Quality control and CHAPTER 14

environmental activities

1 Quality control
1-1 Quality control system
1-2 Product reliability
1-3 For your safety

2 Environmental activities

1
 Quality control and
environmental activities
[Figure 1-1] Quality assurance chart
1. Quality control Division Sales
Customer manager Design, Quality
development Manufacture Inspection control Purchasing Shipment Supplier
Quality manual, division procedures, document control

Quality system
Opto-semiconductor products from Hamamatsu Photonics Education, training
Business policy Sales/equipment/human resource planning
are used in a wide range of fields including medical diagnosis, Quality policy Quality objectives
measurement, industrial instrumentation, automobiles, Marketing research Catalog product proposal

information equipment, general electronics, and academic Product commercialization review

New product Custom Design plan
research. As their product applications expand, demands for needs products
Product design
even higher product quality and reliability are increasing.
Design review
To meet these marketplace demands, we are actively taking Approval
Prototype
Design

measures to improve product quality levels. Design verification

Pilot first sample,
first product manufacturing Inspection Reliability test
Practical test
OK OK
Design validation
1-1 Quality control system Standard procedures, initial production control planning
Product authorization

Order Receive Production Purchasing Material manufacture

Quality policy order planning Supplier registration
Material registration
Incoming Subcontracting
Our policy at the Solid State Division of Hamamatsu
Production

Receiving inspection
Photonics is to “take responsibility as an opto-semiconductor No Good OK
Production Calibration
manufacturer to establish a quality control system that
Nonconforming Inspection
provides products the customer needs and to contribute to product control OK
Product storage
the progress of industry and science.” To achieve this policy,
Delivery Shipment
we are making continuous efforts to supply products that
Complaint Reception Confirmation
Complaint

are even better, cheaper, faster, and gentle on the earth to Root cause investigation, recurrence prevention
satisfy customers. Acceptance Answer Report
Customer Customer
satisfaction satisfaction report
Management review

Quality standardization
Improvement

The Solid State Division employs the ISO 9001 Quality
Management System to standardize quality. In this system,
items that are basic requirements are formalized in a “Quality
Manual” and rules for design, materials, manufacture,
inspection, shipping, and equipment management are placed
in document form as “Standards” to create a consistent
quality assurance system.
Figure 1-1 shows a quality assurance chart.
Corrective/preventive action
Internal quality audits
ISO committee ISO promotion meeting QC meeting PQC meeting
Evaluation of the quality objectives
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Design and development
On the basis of the requirements from our customers
and marketplace, we start investigating the possibility of
production in terms of a new or custom-order product’s
functions, reliability, cost, and so forth.

(1) Input to design and development

We verify the requirements of our customers and marketplace;
outline the functions, performance, applicable regulations,
and the like; and document the information.

2
(2) Output from design and development
The designers outline appropriate information regarding
the input requirements, purchasing, and production
as well as safety and environmental requirements and
create an output document.
(3) Design review
The output from design and development is reviewed to
determine whether the input requirements can be satisfied.
(4) Design and development verification
The output from design and development is inspected
to ensure that the input requirements can be satisfied.
This is conducted in the prototype stage of product
development.
(5) Design and development validity verification
The validity of design and development is verified to
ensure that the product meets the requirements of the
intended application. This includes reliability tests. This
is conducted in the mass production stage of product
development.
(6) Product authorization
Meetings to discuss design (e.g., product specifications),
process (manufacturing and inspection), product (reliability),
and purchasing (subcontractors and suppliers) are held,
and then the product is authorized.
Process management
The production process is supervised based on QC process
charts and work standards to ensure that quality and
reliability are at levels planned in the product design. Main
production processes for opto-semiconductors include
oxidation, photolithography, ion implantation, diffusion,
electrode-forming, and etching in the front end process
(wafer process), as well as wafer dicing, die bonding, wire
bonding, and sealing in the back end process (assembly
process).
To verify that the products meet the required specifications,
Hamamatsu performs process inspections and product
inspections that check the product electrical/optical
characteristics and external appearance. The inspection
items, methods, and test criteria are established in the
product specifications. Destructive testing and lot evaluations
are done by product sampling inspections.
Control to prevent contamination of light receiving/emitting
surfaces is essential for opto-semiconductor products. The
packing process requires use of special packing materials
and techniques to safeguard light receiving/emitting surfaces
from contamination as well as countermeasures to vibration,
impact, temperature/humidity, and electrostatic charges.
Table 1-1 shows a QC process chart example.
Evaluation is made on statistical process control (SPC)
using control charts and the like to determine whether a
process is stable or is in a controlled state as well as process
capabilities. If the control chart indicates an abnormal
tendency or if the process capabilities are insufficient,
the cause of the problem is investigated and fed back to
maintain and improve the relevant process.

[Table 1-1] QC process chart example (part of process)

Process Control item Method

Document
No. Symbol Work name Device/condition, item Measuring device, sample Sample size, frequency Record
1 Material acceptance
1-1 Wafer Resistivity, thickness Check Each time Acceptance inspection sheet Purchasing specification
Appearance Visual check All wafers Work procedure
1-2 Lead frame Dimensions Microscope 1 frame/lot Acceptance inspection sheet Inspection procedure
Appearance Visual check 1 frame/lot
4-2 Plating thickness Thickness gauge 3 frames/lot
1-3 Mold resin Characteristics Check When materials Purchasing specification
are delivered
4-4
2 Wafer process Oxidation furnace
2-1 Oxidation Temperature, time Check Each time Run sheet Work procedure
Wafer appearance 1 Work logbook Wafer process
Color, uniformity Visual check All wafers Manufacturing specification
Wafer appearance 2
SiO2 thickness Thickness gauge 1 wafer/lot
2-2 Photolithographic work Photomask Check Each time Run sheet Work procedure
Wafer appearance 3 Work logbook Wafer process
Pattern condition Microscope 3 wafers/carrier Manufacturing specification
Pattern accuracy, pattern defect Microscope 3 wafers/carrier

3
 Dealing with process errors Product identification and traceability

Figure 1-2 shows a system chart for error handling. To establish traceability for determining the production
lot and material lot for the individual products delivered
[Figure 1-2] System chart for error handling
to our customers, records of each process contain columns
Corrective for entering used materials, devices, and production
Fault finder Supervisor Quality control action dept. Purchasing Supplier
information. These records are stored securely as product
Trouble report Confirm details at history information.
location and on items
When necessary, as shown in the following example, the
No
Close Action needed? type number, production year and month, production serial
Yes
In-house process
number, and so on are indicated on the product.
Where problem
occurred?
Not in-house • Example
process
In-house Corrective action
Confirmation

Trouble investigation instruction S1234 3A 001

request form Supplier Corrective action Serial number
Confirmation
instruction Production month (alphabetical order... Jan: A, Feb: B, Dec: L)
Production year (last digit of year)
Corrective Corrective Type number
countermeasure check

action action
Recurrence
Confirmation
Progress/

prevention check

Purchasing management
Close

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Purchasing management of parts and materials has a large
effect on product quality, so we use a system that judges
When a problem occurs in the production process, which and then registers both the suppliers and the parts and
might cause defects that exceed preset process standards materials for purchasing.
or might adversely affect the product quality, then the We carry out an inspection of the suppliers to check
problematic lot is immediately identified and separated compliance with the quality system, environment system,
from other semi-finished parts. At the same time, the cause green purchasing policy, business continuity capability, and
of the problem is investigated, and the corrective action other factors. We then register those suppliers who meet
that should be taken is decided. Along with confirming the our standards and also make new and periodic supplier
corrective action was effective, we take measures to prevent audits mainly by the purchasing, quality control, and design
the problem from reoccurring. departments.
The semiconductor wafers, electrode materials, chemicals,
Equipment and work environment management gases, and the like used to produce opto-semiconductor
products must be of high purity and high quality. The metal
The work environment in the manufacturing process and ceramic materials, printed circuit boards, and mold
greatly affects product quality and reliability of opto- resin used for packages must be of high precision and high
semiconductor products. Cleanliness, temperature, and quality. These types of purchased items undergo strict
humidity in particular must be strictly controlled. Opto- individual testing and are then registered before they can
semiconductors are produced in clean rooms where be used in our products.
cleanliness is controlled at a high level. To maintain An incoming inspection of those purchased items is then
and control the cleanliness level in clean rooms, strict made based on the required specifications to verify their
control standards are established for factors such as quality. After acceptance, these purchased items are stored
cleanliness, entry/exit methods, work clothing, carry-in in properly controlled locations that meet storage conditions
items, and work procedures. Damage caused by electro- specified in the design standards, and a high level of
static discharge (ESD) can be a serious problem as purchased item quality is maintained [Figure 1-3].
process geometry shrink and diverse packages become
available, so electrostatic countermeasures are enforced.
The department dealing with products requiring
ESD countermeasures sets up special areas that must
comply with ESD control standards and gives workers
instructions in equipment and work site supervision,
work clothing, and handling methods.
Production equipment is verified after modifications or
expansions and also given regular maintenance. Specific
methods for making start-up and periodic equipment
inspections are established to perform preventive
maintenance, and constant efforts are made to prevent
quality problems and keep stable production.

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[Figure 1-3] Purchasing control chart [Figure 1-4] Measuring equipment traceability
Design Quality control Purchasing/subcontractor management Supplier National standard
AIST, NIST*
Public calibration laboratory
Supplier registration

Outsourcing application New supplier application New supplier

Corporation calibration
A Japan Electric Meters Inspection Corporation
Site investigation Rank laboratory
Other than A Other calibration
Private calibration laboratory Measuring equipment manufacturer
Request for decision (internal memo) Supplier registration laboratory
Product management
Standards Measuring equipment standards, calibrator
division
Material registration application Confirmation of contents Material registration Delivery specifications
Purchasing information

and drawings Solid State Division

Purchasing specifications Calibrator Calibrator
and the like QC process chart Quality control
Preliminary survey Estimate
sheet for environmental Solid State Division Measuring Measuring equipment
controlled substances SDS Manufacturing dept. equipment
Acceptance inspection standards Inspection equipment, standard element
RoHS substances analysis report Customer Products Products
High-risk material
registration application * AIST: National Institute of Advanced Industrial Science and Technology (Japan)
NIST: National Institute of Standards and Technology (U.S.)
Purchasing request Order form Material, subcontracting
Purchasing, subcontracting, and change control

KOTHC0033EB
Acceptance inspection Invoice
Inspection sheet
Judgment [Figure 1-5] Measuring equipment inspection example
No Good (for photodiode)
Fault investigation request Cause investigation

Examination, acceptance Solution response Standard (calibrator) Measuring equipment (source meter)
Investigation, answer Material special Material special
acceptance control form acceptance application

Investigation, answer Material change application

→
Calibration
Response Acceptance

Material change or Material change or cancellation Initial product,

cancellation application special acceptance form
B
Rank Amount of annual business
S∙A
Periodic
Basic business contract inspection
Quality assurance agreement
QC check sheet Organization chart Inspection equipment made by Hamamatsu Standard element
supplier environmental (photodiode measuring device) (photodiode)
Quality assurance
Evaluation

investigation report
system chart
Monthly purchasing report ISO registration
certificate
Site investigation plan,
result report

Supplier evaluation report Site investigation

→
←
Start-up
Site investigation report
No Good inspection
Evaluation Improvement plan Improvement activities

KOTHC0039EC

[Figure 1-6] Calibration certificate example of calibrator

Measurement management

To perform product inspection accurately, a system

(traceability) to ensure the accuracy of measuring equipment
is implemented. Calibrators for calibrating the measuring
equipment are traceable to national standards through
measuring equipment manufacturers, public organizations,
or standard equipment in Hamamatsu Product Management
Division. In addition, inspection equipment and standard
elements are traceable to measuring equipment [Figure 1-4].
Furthermore, in addition to calibration, start-up inspections
and periodic inspections are made to detect and prevent
degradation in accuracy and malfunction in measuring
equipment and inspection equipment.

5
 [Figure 1-8] Complaint action chart
Change control
Correspondence section, Division manager,
Customer Sales related section Quality control the responsibility
(design, manufacture) of a management
Changes such as in designs, purchased items, production
Complaint Reception Contents confirmed
methods, and equipment are made in order to improve Information Returned product
product quality, function, reliability, and productivity. confirmation action ledger recorded
Returned product Put on the
action form article card
Change planning is first drawn up, the job schedule from
change setup to completion is clarified, and the planning First report Report Quality judgment/correlativity investigation/making first report

is then finalized at a change conference attended by all HPK No

responsible
related departments including quality control. Finally, Yes
Minor
the change is decided after evaluating the effects on Customer complaint
level
Directions
Critical, major
quality, reliability, productivity, etc. Changes requiring
Quality Complaint ac tion meeting
the customer’s approval in advance are implemented influence “Critical” & “Major”: needed “Minor”: if necessary
Report
after obtaining the customer’s consent. Initial production report of Specific within the range of object/enclosure
products
control is performed as needed and a final check made of Inspection under the reproducibility conditions
all effects caused by the change [Figure 1-7]. Examination and confirmation of correspondence
(survey result and nonconforming circumstances)
[Figure 1-7] Change control chart Examination and confirmation of correspondence
(cause and reproducibility)
Customer Sales Quality control Section initiating change Related sections
Plan of applicable products disposed/
countermeasures implemented
Change proposal

Nonconforming products investigation report (8D report)

Change
meeting Change planning form
Not needed Investigation report
No Good
Needed
Approval Report Approval/agreement
Customer
Change proposal Change meeting
confirmation OK Applicable products disposed/
countermeasures implemented

Design verification/validation Returned product action ledger recorded

Not needed Corrective/

Confirmation Change application Confirmation preventive
action
Needed
Issue of change Needed Customer Corrective & preventive action indicating form
Change application agreement
application form
Not needed OK
Corrective & preventive action Follow-up
Confirmation of customer’s No Good
Customer evaluation
change decision
Close Approval
KOTHC0028ED
Change decision

Revised standards
Instruction and training
Change implementation
The Solid State Division provides worker instruction and
Customer
First sample confirmation First sample control/initial production control
training as an active promotion to maintain and improve
confirmation
product quality as well as upgrade employee skills. Employee
Follow-up skills are periodically reviewed, and instruction/training
plans are then drawn up and performed as needed. When a
Close particular job requires obtaining qualifications, then those
KOTHC0026EB are clearly specified, and a system is then set up to certify
employees who meet the requirements of the job.
Complaint handling The types of instruction span many areas including new
employee education, on-the-job training, and safety and
At Hamamatsu we work to speedily resolve customer health instruction. Positive efforts are also made to collect
complaints by way of our complaint handling system. information outside our company in order to upgrade
The contents of the complaint are first checked, and an employee knowledge and skills.
investigation made to find the cause. Besides notifying the
customer of these results, we also use them as feedback in
the design and production processes to prevent a recurrence
of the trouble. If we decide, based on those investigation
results, that the quality control system must be overhauled,
then corrective action is taken and results from that action
are verified [Figure 1-8].

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1-2 Product reliability
Reliability
(1) Definition of reliability
In the Glossary of Terms Used in Reliability of JIS, reliability
is defined as “the capability of an item to perform a required
function under specified conditions for a specified period
of time.” We define the term as “the capability to withstand
operation under the customer’s usage environment over the
warranty period (or longer than the warranty period).”
(2) Failure region of opto-semiconductor products
The failure region of opto-semiconductor product can be
divided into initial failure, random failure, and wear-out
failure. The curve indicating the change in each failure
rate over time is called a bathtub curve.
[Figure 1-9] Bathtub curve example
Wear-out
Failure rate
Initial failure Random failure failure
Time
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• Initial failure
Initial failures occur at a relatively early period after starting
the use of a product. It is caused by a design or manufacturing
defect, incompatible usage environment, and so on. Initial
failure rate decreases as time passes. Screening inspections
before shipment can eliminate devices exhibiting initial
failures and thereby improve the initial failure rate in the
market place.
• Random failure
As the name suggests, random failures occur randomly
after the initial failure period but before the wear-out failure
period. Failures occur sporadically, and the failure rate is
nearly constant but never zero.
• Wear-out failure
Wear-out failures increase as time passes due to fatigue,
wear, deterioration, and so on. Examples of wear-out failures
in opto-semiconductor products are electromigration,
wire breakage due to repetitive temperature changes, and
sensitivity deterioration due to ultraviolet light and X-ray
exposure.
(3) Reliability testing
We make reliability tests to verify that a product meets the
specified reliability requirements. In reliability testing for
product authorization, long-term stress tests are performed to
verify that wear-out failures do not occur under the assumed
usage environment and within the assumed usage period.
Reliability tests are performed by selecting typical products
from among a group of structurally similar products. If
needed, this testing is performed individually. For a portion
of mass-produced products, to verify that the quality set
at the development stage is maintained even after mass
production, mass-produced products are sampled and
subjected to reliability tests once a year. Reliability test
methods conform to JIS, JEITA, IEC, MIL standards, and
the like. Some products are also tested according to their
product application. For example, optical communication
devices are tested according to the Telcordia GR-468
standards. Products including automotive devices are also
subjected to testing specified by the customer.
Table 1-2 shows typical reliability tests.
(4) Lifetime prediction
Wear-out failure data obtained through reliability testing can
be used to determine the cumulative failure rate over time.
By taking into account logarithmic-normal-distribution,
Weibull-distribution, and acceleration factor of reliability
testing, one can calculate the activation energy that leads to
specific wear-out failures and predict the length of time to
reach the cumulative failure rate reference (wear-out failure
lifetime).
[Figure 1-10] Failure rate prediction using Weibull plot
90
Acceleration Predicted
test failure rate failure rate
50
Cumulative failure rate (%)
10
× Acceleration factor
1
0.1
100 1000 10000 100000
Time (h)
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Failure analysis
Failure analysis is a way of investigating the cause of failure
and the mechanism that leads to the failure by researching
the failure that occurred in the manufacturing process,
marketplace, etc. The facts that are revealed through this
activity are fed back to design and manufacturing to prevent
the same failure from reoccurring [Figure 1-11].
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 [Figure 1-11] Flow chart of typical failure analysis Failure analysis examples
Failure occurrence (1) Leakage between terminals

Collection of failure data  Side face observation: reaction areas verified with an
IR-OBIRCH microscope
Verification of the failure phenomenon
Electrical characteristics measurement: semiconductor parameter analyzer and the like
Appearance observation: optical microscope and the like

Determination of failure location

Light emission observation: emission microscope
OBIRCH observation: IR-OBIRCH microscope
Front side observation: optical microscope and the like

Determination of the root cause and

mechanism of problem (estimation)
Cross section observation: focused ion beam
Front side peeling observation: electron microscope and the like
Elemental analysis: EDX and the like

Feedback
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[Table 1-2] Reliability test examples

Test item Test condition examples Test standards

High-temperature storage Maximum storage temperature Tstg max., 1000 hours EIAJ ED-4701/200 201
Low-temperature storage Minimum storage temperature Tstg min., 1000 hours EIAJ ED-4701/200 202
High-temperature &
85 °C, 85%, 1000 hours EIAJ ED-4701/100 103
high-humidity storage
Maximum operating temperature Topr max., operating conditions:
High-temperature operation EIAJ ED-4701/100 101
depends on individual specs, test time: 1000 hours
Minimum operating temperature Topr min., operating conditions:
Low-temperature operation EIAJ ED-4701/100 101
depends on individual specs, test time: 1000 hours
Life test High-temperature & 85 °C, 85%, operating conditions: depends on individual
EIAJ ED-4701/100 102
high-humidity operation specs, test time: 1000 hours
Unsaturated steam pressurization 120 °C, 85%, 170 kPa, 96 hours EIAJ ED-4701/100 103
Maximum storage temperature Tstg max., 30 minutes, minimum
Temperature cycle EIAJ ED-4701/100 105
storage temperature Tstg min., 30 minutes, 100 cycles
X-ray irradiation Output tube voltage: 100 kV, 1 million roentgen -
Hg light 253.7 nm, 1000 hours
UV light irradiation -
D2 light 200 nm to 400 nm, 1000 hours
Pulling A load is imposed for 10 seconds.
Terminal strength Twisting A lead is bent 90° and rotated. EIAJ ED-4701/400 401
Bending A lead is bent 90° with a load applied, and is then bent back.
100 Hz to 2000 Hz, acceleration: 200 m/s2
Vibration sweep time (100 Hz to 2000 Hz to 100 Hz): 4 minutes EIAJ ED-4701/400 403
sweep direction: 3 directions of X, Y and Z, 4 times each
Maximum acceleration: 15000 m/s2, pulse width: 0.5 ms
Shock shock direction: 4 directions of X1, (X2), Y1, Y2, Z1, (Z2), EIAJ ED-4701/400 404
3 times each
Accelerated aging Steam, 4 hours
EIAJ ED-4701/300 303
Strength Solderability Soldering by hand: 245 °C, 2 seconds
test Lead free
Reflow: 225 °C or higher (235 °C peak), 20 seconds JIS C60068-2-58
Other than surface
260 °C, 10 seconds EIAJ ED-4701/300 302
mount type
Preprocess: JEDEC Level 5a (30 °C, 60%, 48 hours)
Resistance to soldering heat
Surface to Level 1 (85 °C, 85%, 168 hours)
JEDEC J-STD-020
mount type Lead free: solder heating process, 3 times, 235 °C or
higher (240 °C peak), 30 seconds
C=100 pF, R=1.5 kΩ, applied voltage: ±1 kV, number
Electrostatic breakdown EIAJ ED-4701/300 304
of times: 1
Thermal shock 100 °C to 0 °C, 10 times EIAJ ED-4701/300 307
Transportation temperature cycle -40 °C to +70 °C, 5 times JIS C60721-3-2
Solvent type: isopropyl alcohol, dipping time:
Other Resistance to solvents EIAJ ED-4701/500 501
5 minutes, rubbing: 5 strokes in both directions
Note: Please contact us for information on reliability test for individual products.

8
 Cross section observation: cracks verified in the TSV
insulation film (electron microscope; cross section
polisher)
Crack Crack
→ Feedback: insulation film modification, structural
improvement
(2) IC short circuit
 Back side observation: abnormal signals verified with
an IR-OBIRCH microscope
 Front side observation (after film peeling): foreign
substance verified in the abnormal signal area with an
optical microscope
‘ Cross section observation: foreign substance shorting
the terminals is discovered
(focused ion beam; Fe·Cr detected from the foreign
substance through elemental analysis)
→ Feedback: complete particle control, inspection
method enhancement
1-3 For your safety
Handling precautions
Products must be stored and used under the conditions
specified in the delivery specification sheets. If these
conditions are not met, problems such as oxidation and
contamination of leads and packages absorbing moisture
may occur. When using our products in your products, be
sure to agree to the delivery specification sheet.
Depending on the product, precautions specific to the product
may be present in addition to general precautions. As such
details are provided in the operation manual supplied with
the product, be sure to read it.
Table 1-3 shows an example of the handling precautions of
opto-semiconductor products.
Examples of problems that have occurred due to
inappropriate handling
(1) Examples of problems caused by external force
 Damage to metal wiring
Examples in which the metal wiring on a bare chip is
damaged due to physical contact
 Damage to sensor package
An example in which an inappropriate heatsink coupling
(e.g., improper viscosity or nonuniform grease or screws
tightened too strong) causes excessive load to be applied
to the sensor’s heat dissipation section and damages the
bonded area of the ceramic and heat dissipating sections
Ceramic area
Heat dissipation area
‘ Cracked chip caused by external force
An example in which a strong external force applied to
the scintillator on the chip cracks the chip
9
 ’ Damage to the image sensor scintillator
An example in which the surface of the scintillator on
 Resin peeling caused by moisture absorption
a chip is damaged due to physical contact with a jig or
other tool, causing adverse effects on the captured image
(2) Examples of problems caused by the environment
An example in which the resin peels off the chip surface
due to moisture absorption by the package resin during
soldering, causing degradation in sensitivity due to the
increased reflectance from the photosensitive area surface
caused by the peeling

Scintillator damage Captured image

“ Broken cable of a sensor with a cable
An example in which the cable breaks due to long-term
use and repeated bending
 Sensitivity degradation caused by blemishes on the
package surface
An example in which the sensitivity degrades due to the
reduced light transmittance caused by soot adhering to
the package surface of a photosensor used to monitor
the flames in a boiler
X-ray photo of the circled area

[Table 1-3] Handling precaution examples

Type Handling precautions Product examples

Electrical and optical characteristics may deteriorate if dust, contamination, or scratches are on
the product. When handling the product, remember to work in a clean place, not apply strong
Metal, ceramic
friction to the window material, and use tweezers and/or gloves. Standard Si photodiode
plastic package
Product deterioration is especially faster at high temperature and humidity than at normal Photo IC
product
temperature and humidity. Avoid storage or usage in an unnecessary high temperature and
humidity environment.
Storage conditions
Unopened product: temperature: 15 °C to 35 °C, humidity: 45% to 75%, up to 3 months
Opened product: temperature: 15 °C to 35 °C, humidity: 5% or less, up to 20 days
Bare chip Open the bag and mount the product in a clean room (class 10000 or better). Chip product
Be careful not to physically damage or contaminate the chip, and exercise extreme caution
when handling.
Evaluate and verify the effects of your mounting method and packaging material on the reliability.
Storage conditions
Unopened product: temperature: 15 °C to 35 °C, humidity: 45% to 75%, up to 3 months
Opened product: temperature: 15 °C to 35 °C, storage in a low-humidity desiccator (no
condensation), up to 3 months
Unsealed Open the bag and mount the product in a clean room (class 10000 or better).
Windowless product
product Be careful not to physically damage or contaminate the chip, and exercise extreme caution
when handling.
Do not make contact with wiring. As a general rule, use an air blower to remove contamination.
Pay attention to contamination and condensation when sealing or bonding a scintillator.
When soldering, pay attention to the solder iron tip temperature, soldering time, and splashing flux.
Pay attention to prevent wiring errors to thermoelectric coolers or thermistors as errors can
TE-cooled damage the devices. Do not use the devices at current or power exceeding their ratings. Product with built-in
type Use heatsink with sufficient heat dissipation capacity for cooling. Keep the thermal resistance thermoelectric cooler
between the element and heatsink as small as possible (use heat dissipation sheets or silicon grease).
Apply measures to workplace and facilities according to the extent of deterioration that may
Electrostatic occur. Such measures include using a conductive mat and grounding the equipment. Compound semiconductor
sensitive type When handling the product, apply measures according to the extent of deterioration that may occur. Image sensor
Such measures include using an ionizer to remove static electricity and wearing a grounded wrist strap.
For UV light Avoid unnecessary exposure to UV light or X-rays as long-term exposure to them cause Radiation detector
and X-ray deterioration (e.g., increased dark current and sensitivity deterioration) in the product X-ray image sensor
measurement characteristics. Flat panel sensor

10
‘ Sensitivity degradation caused by high-energy UV light
An example in which the sensitivity of the light incident 2. Environmental activities
area degrades as a result of KrF excimer laser striking and
damaging the Shottky film
Environmental idea

Recognizing that living in harmony with the global

environment is a critical issue for mankind, the Solid State
Division of Hamamatsu Photonics conducts business with
consideration to environmental conservation, and works
to create new scientific fields and new industries and to
[Figure 1-12] Sensitivity uniformity (Schottky type photodiode) show the road to true human health through research into
160 photonics technology and extending its application.
Before UV light irradiation
140
Environmental policy
120
Output current (nA)

100 The Solid State Division is conducting environmental

80 After UV light irradiation
activities in compliance with the following environmental
policy.
60
 Establish an environmental management system to
40
promote conservation of the earth’s environment by
20 setting up and maintaining an internal organization for
0 environmental protection.
0 2 4 6 8 10 12
 Assess the impact on the environment by our activities,
Position (mm) products and services, set environmental objectives and
goals, review our environmental preservation activities
KrF excimer laser (λ=248 nm) irradiation area through environmental audits, and constantly improve
KGPDB0081EA
our environmental management.
‘ Comply with environmental regulations and other
requirements we have accepted and impose our own
voluntary standards as necessary, to reduce the burden
on the environment.
’ Take preventative measures for curbing environmental
pollution, save energy and resources, reduce waste, and
ensure correct usage of chemical substances.
“ Strive to raise the understanding of the environmental
policy and the awareness of environmental issues among
all our employees through education and an in-house
publication about the environment.

Standardizing environmental management

The Solid State Division is implementing the ISO 14001

Environmental Management System and making continuous
improvements to provide proper environmental management
and reduce environmental risks.

Environmental auditing

To maintain and improve our environment management

system, we carry out external audits conducted by certification
bodies and internal audits conducted by the Solid State
Division on a regular basis.

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 [Figure 2-2] Infrared detectors used in greenhouse
Activities to reduce environmental risks gases observing satellite “Ibuki”
(a) InGaAs PIN photodiode (b) InGaAs linear image sensor
The Solid State Division constantly makes improvements
that takes into account the burden on the living environment
including the atmosphere, water quality, and noise and
strives to prevent environmental pollution.

Emergency response training

The Solid State Division furnishes manuals for handling
accidents and disasters and regularly performs emergency
training according to each department’s business operation.
Environmental impact of business activities
We assess the impact on the environment by our business
activities and engages to reduce greenhouse gas, drainage,
waste, and other burden placed on the environment.
Addressing environmental issues through products
We work to make our products more compact, power
efficient, long lasting, energy efficient, and so on according
to their applications so that the burden placed on the
environment is reduced.
(2) Environmentally conscious products
As part of our global environmental conservation efforts
and reduction of burden on the environment, we apply
environmental measures on the products, develop new
products and new technologies, and promote the sales of
environmentally conscious products.
Example: CCD area image sensor S12071
With CCD area image sensor S12071, dark current noise
has been suppressed to 1/20 of that in previous products.
This has allowed the cooling temperature of the built-in
thermoelectric cooler to be increased, which has reduced
the power consumption to 1/7 of that in previous products.
Moreover, the incorporation of new packaging technology
has significantly increased the air tightness and moisture
proof reliability and prolonged the service life of the product.

(1) Products contributing to the environment [Figure 2-3] CCD area image sensor S12071
Hamamatsu manufactures products that contribute to
environmental measurement of atmosphere, water quality,
and the like, content analysis of environmental management
substances, and energy reduction of ordinary electric
equipment.

Example: Infrared detectors

Infrared detectors are used to measure the absorption
peak specific to a gas in order to measure its type and
concentration. Our products are used in the greenhouse
gases observing satellite “Ibuki” (GOSAT). [Figure 2-4] Power consumption of built-in thermoelectric cooler

[Figure 2-1] Greenhouse gases observing satellite “Ibuki”

8.2
Power consumption (W)

1/7

1.2

Previous product Improved product S12071

(Courtesy of JAXA) (Td=-10 °C) (Td=0 °C)

KMPDB0396EA

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 Conforming to regulations regarding the chemicals
contained in our products
Hamamatsu Photonics has established an “Environmental
Control Substance Management Standard” to control the
chemical substances contained in products. We are actively
engaged in complying with the EU RoHS directives and
regulations on chemical substances contained in products.
(1) Chemical substances regulated by RoHS
For each product, we control the amount of substances that
are specified in IEC62474 including the six substances (lead,
mercury, cadmium, hexavalent chromium, polybrominated
biphenyl, and polybrominated diphenyl ether) regulated by
RoHS directives.
Judgment on whether a product will comply with RoHS
directives is clearly specified in the quotation sheet when
drawing up an estimate.
(2) Waste reduction, separation, and recycling
From the standpoint of reducing the burden on the
environment and using resources effectively, the Solid
State Division is promoting 3Rs (reduce, reuse, and recycle)
and proper treatment as its fundamental policies and is
engaged in activities under the slogan “Zero Emission.” In
addition, to enforce separation of waste produced, a waste
separation database has been established and is running
on our company’s intranet.
(3) Energy saving and reduction of carbon-dioxide emissions
We at the Solid State Division are expanding our energy
saving activities in an aim to reduce the energy used by
business operations by at least 1% per unit of sales compared
to the previous year. In order to prevent global warming, we
are also actively working to reduce the greenhouse gases,
such as non-energy source carbon-dioxide, that are used in
the manufacturing process .

(2) Management of high-risk materials

When there is possibility that a material may contain an
environmental management substance, we determine
that material as a high-risk material and inspect it using
an X-ray fluorescence analyzer during the acceptance test.

Green purchasing

To comply with environmental regulations on products

and minimize the burden on the environment, we at the
Solid State Division have established green procurement
policies and chemical substance management standards,
and are promoting procurement activities that give priority
to materials with a smaller load on the environment.

Working toward global environmental conservation

At the Solid State Division we conduct environmental

activities for global environmental conservation.

(1) Management of chemical substance usage quantity

If chemical substances are not properly managed,
environmental pollution can result and may cause adverse
effects on human health and ecosystem. At the Solid State
Division we accurately monitor and strictly control the
emission levels of chemical substance into the atmosphere
and water and the amount of movement of waste and so
forth.

Examples
· Management of usage quantity of chemical substances
subject to the PRTR Law
· Collection of SDS information and disclosure within our
company
· Activities to reduce VOC emissions

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