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2N3553 NPN RF
2N3553 NPN RF
2N3553 NPN RF
DATA SHEET
2N3553
Silicon planar epitaxial
overlay transistor
Product specification 1995 Oct 27
Supersedes data of October 1981
File under Discrete Semiconductors, SC08a
Philips Semiconductors Product specification
APPLICATIONS DESCRIPTION
• The 2N3553 is intended for use in VHF and UHF The device is a silicon NPN overlay transistor in a TO-39
transmitting applications. metal package with the collector connected to the case.
PINNING - TO-39/3
PIN DESCRIPTION
1 emitter
2 base 1
handbook, halfpage 2
3 collector
MBB199
3
RF performance
f VCE Po Gp η
(MHz) (V) (W) (dB) (%)
175 28 2.5 >10 >50
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1995 Oct 27 2
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter − 65 V
VCEX collector-emitter voltage IC ≤ 200 mA; VBE = −1.5 V − 65 V
VCEO collector-emitter voltage open base; IC ≤ 200 mA − 40 V
VEBO emitter-base voltage open collector − 4 V
IC collector current (DC) − 0.35 A
ICM peak collector current − 1 A
Ptot total power dissipation up to Tmb = 25 °C − 7 W
Tstg storage temperature −65 +200 °C
Tj junction temperature − 200 °C
THERMAL CHARACTERISTICS
MGC928 MGC927
10 10
handbook, halfpage handbook, halfpage
IC Ptot
(A) (W)
1
(2)
10-2 0
1 10 VCE (V) 102 0 100
Tmb (oC)
200
1995 Oct 27 3
Philips Semiconductors Product specification
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
Note
1. Pulsed through an inductor of 25 mH; δ = 0.5; f = 50 Hz.
MGC935 MGC930
60 20
handbook, halfpage handbook, halfpage
Cc
(pF)
hFE
15
40
10
20
5
0 0
0 100 200 300 400 500 0 20 40 60
IC (mA) VCB (V)
1995 Oct 27 4
Philips Semiconductors Product specification
APPLICATION INFORMATION
RF performance at Tmb = 25 °C.
f VCE Po Gp η
(MHz) (V) (W) (dB) (%)
175 28 2.5 >10 >50
Ruggedness
The transistor is capable of withstanding a load mismatch corresponding to VSWR = 3 : 1 varied through all phases,
under the conditions: VCE = 28 V; f = 175 MHz; Tmb = 25 °C; Po = 2.5 W.
C5
L3
DUT output
C1 L1
input L4 50 Ω
C3
50 Ω (1) C4
C2 L2
MGC926
1995 Oct 27 5
Philips Semiconductors Product specification
MGC937
600 MGC929
handbook, halfpage 10
handbook, halfpage(1)
fT Po (2)
(MHz) (W)
(3)
(1) (4)
(2)
(3)
400 5 (5)
200 0
0 100 200 300 400 0 100 200 300 400
IC (mA) f(MHz)
1995 Oct 27 6
Philips Semiconductors Product specification
PACKAGE OUTLINE
3
5.08 6.6
max 12.7 min
9.4 max MSA241
Dimensions in mm.
Fig.9 TO-39.
1995 Oct 27 7
Philips Semiconductors Product specification
DEFINITIONS
1995 Oct 27 8