Vdd
Vctl
Vee RF in Vgg2
IF
1 RF in 50 ohm matched
ACG1 input For CMD146 Vgg Vd
1 2 3 4 ACG2 4 bit
5 Vgg
RF out & Vdd
Vgg
ACG2
ACG3
3 bit
RF in RF out Port A Ven
5
Vdd output 4 dB 45 deg
Vctl
Vee RF in ACG3 Vgg2
ACG4
6, 7 ACG3, 4
capacitor per application circuit
Vctrl1 Vgg Vd
RF in
Vctrl2
LO
Vctl
Vee RF in Vgg2
Vctl
RF out
Vdd 1Power supply2voltage
Vctrl1
3 Vgg1 Vgg
4
IF1, IF2
8 Vgg1 Vctrl2
RF in
Vctl Decoupling and bypass caps required
Vdd Vdd Vdd
GND
Assembly Guidelines
The backside of the CMD201 is RF ground. Die attach should be accomplished with electrically and
thermally conductive epoxy only. Eutectic attach is not recommended. Standard assembly procedures
should be followed for high frequency devices. The top surface of the semiconductor should be made
planar to the adjacent RF transmission lines, and the RF decoupling capacitors placed in close proximity
to the DC connections on chip.
RF connections should be made as short as possible to reduce the inductive effect of the bond wire. Use
of a 0.8 mil thermosonic wedge bonding is highly recommended as the loop height will be minimized.
The RF input and output require a double bond wire as shown.
The semiconductor is 85 um thick and should be handled by the sides of the die or with a custom collet.
Do not make contact directly with the die surface as this will damage the monolithic circuitry. Handle
with care.
Assembly Diagram
To Vgg2
RF out
RF in
To Vgg1
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions
should be observed during handling, assembly and test.
ver 1.4 0218
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
DC-20 GHz Distributed Power Amplifier
Applications Information
Application Circuit
100 pF 0.1 uF
3 Vdd
Vgg2 2
0.1 uF 100 pF
4
5 RF out
6
7
RF in 1
8 100 pF 0.1 uF
Vgg1
0.1 uF 100 pF
Note: Drain voltage (Vdd) must be applied through a broadband bias tee or external bias network.
External DC block is required on RF input.
The CMD201 is biased with a positive drain supply, a negative gate1 supply and a positive gate2 supply.
Performance is optimized when the drain voltage is set to +10 V. The recommended gate1 and gate2
voltages are -0.55 V and +5 V respectively.
Turn ON procedure:
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com