www.PDHcenter.com PDH Course M143 www.PDHonline.

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8) Adequate pre-filtration is typically used to economically increase HEPA filter life. The pre-

filters shall not be located in a way that they obstruct operations and have to be accessed

for cleaning and replacement through the clean room.

9) Process exhaust systems vary from 1CFM per sq ft for photolithographic areas to 10

CFM per sq ft for etching, diffusion and implant process areas. In the absence of specific

design layouts, a value of 5CFM per sq ft is often used. Exhausts are segregated into

corrosive fumes (using plastic or reinforced fiber glass materials), flammable solvent

vapors, and heat exhausts (using metal components).

10) Precise temperature and humidity control is required in the microelectronic facility. In

semiconductor industry, tolerances of ±1°F are common, and some processes even

require ±0.1 to 0.5°F.In Class 100 areas or better, personnel wear full coverage gowns

that require room ambient temperatures of 68°F or less.

11) Humidity levels vary from 30 to 50% with levels and tolerances a function of process

requirements, prevention of condensation on cold surfaces within the clean room, and

static electricity control. Tolerances are varying from ±0.5 to 5% relative humidity. Static

electricity problems are significantly reduced where humidity’s are above 50%; otherwise

suitable antistatic provisions such as materials/flooring are provided.

12) The major internal load components are people, process equipment and fan energy.

Because clean rooms are usually located within conditioned spaces, traditional

infiltration, solar and heat conduction losses is minimal (less than 2 to 3% of the total

load).

13) Fan energy is a very large heat source in Class 100 or better clean rooms, as re-

circulated airflow rates of 90 CFM per square foot are typical. This is the equivalent of

about 600 air changes per hour.

14) The latent load is primarily from makeup air. Low leaving air dry bulb temperatures of 35

to 45°F are typical to ensure relatively low humidity requirements of many processes.

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