ENGINEERING PERFORMANCE SPECIFICATION

ELECTROPLATING, BRIGHT OR LOW GLOSS DECORATIVE FINISH WSS-M1P83-D2

OVER ABS _ EXTERIOR, LOW TEMPERATURE
APPLICATIONS

ELECTROPLATING, BRIGHT OR LOW GLOSS DECORATIVE FINISH wss-MlP83-D3

OVER PC/ABS - EXTERIOR, HIGH TEMPERATURE
APPLICATIONS

1. SCOPE

These specifications define the performance requirements for finished coatings of mechanically or
chemically deposited electrical conductor coat and electrodeposited copper, nickel, and chromium for
the decoration and protection of acrylonitrile butadiene styrene (ABS) or polycarbonate/acrylonitriie
butadiene styrene (PC/ABS).

2. APPLICATION

These speclfications were released originally where a bright or low gloss decorative and/or protective
finish is required for interior or exterior parts. Unless otherwise specified ontlre engineering drawing, all
parts shall be finished with a final coating of chromium. Two performance levelb are defined as follorlrrs:

WSS-M1P83-D2 Exterior applications - Low impact applications such as badges or in an

operating environment less than or equal to 82 "C
WSS-M1P83-D3 Exterior applications - High impact applications such as grilles or in an
operating environment greater than 82 'C

For coating (paint or ink) over chrome applications, part must meet requirements in the latest version of
wss-M2P191.

2.1 LIMITATIONS

Materials used in all systems shall withstand a paint repair surface temperature of 1 15 oC for 20
minutes without deformation, functional damage or loss of appearance or other physical
characteristics. lf the part cannot meet this requirement, it must be capable of being protected
(e.9. shielding) during repair processing of the vehicle.

3. REQUIREMENTS

All requirements identified for each specification must be met to achieve acceptable field durability No
one requirement, exclusive of others, is capable of insuring satisfactory performance. Any deviations to
the requirements of these specifications may be subject to additional performance requirements.

All part testing requirements apply to those areas of the part identified as a significant surface (per
paragraph 4.3) unless otherurise specified on the engineering drawing. Testing to be done a minimum
of 72 hours after plating.

Date Action Revisions Rev.2

Replaces WSS-M1P83-C2; Split lnt & Ext., Split Ext. into 2 parts, Sec. 3.9,
2008 10 29 Activated
Table 1 C. McComb, FNA
2006 11 10 Activated C. McComb/J, Crist
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 ENGINEERING PERFORMANCE SPECIFICATION

WSS.M1P83-D2/D3

3.1 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS

Material suppliers and part producers must conform to the Company's Standard Requirements
For Production Materials (WSS-M99P11 1 1-A).

3,2 FINISHED PARTS

Testing must be done on actual production parts or a section of the part whenever possibie.
Where part dimensions limit equipment access, representative panels or plaques may be
substltuted for production parts with approval from responsible Design Engineei.

Testing to be conducted at Design Verification (DV) or Process Validation {PV) per Table 1,
Section 4.6, unless otheruJse agreed to by responsible Design Engineer.

3.3 APPEARANCE

The plated parts shall be free from surface imperfections. Parts shall match the approved
Styling master sample for appearance from Color & Trim and the Approved Boundary Sampie.

3,4 PLATING ADHESION

{For acceptance criteria, reference Section 4.6)

3.4.1 Residual Stress Test, D2 only Report should include

Glacial
(Test Method: Dip entire unplated parl in photos of tested part
Acetic Acid, 95% purity, for 30seconds) and control part.

Any color change from the control indicaies concentration of residual or molded-in-
stresses. The intent of this test is to illustrate to the engineering team where these
stresses are located within the molded part. Adhesion tests should be performed in
areas of high molded-in-stress and documented on a part map indicating locations.
(Reference Section 4.2).

3.4.2 Grind-Saw (The saw blade shall have '16 to 18 teeth/inch.)

{ASIM B s71)
No peeling, flaking, or lifting of the electroplate from the substrate.

3.4.3 Bend Test

(ASTM B 571)

No peeling, flaking, oi' lifting of the electroplate from the substrate.

3 4.4 Scribe-Grid Test <5% plating removal

(ASTM B 571)
Use the following modifications to the method:

Lightly hand sand plated surface {10 doubie rubs, moderate pressure)with P600
paper until dull. Clean area with lsopropyl Alcohol.

With a hardened steel, 30" tip blade, scribe eight lines in a rectangular grid in 0.5 cm
increments. Use 3M No. 898 pi'essure sensitive tape.

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 ENGINEERING PERFORMANGE SPECIFICATION

WSS-M1P83-D2/D3

3.4 5 Thermal Shock

(FLTM Br 107-05)

No peeling, flaking, or lifting of the electroplate from the substrate.

3.4.6 Chip Resistance

3.4.6.1 Grit Blast, Split Shot, min Rating 6

(FLTM Br 157-06)

3.4.6.2 Stone Chip, 1.4 L, min Rating 58

(SAE J400, -2A'C +l-2 &23 +l-2"C)

3.5 PLATING THICKNESS

(ASTM B 487, ASTM B 504, ASTM 8568)

It is the supplier's responsibility to identlfy the plating thickness distribution for each unique part
design and rack design by mapping the plating racks and plated parts. Areas of low and high
current density are to be documented on a part map indicating locations that plating
measurements will be taken.

Plating thickness to be determined by Microscopic Examination (ASTM B 487), Coulometric

Method (ASTM B 504), orX-Ray Spectrometry {ASTM B 568).

Exceptions to the minimum plating thickness are to be shown as a detail on the part drawing by*
indicating in an appropriate view the area(s) with deviated thickness(es) allowed. These
exceptions must meet all other requirements of the specification and the areas of deviated
thickness must be approved by the responsible Design Engineer.

The plating thickness requirements identified below represent minimum values in micrometers
and apply to all areas of significant surfaces (as per paragraph 4.3).

.,Q
Copper
Semi-bright Nickel (a) 15
Bright Nickel (b) plus b
Special nickel (c) or
Lowgloss Nickel (d)
Total Nickel (e)
Microporous Chromium (f) 0.18
Regular Chromium

(a) - (f): Refer to section 4.5 in General lnformation.

MICROPOROSITY 10,000 poresicm2

(FLTM BQ 103-05',)

3.7 SIMULTANEOUS THICKNESS AND ELECTROCHEMTCAL POTENT|AL TEST (S.T.E.p.)

3.7.1 The semi-bright nickel layer must be more noble {cathodic) than the bright nickel layer
by a minimum of 100 mv.

3.7.2 The potential of the microporous nickel shall be between 10 and 40 mv noble
(cathodic) to the bright nickel layer.

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 ENGIN EERING PERFORMANCE SPECIFICATION

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3.8 THERMAL CYCLE - CORROSION TEST

There shall be no evidence of plating failure on significant surfaces (per paragraph 4.3) or
failure of the plastic due to corrosion after completing four cycles consisting of the following:

3.8.1 Requirements for Testing, D2

82+l-2"Cfor2h
23 +1- 2 "C for '1 h and 50 +!- 50 relative humidity

-30 +/- 2 "C lar 2 h

23 +l- 2 "C for t h and 50 +l- 5o/o relative humidity

16 h CASS Test fA€tr&f.-F3ry

3.8.2 Requirements for Testing, D3

9A +l-2 "C for 2 h

23 +l- 2 "C for t h and 50 +l- 5o/o relative humidig

-30 +/- 2"Cfor2h

23 +l- 2 "C for t h and 50 +l- 5o/o relative humidity

16 h CASS Test (ASTM B 368)

Note: Parts shall be rinsed with demineralized water only, after each CASS
test cycle. Scrubbing, abrasive cleaning, or polishing is not permitted.
Parts are then examined for corrosion defects per paragraph 3.8.4.

The cycled part shall show no evidence of warpage, deformation, cracks,

delamination or other failures to an extent that would affect its use in the ultimate
assembly.

3.8.4 Plating and Corrosion Defects

3.8.4.1 Cracks and Crazing

Cracks and crazing of the plate are caused by expansion and/or

eontraction due to temperature change. Cracks or crazing exceeding 6
mm in length observed on significant surfaces (per paragraph 4.3) shall
be considered failure of the part.

3.8.4.2 Blistering and Corrosion

Blisters defined as "pop,ups" can be caused by improper molding or

plating, or result from corrosion.

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 ENGINEERING PERFORMANCE SPECIFICATION

wss-M1P83-D2ID3

Failure is noted when:

Any site (hole) larger than 1.5 mm on any significant surface (per paragraph 4.3) (not
including rundown stain)shall be considered failure of the part.

More than 1o/o of part surface area with blisters and/or corrosion on significant
surfaces (per paragraph 4.3)shall be considered failure of the pad.

More than 8% of part surface area yrith blisters and/or corrosion in a grid section
containing 100,6.0 x 6.0 mm spaces placed anywhere on the significant surfaces
(per paragraph 4.3) shall be considered failure of the part.

3.9 THERMAL CYCLE

There shall be no evidence of plating failure on significant surfaces (per paragraph 4.3) or
failure of the plastic due to warpage after completing four cycles consisting of the following:

3.9.1 Requirements for testing, D2

-44 +l- 2 "C for ''l h

82 +l- 2'C for '1 h

3.9.2 Requirements for testing, D3

-4O +l- 2 "C for t h

90 +l-2 "C for t h

Part must be transferred between temperatures within one minute.

All parts shall be complete including all components packaged in the assembly and
fastened onto aetual or representative production support foundations that include noi
only all attaching points but also any boundary conditions that may restrict movement,
unless otherwise specified by the responsible Design and Release Engineer.

The cycled part shall not show changes in appearance, such as warpage,
cracks, or delamination per the print Engineering Tolerance
fli,"lTgiliT
4, GENERAL INFORMATION
The information given below is provided for clarification and assistance in meeting the requirements of
these specifications.

4,1 MATERIAL REFERENCE

The following stress free plateable grade substrates are recommended:

ABS W8rc$FffiiMMR'
PCIABS WSB-M4D8,13-A

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 ENGINEERING PERFORMANCE SPECIFICATION

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4.2 MOLDED PARTS

Plastic pafts intended for plating by this specification must be molded in keeping within the best
commercial practice to achieve stress-free parts and ensure good plating. Molded-in stresses
can resuit in part failure by loss of plating adhesion, blistering, and/or cracking of the plastic
and/or plating when subjected to service temperature extremes.

4.3 SIGNIFICANT SURFACES

Unless othenarise specified on the engineering drawing, significant surfaces are defined as
those surfaces of the finished part that:

- Are directly visible andlor visible by reflection when the finished part is assembled in car
position.

- Can be the source of corrosion products directly visible or visible by reflection.

4.4 DUCTILITY
(ASTM B 490)

Although this is considered a portion of the process control and not a requirement of part
performance, the ductility percentage of Semi-bright Nickel and Bright Nickel on foils plated in
the individual nickel baths should be rated, repofied, and included in the Control Plan.

4.5 PLATING THICKNESS REFERENCE

(a) The sulphur content in the semi-bright nickel bath shall be less than 0.005% (weight
%). The sulphur content is specifred to indicate the type of nickel plating solution that
is to be used and may be measured per the test procedures identified in ASTM B 456.
In-process testing to determine conformance to the sulphur content requirement is
essential to establish and maintain process capability and control.

(b) The sulphur content in the bright nickel bath shall be greater than 0.04% (weight %).
The sulphur content is specified to indicate the type of nickel plating solution that is to
be used and may be measured per the test procedures identified in ASTM B 456 ln-
process testing to determine conformance to the sulphur content requirement is
essential to establish and maintain process capability and control.

(c) lf a special nickel is employed to produce discontinuities in the chromium deposit, the
ihickness of the special nickel shall be added to the measurement of the bright nickel
deposit to meet the combined bright nickel plus special nickel minimum thickness
requirement. lf a special nickel layer is not used, the minimum thickness requirement
applies only to the bright nickel deposit.

(d) Low gloss nickel may be produced by one of the following methods.

- Co-deposit containing inoi'ganic particles insoiuble in the plating bath

- Soluble addition agents co-deposited with the nickel.

- Mechanicaltreatment of a bright nickeldeposit, e.9., brushing or bead blasting.

- When low gloss nickel is specified, special nickel need not be applied.

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 ENGIN EERING PERFORMANGE SPECIFICATION

WSS.M1P83-D2ID3

ie) The semi-bright nickel thickness shall be greater than or equal to 60% of the total
*ickel thickness. The bright nickel thickness shall be less than or equal to 40% of the
total nickel thickness.

(f) Microporous chromium plating systems acceptable under this specification are
defined as those being capable of producing microporosity in conformance with para 3.5.

4.6 PLATINGADHESIONACCEPTANCECRITERIAREFERENCE

Separation between layers of plating on adhesion tests do not indicate a failure of the test, but
indicates a failure within the plating system.

4.7 TABLE 1: DVIPV REQUIREMENTS

DV and PV must be conducted on parts unless approved by Design Engineer.

X= Required

Sample To be done at To be done at

Size
3.4.1 Residual Stress
3.4.2 Grind-Saw*
3.4.3 Bend Test*
3.4.4 Scribe-Grid Test*
3.4.5 ThermalShock*
3.4.6.1 Grit Blast.Solit Shot
3.4.6.2 Stone Chip
3. 5 Plating Thickness**
3.6 Microoorositv**
3.7 S.T E.P.**
3.8.1 CASS Thermal Cycle
for D2
3.8.2 CASS Thermal Cycle
for D3
3.9.1 Thermal Cycle tor D2
3.9.2 Thermal Cycle for D3
DV testinq PV testinq
2 X
X
2 X
X X
X X
X X
J X X
2 X
1 X X
1 X Y
X
X X
X
6 X X

* Samples must be tested

on parts in high stress as identified from Residual Stress test
3.4"1 lor D2 and Engineering Judgement for D3. See Design Engineer for number and
location of test sites per part.
** See Design Engineer for
number and location of test sites per part.

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