Dhandapani et al.

, International Journal of Advanced Engineering Technology E-ISSN 0976-3945

Research Paper
DESIGN, COUPLED FIELD SIMULATION AND
IMPLEMENTATION OF MICRO- ELECTRO MECHANICAL
GRIPPER BY FINITE ELEMENT METHOD APPROACH
V S Thangarasu¹, N V Dhandapani²*,G Sureshkannan3

Address for Correspondence

¹Professor, Department of Mechanical Engineering, Nehru Institute of Engineering and Technology,
Coimbatore – 641105
2*
Professor, Department of Mechanical Engineering, Karpagam College of Engineering,
Coimbatore – 641032.
3
Associate Professor, Department of Mechanical Engineering, Coimbatore Institute of Technology,
Coimbatore – 641014. , INDIA.
ABSTRACT
Micro-Electro Mechanical Systems (MEMS) is one of the most advanced technology developments of the recent trend. It is
the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through micro
fabrication technology. To develop a MEMS Micro gripper that is cheap and easy to fab Design, Coupled Field Simulation
and Implementation of Micro- Electro Mechanical Gripper by Finite Element Method Approach. It is equipped with a wide
gripping range and force sensing capability. The main objective of the MEMS gripper analysis is to determine the deflection
and displacement to the tip of the mechanical structure, thermal expansion of a structure due to the given electric field. In
addition to determine total current, heat flow and temperature distribution of the MEMS gripper.
Key works: MEMS, Thermal expansion, structural deformation, ANSYS.
1. INTRODUCTION deflections and deformations. The maximum
Micro electromechanical systems (MEMS) is a deformation occurs at the tip of the arm structure
technology of miniaturization that has been largely (micron level deflection).
adopted from the integrated circuit (IC) industry 2. Literature Review
and applied to the miniaturization of all systems not C. Clévy, A. Hubert and N. Chaillet, [1], discussed
only electrical systems but also mechanical, optical, about the flexible micro-assembly system equipped
fluid, magnetic, etc. with an automated tool changer. A. Menciassi, A.
Micro Electromechanical systems or MEMS Eisinberg, G. Scalari, C. Anticoli, M.C. Carrozza and
represent an extraordinary technology that promises P. Dario, [2], explained about the force feedback-
to transform whole industries and drive the next based micro instrument for measuring tissue
technological revolution. These devices can replace properties and pulse in microsurgery. Y. Sun, K.T.
bulky actuators and sensors with micron-scale Wan, K.P. Roberts, J.C. Bischof and B.J. Nelson
equivalent that can be produced in large quantities by X.Y. Liu, K.Y. Kim, Y. Zhang, and Y. [3,4],
fabrication processes used in integrated circuits discussed in details regarding Mechanical property
photolithography. This reduces cost, bulk weight and characterization of mouse zona pellucida. K. Kim, X.
power consumption while increasing performance, Liu, Y. Zhang, and Y. Sun [5], explained about the
production volume, and functionality by orders of Micronewton force-controlled manipulation of
magnitude. For example, one well known MEMS biomaterials using a monolithic MEMS microgripper
device is the accelerometer (it’s now being with two-axis force feedback. A. Eisinberg, A.
manufactured using MEMS low cost, small size, Menciassi, S. Micera, D. Campolo, M. C. Carrozza,
more reliability). Furthermore, it is clear that current and P. Dario, R. Legtenberg, A. Groeneveld, and M.
MEMS products are simply precursors to greater and Elwenspoek [6, 7] discussed about the force control
more pervasive applications to come, including of a microgripper for assembling biomedical micro
genetic and disease testing, guidance and navigation devices. N. Agarwal and N. R. Aluru, [8, 9], study
systems, power generation, RF devices( especially about the Design and calibration of a MEMS sensor
for cell phone technology), weapon systems, for measuring force and torque acting on a magnetic
biological and chemical agent detection, and data microrobot. A. Neild, S. Oberti, F.Beyeler, J. Dual
storage. Micro mirror based optical switches have and B. J. Nelson [10, 11], study about the
already proven their value; several start-up investigating the reliability of electrostatic comb-
companies specializing in their development have drive actuators used in microfluidic and space
already been sold to large network companies for systems using finite element analysis. Y. Sun, and
hundreds of millions of dollars. The promise of B.J. Nelson [12], discussed about the MEMS
MEMS is increasingly capturing the attention of new capacitive force sensors for cellular and flight
and old industries alike, as more and more of their biomechanics. S. D. Eppinger and W. P. Seering[13],
challenges are solved with MEMS. dynamic models of robot force control. M.
In this coupled-field multi physics analysis that Rakotondrabe, Y. Haddab and P. Lutz, Tanu Pahwa,
includes for the integration of (coupling) electric, Shefali Gupta, Vineet Bansal, B. Prasad, Dinesh
thermal and structural fields. This actuator works on Kumar [14,15], study about an Analysis and Design
the basics of a thermal expansion between the arm optimization of laterally driven poly silicon Electro
and mechanical structure. An electric potential thermal Micro Gripper for Micro objects
difference applied across the plate, the current passes Manipulation. Ho Yin Chan, Wen J Li [16],
through the arm and mechanical structure then the discussed about the details of Thermally Actuated
arm and structure will heated up. The temperature Polymer Micro Robotic Gripper for Manipulation of
range up to1200 K is generated. These temperatures Biological cells. Xiao - Gang Lu [17], explained in
produce the thermal stress-strain, thermally induced details of theoretical modeling of Thermal Expansion
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 Dhandapani et al., International Journal of Advanced Engineering Technology
of Actuated SOI MEMS Micro Grippers Using
Comsol Multiphysics.
3. FINITE ELEMENT ANALYSIS
FEA is a powerful tool for numerical solution of
wide range of engineering solutions and applications.
Finite element analysis was first developed for use in
the aerospace and nuclear industries where the safety
of structures is critical. Today, the growth in usage of
the method is directly attributable to the rapid
advances in computer technology in recent years. As
a result, commercial finite element packages exist
that are capable of solving the most sophisticated
problems, not just in structural analysis, but for a
wide range of phenomena such as steady state and
dynamic temperature distributions, fluid flow and
manufacturing.
4. COUPLED FIELD ANALYSIS
A coupled field analysis is a combination of analyses
from different engineering disciplines that interact to
solve a global engineering problem. Hence, we often
refer to a coupled -field analysis as a multi physics
analysis. In coupled field or multi physics problems
the input of one field analysis depends on the results
from another analysis that is coupled with it.
Some analyses can have one-way coupled. For
example, in a thermal stress problem, the temperature
field introduces thermal strains in the structural field,
but the structural strains generally do not affect the
temperature distribution. Thus, there is no need to
iterate between the two field solutions. More
complicated cases involve two-way coupled. For
example, handles the interaction between the
structural and electric fields: it solves for the voltage
distribution due to applied displacements, or vice
versa. In a fluid-structure interaction problem, the
fluid pressure causes the structure to deform, which
in turn causes the fluid solution to change. This
problem requires iterations between the two physics
fields for convergence.
5. PRINCIPLE OF MEMS GRIPPER
Fig 1: MEMS Gripper
In operation, electricity current will be applied to the
thermal expansion element causing the thermal
elements to heat up and expands, causing an angular
rotation of the gripper arm and then the gripper tips
will open. Normally, the gripper is in its close
position. Applying voltage to the thermal expansion
element will open the gripper and switching off the
voltage will close it again and thus an object can be
gripped. The force sensing piezo-resistive film
located at the bottom of the gripper arm will signal
Int J Adv Engg Tech/Vol. VII/Issue I/Jan.-March.,2016/34-37
E-ISSN 0976-3945
the operator on the gripping force of the micro
gripper on the gripped object, and subsequent
gripping force can be varied to suit the purpose, by
varying the voltage supplied to the heating element.
6. METHODOLOGY
6.1 Creation of 3D model
3D model of MEMS Gripper is modeled using Pro-E
software. The Gripper Assembly is spitted in to
4parts.
They are as follows,
 Arm of the gripper
 Displacement transfer element
 Thermal expansion element
 Base element
Individual parts are modeled separately in part
modeling. All parts are assembled in an assembly
module. While assemble we need to check the
interference also.
6.2 Meshing
Meshing is done in two stages like 2D & 3D mesh
2D mesh. The base for 3D mesh. Here we have to
select suitable element size and element type. Make
sure there is no disconnectivity, because these are the
factors mainly affecting the convergence of the
result.
6.3 Coupled field analysis
The meshed model is imported to ANSYS. Here
boundary conditions, loading conditions are applied.
Various fields are coupled (Electrical to thermal,
thermal to mechanical) together. Various
distributions like Electrical potential, Temperature
distribution and Structural displacement etc are hence
found out in ANSYS.
To couple the fields like electrical to thermal, thermal
to mechanical to contemplate true condition using
ANSYS and to determine the structural
displacements at end effecter of the MEMS Gripper.
6.4 Deflection
It is the term used to describe the degree to which a
structural element is displaced under a load. The
deflection of a member under a load is directly
related to the slope of the deflected shape of the
member under that load and can be calculated by
integrating the function that mathematically describes
the slope of the member under that load.
7. MODELING OF MEMS GRIPPER Select the
new option to create a new component and give the
name of the part. Create suitable sketch in a sketch
mode and convert that in to 3D model by using part
features and save the created 3D model in a working
directory and close it.
Fig 2: Assembly of MEMS gripper
 Dhandapani et al., International Journal of Advanced Engineering Technology E-ISSN 0976-3945

7.1 Assembly of MEMS Gripper: 6.5 RESULTS from ANSYS

The assembly mode is started with existing
component icon is clicked and then product icon in
the specification tree is clicked to select the file to be
opened to assemble. The components are imported
and assembled by assembly constraints based on
reference drawing. The final MEMS Gripper
assembly is now as shown in the following figures.
7.2 Meshing
The final finished assembly of MEMS Gripper is
imported from Pro-E to hyper mesh. In hyper mesh,
Model cleanup is nothing but the checking the
interference between the parts. If there is interference
we need to correct it. Meshing is done in two stages.
i.e. 2D mesh and 3D mesh. 2D mesh is the base for
3D mesh. Here we have to select suitable element
Fig 5: Electrical Potential Distribution
size and element type. Because these are the factors
mainly affecting the convergence of the result.

Fig 6: Temperature Distribution

Fig 3: Assembly of MEMS gripper
7.3 Input parameter for analysis
Young's modulus 169 Gpa
Poisson ratio 0.22
Co – efficient of thermal expansion 2.9e-6 / °K
Resistivity 2.3e-5 ohm-m
Thermal conductivity 1540 w/m° K
Voltage 0.25 Amps
Element used Solid 98
A coupled field analysis has to be done by using
ANSYS by the approach of finite element analysis. It
is a combination of electric potential, thermal
expansion and structural deformation. In coupled
field or multi physics problems the input of one field
analysis depends on the results from another analysis
that is coupled with it.
7.4 Boundary conditions Fig 7: Total deflection
With respect to the input parameters of the gripper,
apply the boundary conditions of the gripper like
electric potential at the filament on the top of the
MEMS gripper. The light green and orange color
shows the positive and negative supply. The bottom
of the gripper is to be fixed.

Fig 8: Deformed and Un-Deformed Shape of

MEMS gripper
The X and Y plot graph shows the absolute
Fig 4: BCS of the gripper convergence vs. cumulative iteration number.
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 Dhandapani et al., International Journal of Advanced Engineering Technology E-ISSN 0976-3945

8. CONCLUSION: of Micromechanics Microengineering, Vol. 16, pp.

1562-1570, 2006.
MEMS Gripper is a device which is a small movable
11. W. A. Moussa, H. Ahmed, W. Badawy, and M.
mechanical structure, It is useful in a vide range of Moussa, “Investigating the reliability of electrostatic
applications. Pick and place the micron level comb-drive actuators used in microfluidic and space
components. It is a coupled-field multi physics systems using finite element analysis”, in Can. J. Elect.
Comput. eng, Vol. 27, No. 4, pp. 195–200, 2002.
analysis that includes for the integration of (coupling)
12. Y. Sun, and B.J. Nelson, “MEMS capacitive force
electric, thermal and structural fields. This actuator sensors for cellular and flight biomechanics”, in
works on the basics of a thermal expansion between Biomedical Materials, Vol. 2, No. 1, pp. 16-22, 2007
the arm and mechanical structure. The modeling, 13. S. D. Eppinger and W. P. Seering, “On dynamic models
of robot force control”, in Proceedings of the IEEE
meshing and analysis of Micro-Electro Mechanical
International Conference on Robotics & Automation,
Gripper have been done and the results have been pp. 29-34, 1986.
plotted. 14. M. Rakotondrabe, Y. Haddab and P. Lutz, “Modelling
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