MICRO ARRAY HOLE FORMATION IN

GLASS USING
ELECTROCHEMICAL DISCHARGE
MACHINING

ABSTRACT
ECDM is a process to create micro-holes in electrically non-conductive
glass. The process has the capability to create micro-holes in glass,
which can be used as ‘through glass vias’ in Micro-electromechanical
system (MEMS) packaging. This work reports the fabrication of 3×3
array micro-holes in a glass substrate using ECDM. In order to improve
the efficiency of the process, multi-tip array tools were used, where
multiple micro-holes were fabricated at the same time. Fabrication of
stainless steel multi-tip tool having a 3×3 array with an average tip size
of 150 µm was demonstrated using Wire-EDM process. Issues related
to multiple hole creation were discussed. Effects of applied voltage,
pulse frequency and duty cycle on material removal rate (MRR) and
heat affected zone (HAZ) width were observed. Ultimately, precise
quality 5×5 array micro-holes were fabricated at the optimal range of
input parameters.

Submitted By,
Bharath Ram
TVE19MEMA04