Manufacturing Process

Final Report

Instructor: Yun Peng Yeh

Topic: Manufacturing of Smartphone Component
Student: Marcelo Daniel Cardozo Vargas

Date: 25/06/2021
How are Smartphones Made?
Smartphones are manufactured by the following steps:
Making of prototype: Smartphones are manufactured by the following steps: The idea
is conceived and after considering various options, the affirmation is passed to the
research and development lab.
Software Installation: The software team steps in now to breathe life into the handset.
It is basically pre-decided on the operating system that is to be loaded into the phone. It
is utmost necessary that the hardware that is the part played by the electronics team is
compatible for the smooth functioning of the operating system. It is checked here by
many experts in their own manner for the system to be working according to the
expectation.
Testing Phase: Before the production begins, the handset is rigorously tested for
quality, performance and other parameters. They are tested in terms of both hardware
and software. Various tests like drop test, bend test and water tests are carried out to
check its performance.
Mass Production: When the final prototype is ready, then it is time for mass
production.
Packaging: When the handset passes all the tests, then it is sent for packaging. The
handset along with accessories and user manual are put into the box ready to be
shipped.
Shipment: These packaged phones are then dispatched to distributors, stockists and
retailers across the globe and then from these retailers it is the end customer who picks
up the handset.
Hardware
Each piece of the cell phone is created separately
The common components found on all mobile phones are:
A central processing unit (CPU), the processor of phones. The CPU is a
microprocessor fabricated on a metal–oxide–semiconductor (MOS) integrated circuit
(IC) chip.
A battery, providing the power source for the phone functions. A modern handset
typically uses a lithium-ion battery (LIB), whereas older handsets used nickel–metal
hydride (Ni–MH) batteries.
An input mechanism to allow the user to interact with the phone. These are a
keypad for feature phones, and touch screens for most smartphones (typically with
capacitive sensing).
A display which echoes the user's typing, and displays text messages, contacts, and
more. The display is typically either a liquid-crystal display (LCD) or organic light-
emitting diode (OLED) display.
Speakers for sound.
Subscriber Identity Module (SIM) cards and Removable User Identity Module (R-
UIM) cards.
How is a CPU made?
Your CPU Came from Sand

After procuring raw sand and separating the silicon, the excess material is disposed
of and the silicon is purified in multiple steps to finally reach semiconductor
manufacturing quality which is called electronic grade silicon
Purification and Growing
A Big Ingot Ingot Slicing

The ingot is then moved onto

A mono-crystal ingot is
the slicing phase where
produced from electronic grade
individual silicon discs, called
silicon.
wafers, are sliced thin.
 Wafer Polishing

Once cut, the wafers are

polished until they have
flawless, mirror-smooth
surfaces

Photo Resist Application UV Light Exposure

The blue liquid, depicted above, is a At this stage, the photo-resistant

photo resist finish similar to those finish is exposed to ultra violet (UV)

used in film for photography. light.

In the begging is the circuit diagram at design center around the globe experts
collaborate to design circuit diagrams sophisticated integrated circuits like
microprocessors high graphic processors and wireless communication.
The next step is manufacturing, the disk substrates from the microchips are made
from quartz sand and are called silicon wafers. To make this wafers a huge monocrystal
is drawn from purified silicon melt, the result is a perfect silicon lattice into which the
transistors will later be fitted, however impurities pose a threat to the flowless silicon
crystals.
 Because of the dust manufactures must therefore take extensive precautions every
time enter on the dust free clean rooms, the result, the wafers are fabricated in a
environment that is more than 100 thousand times cleaner than an operating theatre,
completely free of dust, then the silicon disc arrive at the cleanroom.
Here 25 wafers are packed into each hermetically sealed container and sent off on a
journey that will make the trough hundreds of manufacturing steps.
Photolithographic techniques transfer the circuit structures to the wafer rather like
slide projection, the key to this whole process is a solid mastery of light.
The silicon disk is spin coated with photosensitive resist, UV light transfers the
circuit structure, is depicted on a mask to the wafer the exposed parts o the resist soluble
and removed by a developer.
The transferred structures can now be used as a template, the unprotected parts of
the wafer surface are etched away the structures of billions of small current switches are
generated each wafer tiny transistors.
From the photolithographic stage wafers move on to the ion implantation where
the electrical properties of the transistors will be specified, here the engineers make
good use of one of silicon most important properties, silicon is a semiconductor which
means that its conductivity can change via high-precision emplacement of so-called
dopant atoms.
First, dopant atoms are injected into the silicon structures, these atoms then
distribute randomly in the silicon lattice, at high temperatures the doping atom become
flexible and take on a fixed position in the atomic structure.
Cooper dominates the next process step; the fines interconnect wires link up
billions of separate transistors to form integrated circuits.
Before them can happen however, cleaning is essential for wafers as particles lurk
at every stage in the manufacturing process. Before the cooper is poured into the
trenches for the interconnects a barrier layer is applied, it helps to avoid short circuits
and guarantees reliability.
The trenches are then filled with copper, finally the excess copper is ground down
to the edges of the trenches, this insulates each interconnect from the others. Electron
microscopes constantly monitor every step in the manufacturing process, down to the
atomic structure of each individual transistor.
In two months, the wafer is ready, huge integrated circuits consisting of conductors
with a length of multiple kilometers link up billion transistors on numerous levels, and
that in a space no longer than a fingernail.
The last production step is the packaging of the chips in preparation for this step tin
silver pellets are applied on the wafer they will link the chip on the frame via the finest
saw blades, the chips are cut off the wafer, the flip chip method is used to bond the chip
to the frame which is sealed with a cover.

Comment
With smartphone technology forming such an important part of our lives, it’s
becoming increasingly important to make sure associated manufacturing processes are
effective and efficient. Innovative companies such as Samsung are ideally placed to lead
the way in these areas and set best-practice standards for the industry.
References
https://www.researchgate.net/publication/3943071_Design_of_a_processor_to_support_
the_teaching_of_computer_systems
https://www.youtube.com/watch?v=qm67wbB5GmI&ab_channel=DIYwithBen
https://globalfoundries.com/
https://www.prizminstitute.com/blog/how-are-smartphones-made/
https://www.fujitsu.com/global/documents/about/resources/publications/fstj/archives/vo
l49-2/paper20.pdf
https://manufacturing.wbresearch.com/blog/samsung-ground-breaking-innovative-
chipmaking-process-strategy