Professional Documents
Culture Documents
Postgraduate Programme
UNIT-I
UNIT-II
Algorithm for the formation of network matrices : Algorithm for formation of Bus
impedance matrix, Addition of a branch and Addition of a link. Simple problems.
UNIT-III
UNIT-IV
Short – circuit studies : Short circuit calculations using Bus impedance matrix, Fault
currents and voltages, short circuit calculations for balanced 3-phase network using Bus
impedance matrix.
UNIT-V
Load flow studies : Load flow problem, Classification of buses, Gauss-Seidal method,
Newton Raphson method, Decoupled and fast decoupled load flow methods,
comparison of load flow methods.
Text books :
UNIT-I
UNIT-II
UNIT-III
UNIT-IV
UNIT-V
Text books:
2. I H Nagrath, “ State Space methods and digital control systems” , New Age
International (2004).
EE PSC 103 ELECTRICAL POWER DISTRIBUTION SYSTEMS
UNIT-I
UNIT-II
UNIT-III
Voltage drop, power loss calculation, voltage control – Derivation for voltage drop and
power loss in for 3-phase and non 3 phase primary lines – importance of voltage
control - definitions – methods of voltage control – capacitors – voltage regulators –
distributed generation.
UNIT-IV
UNIT-V
Text Books:
UNIT-I
UNIT-III
UNIT-IV
UNIT-V
Text Books:
UNIT-I
LOAD FORECASTING : Short time and Long time considerations, statistical and
probabilistic approach to load forecasting – Basic Reliability concepts.
UNIT-II
Generating capacity, Transmission stability and assessment of system resource.
UNIT-III
Generation planning, various aspects of system planning and extension.
UNIT-IV
Voltage and load stability, Short circuit level and reactive power considerations.
UNIT-V
Mathematical modeling of interconnected systems for planning studios
Overall assessment of power systems planning and operation.
Text Books:
UNIT-I
UNIT-II
UNIT-III
Energy Auditing – Definitions and concepts – Types of plant energy studies - energy
index – cost index – piecharts – Sankei diagrams – load problems – energy
conservation schemes – energy Audit of industries – energy saving potential.
UNIT-IV
UNIT-V
Text Books:
UNIT-I
UNIT-I
Digital dynamic simulation of converters and DC systems : Valve model, Gate pulse
generation – generation of control voltage – transformer model – converter model –
transient simulation of DC and AC systems..
Text Books:
TEXT BOOKS:
1. Randy Frank , “ Understanding Smart Sensors” Artech House, London (2000)
2. Creed Huddleston, “Intelligent Sensor Design”Elsevier(2007).
EE PSE 107 PROCESS INSTRUMENTATION AND CONTROL
( Common to EE ICE 107 )
UNIT-I
Introduction to process control, Elements of process control loop, Control system
Evaluation, Analog and Digital Processing.
Principles of Analog signal conditioning, OPAMP circuits in instrumentation, Design
guidelines, Principles of Digital signal conditioning, comparators, Digital-to-Analog
converters (DACS), Analog-to-Digital converters (ADCS), Frequency- Based
converters, Data-Acquisition systems (DAS).
UNIT-II
Review of transducers related to pressure, temperature, flow, level measurements. Final
control operation, Electrical actuators, fluid Valves.
UNIT-III
Process characteristics, control system parameters, Discontinuous controller modes,
continuous Controller modes, composite control modes, cascade control, feed forward
control, Ration control, Process loop tuning.
UNIT-IV
Discrete-State process Control, Characteristics of the systems, Relay Controllers and
Ladder diagrams,
Programmable Logic Controllers : Relay Sequences, Programmable Logic Controller
design, PLC Operation, Programming, PLC Software functions.
UNIT-V
Computers in process control : Data logging, supervisory control, computer-based
controller.
Process – control Networks : Functions of the network, General characteristics,
foundation field bus and profibus.
Text Books:
1. Process control instrumentation technology by Courter D.Johnson, PHI, Edition
(2006)
2. Principles of process control by D.Patranabis, TMH Edition (2001).
3. Process Control Principles and applications by Surekha Bhanot, Oxford
University press, 2008.
EE PSE 108 : DESIGN OF SEMICONDUCTOR MEMORIES
(Common to EE ICE 108)
UNIT-I
Random Access Memory Technologies: Static Random Access Memories
(SRAMs):SRAM cell structure- MOS SRAM architecture – MOS SRAM cell and
peripheral circuit operation – bipolar SRAM technologies – silicon on insulator (SOI)
technology – advanced SRAM architectures and technologies, application specific
SRAMs. Dynamic Random Access Memories (DRAMs): DRAM technology
development –CMOS CRAMs – DRAMs cell theory and advanced cell structures-
BiCMOS DRAMs soft error failure in DRAMs – Advanced DRAM designs and
architecture – application specific DRAMs.
UNIT–II
Nonvolatile Memories: Masked Read – only memories (ROMs): High density ROMs
– programmable read-only memories (PROMs)- bipolar PROMs – CMOS PROMs –
erasable (UV)- Programmable read-only memories (EPROMs)- Floating Gate EPROM
cell- one – time programmable (OTP) Eproms – Electrically Erasable PROMs
(EEPROMs) – EEPROM technology and architecture –nonvolatile SRAM-Flash
memories (EPROMs or EEPROM) – Advanced flash memory architecture.
UNIT – III
Memory fault modeling, testing and memory design for Testability and fault tolerance,
RAM fault modeling, electrical testing, Pseudo random testing – megabit DRAM
testing – nonvolatile memory modeling and testing – IDDQ fault modeling and testing
– application specific memory testing.
UNIT - IV
Semiconductor memory reliability and radiation effects. General Reliability issues –
RAM failure modes and mechanism – nonvolatile memory reliability – reliability
modeling and failure rate prediction – design for reliability – reliability test structures –
reliability screening and qualification. Radiation effects – single event phenomenon
(SEP)- radiation hardening techniques – radiation hardening process and design issues
– radiation hardened memory characteristics – radiation hardness assurance and testing
– radiation dosimetry – water level radiation testing and test structures.
UNIT – V
Advanced memory technologies and high-density memory packaging technologies :
Ferroelectric Random Access Memories (FRAMs) – Gallium Arsenide (GaAs) FRAMs
– Analog memories magnetoresistive random access memories (MRAMs) –
Experimental memory devices. Memory hybrids and MCMs (2D) – Memory stacks and
MCMs (3D) – Memory MCM testing and reliability issues- memory cards- high
density memory packaging future directions.
Text Book:
1. Ashok K.Sharma, “Semiconductor Memories Technology, testing and reliability”,
Prentice hall of India Private Limited, New Delhi 1997.