Sample WLP_BumpHeight LSL USL

1 0.2 0.1 0.3

2 0.25
3 0.24
4 0.28
5 0.2
6 0.2
7 0.21
8 0.15
9 0.18
10 0.21
11 0.29
12 0.2

MEAN 0.2175 =AVERAGE(B2:B13)

STDEV 0.04048007366145 =STDEV.S(B2:B13)

A. Cpu 0.679346589880075 =(D2-B19)/(3*B20)

B. Cpl 0.967554234071623 =(B19-C2)/(3*B20)
C. Cpk 0.679346589880075

Thus, the solder paste machine that prints the solder paste on the flip chip is NOT CAPABLE.