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Datasheet
Features
• Very small conduction losses
• Negligible switching losses
• Low forward voltage drop
• Surface mount miniature package
• Avalanche rated
• ECOPACK2 component
Applications
• Telecom power supply
• Set-top box power supply
• TV power supply
• Battery charger
Description
Single chip Schottky rectifiers designed for high frequency miniature switched mode
power supplies such as adaptors and on board DC/DC converters.
Packaged in SMB, SMA Flat, SMA Flat Notch and SMB Flat, the STPS2L40 is ideal
for surface mounting and used in low voltage, high frequency inverters, free wheeling
and polarity protection applications.
Product status
STPS2L40
Product summary
Symbol Value
IF(AV) 2A
VRRM 40 V
T j(max.) 150 °C
VF(typ.) 0.31 V
1 Characteristics
SMB TL = 130 °C
Average forward current, δ = 0.5, square
IF(AV) SMB Flat TL = 140 °C 2 A
wave
SMA Flat, SMA Flat Notch TL = 130 °C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
SMB 20
SMB Flat 10
Rth(j-l) Junction to lead °C/W
SMA Flat 20
SMA Flat Notch 20
Tj = 25 °C - 220 µA
Tj = 125 °C - 38 80 mA
Tj = 25 °C - 0.39
IF = 1 A
Tj = 125 °C - 0.25 0.28
Tj = 25 °C - 0.43
VF(1) Forward voltage drop IF = 2 A V
Tj = 125 °C - 0.31 0.34
Tj = 25 °C - 0.50
IF = 4 A
Tj = 125 °C - 0.39 0.45
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode
Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient
average forward current temperature (δ = 0.5) SMB
PF(AV)(W) IF(AV)(A)
1.2 2.2
Rth(j-a)=Rth(j-l)
SMB
δ = 0.1 δ = 0.2 2.0
δ = 0.5
1.0 δ = 0.05 1.8
1.6 Rth(j-a)=100°C/W
1.2
0.6 1.0
0.8
0.4
0.6
T T
0.4
0.2
0.2
IF(AV)(A) δ=tp/T tp δ=tp/T tp Tamb (°C)
0.0
0.0
0 25 50 75 100 125 150
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
Figure 3. Average forward current versus ambient Figure 4. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat) temperature (δ = 0.5, SMA Flat, SMA Flat Notch)
IF(AV)(A) IF(AV)(A)
2.2 2.2
SMA Flat
Rth(j-a)=Rth(j-l) SMB Flat Rth(j-a)=Rth(j-l) SMA Flat Notch
2.0 2.0
1.8 1.8
1.4 1.4
1.2 1.2
1.0 1.0
0.8
0.8
0.6
0.6 T T
0.4
0.4
0.2
0.2 δ=tp/T tp Tamb (°C) δ=tp/T tp Tamb (°C)
0.0
0.0
0 25 50 75 100 125 150
0 25 50 75 100 125 150
0.8
0.7
0.1 0.6
0.5
0.4
0.3
0.01
0.2
Single pulse
0.1
t p (s)
t p(µs) 0.0
0.001 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
1 10 100 1000
Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB flat) to ambient versus pulse duration (SMA Flat)
Zth(j-l) / Rth(j-l) Zth(j-a)/ Rth(j-a)
1.0 1.0
SMB Flat
0.9 0.9
SMA Flat / SMA Flat Notch
0.8 0.8
0.7 0.7
0.6 0.6
0.5 0.5
0.4 0.4
0.3 0.3
Single pulse
0.2 0.2
Single pulse
0.1 0.1
t p (s) t p (s)
0.0 0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Figure 9. Reverse leakage current versus reverse voltage Figure 10. Junction capacitance versus reverse voltage
applied (typical values) applied (typical values)
IR(mA) C(pF)
1.E+02 1000
Tj = 125 °C F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E+01
1.E+00
100
1.E-01
Tj = 25 °C
1.E-02
VR(V) V R (V)
10
1.E-03
1 10 100
0 5 10 15 20 25 30 35 40
Figure 11. Forward voltage drop versus forward current Figure 12. Forward voltage drop versus forward current
(high level) (low level)
IF(A) IF(A)
10.0 3.0
Tj=125°C
Tj=125°C 2.5 (maximum values)
(Maximum
(maximum values)
(Maximum
Tj=25°C
(maximum values) 2.0
Tj=125°C Tj=125°C
(typical values) (typical values)
1.0 1.5
Tj=25°C
(maximum values)
1.0
0.5
VF(V) VF(V)
0.1 0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.0 0.1 0.2 0.3 0.4 0.5 0.6
Figure 13. Thermal resistance junction to ambient versus Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMB) copper surface under each lead (SMB flat)
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
200 200
Epoxy printed circuit board FR4, eCu = 35 µm SMB flat
Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm SMB
150 150
100 100
50 50
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA
Flat Notch)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat
SMA Flat Notch
150
100
50
S(Cu)(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
E1
A1
C A2
L b
Dimensions
2.18
(0.086)
5.84
(0.230)
A
c
D
L 2x
L1 2 x
E E1
L2 2 x
Dimensions
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
A
c
D
L 2x
L1 2 x
E E1
L
L2 2 x
b 2x
Dimensions
5.52
(0.217)
1.52
(0.060)
Dimensions
1.52
(0.060)
5.52
(0.217)
3 Ordering information
Revision history