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The direction of airflow is as shown in Figure 1 along with the three-dimensional view of the
transparent volume setting the size limits for the heat sink. The dimensional constraints, depth
(D), width (W) and height (H) for the sink are 45, 50 and 60 mm, respectively. The maximum
airflow rate of the fans serving the heat sink is 0.020 m3/s.
Figure 1. The flow direction and the space constraints for the heat sink.
Figure 2 shows the layers of components in a typical CMOS microprocessor encased in a
package. The chip is in intimate contact through a thin layer of thermal interface material (TIM)
with and an integral heat spreader (IHS) made of copper. The IHS spreads the power dissipated
by the chip more or less uniformly over its entire area of 30 mm x 30 mm. The heat sink is to
be attached intimately to the top of the IHS through a film of TIM. The material of the heat
sink, which fits into a 45 x 50 x 60 mm volume, including its 10 mm base, will be determined
by the project group in the most appropriate way for the design.
FoM Cost TIHS Tamb
3 1
5. Prepare a report summarizing your assumptions, design methodology, the items in part
(4) and comments about the advantages and disadvantages of your selected design.
6. Submit a contribution sheet along with the final report.
7. Prepare a powerpoint presentation about your design and analysis.
Please make sure that the dimensions and calculated flow conditions of the heat sink make sense
when designing the heat sink. For example, nanometer-sized fins/gaps or air velocities of
hundreds of m/s or pressure drops of the order of kPa are unacceptable. It is the project group’s
responsibility to research reasonable operating conditions for a heat sink.