Simplified Stock Management

Stable Printability

Lead-free solder paste

Nihon Superior SN100C P506 D4 is a lead-free

no-clean solder paste that can be stored at
room temperature for extended periods with
minimum change in viscosity. This new material
will not only simplify stock management, but
also improve productivity with excellent
consecutive printability.

No silver Printing
Lead-free
Grade

Excellent Minimized
Excellent
Storage Mid-Chip
Wetting
Stability Beading

Printability Mid-Chip Beading Minimized

First Print After 10 hours printing

QFP 0.4mm pitch

Printing environment
16 ∼ 25℃ 40%RH

No print defects after

10 hours continiuous
printing

Excellent wetting Stable viscosity

Viscosity as a Function of Time at 40C

SOT23-3 pin 0.4mm pitch QFP

Stencil Thickness Programing rate

Peek temperature Time above liquidus
Lead-Free Solder Paste

Properties
Test Specification
Alloy Composition

Melting point 227℃

Powder size 20 ∼ 38μm/TYPE4
Flux Classification

Halide(Potentiometric titration wt %
Copper plate corrosion No Corrosion
Flux Content 12wt %
Viscosity Pa・s Annex6
Thxotropic index Annex6
Insulation resistance Ω
Electromigration Pass
Spread

Long term storage life 12months in refrigerator

On line shelf life 60days Up to 40℃

Reflow Profiles Product Code

Peak
Soak for
temperature
RSS profile
240 5℃
160-200C
temperature（℃）

Ramp rate for

for RSS 60-90sec
profile
2-4℃/sec
Alloy Flux type Powder size
Time above
227℃ liquidus

Minimum Order Quantity

Ramp rate for
RTS profile
1-2℃/sec
5kg (10×500g jars)

time（sec.）