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XDM™ General Description
March 2001
2nd Release
 Copyright by LIGHTSCAPE NETWORKS LTD., 2001. All rights reserved worldwide.

The information contained in this document is proprietary and is subject to all relevant copyright, patent and other
laws protecting intellectual property, as well as any specific agreement protecting LIGHTSCAPE NETWORKS
LTD.’s rights in the aforesaid information. Neither this document nor the information contained herein may be
published, reproduced or disclosed to third parties, in whole or in part, without the express, prior, written
permission of LIGHTSCAPE NETWORKS LTD. In addition, any use of this document or the information contained
herein for any purposes other than those for which it was disclosed is strictly forbidden.
LIGHTSCAPE NETWORKS LTD. reserves the right, without prior notice or liability, to make changes in equipment
design or specifications.
Information supplied by LIGHTSCAPE NETWORKS LTD. is believed to be accurate and reliable. However, no
responsibility is assumed by LIGHTSCAPE NETWORKS LTD. for the use thereof nor for the rights of third parties
which may be affected in any way by the use thereof.
Any representation(s) in this document concerning performance of LIGHTSCAPE NETWORKS LTD.’s product(s)
are for informational purposes only and are not warranties of future performance, either express or implied.
LIGHTSCAPE NETWORKS LTD.’s standard limited warranty, stated in its sales contract or order confirmation
form, is the only warranty offered by LIGHTSCAPE NETWORKS LTD. in relation thereto.
This document may contain flaws, omissions or typesetting errors; no warranty is granted nor liability assumed in
relation thereto unless specifically undertaken in LIGHTSCAPE NETWORKS LTD.’s sales contract or order
confirmation. Information contained herein is periodically updated and changes will be incorporated into
subsequent editions. If you have encountered an error, please notify LIGHTSCAPE NETWORKS LTD. All
specifications are subject to change without prior notice.
XDM-500 XDM-1000 XDM-2000
The XDM – Intelligent, scalable optical networking platform

IMPORTANT: The XDM platform is supplied in two versions,
! one for SDH and one for SONET. While some of the graphics
in this General Description use SDH-related terminology only,
the information contained in this document is applicable to both
the SDH and SONET versions of the XDM.
XDM™ Contents
Table of Contents
1. Introduction .................................................................................................. 1-1
1.1 XDM™ – Intelligent, Scalable Optical Networking Solutions ............ 1-1
1.2 Unmatched DWDM Capabilities ....................................................... 1-2
1.3 Outstanding Performance ................................................................ 1-3
1.4 Unclogging the Network ................................................................... 1-3
1.5 Significant Savings with the XDM..................................................... 1-3
1.6 Small Size ........................................................................................ 1-6
1.7 XDM Shelves ................................................................................... 1-7
2. Optical Capabilities ...................................................................................... 2-1

2.1 System Capabilities.......................................................................... 2-2
2.2 System Design................................................................................. 2-3
2.3 DWDM Features .............................................................................. 2-4
2.4 DWDM Components ........................................................................ 2-5
2.4.1 Mux/Demux Cards ................................................................ 2-5
2.4.2 Transponders ....................................................................... 2-6
2.4.3 Optical Fiber Amplifiers (OFAs) ............................................ 2-9
2.4.4 Optical Add/Drop Multiplexer (OADM) and Equalization
Card.................................................................................... 2-10
2.4.5 Optical Multiplexer Section Protection (OMSP) and Automatic
Laser Shutdown (ALS)........................................................ 2-13
2.4.6 Optical Performance Monitoring (OPM) Card ..................... 2-13
3. TDM, DXC and Data Capabilities ................................................................. 3-1

3.1 ADM/TM Modes ............................................................................... 3-2
3.1.1 Simple TM Mode................................................................... 3-2
3.1.2 Multi-TM Mode...................................................................... 3-3
3.1.3 Simple ADM Mode ................................................................ 3-3
3.1.4 Multi-ADM Mode ................................................................... 3-5
3.2 DXC Modes...................................................................................... 3-5
3.2.1 Broadband Digital Cross-Connect Mode (BB-DXC 4/4) ....... 3-5
3.2.2 Wideband Digital Cross-Connect Mode (WB-DXC 4/3/2/1) . 3-6
3.2.3 Integrated Wideband/Broadband Digital Cross-Connect
Mode (WB-DXC/BB-DXC 4/4/3/2/1/0)................................... 3-6
3.3 Integrated DXC/TM Mode ................................................................ 3-7
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3.4 Integrated DXC/ADM Mode.............................................................. 3-8

3.4.1 Grooming and Consolidation .............................................. 3-10
3.5 Carrier-class Data Services............................................................ 3-12
3.5.1 Erasing Technological Boundaries...................................... 3-13
3.5.2 Optimizing the Transport Network for Datacom Applications3-14
3.5.3 Application Benefits ............................................................ 3-15
3.5.4 Ethernet Networking Services............................................. 3-15
3.5.5 Configuration ...................................................................... 3-16
3.5.6 Unparalleled Functionality................................................... 3-19
3.5.7 Embedded Ethernet Switching............................................ 3-19
4. Applications.................................................................................................. 4-1
4.1 Solving Today’s Network Problems.................................................. 4-2
4.2 The XDM as an Optical Gateway ..................................................... 4-2
4.2.1 Metropolitan Access Rings ................................................... 4-3
4.2.2 Point to Point Applications .................................................... 4-4
4.2.3 Optical Add and Drop ........................................................... 4-4
4.2.4 Ring Applications .................................................................. 4-5
4.3 The Backbone Network.................................................................... 4-6
4.3.1 The Conventional Backbone Problem................................... 4-6
4.3.2 The XDM Solution................................................................. 4-7
4.4 The Regional and Metropolitan Trunk Layers................................. 4-10
4.4.1 The Problem ....................................................................... 4-10
4.4.2 The Solution ....................................................................... 4-11
4.5 Intra-Hub Optical Cross-Connect ................................................... 4-14
4.5.1 The Problem ....................................................................... 4-14
4.5.2 The Solution ....................................................................... 4-15
4.6 Data Services across WANs .......................................................... 4-17
4.6.1 Corporate Network Interconnection (GbE Leased Lines) .... 4-18
4.6.2 ISP/ASP Connectivity ......................................................... 4-19
4.6.3 VPNs (Virtual Private Networks) Connectivity ..................... 4-20
4.7 Business Areas .............................................................................. 4-21
4.8 Cellular Applications....................................................................... 4-22
4.9 The XDM-500 in a CU Implementation........................................... 4-23
4.10 The XDM-500 in an ADM-64 Implementation ................................. 4-24
5. Basic System Design ................................................................................... 5-1

5.1 Modular Design ................................................................................ 5-1
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XDM™ Contents
5.1.1 Control and Communication Subsystem ............................... 5-2

5.1.2 Timing and Synchronization Subsystem ............................... 5-4
5.1.3 Traffic Subsystem ................................................................. 5-6
5.1.4 The Power Feed Subsystem............................................... 5-17
6. Migration to XDM Networks......................................................................... 6-1

6.1 Complete Compatibility .................................................................... 6-1
6.1.1 Traffic Interoperability ........................................................... 6-2
6.1.2 DCC Interoperability.............................................................. 6-2
6.1.3 Management Interoperability................................................. 6-2
6.2 XDM Overlay.................................................................................... 6-4
6.2.1 Physical Overlay ................................................................... 6-4
6.2.2 Logical Overlay ..................................................................... 6-5
6.3 Mixed ADM and XDM Network – Hub Site Upgrade......................... 6-7
6.4 ADM to XDM Upgrade...................................................................... 6-9
6.4.1 One for One.......................................................................... 6-9
6.4.2 Multiple to One (NE Reduction) .......................................... 6-11
6.5 XDM Upgrade ................................................................................ 6-12
6.5.1 Direct Upgrade ................................................................... 6-12
6.5.2 DWDM Upgrade ................................................................. 6-13
6.5.3 Layer Upgrade .................................................................... 6-14
7. Protection and Redundancy ........................................................................ 7-1

7.1 Comprehensive Path Protection....................................................... 7-1
7.1.1 Dual Route Path Protection (Route Diversity) ....................... 7-1
7.1.2 SubNetwork Connection Protection (SNCP) ......................... 7-4
7.2 Multiplex Section Protection (MSP) .................................................. 7-6
7.2.1 MSP-L – Linear Multiplex Section Protection ........................ 7-6
7.2.2 MS-SPRing – Multiplex Section Shared Protection Ring....... 7-7
7.3 Traffic Protection and Restoration.................................................... 7-8
7.4 Comprehensive Equipment Protection ............................................. 7-9
7.4.1 Common Units Hardware Protection..................................... 7-9
7.4.2 Traffic Units (I/O Cards) Hardware Protection....................... 7-9
7.5 Optical Protection............................................................................. 7-9
7.5.1 OMSP (Optical Multiplex Section Protection) ...................... 7-10
7.5.2 OCH Protection................................................................... 7-11
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8. Management ................................................................................................. 8-1

8.1 Layered Architecture ........................................................................ 8-1
8.2 The eNM Network Manager ............................................................. 8-2
8.2.1 Topology Management ......................................................... 8-3
8.2.2 Trail Configuration ................................................................ 8-4
8.2.3 Fault Management................................................................ 8-4
8.2.4 Performance Monitoring........................................................ 8-4
8.2.5 Troubleshooting, Maintenance and Security ......................... 8-4
8.3 The eNM-XDM ................................................................................. 8-5
8.3.1 Alarm Management .............................................................. 8-5
8.3.2 Configuration and Inventory Management ............................ 8-6
8.3.3 Provisioning .......................................................................... 8-6
8.3.4 Security Management ........................................................... 8-6
8.3.5 Interfaces.............................................................................. 8-6
8.4 eCraft – An Advanced Web-Based Craft Terminal ........................... 8-7
9. Physical Description .................................................................................... 9-1

9.1 XDM Shelf Configurations ................................................................ 9-1
9.1.1 The XDM-1000 Shelf Layout................................................. 9-2
9.1.2 The XDM-500 Shelf Layout................................................... 9-3
9.1.3 The XDM-2000 Shelf Layout................................................. 9-4
9.1.4 Rack Layouts and Expansion Shelves .................................. 9-5
9.2 XDM-1000 Standard Card Layout .................................................... 9-8
9.3 XDM-500 Standard Card Layout .................................................... 9-10
9.4 XDM-2000 Standard Card Layout .................................................. 9-11
9.5 XDM Control, Matrix and I/O Cards................................................ 9-12
9.5.1 Hi-Lo Cross-Connect Matrix Cards (HLXC)......................... 9-12
9.5.2 Main Control Processor Cards (xMCP) ............................... 9-12
9.5.3 MECP (Main Equipment Control Panel) .............................. 9-13
9.5.4 ECB (External Connection Board) ...................................... 9-13
9.6 I/O Card Installation ....................................................................... 9-13
9.6.1 Electrical Interface Connection Modules ............................. 9-15
9.6.2 I/O Card Optical Transceiver Modules ................................ 9-16
9.7 DWDM Modules ............................................................................. 9-16
9.8 DWDM Basecards ......................................................................... 9-18
9.8.1 Transponders Slide-in Modules .......................................... 9-19
9.8.2 Optical OFA Modules.......................................................... 9-19
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XDM™ Contents
9.9 DIO Card and Modules................................................................... 9-19
10. Maintenance ............................................................................................. 10-1

10.1 Short Mean-Time-to-Repair (MTTR) .............................................. 10-1
10.2 Built-In Test (BIT) Overview ........................................................... 10-2
10.3 Tandem Connection Monitoring (TCM) .......................................... 10-2
10.4 The Alarms System........................................................................ 10-4
10.5 Troubleshooting ............................................................................. 10-5
11. Specifications ........................................................................................... 11-1

11.1 Cross-Connect Specifications ........................................................ 11-1
11.1.1 Cross-Connect Levels......................................................... 11-1
11.1.2 Cross-Connect Capacity ..................................................... 11-1
11.2 Traffic Protection............................................................................ 11-1
11.3 Redundancy................................................................................... 11-1
11.4 Synchronization.............................................................................. 11-2
11.5 Jitter and Wander........................................................................... 11-2
11.6 I/O Interfaces ................................................................................. 11-2
11.7 Management .................................................................................. 11-4
11.7.1 Management and Alarm Interfaces ..................................... 11-4
11.7.2 Alarm and Performance...................................................... 11-4
11.8 SDH Interfaces............................................................................... 11-5
11.8.1 SDH STM-64 I/O Card – 9953.280 Mbit/s ±4.6 ppm ........... 11-5
11.8.2 SDH STM-16 I/O Card – 2488.320 Mbit/s ±4.6 ppm ........... 11-6
11.8.3 SDH STM-4 I/O Card – 622 Mbit/s ±4.6 ppm ...................... 11-7
11.8.4 SDH STM-1 I/O Card – 155 Mbit/s ±4.6 ppm ...................... 11-8
11.9 Optical Specifications..................................................................... 11-9
11.9.1 2.5 Gbit/s Transponders – Receiver Type P ....................... 11-9
11.9.2 2.5 Gbit/s Transponders – Receiver Type A ..................... 11-10
11.9.3 10 Gbit/s Transponders – Receiver Type P ...................... 11-11
11.9.4 10 Gbit/s Transponders – Receiver Type A ...................... 11-12
11.9.5 2.6 Gbit/s Receivers ......................................................... 11-13
11.9.6 10 Gbit/s Receivers .......................................................... 11-13
11.9.7 Mux................................................................................... 11-13
11.9.8 Demux .............................................................................. 11-14
11.9.9 Optical Fiber Amplifiers (OFAs) ........................................ 11-14
11.9.10 LOS Detection ................................................................. 11-14
11.9.11 LOS Monitor Splice.......................................................... 11-14
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11.9.12 LOS Decision Circuit ....................................................... 11-15

11.9.13 OMSP (Optical Multiplex Section Protection) Module ...... 11-15
11.9.14 OSNR (Optical Signal-to-Noise Ratio) ............................. 11-16
11.9.15 Frequencies and Wavelengths ........................................ 11-16
11.10 OMGE_1SX, OMGE_1LX, DOM16_I3 Specifications .................. 11-17
11.11 Physical Specifications................................................................. 11-18
11.11.1 Dimensions (H x W x D) .................................................. 11-18
11.11.2 Weight ............................................................................. 11-18
11.11.3 Power .............................................................................. 11-19
11.11.4 Environmental Conditions................................................ 11-19
11.11.5 EMC ................................................................................ 11-19
11.11.6 Safety .............................................................................. 11-20
11.11.7 Laser Safety .................................................................... 11-20
11.11.8 NEBS Compliance........................................................... 11-20
11.11.9 Reliability ......................................................................... 11-20
A. Reference Documents .................................................................................A-1
B. Glossary .......................................................................................................B-1
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XDM™ Contents
List of Figures
Figure 1-1: Hybrid optical XDM platform................................................... 1-2
Figure 1-2: Next-generation networks – a single unit instead of six.......... 1-5
Figure 1-3: Size comparison..................................................................... 1-6
Figure 1-4: XDM-1000, XDM-500 and XDM-2000 shelves ....................... 1-7
Figure 2-1: XDM DWDM options .............................................................. 2-2
Figure 2-2: The XDM-2000 shelf .............................................................. 2-4
Figure 2-3: Transponder functionality....................................................... 2-6
Figure 2-4: Transponder block diagram ................................................... 2-7
Figure 2-5: OPM cards location and connections to the network
manager ............................................................................. 2-14
Figure 3-1: Different upgrade paths from simple TM mode ...................... 3-3
Figure 3-2: Different upgrade paths from simple ADM mode.................... 3-4
Figure 3-3: The XDM in an integrated TM configuration........................... 3-7
Figure 3-4: The XDM in a multi-TM star configuration .............................. 3-8
Figure 3-5: The XDM in an integrated multi-ADM multilayer mode
(two-dimensional view) ......................................................... 3-9
Figure 3-6: The XDM in an integrated multi-ADM mode (three-dimensional
view) ................................................................................... 3-10
Figure 3-7: XDM grooming and routing functions ................................... 3-11
Figure 3-8: XDM cross-connect consolidation ........................................ 3-12
Figure 3-9: Multilayer, multiservice XDM platform .................................. 3-13
Figure 3-10: Data connectivity across WANs ......................................... 3-14
Figure 3-11: XDM GbE functionality ....................................................... 3-16
Figure 3-12: GbE over SDH/SONET/DWDM.......................................... 3-17
Figure 3-13: GbE aggregated into DWDM ............................................. 3-18
Figure 3-14: GbE and STM-16 connection over DWDM......................... 3-18
Figure 4-1: The XDM-1000 and XDM-2000 in a metro application ........... 4-3
Figure 4-2: Point to point application ........................................................ 4-4
Figure 4-3: Optical add/drop application................................................... 4-4
Figure 4-4: Ring application ..................................................................... 4-5
Figure 4-5: Conventional vs. XDM backbone networks ............................ 4-9
Figure 4-6: Conventional and XDM-based regional and metropolitan
network ............................................................................... 4-13
Figure 4-7: Traditional intra-nodal DXC spaghetti vs. advanced XDM-DXC
application .......................................................................... 4-16
Figure 4-8: Data connectivity over different operators’ networks ............ 4-17
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Contents XDM™
Figure 4-9: Corporate network interconnections..................................... 4-18

Figure 4-10: ISP/ASP connectivity.......................................................... 4-19
Figure 4-11: Connectivity between VPNs ............................................... 4-20
Figure 4-12: The XDM-1000 as a business concentrator ....................... 4-21
Figure 4-13: The XDM in a cellular network ........................................... 4-22
Figure 4-14: The XDM-500 acting as a CU for BroadGate or other
vendors’ NTs ...................................................................... 4-23
Figure 4-15: The XDM-500 in a TDM ADM-64 configuration .................. 4-24
Figure 5-1: The control system block diagram.......................................... 5-3
Figure 5-2: Timing distribution block diagram........................................... 5-5
Figure 5-3: General block diagram ........................................................... 5-6
Figure 5-4: Typical XDM-1000 cards layout.............................................. 5-7
Figure 5-5: Typical XDM-500 cards layout................................................ 5-7
Figure 5-6: Typical XDM-2000 cards layout.............................................. 5-7
Figure 5-7: Internal traffic flow.................................................................. 5-8
Figure 5-8: The XDM’s cross–connect scheme ........................................ 5-8
Figure 5-9: Unidirectional and bidirectional connections......................... 5-12
Figure 5-10: Broadcast cross-connection ............................................... 5-13
Figure 5-11: Monitor port test circuit diagram ......................................... 5-13
Figure 5-12: Split port test circuit diagram .............................................. 5-13
Figure 5-13: Front-end loop circuit diagram............................................ 5-14
Figure 5-14: Matrix loopback circuit test diagram ................................... 5-14
Figure 5-15: Backend loop circuit diagram ............................................. 5-14
Figure 5-16: Power distribution............................................................... 5-17
Figure 6-1: Integrating the XDM into existing SDH transmission hierarchy6-3
Figure 6-2: A pure XDM overlay ............................................................... 6-5
Figure 6-3: Segment AB upgrade............................................................. 6-6
Figure 6-4: Completion of the XDM ring ................................................... 6-7
Figure 6-5: Hub site before and after an XDM upgrade............................ 6-8
Figure 6-6: One for one ADM to XDM upgrade ...................................... 6-10
Figure 6-7: Original six-ring, 30-element ADM network .......................... 6-11
Figure 6-8: Upgraded, equivalent XDM network..................................... 6-11
Figure 6-9: DWDM upgrade ................................................................... 6-13
Figure 6-10: Physical view...................................................................... 6-14
Figure 6-11: Hierarchical view ................................................................ 6-14
Figure 7-1: Path protection switching in a bidirectional self-healing ring... 7-2
Figure 7-2: Path diversity protection switching in a mixed equipment ring 7-3
Figure 7-3: Integration with other vendors’ SDH equipment ..................... 7-4
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XDM™ Contents
Figure 7-4: MS line protection .................................................................. 7-6

Figure 7-5: Four-fiber MS-SPRring protection .......................................... 7-8
Figure 7-6: OMSP line protection ........................................................... 7-10
Figure 7-7: OCH protection scheme....................................................... 7-11
Figure 8-1: Lightscape Networks’ layered architecture management
concept ................................................................................. 8-1
Figure 8-2: The eNM’s main screen ......................................................... 8-3
Figure 8-3: The XDM shelf view as displayed in the eNM-XDM................ 8-5
Figure 8-4: XDM shelf view as seen from the eCraft window.................... 8-8
Figure 9-1: XDM-500, XDM-1000 and XDM-2000 shelves ....................... 9-1
Figure 9-2: XDM-1000 standard shelf open view...................................... 9-2
Figure 9-3: XDM-500 shelf open view ...................................................... 9-3
Figure 9-4: XDM-2000 open view ............................................................. 9-4
Figure 9-5: Two standard XDM-1000 shelves installed in a 2600 mm rack9-6
Figure 9-6: Two XDM-500s or XDM-2000s in a 2200 mm rack ................ 9-7
Figure 9-7: XDM-1000 and XDM-500 or XDM-2000 in a 2600 mm rack... 9-7
Figure 9-8: XDM-1000 standard card layout............................................. 9-9
Figure 9-9: XDM-500 standard card layout............................................. 9-10
Figure 9-10: XDM-2000 standard card layout......................................... 9-11
Figure 10-1: Tandem Connection Monitoring (TCM) .............................. 10-3
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Contents XDM™
xii Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

XDM™ Contents
List of Tables
Table 2-1: XDM transponders .................................................................. 2-9
Table 2-2: Inline amplifier types.............................................................. 2-10
Table 2-3: Single-channel OADM – 100 GHz spacing............................ 2-12
Table 2-4: Single-channel OADM – 200 GHz spacing............................ 2-12
Table 2-5: Four-channel OADM – 100 GHz spacing .............................. 2-12
Table 2-6: Four-channel OADM – 200 GHz spacing .............................. 2-12
Table 2-7: Four-channel GOADM – 100 GHz spacing............................ 2-12
Table 3-1: Broadband cross-connect connectivity .................................... 3-5
Table 3-2: Wideband cross-connect connectivity ..................................... 3-6
Table 3-3: Wideband/broadband cross-connect connectivity ................... 3-7
Table 5-1: XDM equivalent matrix capacity .............................................. 5-9
Table 5-2: Single shelf interface capacity ............................................... 5-17
Table 9-1: I/O basecards data for XDM-1000 and XDM-500 systems .... 9-14
Table 9-2: Connection module data for electrical I/O cards .................... 9-15
Table 9-3: Optical transceiver module data for optical I/O cards ............ 9-16
Table 9-4: DWDM module data.............................................................. 9-17
Table 9-5: DIO card data interface modules (DMs) and optical
transceivers (Tx/Rx) .............................................................. 9-20
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Contents XDM™
xiv Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

Introduction
1.1 XDM™ – Intelligent, Scalable Optical
Networking Solutions
SDH and SONET have proved to be reliable and practical transport technologies.
Thousands of SDH/SONET networks have been deployed in recent years and
continue to be deployed in high volumes. In fact, SDH/SONET are so common and
so reliable, that access equipment, switches, routers and optical elements have also
integrated SDH/SONET interfaces, making them the core technologies of the 21st
century.
However, despite the fact that SDH/SONET technologies continue to make giant
strides forward, traditional SDH/SONET equipment is rigid, bitrate specific and thus
unable to offer the flexibility, capacity and services required today by operators and
carriers. As demand for capacity in the access and backbone sections of the network
skyrockets, the major obstacle for network operators becomes the link between the
core and the access layers.
At Lightscape Networks we specifically addressed these issues when we designed
the XDM™ platforms. The XDM integrates the capabilities of multiple technologies
– Dense Wavelength Division Multiplexing (DWDM), Time Division Multiplexing
(TDM) and digital cross-connects (DXCs) – and combines them into a single next-
generation hybrid optical network element. Taking into account the enormous
growth of data traffic, we also added Internet Protocol (IP), Asynchronous Transfer
Mode (ATM) and gigabit Ethernet (GbE) capabilities for the efficient transmission
of data (see Figure 1-1).
The systems were designed such that the operator can choose to use only the features
required based on current demands, and add functions and services as requirements
grow. This results in scalable, multiservice, multipurpose and flexible platforms.
The XDM’s high capacity, scalability, full connectivity and high service support
bring a new dimension to the transport and optical networks, making it simpler,
multifunctional and future proof.
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Introduction XDM™
1.2 Unmatched DWDM Capabilities

DWDM significantly increases the data-carrying capacity of your network by
multiplexing and simultaneously transmitting a number of signals at different
wavelengths over a common optical fiber. It facilitates the transmission of all
common signal formats, including SDH, SONET, PDH, ATM and IP.
By incorporating DWDM technology, the XDM supports higher Gbit/s line-
transmission trunks. The XDM supports up to 40 DWDM channels, scalable to 80
channels, and carries up to 400 Gbit/s of voice and data traffic scalable to 800 Gbit/s.
The XDM is the perfect solution for current and future network growth, as it
combines the powerful capabilities of DWDM with the robustness of TDM. And it
does so while maintaining high levels of performance and reliability. Moreover, the
inherent DWDM capabilities of the XDM provide operators with a “pay as you
grow” intelligent infrastructure of virtually unlimited expansion paths.
40/80-channel (STM-64/OC-192)
optical backbone
OADM DWDM
40/80
ADM-64
A A D
STM-16/64 OC-48/192 W
D IP D
M M D
M
ATM
N x STM-16/64 OC-48/192
Optical metropolitan ring
A A D
1/0 W
D D
STM-1/4 OC-3/12 M M D
DXC 4/4/3/2/1 M
SDH/SONET ADM
DWDM OADM
PSTN IP ATM GbE SDH/

SONET
E1, E3/DS3, STS-1, GbE
STM-1/OC-3(c); STM-4(c)/OC-12(c)
STM-16(c)/OC-48(c);STM-64(c)/OC-192(c)
Figure 1-1: Hybrid optical XDM platform
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XDM™ Introduction
1.3 Outstanding Performance

Lightscape Networks’ new generation hybrid optical networking platforms integrate
all the transport functions of a complete Point of Presence (POP) in a single-shelf-
size element. The XDM accommodates the growing demand for bandwidth, while
maintaining compatibility and enhanced flexibility to transport all types of traffic,
including voice, ATM, IP and data.
The new XDM concept combines the wealth of bandwidth of DWDM, with TDM
manageability, fast protection time and ring topology, and enhanced DXC
connectivity and availability. This creates a single, powerful, flexible and highly
intelligent platform with a basic, robust and simple architecture and unparalleled
functionality.
1.4 Unclogging the Network

While advances in access equipment bring increased bandwidth to the service-
centric customer, and backbone networks are fleshing out capacity with DWDM,
high-speed connectivity between the two remains encumbered by costly equipment
deployed inefficiently. Connectivity in the transport network has become the
bottleneck in service provisioning.
Current network solutions based on existing equipment capabilities and financial
considerations limit the operators’ ability to respond to changes in network traffic
patterns, and to demands for topology modifications driven by new services.
The XDM is equipped with a high capacity, nonblocking matrix that provides
support to High Order (HO) and Low Order (LO) services. Consequently, it is
possible to build an extremely flexible and transparent optical network.
In addition, and unlike traditional SDH equipment, built to support each bitrate
separately, a single XDM system supports any SDH line rate from STM-1 to
STM-64.
1.5 Significant Savings with the XDM

As competition forces service prices down, operators need less complex, less costly
equipment in order to compete effectively.
Combining an unparalleled single card and single shelf port capacity with the ability
to expand port capacities with expansion shelves, the XDM provides rock bottom
prices per port. And this is just the beginning.

Introduction XDM™
The XDM has the versatility to perform the function of more than ten types of
pre-XDM-technology elements (see Figure 1-2), while at the same time enhancing
connectivity and reducing the total number of elements in the networks by
approximately 75%. The XDM solution can slash the initial network prices by over
50%. But the savings don’t stop there.
By enabling operators to address all their transport needs in a single platform, the
XDM cuts down substantially operators’ overhead costs as well as spare parts,
training and management expenses.
According to prevalent “laws of provisioning”:
Capacity x Connectivity = Cost
This means that increasing capacity or connectivity always results in higher
networks costs.
The XDM breaks the rules of this equation, offering higher capacity and
nonblocking connectivity at a lower cost.
Figure 1-2 shows how multiple units for multiple technologies can be easily replaced
by a single unit – the XDM – for multiple technologies.

XDM™ Introduction
ADM Vendor A
Management
ADM Vendor B
Management
STM-16 DXC Management

Backbone
network DWDM
Management
STM-64 DWDM
Backbone Backbone
network network
DXC
STM-4
Metropolitan STM-1
network Metropolitan
network
Single Integrated
Management
STM-16
Backbone
network
STM-64
Backbone DWDM
network Backbone
network
STM-4 STM-1
Metropolitan Metropolitan
network network
Figure 1-2: Next-generation networks – a single unit instead of six

Introduction XDM™
1.6 Small Size

All these capabilities are provided in a single, small and highly scalable ETSI shelf.
As shown in Figure 1-3, an equivalent solution, using traditional SDH/SONET and
optical equipment may require over ten fully equipped racks.
15 x TM-1 8 x ADM-1 50 x ADM-4 9 x ADM-16 9 x TM-1 50 DDF racks
TDM
Ethernet/IP
ATM
Video
2 Mbit/s to STM-64 STM-1 to 40/80 x STM-64
Figure 1-3: Size comparison

XDM™ Introduction
1.7 XDM Shelves

Depending on the application, topology and required configuration, three types of
XDM shelves are available:
♦ XDM™-1000 regular shelf – multiservice metro optical switch, designed for
high capacity central exchange applications
♦ XDM™-500 compact shelf – data aware access gateway, designed for
medium interface capacities and street cabinet installations
♦ XDM™-2000 – multifunctional intelligent optical switch, optimized for
optical DWDM applications.
To facilitate operation and maintenance, all XDM shelves support exactly the same
card types and modules. The shelves differ only in physical size and in the number
of I/O slots.
For additional details about the XDM shelf options, see Chapter 9.
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
ACTIVE FAIL ACTIVE FAIL ACTIVE FAIL

FAIL FAIL FAIL FAIL FAIL FAIL
FCU-1 FCU-2 FCU-3 xFCU xFCU xFCU

xFCU xFCU xFCU
Figure 1-4: XDM-1000, XDM-500 and XDM-2000 shelves
In summary, Lightscape Networks’ new XDM platforms combine the functionalities

of an optical DWDM multiplexer, an ADM, and a narrow, wide and broadband
digital cross-connect into a single system. And all this capability is offered at a
fraction of the cost and size of any equivalent equipment available today on the
market.

Introduction XDM™

Optical Capabilities
The future of telecommunication networks is already here, and Dense Wavelength
Division Multiplexing (DWDM) is playing a key role in these rapidly evolving
infrastructures. Moreover, current technologies are advancing at unprecedented
speeds to keep up with increasing bandwidth demand generated by Internet growth
and expansion of telecommunication requirements.
Lighstcape Network’s XDM multiservice optical provisioning platforms are the
ideal infrastructure for the optical layer. This unique, powerful, intelligent equipment
combines the comfort and ease of use of the XDM shelves with the powerful
capabilities of DWDM. Moreover, it provides a winning combination of
nonblocking cross-connectivity and large capacity with the ability to cover extremely
long distances.
The XDM multichannel transport platforms carry fully managed terabit traffic to
short, medium and long distances. The XDM features a fully managed, optically
transparent capability that integrates seamlessly with existing infrastructures.
One of the system’s most outstanding features is its flexibility. Telecom Operators
(TOs) can start with limited bandwidth support based on current requirements, and
add capacity and services as needs grow. This provides an excellent opportunity to
operate an intelligent DWDM network of unlimited capacity at reasonable prices.
The XDM sets new standards for optical networking. It is reliable, sophisticated and
cost-effective – in short, the ideal platform to meet the challenges of 21st century
networks.

Optical Capabilities XDM™
2.1 System Capabilities

As shown in Figure 2-1, the XDM supports higher transmission bitrates using
DWDM technology. By supporting DWDM options for 10-400 Gbit/s payload
transmission, the XDM provides:
♦ High flexibility for field installations
♦ High utilization of existing fibers
♦ Gradual capacity expansion based on service provisioning needs.
N x STM 16/64
N x STM 16/64
Inline
amplifiers
Figure 2-1: XDM DWDM options
In addition to 10 Gbit/s TDM, the XDM can also provide 10 Gbit/s by combining
four STM-16 I/O interfaces – each operating at 2.5 Gbit/s – with DWDM. These
high capacity transmission options can be implemented in stages, using integrated
DWDM modules and installing STM-16 I/O cards in scheduled upgrades.
This modular implementation option enables operators and service providers to
reach desired capacity levels according to network growth, and with full cross-
connectivity available at all times.
The XDM is equipped with Optical Add/Drop Multiplexer (OADM) modules, and
integrated DWDM-16, DWDM-40 and DWDM-80 mux/demux units. Integrated
optical boosters and preamplifiers extend the XDM’s fiber reach, saving on
regeneration equipment. Inline amplifiers can further extend the DWDM
transmission span up to 700 km (for additional information, see the “LumiNet™
Ultra Long Continental DWDM Platform General Description”).

XDM™ Optical Capabilities
The XDM incorporates sub-lambda grooming and integrates DWDM and data layers
in metro and regional networks in a single box with a single management system.
This provides an optical transparency that integrates seamlessly with existing
infrastructure.
In addition, the XDM’s sub-lambda connectivity allows service providers to create
customer-controlled Virtual Private Networks (VPNs) with defined access and
bandwidth capabilities. In these applications, service providers handle administration
functions, while each customer’s network is operated and provisioned
independently. This powerful feature enables to build customized networks to satisfy
specific customer requirements.
2.2 System Design

The XDM shelves provide enormous optical capabilities using a variety of
mux/demux units, optical amplifiers (boosters, inline amplifiers and preamplifiers),
transponders, Optical Add/Drop Multiplexer (OADM) modules, equalization units
and more.
A single XDM-1000 shelf installed in a 2200 mm rack provides up to 24 different
wavelengths or up to 12 add/drop wavelengths. Two XDM-2000 shelves installed in
a single 2200 mm rack provide up to 48 different wavelengths or up to 24 add/drop
wavelengths.
For additional flexibility, mux/demux modules, boosters and preamplifiers can all be
installed in either the upper or lower cage of the XDM-1000.
Lightscape Networks’ DWDM channels provide for up to 41 center frequencies
from 192.10 THz to 196.10 THz, with a mean 100 GHz channel spacing between
frequencies. These specifications comply with ITU-T Recommendation G.692.
The XDM’s multipurpose platform enables any network to significantly increase
efficiency using existing resources. For example, it can add/drop any 2 Mbit/s signal
to/from any STM-64 (10 Gbit/s) stream taking advantage of the system’s granularity
matrix. This capability greatly reduces costs. In fact, the XDM eliminates the
additional costs of intermediate equipment between the DWDM and SDH/SONET
layers.
Available system configurations include a 16-channel system upgradeable to 32 and
64 channels (within the L band), and a 40-channel system upgradeable to 80
channels, also within the L band.
With a 40-channel DWDM mux/demux and a 10 Gbit/s transponder, or with the
XDM’s I/O cards, the system reaches a total capacity of 400 Gbit/s. This capacity is
scalable to 800 Gbit/s using an 80-channel DWDM mux/demux.

Figure 2-2: The XDM-2000 shelf
2.3 DWDM Features

DWDM has proved to be highly efficient in delivering large amounts of bandwidth
over long distances reliably and cost-effectively. The XDM features unparalleled
optical capabilities that enable it to meet the challenges of constantly growing optical
networks:
♦ Multichannel flexibility
♦ Multispan – up to 300 km for metro and regional applications, and up to
700 km for national applications (using the XDM 4000’s amplifiers for ultra
long distances, without electrical regeneration).
♦ Transparent support of transmission channels for SDH/SONET, PDH, ATM,
Gigabit Ethernet (GbE) and IP

♦ Integrated DWDM/SDH configuration

♦ Non-traffic affecting upgrade channel by channel, starting from a single
channel
♦ Point-to-point or east to west topologies
♦ Add and drop of any channel in any node
♦ Full compliance with applicable ITU-T recommendations for optical
equipment
♦ Full compliance with ITU-T safety standards
♦ Extremely powerful management that renders the system easy to control,
monitor and maintain
♦ Easy installation in ETSI or 19” rack
♦ Full hardware and software integration with Lightscape Networks’ SDH
SYNCOM™ equipment, providing a low cost integrated transport network
♦ Full networkwide management via Lightscape Networks’ eNM network
manager station
♦ Tiny footprint.
2.4 DWDM Components

The XDM shelves house mux/demux modules, transponders, OFAs (Optical Fiber
Amplifiers) and other cards and modules used to process, amplify and boost DWDM
signals.
The following sections provide a detailed description of these optical components’
features and functionality.
2.4.1 Mux/Demux Cards

The XDM offers a wide range of DWDM mux and demux cards, ranging from
extremely cost-effective two and four-channel systems, up to 40 and 80-channel
systems with a spectral spacing of 100 GHz between channels. Upgradeable systems,
such as an 8-channel system upgradeable to 16 channels, 16-channel system
upgradeable to 32 and 64 channels, and 40-channel system upgradeable to 80
channels are also available.
For maximum flexibility, two mechanical versions of the 16/32/64 and 40/80
channel mux/demux cards are available, to enable installation in the XDM-1000’s
lower or upper cages. To achieve higher performance and lower cost, the demux
modules designed for 16 or more channels feature Array Waveguide Grating (AWG)
technology.

2.4.2 Transponders
The XDM transponders comply with ITU-T’s 100 GHz multichannel spacing
standard. The transponders support SDH, SONET, PDH, ATM, IP, and GbE at any
bitrate ranging from 34 Mbit/s up to 2.5 Gbit/s or 10 Gbit/s.
In addition, both the 2.5 Gbit/s and 10 Gbit/s transponders support a 7% outband
FEC (Forward Error Correction) functionality for better performance.
In today’s complicated and overpopulated networks, a small footprint is necessary.
The XDM transponder consists of a single baseboard with two separate transponders
and a built-in Optical Channel protection (OCH) module, which operates based on
Performance Monitoring (PM) parameters. Switch to protection time is less than 5
ms.
Two types of baseboards are supplied – one for the 2.5 Gbit/s transponder (including
all its variations) and one for the 10 Gbit/s transponder (including all its variations).
Each transponder’s transmitter provides two different wavelengths (via a tunable
laser), thus reducing spare parts requirements. Spare parts costs are further reduced
because the same type of baseboard is used for all distances and/or applications.
Two 2.5 Gbit/s transponders in a single slot support up to 48 different wavelengths
or up to 24 add and drop wavelengths. In addition, the transponder is capable of
Regenerating Reshaping and Retiming (3R) signals. For non-standard bitrates, a
bypass mechanism is used (2R).
SDH
DWDM transponder
with QoS monitoring
SONET
Inline amp.
PDH
+ OADM
ATM
CATV
IP
Figure 2-3: Transponder functionality

Transmitter
The transponder features two transmitter types for the standard ITU-T 100 GHz
spacing range and different dispersion values. The transmitter features a temperature
closed-loop unit that controls the wavelength’s accuracy. This control unit is ideal
for the 100 GHz spacing range. Other transmitter types are under development for
future upgrade operations, and a wave locker can be added to the transponder to
support 50 GHz spacing.
Receiver
The optical receiver is a slide-in extractable module. It can be extracted and replaced
with a receiver of different characteristics. There are two types of receivers:
♦ Type A – highly sensitive receiver with an Avalanche PhotoDiode (APD)
detector.
♦ Type P – PIN detector-based low sensitivity receiver.
In the 2.5 Gbit/s transponder, the detector (APD or PIN, depending on the receiver
type selected) is optimized to a bandwidth that supports signal bitrates up to 2.66
Gbit/s (STM-16 bitrate plus the 7% overhead of the out-of-band FEC). In the 10
Gbit/s transponder, the detector is optimized to a bandwidth that supports bitrates up
to 10.66 Gbit/s (STM-64 plus the 7% overhead of the out-of-band FEC).
Figure 2-4 illustrates the transponder’s block diagram.
Loss of signal
RX Loss of data
Bypass
DEMUX
LOS
LOF
FEC&PM SF
SD
Control To Slave
MUX
Selector
TX LOS
TX TX_EN
Figure 2-4: Transponder block diagram

SDH PM is based on the following parameters:

♦ LOS – Loss of Signal
♦ LOF –Loss of Frame
♦ J0 – Connectivity supervision
♦ B1– BIP-8 over the entire previous frame
♦ B2
♦ SF/SD (Signal Failure/Signal Degradation) indications
♦ MS-AIS insertion – prevents cascading of LOS alarms.
GbE PM is based on the following parameters:

♦ Invalid code words
♦ Running disparity error
♦ Frame synchronization loss.
FEC operation modes:

♦ Encode only in the transmit transponder
♦ Decode only in the receive transponder
♦ Decode and encode – when the transponder acts as a regenerator
♦ Encoding and decoding disabled – FEC is not required.
To achieve maximum modularity and reduce spare parts requirements to a

minimum, the transponders consist of a baseboard and optical modules that can be
easily installed and replaced. The list below provides a short description of these
components:
♦ TRP25_2 – baseboard with two transponders, including any of the following
modules:
− OMA_25 – optical receiver type A
− OMP_25 – optical receiver type P
− OMV_25xx – optical transmitter type V
− OMB_25xx – optical transmitter type B
− OMX_25xx – optical transmitter type X
− OMS_25S3 – 1310 nm optical transmitter.
Table 2-1 lists available XDM transponders. For additional information, see Chapter
11, Specifications.

Table 2-1: XDM transponders
X X X s s YZ t t
tt ITU wavelength number

Z Transmitter type V_5 1 dBm/1800 ps/nm
B_5 0 dBm/3000 ps/nm
X_5 5 dBm/1800 ps/nm
S3 -5 dBm/200 ps/nm
VL 1 dBm/10800 ps/nm
Y Receiver type A APD
P PIN
ss Bit rate 25 2.5 Gbit/s
10 10 Gbit/s
XXX Card name TRP Transponder
2.4.3 Optical Fiber Amplifiers (OFAs)

In medium and long range applications, optical amplifiers are used to boost the
optical signal. The OFA is an EDFA (Erbium-Doped Fiber Amplifier) module that
enables signal amplification. The EDFA-based OFA is extremely simple to operate
and support the entire C band. It therefore allows bandwidth upgrades without
having to replace the entire transmission system.
The XDM platform features three types of optical amplifiers: boosters, inline
amplifiers and preamplifiers. For maximum flexibility, two mechanical versions of
the booster and preamplifier are available so that they can be installed in the lower or
upper cage of the XDM-1000.
Two gain blocks mounted on a single baseboard support booster and preamplifier
functions. Two inline amplifiers, one for each direction, are also mounted on a single
baseboard. This very small footprint is extremely cost effective when considering
spare parts costs.

There are three types of amplifiers for metro and regional applications:
NOTE: The prefix MO denotes the module is located in the

upper cage of the XDM-1000 shelf; the prefix OM denotes
the module is located in the XDM-2000 shelf. There are no
functional differences between the modules.
♦ MO_BAC/OM_PBC (optical booster) – boosts the signal at the transmitting

end of the line. The optical booster covers the entire C band.
♦ MO_PAC/OM_PAC (optical preamplifier) – amplifies the signal at the
receiving end of the line. It improves receiver sensitivity and enables to
extend the signal while still allowing to lock on to the Rx signal. The
preamplifier covers the entire C band.
♦ OM_ILC (inline amplifier) – this is a passive optical boosting element. It
manages all C band channels with a uniformity of less than 1 dB. For metro
and regional applications, up to two inline amplifiers (up to three spans) can
be used. To achieve optimum results, three types of inline amplifiers are
available (see Table 2-2).
Table 2-2: Inline amplifier types
Inline Amp. Bitrate Gain Distance No. of Channels

OM_ILC_23 10 Gbit/s 23 dB 267 km 40
OM_ILC_25 2.5 Gbit/s 25 dB 280 km 40
OM_ILC_29 2.5 Gbit/s 29 dB 303 km 40
Cable loss: 0.25 dB/km.
For additional inline amplifiers’ specifications, see Chapter 11, Specifications.
2.4.4 Optical Add/Drop Multiplexer (OADM) and

Equalization Card
Metropolitan and long haul applications require the transmission of traffic over short
terminal-to-terminal distances. However, it is not always necessary to drop all the
channels at every node along the path. In these cases, the OADM provides a very
cost-effective solution.
The introduction of OADMs into ring topologies provides similar functionality to
the traditional SDH/SONET-based ring protection. The ability to implement
established switching criteria in the optical-network layer for a variety of services
(ATM, IP, SDH/SONET, etc.), further benefits operators and service providers.

The OADM adds and drops single or multiple channels without interfering with the
remainder of the channels. It therefore allows the sharing of network resources
among several traffic hubs, nodes or subnetworks.
The XDM platform features three types of OADMs:
♦ Fixed OADM – the fixed OADM is equipped with a special filter that
separates the add/drop channels from the go-through channels. One, four or
eight channels can be added/dropped in each OADM site.
♦ Flexible OADM – here too the OADM is equipped with a special filter that
separates the add/drop channels from the go-through channels. In addition, the
selected channel goes through an optical switch that selects between the go-
through and add/drop operations. One, four or eight channels can be
added/dropped in each OADM site.
♦ Grouped OADM (GOADM) – the GOADM consists of a set of wideband and
narrowband filters that enables to achieve a cost-effective, lost insertion loss
solution.
The OADM consists of a baseboard with plug-in modules – filters (for the add/drop
operation) and attenuators (for equalization purposes). The baseboard is highly
modular and flexible. Depending on the application, the OADM baseboard can be
supplied in any of the following configurations:
♦ Four filters and four attenuators
♦ Eight filters
♦ Eight attenuators.
NOTE: When the baseboard is supplied with only eight

attenuators, it is called EQ8.
The OADM maintains channel equalization between the add/drop channels and the
pass-through channels. This feature is essential to prevent severe gain tilt problems
in the optical amplifiers downstream.
Proper equalization requires that the add/drop channels have the same power level as
the pass-through channels. This is achieved by monitoring the add/drop channels’
power level, comparing between them, and equalizing them via an equalization unit.
The attenuators control the power of the different channels (one attenuator per
channel), and are tuned according to Optical Performance Monitoring (OPM)
measurements.
Tables 2-3 through 2-7 provide the optical specifications of OADMs with one and
four-channel filters, and 100 GHz and 200 GHz channel spacing respectively.

Table 2-3: Single-channel OADM – 100 GHz spacing
Insertion Loss
Through Drop Add
1. Total insertion loss – through channels <1.6 dB - -
2. Total insertion loss for dropped channel - <2.5 dB -
3. Minimum insertion loss for added channel - - <1.8 dB
Table 2-4: Single-channel OADM – 200 GHz spacing
Insertion Loss
Through Drop Add
2. Total insertion loss for dropped channel - <2.5 dB -
Table 2-5: Four-channel OADM – 100 GHz spacing
Insertion Loss
Through Drop Add
2. Total insertion loss for dropped channel - <5 dB -
3. Minimum insertion loss for added channel - - <4 dB
Table 2-6: Four-channel OADM – 200 GHz spacing
Insertion Loss
Through Drop Add
1. Total insertion loss – through channels < 6,5 dB - -
Table 2-7: Four-channel GOADM – 100 GHz spacing
Insertion Loss
Through Drop Add
1. Total insertion loss – through channels <2 dB - -

2.4.5 Optical Multiplexer Section Protection (OMSP)

and Automatic Laser Shutdown (ALS)
The OMSP and ALS provide optical protection to the system at the line level. When
they sense a power failure, they send a signal to the transmit side that the system is
switching to protection mode.
The OMSP is an add-on feature to the ALS (Automatic Laser Shutdown) unit, thus
eliminating the need for additional LOS detection mechanisms and electrical control
components. The OMPS and ALS form a single integral unit.
A standalone ALS card is also available as a partial implementation of the complete
unit. This modularity enables to reduce system price even further.
2.4.6 Optical Performance Monitoring (OPM) Card

To properly manage complex and large DWDM networks, active monitoring of the
network’s optical layer is critical.
The OPM card allows direct feedback of the optical signal’s status. Specifically, it
reports three critical parameters to the network management layer:
♦ Power level
♦ Wavelength (and channel count)
♦ Optical signal to noise ratio (OSNR).
When installed in an OADM site, the OPM card provides equalization. In this case,
the OPM taps the OADM (east or west) output, and measures the power level of
each wavelength, whether it is passing through from a previous site or added to the
OADM node.
The differences in power between add and pass-through wavelengths are equalized
using the variable attenuators in the equalization card.
When the OPM is at the beginning of a span and before the demux, it measures the
span’s optical performance.
The OPM performs scheduled measurements. These are compared to an historical
database of measurements. Long-term monitoring provides a performance baseline
that enables future forecasting and rapid network restoration in case of failures.
Figure 2-5 illustrates the different possible locations for the OPM card and shows the
connection to the central network management to enable monitoring of each
individual wavelength.

OPM
#3
DEMUX
MUX
OADM
5% 5% 5% 5% 5%
And/Or l1 l2
OPM OPM
#1 #4
OPM
#5
OPM
#6
OPM
#2
Manager
Figure 2-5: OPM cards location and connections to the network manager

TDM, DXC and Data Capabilities
The XDM platform provides a single infrastructure for all transmission applications
and operator needs. It can be configured in a variety of operation modes and be used
in a wide range of alternative applications. All configurable modes are embedded in
the system’s architecture. The transition is straightforward and completely non-
traffic affecting.
In addition to the powerful DWDM operation mode described in Chapter 2, the
XDM’s operation modes include:
♦ ADM/TM modes:
− Simple TM (STM-1 to STM-64)
− Multi-TM (STM-1 to STM-64)
− Simple ADM (STM-1 to STM-64)
− Multi-ADM (multiple ring closure, STM-1 to STM-64)
♦ Digital Cross-connect (DXC) modes:
− Broadband digital cross-connect (BB-DXC 4/4)
− Wideband digital cross-connect (WB-DXC 4/3/2/1)
− Narrowband digital cross-connect (NB-DXC − 1/0)
− Integrated wideband/broadband digital cross-connect
(WB-DXC/BB-DXC − 4/4/3/2/1/0)
♦ Integrated DXC/TM mode
♦ Integrated DXC/ADM mode.
The XDM platform also provides carrier-class data services, including:

− IP and POS (Packet over SDH/SONET) concatenated interfaces
− Transparent GbE services
− ATM transport services
− Ethernet and ATM IP interfaces
− Data aggregation into SDH/SONET streams and DWDM wavelengths.

TDM, DXC and Data Capabilities XDM™
The above operation modes are embedded in the XDM’s core system, allowing the
operator to switch or upgrade to another operation mode in-service. This capability
provides operators with a future-proof and cost-effective upgrade path.
3.1 ADM/TM Modes
3.1.1 Simple TM Mode

In addition to its advanced operational modes, the XDM can economically function
also in simple TM applications. In the TM mode, the XDM provides classic
lightwave multiplex functionality. It operates at STM-1/4/16/64 or higher levels
(through integrated DWDM).
To operate the XDM as a TM, all that is required is to insert a single Input/Output
(I/O) port. Even in simple TM mode, the XDM matrix provides full connectivity.
This allows the TM mode to upgrade to other advanced modes automatically and
without affecting traffic.
Mode upgrade possibilities include:
♦ Increasing the capacity of a TM (as described below).
♦ Changing from TM to ADM mode. This is achieved by simply adding an
additional line port to the operating NE.
♦ Adding functions to the same NE. This is achieved by simply adding an
additional line port at the desired rate to the operating NE, and using shared
tributaries between the different TM functions.
♦ Adding functions and integrated DXC 4/1 to the same NE. Same as the above
option, with integrated cross-connect functionality between all TM functions
(inter-TM cross-connect).
As shown in Figure 3-1, the XDM offers a variety of upgrade paths to increase the
capacity of the TM mode. There are four possibilities:
1. Replace the existing port with a higher capacity port (minimal effect on
traffic).
2. Insert an additional higher capacity card and switch traffic to the new port
while in service (non-traffic affecting). For example, upgrade a 2.5 Gbit/s
TM to a 10 Gbit/s TM by inserting an SIO-64 (SDH Input/Output STM-x
card) and switching traffic from an SIO-16 card.
3. Insert an additional higher capacity port to operate in tandem with the
existing port (non-traffic affecting). For example, add an additional port to
the existing 2.5 Gbit/s STM-16 port and obtain a 5 Gbit/s TM.

XDM™ TDM, DXC and Data Capabilities
4. Use the XDM’s integrated DWDM capabilities to increase the capacity of an

existing line. To increase the line rate, simply insert additional wavelength-
based interfaces.
TM-16
DWDM ADM-64 ADM-16 Multi TM DXC

TM-64 TM-16 TM-16
TM-16 TM-16 TM-16 TM-16 TM-16 TM-16
5 Gbit/s and 10 Gbit/s and Tributaries Shared Shared

up TM up TM tributaries tributaries
Figure 3-1: Different upgrade paths from simple TM mode
3.1.2 Multi-TM Mode

From the simple STM-1/4/16/64 and higher TM mode, you can expand to a more
complex configuration without adding additional equipment. For example, you can
expand to a multi-TM 1/4/16/64 (mixed rates) or an integrated 4/4/3/2/1 DXC and
TMs.
The multi-TM mode allows connecting the element to numerous other elements
where each TM function is performed by a single I/O port (at the required rate),
while the remaining functions such as matrix, control and tributaries are common to
all ports.
3.1.3 Simple ADM Mode

In the ADM mode, the XDM provides classic lightwave add/drop multiplex
functionality. It operates at the STM-1/4/16/64 or higher rates (through integrated
DWDM). Connectivity is the same as in the integrated DXC-ADM mode.
To operate the XDM as an ADM, all that is required is to insert two I/O ports.
Traditional ADM requires that both I/O ports operate at the same bitrate. The XDM
allows operating the ports both at identical and different rates, allowing maximum
flexibility for the operator.

Even in simple ADM mode, even at the highest STM rate (STM-64), the XDM
matrix provides full capacity and connectivity. This allows the ADM mode to
upgrade to other advanced modes automatically and without affecting traffic.
The mode upgrade possibilities include:
♦ Increasing the capacity of an ADM (as described below).
♦ Adding functions to the same NE. This is achieved by simply adding line
ports to the operating NE at the desired rate, and using shared tributaries
between the different ADM functions.
♦ Adding functions and integrated DXC 4/1 to the same NE.
♦ Same as the second option above, fully utilizing the integrated cross-connect
functionality between all the ADM functions (inter-ADM cross-connect).
The XDM offers a variety of upgrade paths to increase the capacity of the ADM
mode (see Figure 3-2). There are four possibilities:
1. Replace the existing ports with higher capacity ports. (This is a non-traffic
affecting operation, provided the trails are defined as protected.)
2. Insert an additional higher capacity card and switch traffic to the new port
while in service (non-traffic affecting). For example, upgrade a 2.5 Gbit/s
ADM to a 10 Gbit/s ADM by inserting an SIO-64 and switching traffic from
an SIO-16 card.
3. Insert an additional higher capacity port to operate in tandem with the
existing port (non-traffic affecting). For example, add another port to an
existing 2.5 Gbit/s STM-16 port and obtain a 5 Gbit/s ADM.
4. Use the XDM’s integrated DWDM capabilities to increase the capacity of an
existing line. To increase the line rate, simply insert additional wavelength-
based interfaces.
ADM-16
DWDM ADM-64 Multi ADM DXC

ADM-64 ADM-16
ADM-4 ADM-16 ADM-16 ADM-16
5 Gbit/s and 10 Gbit/s and Shared Shared

up ADM up ADM tributaries tributaries
Figure 3-2: Different upgrade paths from simple ADM mode

3.1.4 Multi-ADM Mode

The simple STM 1/4/16/64 ADM mode can also be expanded to a more complex
configuration without adding additional equipment. For example, it is possible to
expand to a multi-ADM 1/4/16/64 (mixed rates) or an integrated 4/4/3/2/1 DXC and
ADMs.
The multi-ADM mode allows connecting the element to numerous other elements
where each ADM function is performed by two dedicated I/O ports (at the required
rate). The remaining functions, such as matrix, control and tributaries, are common
to all ports.
3.2 DXC Modes
3.2.1 Broadband Digital Cross-Connect Mode

(BB-DXC 4/4)
In this mode, the BB-DXC conforms to cross-connect type I and performs the
following routing, mapping, demapping, multiplexing, demultiplexing, rearranging,
grooming and consolidation functions:
From: Any incoming VC-4 or VC-4-n-c* in any incoming STM-n payload.

To: Any outgoing VC-4 or VC-4-n-c* of any outgoing STM-n interface, or any outgoing
payload with full nonblocking connectivity.
*n = 4, 8, 16, 64
If there are changes in traffic demands, operators can upgrade from this mode to the
4/4/3/2/1 mode while in service and without interrupting live traffic. No hardware
changes are required.
Table 3-1: Broadband cross-connect connectivity
VC-4-n-c-i, VC-4-I
SDH I/F A SDH I/F B PDH I/F X PDH I/F Y
VC-4ncj SDH I/F A √ √ √ √
VC-4j
SDH I/F B √ √ √ √
PDH I/F X √ √ √ √
PDH I/F Y √ √ √ √
SDH/PDH I/F A/B, X/Y – full connectivity (√) between any SDH/PDH I/F (A, X) and any other SDH/PDH I/F (B, Y).

3.2.2 Wideband Digital Cross-Connect Mode

(WB-DXC 4/3/2/1)
In this mode, the WB-DXC conforms to cross-connect type II and performs the
following routing, mapping, demapping, multiplexing, demultiplexing, rearranging,
grooming and consolidation functions:
From: Any incoming VC-12, VC-2, VC-3 and VC-4 in any incoming STM-n, or any
2 Mbit/s, 34 Mbit/s and 45 Mbit/s payload.
To: Any outgoing VC-12, VC-2, VC-3 and VC-4 of any outgoing STM-n interface, or any
outgoing 2 Mbit/s, 34 Mbit/s and 45 Mbit/s payload with full nonblocking
connectivity.
Operators can upgrade from this mode to the 4/4/3/2/1 mode while in service, and
without interrupting live traffic.
Table 3-2: Wideband cross-connect connectivity
VC-4-I, VC-3-I, VC-2-I, VC-12-I

VC-4j SDH I/F A √ √ √ √
VC-3j
SDH I/F B √ √ √ √
VC-2j
VC-12j PDH I/F X √ √ √ √
PDH I/F Y √ √ √ √
SDH/PDH I/F A/Z, X/Y – full connectivity (√) between any SDH/PDH I/F (A, X) and any other SDH/PDH I/F (B, Y).
3.2.3 Integrated Wideband/Broadband Digital Cross-

Connect Mode (WB-DXC/BB-DXC 4/4/3/2/1/0)
This is the XDM default mode that combines the capabilities of a broadband
4/4 cross-connect with a wideband 4/3/2/1 cross-connect in a single system. This
eliminates the need to purchase and operate two different cross-connect systems.
In this mode, the WB-DXC/BB-DXC conforms to cross-connect type III and
performs the following routing, mapping, demapping, multiplexing, demultiplexing,
rearranging, grooming and consolidation functions:
From: Any incoming VC-12, VC-2, VC-3, VC-4 or VC-4-n-c* (in any incoming STM-n), or
2 Mbit/s, 34 Mbit/s and 45 Mbit/s payload
To: Any outgoing VC-12, VC-2, VC-3, VC-4 or VC-4-n-c* of any outgoing STM-n
interface, or any outgoing 2 Mbit/s, 34 Mbit/s and 45 Mbit/s interface with full
nonblocking connectivity.
*n = 4, 8, 16, 64

Table 3-3: Wideband/broadband cross-connect connectivity
VC-4-n-c-i, VC-4-i, VC-3-i, VC-2-i, VC-12-i

VC-4ncj SDH I/F A √ √ √ √
VC-4j
SDH I/F B √ √ √ √
VC-3j
VC-2j PDH I/F X √ √ √ √
VC-12j PDH I/F Y √ √ √ √
SDH/PDH I/F A/B, X/Y – full connectivity (√) between any SDH/PDH I/F (A, X) and any other SDH/PDH I/F (B, Y).
3.3 Integrated DXC/TM Mode

In the integrated DXC/TM mode, a single XDM replaces an array of TMs at the
central site, operating as multiterminal cross-connects sharing common circuitry (see
Figure 3-3).
All connections to the XDM are performed remotely via ITU-T G.691, G.692 and
G.957-compliant optical trunks at STM-1, STM-4, STM-16 and STM-64 bitrates as
required. TMs are not required at the DXC site, and a single STM-n (n = 1, 4,
16, 64) slide-in unit replaces a whole TM.
N x 10 Gbit/s
N x STM-16 N x STM-16
N x 10 Gbit/s N x STM-16
N x 10 Gbit/s
Figure 3-3: The XDM in an integrated TM configuration
The integrated TM function also enables to connect the XDM to remote TM or

ADM nodes in a star topology. Neither application requires a TM on site.
Figure 3-4 shows the XDM in a multi-TM star configuration. The integrated
DXC/TM mode provides a versatile solution to any type of connectivity, alarm or
PM level.

N x STM-16
DWDM
TM-16 TM-1
STM-16 STM-1
DWDM DWDM
STM-16 STM-4
TM-16 TM-4
N x STM-16
DWDM
Figure 3-4: The XDM in a multi-TM star configuration
3.4 Integrated DXC/ADM Mode

In the integrated DXC/ADM mode, an XDM replaces an array of ADMs at the
central cross-connect site, performing multi-ADM cross-connects over a common
circuitry. This allows backbone and regional rings terminating at the central cross-
connect site to be closed and cross-connected directly via the XDM platform,
without the need for external add/drop multiplexers on site.
Ring closure on the XDM is performed via ITU-T G.957-compliant optical trunks at
various STM-1, STM-4, STM-16 or STM-64 bitrates as required. Additional ADMs
are not required at the DXC site, and two SIO-n (n = 1, 4, 16, 64) slide-in units
replace a complete ADM.
Figure 3-5 shows the physical layout of an XDM in the multiring closure mode. In
this mode, the integrated ADM function enables operators to connect a single XDM
system to multiple rings, providing robust cross-connectivity between the rings
through a very small number of high bitrate trunks.

N x STM-16
DWDM
ADM-
64 ADM- ADM- ADM-
64 4 4
ADM-
STM-64 ADM-
64 4 STM-4
ADM-
64 ADM-
4
ADM-
ADM-
N x STM-16 64 N x STM-16
4
DWDM DWDM
ADM- STM-16 ADM-1

16
STM-1
ADM- ADM-1
16
ADM-1
ADM- ADM-
16 16
N x STM-16 ADM-1
DWDM
Figure 3-5: The XDM in an integrated multi-ADM multilayer mode

(two-dimensional view)
Figure 3-6 illustrates a logical view of the same configuration.

N x STM-16
DWDM
N x STM-64
N x STM-- 64
DWDM
DWDM
Tier 1
N x STM-16
DWDM
ADM- ADM-
ADM- 64 4
64 ADM- ADM- ADM-
64
STM-64 4
STM-4
4
ADM- ADM-
ADM- ADM-
64 64
4 4
STM-16 STM-1
ADM-
16
ADM-1 Tier 2
ADM-
16 ADM-1
ADM-
ADM- ADM-1
16
16 ADM-1
Figure 3-6: The XDM in an integrated multi-ADM mode (three-dimensional view)
Additional slide-in units can support other services like traffic interlacing at the site.
The DXC/ADM mode provides a versatile solution at any connectivity, alarm and
Performance Monitoring (PM) level.
3.4.1 Grooming and Consolidation

As a broadband 4/4, wideband 4/3/2/1 or broadband-wideband 4/4/3/2/1/ cross-
connect, the XDM, managed by Lightscape Networks’ powerful eNM network
manager, offers unique grooming and consolidation features, as described in the
following sections.

Grooming
The XDM enables operators to sort data according to predetermined parameters, for
example, the separation of switched and non-switched data for distribution over
networks. Grooming can also be used to allow network operators to apply financial
parameters like differential tariffs relating to transmission quality or reliability.
Another grooming function enables individual signals arriving from any direction to
be routed via any predefined path. This facilitates optimization of individual
transmission routes in meshed networks and provides for alternative routing if a
particular path fails (see Figure 3-7).
C A
C A
C A
C A
A B A C A A A A
B A C A B B B B
A A
A C
B A A Premium Service A
A Regular Service A
C B B Service B
C Service C
Figure 3-7: XDM grooming and routing functions
Consolidation
The XDM enables operators to optimize transport media efficiency by consolidating

a large number of partially filled payload lines into a few concentrated lines. This
allows the network hierarchy to be filled to a near maximum capacity with fully
populated HO VCs. Figure 3-8 shows the XDM’s cross-connect consolidation
functions.

Figure 3-8: XDM cross-connect consolidation
3.5 Carrier-class Data Services

In today’s telecommunications industry, telecom operators and service providers
require a highly available and scalable broadband infrastructure to deliver increasing
amounts of data traffic to their customers seamlessly and transparently.
Telecommunications and networking equipment is increasingly using Gigabit
Ethernet (GbE) as the connection technology of choice for datacom. GbE addresses
the bandwidth problem in capacity-hungry networks, which are beginning to exhaust
almost all their resources due to multimedia-based Internet and intranet applications
that require high amounts of bandwidth.
The XDM provides a unique capability of migration from voice-oriented networks
to data-oriented networks by offering scalable data capabilities. It provides datacom
interfaces (GbE and concatenated STM-nc) for efficient transport of data.
Although SDH/SONET and PDH are dominant technologies in WAN environments,
Ethernet is the protocol of choice for LAN communications. Lightscape Networks’
XDM platform bridges between these two technologies by creating GbE networks
within SDH/SONET networks. It accomplishes this without sacrificing any of the
equipment reliability, robustness and Quality of Service (QoS) operators demand.
The XDM, therefore, simplifies the most complex networks, integrating into the
same platform SDH/SONET and PDH services, optical services and LAN/WAN-
based services.

n x OCH
SDH/ PSTN IP ATM Gigabit

SONET Ethernet
Figure 3-9: Multilayer, multiservice XDM platform
3.5.1 Erasing Technological Boundaries

The LAN and WAN environments differ significantly in various aspects, some of
which are:
♦ Different bitrates, interfaces and protocols – 10 Mbit/s, 100 Mbit/s, 1 Gbit/s
and 10 Gbit/s for data; 2 Mbit/s up to 2.5 Gbit/s and higher for
PDH/SDH/SONET. This demands provisioning different types of equipment
for each network environment, with the corresponding increase in expenses.
♦ Different cost of ownership – in LAN networks, the use of data is free; in
PDH/SDH/SONET networks, bandwidth is a commodity. Operators sell
bandwidth whereas service providers charge for actual bandwidth used.
♦ Different data security mechanisms – the transmission of data within
corporations or businesses does not guarantee a very strict delimitation of
packets, or in other words, security. This is not the case when data is
transmitted between large organizations across WANs.
The XDM in effect erases the boundary between data communication (LAN
environment) and voice communication (PDH/SDH/SONET environments), and
paves the way for the provision of intelligent datacom services. Operators and
service providers therefore benefit from the best of both worlds: the cost
effectiveness and universality of Ethernet, and the QoS, scalability and survivability
of SDH/SONET.

3.5.2 Optimizing the Transport Network for Datacom

Applications
Traditional SDH/SONET networks were designed to carry primarily voice. In light
of increasing demand for additional capacity, SDH/SONET are currently deployed
more and more in metropolitan and regional networks. At the same time, these
networks have to cope with a huge explosion of data traffic, where GbE is the
protocol of choice.
What is needed, therefore, is an infrastructure that combines some of the most
important features of SDH/SONET (guaranteed latency, reliability and excellent
protection), with the simplicity, high utilization, scalability and low cost of GbE.
The XDM platform accomplishes this perfectly by optimizing SDH/SONET
networks to transport GbE and providing:
♦ LAN interconnection
♦ Broadband corporate VPNs
♦ High-speed Internet access
♦ Hosting services
Figure 3-10: Data connectivity across WANs
The XDM’s data implementation is ideal for customers who want to add bandwidth
on demand based on the expected increase in their data traffic. This enables them a
“pay as you grow” infrastructure, which allows them to acquire capacity only when
they need it.

3.5.3 Application Benefits

The XDM provides bandwidth by the slice to Internet Service Providers (ISPs),
Application Service Providers (ASPs), Storage Service Providers (SSPs), data
centers, business corporations, content distribution organizations and many other
service providers.
This means that operators can divide available SDH/SONET capacity into fixed
increments and sell it to service providers, thus increasing profitability. These new
services can be offered using existing infrastructure to transmit GbE over
SDH/SONET trails, taking advantage of inherent network features, such as
protection, reliability and end-to-end management.
In turn, service providers can receive and pay for the bandwidth they need without
having to reprovision hardware for each service. This is a typical bandwidth-on-
demand application that reduces truck rolls to a minimum.
The XDM’s data implementation guarantees full connectivity and flexibility:
♦ Each GbE signal can be configured independently, providing full network
connectivity
♦ Traffic is transmitted point to point, in both ring and mesh topologies
♦ Each GbE signal is transmitted over a separate trail. This guarantees
SDH/SONET/DWDM network security levels.
The XDM platform enables service providers to increase capacity without disrupting
existing services by building a scalable, optical GbE infrastructure. The nonblocking
architecture of the XDM ensures consistent IP services throughput. In addition, link
aggregation can scale bandwidth by aggregating several logical GbE connections
into one physical link.
3.5.4 Ethernet Networking Services

The XDM’s carrier-class Ethernet networking services directly to customers in wide
area SDH/SONET networks guarantees:
♦ Simple point-to-point connectivity
♦ QoS guaranteed by inherent SDH/SONET network features
♦ No alteration of end-users’ data packets
♦ An extremely cost-effective solution
♦ Comprehensive SLA metrics
♦ SDH/SONET reliability and security levels.

Moreover, the XDM’s provides these datacentric services over fiber with broadband
flexibility and capacity. Services are therefore easy to provision and adjust, offering
customers bandwidth scalability optimized for their unique requirements.
The bandwidth allocated to GbE services is provided in VC-4 increments. The
service rate adapts to end users’ needs, allowing service providers to tailor pricing to
a finer granularity of data rates.
GbE GbE
interfaces interfaces
SDH/SONET
D DWDM D
I I
O O
Figure 3-11: XDM GbE functionality
The XDM’s technology enables to transport fractional GbE traffic from up to eight
different customers over the network cloud. It does so by mapping GbE signals into
SDH/SONET trails or DWDM wavelengths. Consequently, service providers can
create a wide range of customized service options for end users and deliver these
services over more efficient access and core networks, thus leveraging the cost-
effectiveness of GbE.
3.5.5 Configuration
The XDM implements Layer 1 transparent data transmission using a sophisticated
and intelligent card – the DIO (Data I/O) – that provides GbE over
SDH/SONET/DWDM. The DIO is a modular card that consists of a baseboard,
hardware for data processing and four plug-in, field-replaceable data modules (DMs)
for interface support.
The DIO provides control and bandwidth management allocation for each GbE
connection in VC-4 increments up to VC-4-8c (full GbE rate). Each GbE interface is
configured separately, without interfering with other connections. This flexibility
enables service providers to adapt service rates to customer needs and tailor prices
accordingly.
The DIO card supports up to eight GbE user ports and can be used in three
configurations:
♦ Up to eight GbE ports
♦ Up to six GbE ports and one STM-16 port
♦ Up to four GbE ports and two STM-16 ports.

Eight GbE ports
In this configuration, the DIO card maps up to eight GbE ports via the XDM’s
SDH/SONET HLXC matrix, providing connectivity over SDH/SONET and DWDM
networks.
This configuration is extremely cost-effective and enables a “pay as you grow”
expansion architecture as customers pay for actual bandwidth allocated rather than
for the full GbE capacity. Obviously, allocated bandwidth can also be increased or
reduced based on demand. This solution provides a very high port density at a very
low cost per port.
SDH interface XDM Backplane
GbE
GbE
GbE
GbE
HLXC
GbE Matrix
GbE
GbE
GbE
Figure 3-12: GbE over SDH/SONET/DWDM

Up to six GbE ports and one STM-16 port
This configuration is ideal to carry GbE traffic over pure optical networks. It
provides a total bandwidth of 2.5 Gbit/s.
Here the DIO card is connected directly to a transponder (via an STM-16 port), and
aggregates up to six full GbE connections over lambda.
GbE
GbE
GbE
GbE
GbE
GbE
STM-16
Figure 3-13: GbE aggregated into DWDM
Up to four GbE ports and two STM-16 ports
In this configuration, the DIO enables end users to increase bandwidth on demand
until reaching the full GbE rate. The card aggregates up to four GbE ports and up to
two STM-16 ports directly into DWDM transponders. This configuration provides a
total output of 5 Gbit/s.
GbE
GbE
STM-16
GbE
GbE
STM-16
Switch
Figure 3-14: GbE and STM-16 connection over DWDM

3.5.6 Unparalleled Functionality

The XDM’s DIO provides operators and service providers with the following
functional features:
♦ Adaptive rate control for each connection (from VC-4 to VC-4-8v in VC-4
increments)
♦ End to end lossless transmission of data
♦ Virtual concatenation. GbE traffic is mapped to standard virtual containers,
ensuring data transfer over existing SDH/SONET infrastructures
♦ Easy, point and click, end-to-end, real time, point to point connectivity, just
like any SDH/SONET trail
♦ Network protection (optional) – SDH protection mechanisms applied to each
connection
♦ Full equipment protection (optional).
Adaptive data rate control
The XDM’s DIO card features adaptive data rate control based on IEEE 802.3
standard’s backpressure mechanism.
The adaptive data rate control mechanism maps data frames into the SDH virtual
container. When the end user exceeds allocated bandwidth, the DIO activates a
mechanism that prevents exceeding the provisioned bandwidth.
End-to-end lossless transmission capabilities
In long-distance, point-to-point links, large amounts of data remain in the network at

all times, and sometimes some of the traffic is lost.
The XDM equipped with the DIO card ensures no loss of any data in transit in the
network. This feature guarantees carrier-class lossless transmission at all times.
3.5.7 Embedded Ethernet Switching

Future versions of the XDM will feature embedded Ethernet switching, which will
enable end users to share network resources over ring and mesh topologies.


Applications
The XDM platform is exceptionally versatile, allowing effective deployment in
diverse applications. It may be used in backbone and regional networks, as well as in
metropolitan applications due to the increase in intra-city traffic.
The XDM’s exceptional capacity and modularity, combined with its compact size
and economical cost, enable to cost-effectively deploy it in metropolitan and access
networks. The XDM can therefore boost service in all network tiers, backbone to
metropolitan, making it a single element solution for almost all transport
applications.
The XDM is especially valuable where the following capabilities are required:
♦ Optical gateway
♦ Full connectivity, high traffic volume hubs
♦ Multiple ring closing through single sites
♦ Various traffic types through the same infrastructure.
The XDM radically simplifies the most complex networks and can reduce the
number of NEs needed by an average of 75%. Furthermore, due to the platform’s
great flexibility and full connectivity, it assures maximum infrastructure utilization,
while accommodating the rapidly growing range of telecom services featuring a
future-proof investment.

Applications XDM™
4.1 Solving Today’s Network Problems

Lightscape Networks has closely studied the major problems of high capacity
networks at the backbone, regional and metropolitan levels. To name just a few
major issues, modern networks are over equipped, have severe traffic flow and
connectivity problems, take up vast floor space and are hard to manage. The XDM
has been especially designed to solve these and other critical transmission problems.
The following sections describe network applications that address these issues.
4.2 The XDM as an Optical Gateway

Until recently, DWDM has been highly successful in long haul networks. However,
the unparalleled pace of network expansions, especially in the access layer, is
forcing TOs to deploy optical networks in regional and metropolitan areas. This is
because they offer unlimited bandwidth over fiber, higher bitrates, and very efficient
bandwidth use and management at reasonable prices.
DWDM is also ideal to cope with the astounding increase in Internet traffic. In
addition to ATM, SDH/SONET and video, DWDM technology has proved to be
capable of transporting IP packets simply and seamlessly.
Lightscape Networks’ XDM platform offers incumbent and emerging service
providers a cost-effective solution for metropolitan networks. It enables to supply
wavelength-based services and create route diversity. The system allows operators to
start with a basic configuration and expand the system up to 80 channels on the same
fiber infrastructure as traffic needs grow.

XDM™ Applications
4.2.1 Metropolitan Access Rings

Metropolitan access rings consist of a low cost optical layer without optical
amplifiers. To achieve this capability, high power transponders and low insertion
loss OADM cards are used.
In these applications, the XDM-1000 or XDM-2000 shelves house the number of
OADM and transponders cards necessary to add/drop the required number of
channels in each node. The same type of transponder is used to transmit all types of
services (SDH, SONET, PDH, IP, ATM).
ATM
IP
SDH IP
IP SDH
ATM
ATM
Figure 4-1: The XDM-1000 and XDM-2000 in a metro application

Applications XDM™
4.2.2 Point to Point Applications

In point to point applications, the XDM carries voice and data traffic over multiple
wavelengths. Moreover, it improves capacity cost-effectively in congested regional
areas with a busy infrastructure.
SDH
SONET
PDH
ATM
CATV
Preamp. Booster
IP
Figure 4-2: Point to point application
4.2.3 Optical Add and Drop

The XDM is ideal for metropolitan applications that transmit traffic over short
distances, and where signals are added and/or dropped at network elements deployed
along the path. Figure 4-3 illustrates an add and drop application spanning 80 km.
SDH
SONET
PDH Up to 80 km
ATM
CATV
Preamp. Booster
IP
Inline amp.
+ OADM
Figure 4-3: Optical add/drop application

XDM™ Applications
4.2.4 Ring Applications

In these applications, DWDM and TDM are combined in rings with sub-lambda
connectivity.
PDH
GbE
IP over optics
GbE PDH
Figure 4-4: Ring application

Applications XDM™
4.3 The Backbone Network
4.3.1 The Conventional Backbone Problem

Conventional backbone networks have several major problems:
♦ They are over-stacked and over-equipped
♦ They are plagued by serious connectivity problems
♦ They are becoming extremely hard to manage and operate.
Over-stacking
To meet initial capacity needs, TOs typically build ring-based backbones, usually
consisting of STM-16 or STM-64 ADMs. As network demands increase, more and
more rings are stacked on the upper tier of the SDH transmission hierarchy and
transmission sites become over-equipped.
Connectivity problems
The result of stacking additional rings is a continuously growing pressure on

tandem, interconnect and hub sites. Tandem traffic typically ranges from 30% to
70%. As more rings are added, inter-ring connectivity drops sharply to almost full
blocking. This makes it increasingly difficult to transmit services from ring to ring,
and nearly impossible to operate the backbone network.
Moreover, as demand for inter-ring connectivity increases, the capacity of network
elements is wasted creating connectivity, which leaves significantly less capacity to
transmit actual data. Newly installed rings, therefore, exhaust their capacity quickly,
making them difficult to manage.
Management problems
To alleviate the connectivity problem, administrators are forced to purchase large

quantities of expensive equipment, including high bitrate ADMs, multiple
multichannel DWDM systems, and large digital cross-connects. The additional
equipment overloads the transmission sites and seriously complicates the
management, operation and maintenance of the entire network.

XDM™ Applications
4.3.2 The XDM Solution

As shown in Figure 4-5, the XDM offers backbone network connectivity and
capacity with a simple operational paradigm.
XDM backbone networks:
♦ Reduce the number of NEs required by an average of 75 % and minimize the
overall number of equipment types by a typical ratio of 5:1.
♦ Resolve bottlenecks and reduce equipment due to the system’s high capacity
and full 4/4/3/2/1 connectivity.
♦ Permit flexible design and multiservice functionality due to the XDM’s
extensive interfaces and services capability.
♦ Reduce costs.
♦ Make a highly efficient use of fibers.
♦ Free up valuable bandwidth using the XDM’s fine grooming and
consolidation capabilities.
Reduced number of NEs
The XDM’s integrated architecture combines the capabilities of multiple ADMs,

DWDMs and a large DXC, all in a single compact unit. This feature provides the
required capacity while minimizing the number of NEs by 75 % on average, and the
number of equipment types by 5:1. It also simplifies site construction and reduces
operating costs and space requirements.
Stacked rings elimination
With the XDM, TOs can easily connect sites in the backbone layer by simply adding
interfaces or expanding ports over DWDM as the demand for bandwidth increases.
This offers an effective fiber utilization and permits a minimum initial investment
with a pay-as-you-grow strategy. As a result, ADM rings are no longer necessary.
Bottleneck elimination
The XDM eliminates bottlenecks in existing backbone networks due to its inherent
high-capacity, nonblocking, full connectivity 4/4/3/2/1 granularity and multiring
interconnectivity. The XDM clears up operators’ network congestion in heavily
populated hub sites with minimum investment and maximum use of existing
infrastructure.

Applications XDM™
The XDM’s connectivity and high capacity considerably reduce the quantity and
variety of required equipment. A single XDM supports multiple trunks passing
through the same location. Separate DXCs or ADMs are not required when using the
XDM in the backbone tier. The XDM’s multilayered functionality permits
connections to the lower transmission layers without having to add equipment.
Interlayer transmission boosting
The XDM provides an ideal backbone network platform. It supports single and
multiple STM-1, STM-4, STM-16 and STM-64 interfaces, enabling operators to
design the network’s structure with minimal limitations. Thus, backbone network
connections can be planned and operated at the VC-4 level, with the additional
benefits of VC-3, VC-2 and VC-12 connectivity. In this manner, the backbone
network becomes fully transparent and nonblocking to Low Order (LO) services.
Multiservice infrastructure provision
The XDM’s concatenated interfaces and integrated service matrixes enable it to

serve as a true, multiservice backbone node.
The XDM’s high-speed trunks can be directly connected to large ATM switches and
gigabit routers, making the TO’s network cost-effective and flexible. The cost of
separate voice and data backbones can now be considerably reduced as the resources
share a single platform in a single Lightscape Netowrks–XDM-based backbone.
Bandwidth management pinpointing
The XDM platform’s advanced grooming techniques rearrange bandwidth by

transferring high order transmission into more efficient low order transmission,
significantly releasing bandwidth in the backbone trunks and tier.
Figure 4-5 compares between a conventional backbone network and its equivalent
XDM backbone network.

XDM™ Applications
ADM-4/16/64
Figure 4-5: Conventional vs. XDM backbone networks

Applications XDM™
4.4 The Regional and Metropolitan Trunk

Layers
4.4.1 The Problem

Conventional regional and metropolitan trunk networks feature:
♦ Frequent infrastructure upgrades, as new traffic requires additional rings
♦ Limited scalability and upgrade capabilities
♦ Complex infrastructure
♦ Limited connectivity between rings/sites
♦ Expensive and slow expansion capabilities.
Infrastructure limitations
Regional and metropolitan trunk networks are characterized by a wide deployment

of mesh or star-based fiber routing. The popular superimposition of rings over this
fiber network does not always suit the limitations of this infrastructure.
Frequent infrastructure upgrades
In regional networks, traffic and network structure are frequently modified to

provide additional rates and services. Traffic distribution and capacity changes are
therefore difficult to predict or prepare for.
The increase in metropolitan traffic often requires upgrading the regional rings from
STM-1 to STM-4 to STM-16 to STM-64 and the addition of new services. Unable to
quickly perform such upgrades, many TOs get caught trying to keep up with demand
and thus lose revenues.
The limitations of ADM equipment, restricted to rings designed according to initial
traffic patterns, do not allow TOs to adapt to traffic changes. Moreover, metropolitan
traffic requires full LO connectivity. With these limitations, operators have to stack
rings in different routes and between different sites, especially at the upper regional
tier. The result is a tremendously complex and hard to operate regional network.
Upgrades of ADM-4 equipment to the STM-16 line bitrates create severe intra-ring
blocking that prevents TOs from using available ring capacity for service delivery.
TOs predict that this problem may be even more severe when upgrading to the
STM-64 line bitrate.
The XDM provides LO connectivity with STM-64 line rates.

XDM™ Applications
4.4.2 The Solution

As shown in Figure 4-6, XDM regional and metropolitan trunk networks provide:
♦ Inherent scalability and upgradability that enable upgrade from the STM-1
line bitrate to N x STM-64 featuring full LO connectivity in a single platform.
♦ Flexible, easy in-service upgrade without adding new equipment/rings,
simply by changing or adding ports.
♦ A simple network solution (featuring a single equipment type and using a
single fiber pair).
♦ An extremely cost-effective regional and metropolitan solution (together with
Lightscape Networks’ µSDM-1 miniature multiplexer).
♦ Easy integration into existing networks.
Optimal match with fiber infrastructure
Since the XDM supports any network topology, it can optimally match any fiber-
based infrastructure, whether ring, mesh or star topology. Free from ADM-type
limitations, operators not only use their fiber plan better, but can now quickly adapt
to changes in traffic patterns, delivering services to customers faster and thereby
gaining more business.
Multi-tier operation
The XDM platform can concurrently support multiple upper and lower tier rings, at
various STM-N rates, providing high capacity nonblocking connectivity. It is ideal
for regional operators as it saves multiple ADMs at the hub sites. Moreover, it
enables wider use of low cost µSDM-1s instead of ADMs in the access layer, thus
lowering the cost of the metropolitan network.
Furthermore, new regional rings at all STM-N rates (STM-1/4/16/64), can easily be
integrated into the backbone network by simply installing new slide-in units into the
existing XDM system, and without changing the network’s topology.

Applications XDM™
Scalable and cost-effective migration
The XDM’s large matrix and its flexible SDH port capacity provide a flexible and
modular platform for integrated network expansion solutions. The XDM supports
many STM-1, STM-4, STM-16 and STM-64 I/Os and features flexible slot
assignment. A regional ring can also be easily upgraded to a higher bitrate by simply
changing the line card in the XDM without additional equipment.
The XDM can function as a unique ADM-64 with full nonblocking LO connectivity,
featuring a smooth STM-1 to STM-64 upgrade path with the required connectivity
for the regional and metropolitan network. It enables regional operators to serve
present and future traffic requirements by building large capacity and cost-effective
regional backbones.
Figure 4-6 depicts a conventional regional and metropolitan network and its
equivalent XDM-based network.

XDM™ Applications
Inter-regional
exchange
Inter-regional Inter-regional
exchange exchange
ADM-16
Inter-regional Inter-regional
exchange exchange ADM-64
Exchange
15 Gbit/s 15 Gbit/s
Exchange Exchange
15 Gbit/s 15 Gbit/s
15 Gbit/s
Exchange Exchange
Figure 4-6: Conventional and XDM-based regional and metropolitan network

Applications XDM™
4.5 Intra-Hub Optical Cross-Connect
4.5.1 The Problem

Traditional hub and tandem interlayer sites:
♦ Require a dense mass of cable connections
♦ Occupy vast space
♦ Require dedicated TM/ADMs for every remote traffic source
♦ Are difficult to operate and maintain
♦ Require separate management for each type of equipment and have different
operation/maintenance concepts.
Exceeding complexity
The operation, maintenance and interconnection within hub and tandem interlayer
sites are a source of major concern to TOs.
These sites are characterized by a dense tangle of cable connections, multiple
equipment types, diverse management stations and different operation concepts. All
of these elements take up valuable space, are difficult to operate and maintain, prone
to misconnection and have a general negative impact on traffic availability.
Many dedicated terminal/ADM multiplexers are required
Traditional DXC implementations require a dedicated TM or ADM for every remote

traffic source. This source can be another TM or ADM. The intra-site connection
between a DXC and TMs uses a high number of STM-1 ports in both the DXC and
the TMs, requiring a multitude of electrical cables.
Occupy enormous space
Furthermore, to release load and minimize the costs of STM-1 ports in DXC 4/1
systems, operators often establish an additional DXC 4/4 system in tandem sites,
thus adding to overall congestion and network complexity.
Traditional DXC layouts require vast floor areas. As traffic sources increase and
traffic volume expands, more and more equipment and electrical cables are added.
The tandem or hub site becomes very congested and the additional cost of floor
space in some communication centers can become a heavy financial burden on
network operators.

XDM™ Applications
4.5.2 The Solution

The XDM offers the following advantages (see Figure 4-7):
♦ Replacement of multiple electrical cables with a small number of optical
fibers.
♦ High savings in floor space and power consumption.
♦ Simplicity in network design and operation – no TMs, ADMs, DXC 4/4s or
DXC 4/1s are necessary at all. Only a single XDM shelf is required.
♦ Single network management of all (single) equipment types.
♦ Integrated smooth and safe entry into the optical layer.
♦ Low-cost solution with significant savings to TOs.
♦ Simple design and easy operability resulting in substantial savings in
operation and maintenance costs.
♦ Superior MTBF.
♦ Superior traffic availability.
Multiservice single platform
In an advanced DXC implementation, a single XDM replaces an array of TMs and

ADMs at the central site. With the XDM, all connections to the cross-connect are
performed remotely via optical trunks at various bitrates as necessary (STM-1,
STM-4, STM-16, STM-64 and higher). Thus, TMs or ADMs are not required at the
DXC site and are replaced by a single or dual SDH I/O slide-in unit. A separate
DXC 4/4 is not required as the XDM supports both 4/4 and 4/3/2/1 functions
simultaneously.
The XDM provides operators with all the benefits of an optical cross-connect,
maintaining existing infrastructure, high manageability, traditional operation and
maintenance concepts.
Figure 4-7 depicts traditional intra-nodal DXC spaghetti compared with an advanced
XDM-DXC application.

Applications XDM™
TM-16
ADM-4
DXC 4/4
ADM-4
ADM-1 DXC 4/1
TM-16
ADM-16
TM-4 TM-1
ADM-16 ADM-16
ADM-4 ADM-4
ADM-1 ADM-1
Released STM-16
space STM-16c
(new)
STM-1
STM-4c
(new)
10 Gbit/s STM-4
STM-16
Figure 4-7: Traditional intra-nodal DXC spaghetti vs. advanced XDM-DXC application

XDM™ Applications
4.6 Data Services across WANs

The XDM is the ideal platform for the transmission of data over the WANs. It
provides a transparent, seamless connection between ISPs, ASPs, SSP, data centers,
corporate businesses, content distribution organizations and many other service
providers.
With the XDM, GbE traffic is transported over any type of network, be it
SDH/SONET, pure DWDM or a combination of both. In addition, the network/s
crossed by the GbE signals may contain equipment manufactured by Lightscape
Networks or by any other vendor. Thus, the XDM’s capabilities to implement data
transmission are not limited by topology, technology or infrastructure.
Operator A Operator A
SDH SDH
D D
I Operator B I
O O
DWDM
Figure 4-8: Data connectivity over different operators’ networks

Applications XDM™
4.6.1 Corporate Network Interconnection

(GbE Leased Lines)
The XDM equipped with the DIO card is ideal for the transmission of data between
corporate offices. End users benefit from:
♦ Inherent security and reliability features of transport networks
♦ Leased line connection reliability
♦ Bandwidth on demand
♦ LAN-native interfaces.
Moreover, native GbE connectivity enables end users to save on the cost of
deploying expensive POS (Packet Over SONET/SDH) modules in their networks.
This further reduces overall equipment costs.
D Branch offices
I
O
D SDH/SONET
I DWDM
O
D
I
O
Corporate headquarters
Branch offices
Figure 4-9: Corporate network interconnections

XDM™ Applications
4.6.2 ISP/ASP Connectivity

The XDM equipped with the DIO card for GbE connectivity is a very cost-effective
solution for data-native infrastructures. It enables carriers to offer ISPs, ASPs and
other service providers instant network availability, high bandwidth, a “pay as you
grow” infrastructure and extremely fast provisioning.
D
D I
I O
PSTN
O Servers farm
SDH/SONET
DWDM
D
I
O
DSLAM D Content provider
DSLAM I
DSLAM O
Main providers facilities
Figure 4-10: ISP/ASP connectivity

Applications XDM™
4.6.3 VPNs (Virtual Private Networks) Connectivity

Another important application where the XDM takes utmost advantage of its data
transmission capabilities is in VPNs. Operating in this environment, end users
benefit from:
♦ High security levels
♦ Bandwidth allocation based on each customer’s needs
♦ Transparency (for example, any type of encryption mechanism can be used)
♦ No traffic sharing.
In these applications, data packets are not altered and/or interfered with in any way.
They are mapped into the SDH/SONET signals or DWDM wavelengths, thus
providing complete network security.
LAN C LAN C
LAN A LAN A
D
I D
O I
LAN B O
SDH/SONET LAN B
DWDM
D
I
LAN B O
LAN A
LAN C
Figure 4-11: Connectivity between VPNs

XDM™ Applications
4.7 Business Areas

The XDM’s powerful transport capability supports multiservice applications on the
same infrastructure. The XDM provides TOs with direct broadband service links
over a variety of interfaces and connection types, over both fiber and copper.
The XDM’s integration with Lightscape Networks’ access service products – the
µSDM compact ADM and the BroadGate business Network Termination (NT) units
– enables TOs to optimize network utilization by connecting ATM/IP traffic
originating from residential or business customers directly to the XDM. This
eliminates the need for separate networks.
These service systems perfectly complement the XDM trunk solution. The XDM
provides the high capacity main transport node while the micro systems provide
low-cost, dedicated service distribution. The result is a flexible, reliable and cost-
effective network solution for business and residential areas.
One XDM-1000 serving as a hub consolidation unit can support up to 192 remote
BroadGate NTs with embedded high capacity narrowband service grooming and
consolidation capabilities. This results in minimal cost per service line (see
Figure 4-12).
STM-1 STM-1 STM-1
NT 1 NT 2 . . . . . . . . . . . NT 192 mSDM-1
Figure 4-12: The XDM-1000 as a business concentrator

Applications XDM™
4.8 Cellular Applications

The cellular market is booming and operators are forced to deal with huge increases
in traffic on a daily basis. As cellular networks grow, the number of Base Station
Controllers (BSCs) increases, demanding more and more network expansions.
The XDM enables to connect several rings in the same shelf, thus reducing the
number of co-located network elements by half. Dedicated ADMs for each BSC will
no longer be necessary as the XDM achieves interconnection between rings.
The XDM turns extremely complicated cellular networks into flexible, scalable
networks, with extremely lower operational costs.
TSC
STM-16 TSC
STM-64
mSDM-1
MSC MSC MSC
STM-16/64
BSC
mSDM-1
STM-1
BSC
STM-1
mSDM-1
mSDM-1
mSDM-1
Figure 4-13: The XDM in a cellular network

XDM™ Applications
4.9 The XDM-500 in a CU Implementation

Thanks to its all-band integrated service matrixes – XC 1/0, IP, ATM – the
XDM-500 can be employed as a Consolidation Unit (CU) for BroadGate access
Network Termination (NT) units or any other vendor’s NTs (Figure 4-14). This type
of application provides an extremely low cost per service.
Metropolitan optical ring
Up to 80 optical
based NT units
Street cabinet installation
Figure 4-14: The XDM-500 acting as a CU for BroadGate or other vendors’ NTs

Applications XDM™
4.10 The XDM-500 in an ADM-64

Implementation
As shown in Figure 4-15, the XDM-500 can also be deployed as an ADM-64 with
full nonblocking LO connectivity. In this case, it features a smooth STM-1 to STM-
64 upgrade path and provides the required connectivity for regional and
metropolitan networks.
ADM-64
ADM-64 ADM-64
Figure 4-15: The XDM-500 in a TDM ADM-64 configuration

Basic System Design
5.1 Modular Design
The XDM’s modular architecture allows expansion according to market demand. A
network operator can start out with a simple, low cost system, and upgrade it to an
extremely high capacity system. This upgrade can be performed easily, in-service
and at very low cost. The XDM’s modular capabilities include:
♦ A simple procedure to add or replace a single plug-in card or expansion shelf.
This can be performed while the system is operating, and without affecting
through traffic in any way.
♦ No I/O card assignment limitation in the XDM’s shelves. The XDM’s
unlimited interface capacity and flexible assignment allow for a smooth
upgrade capability without the need to add shelves.
♦ Addition of I/O expansion shelves – connected to the switch core through
optical or electrical connections – to expand the XDM’s I/O capacity, thus
providing even higher on-site expansion capabilities.
♦ In-service upgradeability of the XDM’s I/O trunks. An optical connection
operating at a specific STM rate can be upgraded to an STM-1, STM-4,
STM-16, STM-64 or higher (via DWDM) bitrate.
♦ In-service upgradeability of the XDM’s matrix core, from the basic
96 x STM-1 equivalent matrix to a 192 x STM-1 matrix to matrixes of
384 x STM-1 equivalents and higher.
♦ Internal mechanisms and high level Built-In Test (BIT) to ensure the correct
connectivity within the switch core and between the I/Os to the switch. Since
there is no blocking of the matrix and every SIO/PIO card has direct access to
it, the XDM can support all network topologies including star, mesh, ring, and
multiple topologies.
These capabilities provide a rapid response solution to customers’ needs. With the
XDM’s pay-as-you-grow strategy, network operators can provide new services as
needed, expanding traffic capacity with minimum investment.

Basic System Design XDM™
The XDM’s subsystems are defined according to their overall functions:

♦ Optics and DWDM (described in Chapter 2).
♦ Control and communication
♦ Timing and synchronization
♦ Traffic
♦ Power feed.
5.1.1 Control and Communication Subsystem

The XDM’s control and communications subsystem is based on a fully redundant
master-slave card hierarchy and is controlled by the XDM’s Main Control Processor
(xMCP) card.
The xMCP main functions are:
♦ XDM shelf and card control
♦ Internal communication and processing
♦ Communication with external equipment and management
♦ Alarm and maintenance
♦ Software activation and backup
♦ NE configuration backup
♦ BIT.
Control subsystem
The xMCP card provides central control, alarm, maintenance and communication
functions for the XDM network element. It also communicates with the control
processors of the various cards using a master-slave control hierarchy.
The xMCP can be protected with an identical xMCP card. The redundant xMCP
contains an identical database as the active xMCP and operates as a full capability
standby control and communication card. Upon a failure of the active xMCP or a
command from the management (eNM-XDM), the standby xMCP card becomes the
active control unit.

XDM™ Basic System Design
Each xMCP unit contains a Non-Volatile Memory (NVM) backup unit that stores a
complete backup of both the system’s software and its node configuration. This
ensures that the XDM benefits from superior management and control availability.
Double redundancy for system software and configuration in every shelf can be
provided using a redundant NVM unit in the second xMCP card.
The xMCP card enables easy software upgrade using a remote software procedure
operated from the eNM-XDM management station. The xMCP can store several
different software versions at the same time, and enables a quick switch over
between the different versions when required.
The XDM’s control subsystem is separate from the traffic subsystem. In case of a
failure or extraction of the xMCP card, the traffic is not impaired. In fact, as each
card has a separate local controller, once started, the XDM can operate without the
xMCP cards. In this case, however, it loses its communication capability with the
management (see Figure 5-1).
xMCP
HLXCs I/Os CCPs Fan & power

1-2 1-12 1-11 units
Figure 5-1: The control system block diagram
Communication subsystem
The xMCP is also responsible for the communication with external network
elements and with the different management stations.
The xMCP communicates with other SDH NEs through the DCC channel embedded
in each of the SIO links. The active xMCP also provides a Q-3 interface for
Telecommunications Management Network (TMN), and an Ethernet interface to the
eNM-XDM. The xMCP can also communicate with a desktop or laptop PC-based
craft terminal (eCraft) via a serial interface.
The xMCP provides alarm outputs, Engineering OrderWire (EOW) and Overhead
Access (OHA) like the user channel (F1, F2), through multiple G.703 and V.11
interfaces.
The xMCP can provide multiple accesses to all overhead bytes in all incoming SDH
lines. In addition, it provides 64 kbit/s and N x 64 kbit/s trail capability for
transporting the management data, or DCC channels of external devices, or for
external DCN purposes.

5.1.2 Timing and Synchronization Subsystem

The XDM features a central synchronization subsystem that provides a highly
redundant, high-quality system timing to all traffic cards and functions.
The main unit in the XDM’s synchronization subsystem is the TiMing Unit (TMU)
residing in the HLXC matrix card. This minimizes unit types and reduces operation
and maintenance costs.
As shown in Figure 5-2, timing is distributed from the TMUs redundantly to all
traffic cards (I/Os and HLXCs).
The TMU units and the internal and external timing paths are fully redundant. The
high level distributed BIT mechanism ensures top performance and availability of
the synchronization subsystem. In case of hardware failure, the redundant
synchronization subsystem takes over the timing control with no traffic disruption.
In order to provide reliable timing, the XDM provides multiple synchronization
reference options. Networkwide multiple XDM systems provide a variety of
synchronization options.
Up to four of the following timing references can be monitored simultaneously by
each XDM shelf:
♦ 2 x 2 MHz external timing sources (T3)
♦ 2 x 2 Mbit/s external timing sources (T3)
♦ STM-n line timing from any SDH interface card
♦ PDH line timing from any PDH interface card
♦ Local interval clock
♦ Holdover mode.
Each input timing source has its own 8 kHz frame timing, which is delivered to the
timing generator. The TMU selects one of the timing sources as a system reference.
The timing signal is received from each of the I/O cards and is routed to the TMU
through the timing reference bus. Any SIO/PIO interface card can be selected as a
reference source, transferring an 8 kHz timing signal to the TMU. The 2.048 MHz
external clock signal is routed directly to the clock unit, where the 8 kHz component
is extracted.
The TMU provides direct control over the source selection and the frequency control
loop. It receives its source selection from the system software. The definition of the
synchronization source depends on the source quality and on the synchronization
mode according to network timing topology (set by the remote eNM).

The synchronization references are classified at any given time according to a

predefined priority and prevailing signal quality. The XDM’s synchronization
subsystem synchronizes to the best available timing source using the
Synchronization Status Marker (SSM) protocol. The TMU, a Temperature
Compensated Voltage Controlled Crystal Oscillator (TVCXO), is frequency-locked
to this source, providing internal system and SDH line-transmission timing. The
XDM is synchronized to this central timing source.
In addition, the XDM provides synchronization outputs for synchronization of
external equipment within the exchange. There are two external T4 interfaces. The
T4 interfaces may provide 2 MHz or 2 Mbit/s external timing as required. These
outputs can be used to synchronize any peripheral equipment or switch.
The operator can remotely manage network synchronization using the eNM-XDM,
and can select and determine the priority for each XDM timing source reference.
These sources can include any external reference clock, PDH line signal, SDH line
signal or internal clock, as described above. In addition, the eNM can be used to
define overall network synchronization, network synchronization maps and
alternative synchronization maps for different contingency events.
The XDM supplies a 4.6 ppm stable holdover mode when all alternative
synchronization sources are temporarily unavailable.
The XDM’s default clock accuracy corresponds to ITU-T standard G.813 at the
node level, and ITU-T standard G.803 at the network level. Optional G.812 or G.811
synchronization quality can be provided using additional external units (Figure 5-2).
T4
T3 T3
T4
TMU
TMU
I/O 1 I/O 12 HLXC-L HLXC-R
Timing reference bus
Figure 5-2: Timing distribution block diagram

5.1.3 Traffic Subsystem

The central component of the XDM is its powerful, nonblocking high-capacity,
High Level/Low Level Cross-connect matrix (HLXC card). Figure 5-3 illustrates the
XDM’s simplified overall block diagram. It provides an overview of both the
physical and functional partitioning of the system. Each of the blocks represents an
I/O slot that can accommodate any type of card, with any bitrate and service.
Examples of cards and modules are:
♦ SIO (SDH I/O) cards – STM-1e, STM-1, STM-4, STM-16, STM-64
♦ PIO (PDH I/O) cards – 2 Mbit/s, 34/45 Mbit/s, 140/155 Mbit/s
♦ DIO (Data I/O) cards – GbE (Gigabit Ethernet), Fast Ethernet
♦ Optical modules and cards – mux/demux, OADM, booster, preamplifier,
inline amplifier, OADM, transponder.
OHA AUX TMN eNM eEM

G.703
V.11 Q F f
XDM
xMCP Control P
M
elec
8 x STM-1
P
84 x E1 M
P
M
opt
16 x STM-1
P
M
16 x E3 P
M 4/4/3/2/1
opt
4 x STM-4
Cross-Connect P
P M
Core M
16 x DS-3 P
opt
M 2 x STM-16
P
M
opt
8 x GbE P
Synchronization 1 x STM-64
P
M M
2MHZ 2Mb/s STM-N 2Mb/s

34Mb/s
45Mb/s
140Mb/s
Figure 5-3: General block diagram

Figure 5-4, Figure 5-6 and Figure 5-6 illustrate typical XDM-1000, XDM-500 and
XDM-2000 card layouts.
MIO10
MIO11
MIO1
MIO2
MIO3
MIO4
MIO5
MIO6
MIO7
MIO8
MIO9
Upper
cage
MECP
Lower
HLXC-R
HLXC-L
cage
xMCP
xMCP
IO10
IO12
IO11
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
Figure 5-4: Typical XDM-1000 cards layout
MECP
MIO1
MIO2
MIO3
MIO4
HLXC-R
HLXC-L
xMCP
xMCP
IC4
IC1
IC2
IC3
IC5
IC6

MECP
MO_DW16
MO_DW16
TRP25_2
TRP25_2
TRP25_2
TRP25_2
TRP25_2
TRP25_2
TRP_10
TRP_10
TRP_10
TRP_10
TRP_10
TRP_10
xMCP
xMCP
Traffic paths data flow
The heart of the XDM is its high capacity 4/4/3/2/1 nonblocking cross-connect
matrix. As shown in Figure 5-7, the XDM shelf is constructed with two redundant
HLXC cards.
The matrix core supports 96/192/384 x VC-4 equivalents (4/4/3/2/1).

All the interface cards are connected to the central matrix in a star structure,
allowing full I/O assignment flexibility.
Each I/O card is directly connected to the matrix core (both main and protect cores),
and linked to every cross-connect direction and level. The link is fully redundant at
both the intra-shelf and inter-shelf levels (if expansion shelves are used).
D D
W W
D I/O I/O D
M HLXC M
Figure 5-7: Internal traffic flow
For redundancy purposes, the XDM supports matrix cores that operate
simultaneously, passing traffic to the peripheral I/O cards. In case of a hardware
failure in the operational switch core or in its traffic interconnections, the I/O
interface cards switch to the second core within 30 ms. Additional internal
mechanisms and a high level BIT ensure high reliability and fast switching to
protection in case of any other hardware failure.
The matrix and cross-connect capabilities
1. Cross-connect architecture and functions
All XDM cross-connect functions are performed by the central cross-connect matrix,
as illustrated in Figure 5-8. It is this architecture that enables the XDM’s outstanding
configuration flexibility.
1 1
4/4/3/2/1
192/384 192/384
Figure 5-8: The XDM’s cross–connect scheme

For redundancy purposes, there are two matrixes that operate in parallel. Each XDM
matrix permits full nonblocking connectivity at all VC levels, for both HO and LO
VCs .
The full connectivity capabilities of each matrix are available to all I/O ports, from
2 Mbit/s up to 10 Gbit/s and higher.
The main functions of the XDM matrix are:
♦ High and low order SDH cross-connect VC-12, VC-2, VC-3, VC-4, VC-4nc
order levels. Space-time matrix of 96/192/384 nonblocking cross-connects
(XC 4/4/3/2/1).
♦ Cross-connect section protection termination function. The XDM matrix core
performs MS linear and shared protection mechanisms by processing the
K1/K2 Automatic Protection Switching (APS) bytes.
♦ Overhead cross-connect. The matrix has cross-connect capability of SDH
overhead bytes (such as E1, E2, F1, F2 and unused). This capability is
available in all STM-N ports.
The high and low order SDH functionality of the XDM matrix is shown in Table
5-1.
Table 5-1: XDM equivalent matrix capacity
192 x 192 STM-1 eq. 384 x 384 STM-1 eq.

VC-12 12,096 x 12,096 24,192 x 24,192
VC-2 4,032 x 4,032 8,064 x 8,064
VC-3 576 x 576 1,152 x 1,152
VC-4 192 x 192 384 x 384
VC4-4c 48 x 48 96 x 96
VC4-16c 12 x 12 24 x 24
VC4-64c 3 x 3* 6x6
* In XDM-500 version only
In addition to its multiring support and due to its capabilities, the XDM matrix can
serve both as a medium-size DXC 4/4, as well as a large DXC 4/4/3/2/1, thus
providing a full network backbone layer digital cross-connect solution. These
capabilities are all contained in a single-shelf unit.
By providing high Operations, Administration, Maintenance and Provisioning
(OAM&P) savings, the XDM eliminates the need for separate DXC nodes.

2. Instant matrix protection and upgrade
Two matrix cores are implemented using redundant HLXC matrix cards. Both
matrix cores route simultaneously, passing traffic to the peripheral I/O cards. In case
of a hardware failure, the I/O interface card switches to the operational matrix within
30 ms.
This design enables fast and simple matrix upgrade with minimum traffic
interference. All that is required to upgrade the matrixes (for example from
HLXC 192 to HLXC 384) is simply the following:
1. Removing one of the HLXC 192 matrix cards.
2. Replacing it with an HLXC 384 matrix card.
3. Switch-assignment of the HLXC 384 matrix and rerouting the traffic from
the active HLXC 192 card to the inactive HLXC 384 card.
4. Replacing the second HLXC 192 matrix with an HLXC 384.
3. Cross-connect modes
The XDM provides several types of cross-connects as defined in ITU-T

Recommendation G.707. These include broadband, wideband and integrated
broadband/wideband cross-connects for SDH, PDH and integrated SDH-PDH
systems.
SDH cross-connection
The XDM supports the following cross-connections for SDH signals in STM-n
systems (STM-0, STM-1, STM-4, STM-16, STM-64):
1. Cross-connection of any VC-4 or VC-4nc container in any STM-n signal
directly to any other VC-4 or VC-4nc container in any corresponding
STM-m signal.
2. Cross-connection of any VC-12, VC-2 or VC-3 container in a given VC-4 of
any STM-n signal directly, to any other VC-12, VC-2 or VC-3 container in
any position of the VC-4 container of another corresponding STM-m signal.
3. Cross-connection of any VC-12, VC-2, VC-3 or VC-4 locally to any VC-12,
VC-2, VC-3 or VC-4 (local cross-connect).

SONET cross-connection
The XDM supports the following cross-connections for SONET signals in

STS/OC-n systems (STS-1, STS-3, OC-3, OC-12,OC48, OC-192):
1. Cross-connection of any AU-3 or AU-3-nc container in any STS/OC-n
signal, directly to any other AU-3 or AU3-nc container in any corresponding
STS/OC-n signal.
2. Cross-connection of any AU-3 locally to any other AU-3 (local cross-
connect).
PDH cross-connection
The XDM supports the following cross-connections for PDH signals:

1. Cross-connection of any 45 Mbit/s signal to any other 45 Mbit/s signal.
4. Cross-connection of any 2 Mbit/s signal to any position in any 34 Mbit/s
signal (using channeled E3 ports).
Datacom switching/routing
In order to provide datacom interfaces and data grooming consolidation capabilities,

the XDM can utilize statistical multiplexing from the following:
1. GbE interfaces to POS (Packet Over SONET/SDH).
2. STM-nc interfaces carrying IP traffic.
3. STM-nc interfaces carrying ATM traffic.
4. PDH interfaces carrying IP, ATM or FR traffic.
Narrowband (1/0) cross-connect
The XDM provides grooming and consolidation capabilities for partially populated
E1s. In this case, a service matrix performs 1/0 cross-connection at the 64 kbit/s
channel level.

SDH-PDH cross-connection
The XDM supports the following cross-connections for SDH-PDH signals:

1. Cross-connection of any 140 Mbit/s signal directly to any VC-4 container in
any STM-n signal (STM-1, STM-4, STM-16, STM-64 and higher).
any STM-n signal.
any STM-n signal.
4. Cross-connect types
Unidirectional and bidirectional connection
A unidirectional connection connects a single input port to a single output port in

one direction only. A bidirectional connection connects the input and an output of a
single port to the output and input of another port in both directions.
As shown in Figure 5-9, the XDM supports both unidirectional and bidirectional
cross-connects, allowing operators to switch from unidirectional to bidirectional
connection without affecting the through traffic on the unidirectional connection.
Figure 5-9: Unidirectional and bidirectional connections
Broadcast cross-connection
As shown in Figure 5-10, the XDM supports broadcast cross-connections, allowing

the input of a single port to be connected to an unlimited number of output ports.
The number of output ports is limited only by the capacity of the system and it is
possible to change any unidirectional connection to any broadcast connection
without affecting through traffic.

Figure 5-10: Broadcast cross-connection
Test circuits
The XDM facilitates the generation of test circuits that enable to monitor and control
the cross-connect system. These test circuits include monitor ports, split ports, front
end loops, matrix loops and backend loops.
Monitor Ports The XDM supports monitor ports in any existing cross-connect without
affecting the traffic through the connection. Figure 5-11 shows the XDM’s
monitor port test circuit.
Test Outputs
Figure 5-11: Monitor port test circuit diagram
Split Ports The XDM enables the creation of split ports, allowing the original
connection to be discontinued, and two bidirectional test connections
made to the ports for analysis and insertion of test signals. Figure 5-12
shows the XDM’s split port test circuit.
Original Connection
Test Input and Outpts
Figure 5-12: Split port test circuit diagram

Front-End The XDM enables physical loopbacks of any incoming line signal,
Loopback allowing a signal to be looped back before being switched through the
matrix. Figure 5-13 shows the XDM’s front-end loop test circuit.
I/O Switching I/O

Matrix
Figure 5-13: Front-end loop circuit diagram
Matrix The XDM supports logical loopbacks of any signal in the switching
Loopback matrix. Figure 5-14 shows the XDM’s matrix loop circuit diagram.
I/O Switching I/O

Matrix
Figure 5-14: Matrix loopback circuit test diagram
Backend The XDM supports physical loopbacks of any outgoing signal, allowing
Loopback the signal to loopback after it has been switched through the matrix.
Figure 5-15 shows the XDM’s backend loop circuit test diagram.
I/O Switching I/O

Matrix
Figure 5-15: Backend loop circuit diagram

XDM Interfaces and Services
The XDM is based on a robust platform that supports a wide range of voice, data
and video services via a spectrum of access, connectivity and capacity levels. These
services include:
♦ Optical
♦ Broadband
♦ Wideband
♦ Narrowband
The capability to support and aggregate a wide range of services over a variety of
technologies and media, permits operators to deploy the XDM in different
infrastructures like SDH, optical or both. This enables a smooth integration with
existing and future networks.
The XDM supports a large variety of applications as follows:
♦ Direct service over optics
♦ High Order (HO) transmission paths for high order and low order
subnetworks
♦ Low Order (LO) transmission paths
♦ Public Switched Telephone Networks (PSTN)
♦ Integrated Services Digital Networks (ISDN)
♦ Narrowband distribution and consolidation
♦ Leased lines at various bitrates, from 2 Mbit/s up to 10 Gbit/s and
wavelengths
♦ Data networks and other digital services
♦ HO transmission paths for ATM networks
♦ HO transmission paths for IP networks (for example LAN to LAN
connectivity: GbE ↔ GbE)
♦ Service over SDH via optical channels.

Diverse I/O Interfaces
The XDM supports a wide range of I/O interfaces. This flexibility provides smooth
integration with existing PDH and SDH interfaces. It also enables integration with
new and emerging technologies, including ATM, IP and digital video services. The
following XDM’s tributary interface options are supported:
♦ E1 (2 Mbit/s asynchronous mapping)
♦ E1 (2 Mbit/s byte-synchronous mapping)
♦ E1 (framed 2 Mbit/s, for example for ISDN)
♦ E3 (34 Mbit/s)
♦ DS-3 (45 Mbit/s)
♦ STS-1 (52 Mbit/s)
♦ STM-0 electrical and optical interfaces (52 Mbit/s)
♦ STM-1 electrical interface (155 Mbit/s); STM-1 optical interface (155 Mbit/s)
♦ STM-4 (622 Mbit/s); STM-4c (ATM/IP 622 Mbit/s)
♦ STM-16 (2.5 Gbit/s); STM-16c (ATM/IP 2.5 Gbit/s)
♦ STM-64 (10 Gbit/s); STM-64c (ATM/IP 10 Gbit/s)
♦ N x STM-16 (N x 2.5 Gbit/s, via DWDM, N=1...40/80)
♦ N x STM-64 (N x 10 Gbit/s, via DWDM, N=1...40/80)
♦ GbE.
And there are more interfaces in development, which will become available in future
versions of XDM products.
The I/O interfaces are fully compatible with optical ITU-T Recommendations and
ETSI standards. PDH electrical interfaces are designed according to ITU-T
Recommendation G.703. SDH optical interfaces are designed according to
ITU-T Recommendations G.691, G.692 and G.957.
The XDM enables flexible assignment of the above mentioned I/Os. Any
combination of I/O cards is allowed, provided that the total matrix capacity is not
exceeded.

Table 5-2: Single shelf interface capacity
Traffic Type Ports per card XDM XDM-C

Max. ports per single shelf Max. ports per single shelf
(12 I/O slots) (6 I/O slots)
2 Mbit/s* 84 924 336
34 Mbit/s* 8/16 88/176 32/64
45 Mbit/s* 8/16 88/176 32/64
STS-1 8 88 32
STM-1 8/16/32 96/192/368 48/96/160
STM-4 4/8 48/96 24/48
STM-16 2 24 12
STM-64 1 6 3
*The number of interfaces can be expanded to the full capacity of the matrix using an identical XDM expansion
shelf.
5.1.4 The Power Feed Subsystem

The XDM features a distributed, fully redundant power feed subsystem. Two
external power inputs are available for the XDM. Two redundant Input Filter Units
(xINFs) filter and distribute the -48 V dc or -60 V dc battery plant inputs to all
internal cards through fully redundant power buses. Each card generates its own
local voltage using high quality DC/DC converters. This distributed power concept
assures system upgrading and efficient heat distribution. It also ensures maximum
reliability of the power feed subsystem (see Figure 5-16).
48V A
DC/DC
IN A
DC/DC
INF 1 DC/DC
48V B
IN B INF 2
I/Os, HLXCs, xMCPs
Figure 5-16: Power distribution
Additional features of the power subsystem include:

♦ Supply power of 1500 W per shelf
♦ Reverse polarity protection
♦ Surge protection (2 kV line to line, 4 kV line to ground)
♦ Overvoltage protection

♦ Overcurrent and short circuit protection

♦ Redundancy and current sharing between xINF units
♦ Hot swap
♦ Power fail detection + 10 ms holdup
♦ Undervoltage detection.

Migration to XDM Networks
An existing network can easily be upgraded to reach significantly higher capacities
and connectivity levels using the XDM.
The XDM’s architecture allows Telecom Operators (TOs) to integrate it in existing
networks, thereby permitting the maximum infrastructure reuse paradigm. For
example, the addition of just a few XDM elements, strategically located in central
inter-ring sites, can boost existing network capabilities in the most cost-effective
manner.
The XDM offers a number of ways to upgrade existing networks to best fit the new
service requirements:
♦ An XDM overlay to existing transport.
♦ Mixed technology networks.
♦ A complete legacy to XDM upgrade.
♦ An XDM to XDM upgrade.
6.1 Complete Compatibility

The XDM is certainly the favorable building block of any newly established
transport network. Nevertheless, any newly established network or equipment must
interoperate and be fully compatible with existing infrastructure, especially in a
multivendor environment.
The XDM features several unique capabilities that enable it to smoothly integrate
with any legacy transport equipment from any vendor. This enables its integration at
strategic locations in existing networks, thus boosting existing infrastructure
capabilities with minimum investment.

Migration to XDM Networks XDM™
The XDM is fully compatible with Lightscape Networks’ high quality SDH/DWDM
product lines. This includes the LumiNet™ DWDM and OADM optical products,
the SDM-1, SDM-4 and SDM-16 SYNCOM™ add/drop multiplexers, the versatile
µSDM-1/4 access multiplexers, and the BroadGate™ service NT (Network
Termination) units. The eNM-XDM element manager is also fully integrated with
Lightscape Networks’ powerful network manager – the eNM – providing an end-to-
end managed network solution, from the highest capacity backbone level down to
the user access level.
6.1.1 Traffic Interoperability

The XDM is fully compliant with SDH/SONET/DWDM/ATM/IP standards and
thus is fully interoperable with any combination of other vendors’ equipment.
6.1.2 DCC Interoperability

The XDM was designed for bringing its vast capabilities to networks that are not
based on Lightscape Networks products, without interfering with their natural flow.
The DCC transparency feature allows the XDM to pass any other vendor’s DCC
transparently without overriding it.
The DCC routing feature allows routing/cross-connecting any DCC stream from any
VC-4 to any other VC-4, while utilizing effective IP routing schemes. This provides
full DCC connectivity between any vendor’s elements.
6.1.3 Management Interoperability

The eNM-XDM (XDM’s element management system) was designed as an open
system in compliance with the open CORBA standard. Utilizing the SSIM
(SDH/SONET Interface Module), the XDM can be managed through any standard
compliant NMS (Network Management System) or from Lightscape Networks’
powerful eNM. Furthermore, the eNM has a northbound interface that allows it to be
managed from a TO’s TMN (Telecommunications Management Network).
Figure 6-1 illustrates how the XDM integrates with Lightscape Networks’ existing
comprehensive network solutions. Placed at tandem interlayer or inter-ring
locations, a handful of XDM systems can boost the capability of the existing
network in terms of capacity, connectivity and operation. A single XDM serves the
transmission needs of tiers 1 and 2, and as a gateway for both optical and access
layers.

XDM™ Migration to XDM Networks
Optical layer
Optical gateway
STM-16 STM-64 Transport layer 1
STM-4 STM-16
STM-1 Transport layer 2
Access gateway
Access/Service layer
ADM-16 ADM-4
ADM-64 ADM-1
XDM DWDM
Figure 6-1: Integrating the XDM into existing SDH transmission hierarchy

6.2 XDM Overlay

Overlaying permits TOs to increase the capacity of networks without affecting
traffic. The overlay fully preserves existing infrastructure, thereby maintaining
investments. There are two possible methods to perform this procedure – physical
overlay and logical overlay.
6.2.1 Physical Overlay

An XDM network can be built in parallel to an existing legacy SDH network
significantly increasing existing capacity. This procedure can be followed by joining
the overlaid XDM systems to the NEs to provide inter-ring connectivity. The
upgrade is possible in any topology. For example, the upgrade of an ADM-16 ring to
an XDM-STM-64-based ring can easily be achieved following this procedure:
1. XDM units are placed in proximity to the ADM-16s. The XDMs are
connected, resulting in an independent STM-64 XDM ring located in parallel
to the ADM-16 ring. The new two-ring structure provides a capacity of
12.5 Gbit/s on two separate fiber pairs.
2. To provide connectivity between the rings, the co-located XDMs and
ADM-16s should interconnect via STM-1 links.
The physical overlay does not require any traffic reconfiguration, nor the
disconnection of any connection on existing ADM-16 rings, and therefore is simple
and fully nontraffic affecting.
Figure 6-2 illustrates the network before and after the installation of the XDM.

B STM-16
ring C
ADM-16
B C
STM-16
ring
ADM-16
XDM
Figure 6-2: A pure XDM overlay
6.2.2 Logical Overlay

An existing ADM ring can be integrated into a newly established XDM network
following a segment-by-segment procedure. This procedure involves converting the
existing physical fiber-optic connections to logical connections created via high
bitrate XDM links. A small amount of network provisioning is all that is required to
make the new spans operational. This link-by-link process has almost no effect on
traffic.

For example, an ADM-16 ring can be upgraded to an XDM ring by increasing the
capacity of the ring from 2.5 Gbit/s to 10 Gbit/s and above. As shown in Figure 6-3,
the upgrade procedure is very simple:
1. Installation of XDMs adjacent to existing ADM-16s.
2. Upgrading of segment AB to STM-64 by connecting the XDMs through
STM-64 I/O cards.
3. Installation of STM-16 I/O cards in all XDMs and creation of STM-16 to
STM-64 connections.
4. Disconnection of the ADM-16 aggregates in segment AB and their supply
through the STM-16 I/O cards in AB XDMs. This procedure is nontraffic
affecting due to the protected nature of the ring (50 ms switch to protection
time).
5. After the above procedure is completed, the ring is once again contiguous
and the next segment may be upgraded. The steps illustrated in Figure 6-3
are repeated for segments BC and CA.
STM-16/64
ring
B C
ADM-16
XDM
Figure 6-3: Segment AB upgrade

6. Figure 6-4 illustrates the completion of the XDM ring. The ADM-16 ring is
embedded through the XDM’s STM-64 line without any configuration
change and with minimum effect on traffic.
B C
STM-16
ring
ADM-16
XDM
Figure 6-4: Completion of the XDM ring
This upgrade mode is quick and safe. No traffic is interrupted and the network
capacity grows effortlessly to four times its original size. The virtual overlay enables
to use the fiber plan more effectively, using a single fiber pair between all sites.
6.3 Mixed ADM and XDM Network – Hub Site

Upgrade
XDMs can be integrated into existing networks with minimum or no changes to
existing installed equipment. An ideal option for such mixed technology upgrade is
the inter-ring node upgrade.
In this upgrade, operators can replace a myriad of space consuming and partly
interconnected multi-bitrate multiplexers with a single XDM shelf. This procedure
provides full inter-ring connectivity while reducing the number of NEs and
simplifying the hub site. A single installed XDM shelf therefore boosts the existing
network’s capacity significantly and at minimum cost.
For example, four ADM-16 rings with four inter-ring ADM-16s linking the rings at
the hub site can be replaced by a single XDM.
Figure 6-5 illustrates a hub site before and after an XDM upgrade.

STM-16 STM-16
ring ring
STM-16 ring
STM-16 STM-16
ring ring
ADM-16
ADM-16
XDM
eNM
Figure 6-5: Hub site before and after an XDM upgrade

Benefits of the hub site upgrade:

♦ Infrastructure reuse
− Upgraded capability to existing ADM-16 rings
− Interoperable with ADM-16 rings
− Reuse of freed ADM-16s in existing/new rings
♦ Full high order (HO) and low order (LO) connectivity between rings
♦ Large savings in space, power, cabling
♦ Simplified site and network management
♦ Improved reliability and availability.
6.4 ADM to XDM Upgrade

To radically increase network capacity and take full advantage of the nonblocking
powers of the XDM network, operators may choose to upgrade complete parts of
their network to XDM. This can be achieved in one of two ways:
♦ One for one
♦ Multiple for one (drastic reduction in the number of NEs).
6.4.1 One for One

The example depicted in Figure 6-6 shows the upgrade of complete ADM rings to
XDM rings. The upgrade process involves converting every ADM into an XDM,
one at a time or ring by ring.
The upgrade procedure
The ring upgrade procedure consists of three phases:

Phase 1: Addition of an XDM, including:
♦ NE insertion
♦ Database conversion
♦ Switching of cables and fibers to XDM.
Phase 2: ADM removal. (The ADM that is removed can be then installed
elsewhere or used as an XDM expansion shelf (in-service)).
Phase 3: Nontraffic affecting upgrade segment by segment (50 ms protection
switch).

Network without XDM Network with XDM
Replacing an NE with an XDM Additional replacements
Upgrading inter-ring nodes Complete two-ring upgrade
ADM-16
XDM
Figure 6-6: One for one ADM to XDM upgrade

6.4.2 Multiple to One (NE Reduction)

Due to the XDM’s enormous capacity, a single unit can replace several conventional
ADMs. This can significantly reduce network size, thereby simplifying the network.
For example, a six-ring network with 30 ADM-16s can be replaced with only eight
XDMs in two interconnecting rings.
♦ 30 x ADM-16 shelves
♦ Inter-ring connectivity
limitations
♦ 4-6 shelves per site
♦ Four fiber pairs in use
ADM-16
Figure 6-7: Original six-ring, 30-element ADM network
♦ 8 x XDM shelves
♦ Full connectivity
♦ One shelf per site
♦ Single fiber pair
TDM or WDM
XDM
Figure 6-8: Upgraded, equivalent XDM network

The benefits:
♦ 4:1 reduction in NE number
♦ Space/power/cost/operation/maintenance/reliability
♦ Simplicity.
6.5 XDM Upgrade

Existing XDM networks can also be easily upgraded. As all NE types/modes (TM,
ADM, DXC and DWDM) are already incorporated into the XDM and do not require
any upgrade, an XDM network upgrade focuses mainly on port or line bitrate
capacity. There are three possible methods: direct upgrade, DWDM upgrade and
layer upgrade.
6.5.1 Direct Upgrade

To make a direct upgrade, switch or replace a line bitrate card to a higher bitrate. For
example, switch an XDM’s STM-16 I/O card traffic to another STM-64 I/O card,
then replace the STM-16 I/O card with an STM-64 I/O card.

6.5.2 DWDM Upgrade

Use the XDM’s integrated DWDM unit as shown in Figure 6-9. Add wavelength-
based STM-16 or STM-64 ports to the XDM to increase the DWDM line rate up to
400 Gbit/s using 40-channel mux/demux modules.
XDM
SIO-16
W
MATRIX D
M
Booster
XDM
SIO-16
W
SIO-16 D
MATRIX
M
Booster
XDM
SIO-16
W
SIO-16 D
MATRIX
SIO-16 M
SIO-16 Booster
Figure 6-9: DWDM upgrade

6.5.3 Layer Upgrade

As shown in Figure 6-10 and Figure 6-11, TOs can gain path diversity by adding an
additional layer to existing networks without adding more equipment. By adding
SIO ports to an already installed XDM, TOs can add additional transmission layers
encapsulated within the XDM.
Path diversity (virtual rings)

through a mesh network
Encapsulated in XDM
XDM
Figure 6-10: Physical view
Optimized bandwidth for each Encapsulated in XDM

protected path
mSDM-1
XDM
Figure 6-11: Hierarchical view

Protection and Redundancy
The XDM features proven redundancy mechanisms to ensure the complete integrity
of all data transfers. The XDM’s protection scheme comprises highly reliable trail
protection arrangements, as well as equipment duplication on all units.
7.1 Comprehensive Path Protection

The XDM incorporates two independent self-healing path protection mechanisms:
1. Dual route patch protection (route diversity)
2. SubNetwork Connection Protection (SNCP).
7.1.1 Dual Route Path Protection (Route Diversity)

The XDM supports highly efficient advanced ring topologies, which provide
inherent protection in the event of any traffic-affecting circuitry or link failure. In
this mode, the protection paradigm is a self-healing path-protection scheme. The
protection switching is done at the PIO or SIO interface levels as illustrated in
Figure 7-1.
Path protection is supported by all SIO cards, and VC trail protection may be
selected from any two SIO interfaces. This flexibility enables the XDM to integrate
with other network nodes as well as end-to-end network path protection regardless
of the network topology. The XDM’s integrated path protection capability enables
operators to smoothly integrate the XDM into existing networks.

Protection and Redundancy XDM™
S/PIO
interfaces
S/PIO
S/PIO interfaces
interfaces
S/PIO
interfaces
Figure 7-1: Path protection switching in a bidirectional self-healing ring
In a bidirectional route with path protection, each TU (or AU) is transmitted

simultaneously on both STM-n lines. At the receiving node, the line interface selects
the TU from one of the two directions. It then continuously monitors the incoming
signal.
When a fault causing an alarm, such as AIS, MS-EBER or TU-BER, is detected on
the selected signal, the interface switches and selects the incoming TU (or AU) in
the other direction.
Path protection switching operates automatically in the XDM and does not require
any operator intervention or path recalculation. The result is an exceptionally fast
switch to protection performed in less than 30 ms.
Dual route path protection is topology-independent. It can be used in any complex
network topology such as multirings, chains and mesh. Protection is performed at
service end-points. This ensures service protection regardless of network topology or
intermediate equipment.

XDM™ Protection and Redundancy
Route diversity protection ensures seamless protection integration of XDM systems

with any other SDH equipment. Figure 7-2 shows the protection implementation
when integrating XDM systems with ADM-16 NEs.
ADM-16
XDM
Figure 7-2: Path diversity protection switching in a mixed equipment ring

Dual route path protection also allows the XDM to work in conjunction with other
vendors’ SDH equipment at various transmission rates, regardless of topology and
equipment (see Figure 7-3).
Vendor A
STM-1
Vendor D STM-64 STM-4 Vendor B
STM-16
XDM
ADM-16
ADM-4
ADM-1
ADM-64
Vendor C SDH interfaces
Figure 7-3: Integration with other vendors’ SDH equipment
7.1.2 SubNetwork Connection Protection (SNCP)

SubNetwork Connection Protection (SNCP) provides independent trail protection
for individual subnetworks connected to the XDM. Combined with the XDM’s drop-
and-continue capability, SNCP is a powerful defense against multifailure conditions.
By integrating SNCP into the XDM, operators achieve superior traffic availability
figures. SNCP, therefore, is extremely important for leased line or other traffic
which require superior Service Level Agreement (SLA) availability.

Leased lines are provided through single-link connections. SNCP provides the
means to protect leased-line traffic in case of failure by switching at the service
termination point.
SNCP switching operates automatically in the XDM and does not require any
operator intervention or path redefinition. The result is an exceptionally fast
protection switching performed in less than 30 ms. Typical switching time normally
takes only a few milliseconds.
A major SNCP advantage is its flexibility. SNCP is topology independent and can be
implemented with ring, chain, star, mesh and hybrid topologies.
The XDM supports SNCP at all STM-n levels (STM-1 to STM-64) and for all VC-n
objects as follows:
♦ Any VC-4 in any STM-n (STM-1 to STM-64)
♦ Any VC-4nc in any STM-n (STM-1 to STM-64)
♦ Any VC-3 in any VC-4 in any STM-n (STM-1 to STM-64)
♦ Any VC-2 in any VC-4 in any STM-n (STM-1 to STM-64)
♦ Any VC-12 in any VC-4 in any STM-n (STM-1 to STM-64).
The XDM supports SNCP types as defined by ITU-T Recommendation G.841,

SNCP/I, SNCP/N and SNCP/S, as correlated to Tandem Connection Monitoring
(TCM) functions.
♦ SNCP/I – SNC protection switching due to TU-AIS, AU-AIS, TU-LOP or
AU-OP events.
♦ SNCP/N – SNC protection switching due to TU-AIS, AU-AIS, TU-LOP or
AU-LOP events, and any other path overhead alarms (signal label mismatch,
path trace error, Excessive Bit Error Rate [EBER]).
♦ SNCP/S – SNC protection switching based on Tandem Connection
Performance Monitoring (TCMP).
The XDM enables the user to set EBER thresholds for BER and Signal Degradation
(SD) conditions. The SNCP function is complemented by the user option to set hold-
off time for switching (0-10 sec in 100 ms intervals) and Wait-To-Restore (WTR)
time of 1-30 minutes in accordance with ITU-T Recommendations G.841 and
G.842.
The eNM-XDM enables manual switch-to-protection and protection-lockout
commands. When an automatic switch occurs, a notification is sent to the
subnetwork management station. The status of the selectors and the subnetwork
connections are displayed on the eNM-XDM screen.

7.2 Multiplex Section Protection (MSP)

The XDM incorporates two independent MSP mechanisms:
♦ Linear Multiplex Section Protection (MSP-L)
♦ Multiplex Section Shared Protection Ring (MS-SPRing).
The XDM supports the MSP mode between any optical SIO interface cards. The
MS-based protection mechanism is fully automatic and is performed in less than
50 ms.
7.2.1 MSP-L – Linear Multiplex Section Protection

MS line protection is designed to protect single MS links. The MS line protection is
most suitable for protecting appendage TM/STAR links or for providing four-fiber
protection in chain topologies.
The XDM supports MS line protection in all SIO line cards (STM-1, STM-4,
STM-16 and STM-64). Both MSP 1+1 and MSP 1:1 modes are supported. As in
SNCP and path protection, in MSP mode the XDM provides protection for both
fiber and hardware faults.
Figure 7-4 shows an XDM four-fiber star with all links MS protected. This ensures
uninterrupted service even in case of a double fault. The XDM automatically
performs MSP switching within 50 ms.
Figure 7-4: MS line protection

7.2.2 MS-SPRing – Multiplex Section Shared

Protection Ring
In addition to SNCP and path protection – which may also be implemented in ring
topologies – the XDM supports the Multiplex Section Shared Protection Ring
(MS-SPRing) mode. This mode may provide bandwidth advantages for some ring-
based traffic patterns.
MS-SPRing supports any ring closed by the XDM via SIO-N cards at any bitrate, in
compliance with ITU-T Recommendation G.841. It operates in both two-fiber and
four-fiber applications. The MS-based protection mechanism is fully automatic and
is performed in less than 50 ms.
In the MS-SPRing mode, the STM-N signal is divided into working and protection
capacity per multiplex section. In case of a failure in one multiplex section of the
ring, the protection is performed by looping back the affected traffic at both ends of
the faulty section using the protection capacity for this rerouting.
MS-SPRing is designated for ring applications that demonstrate uniform or adjacent
traffic patterns. In these cases, MS-SPRing may offer significant capacity advantage
compared to other protection schemes.
Figure 7-5 shows an example of an XDM in a four-fiber Bidirectional Line Switched
Ring (4F-BLSR). If working and protect fiber pairs travel in separate ducts, the four-
fiber scheme enables to protect against multiple ring failures thus improving traffic
availability in the ring.

Figure 7-5: Four-fiber MS-SPRring protection
7.3 Traffic Protection and Restoration

The XDM also provides protection for internal traffic paths. All traffic is fully
redundant within the XDM and is routed via separate traffic paths and hardware
units. In case of equipment or line failure, traffic protection switching takes place
within 8-12 ms.
The XDM also supports mesh and ring traffic protection and restoration. The
restoration mechanism ensures traffic rerouting in the event of a major contingency.
TOs may define their own major contingencies based on individual operating
parameters. Traffic restoration time is generally dependent on the network’s
complexity and traffic load.
For more information concerning the traffic restoration feature, please refer to the
eNM General Description.

7.4 Comprehensive Equipment Protection

The XDM’s high level of reliability is achieved through comprehensive equipment
redundancy on all units.
Automatic protection switching is initiated by a robust internal Built-in-Test (BIT)
diagnostic system.
7.4.1 Common Units Hardware Protection

The XDM provides 1+1 and 1:1 protection of all common circuits, including the
following:
♦ Matrix core (HLXC)
♦ Control units (xMCP)
♦ Synchronization units
♦ Synchronization inputs and outputs
♦ Power supply
♦ FCU (Fan Control Unit).
7.4.2 Traffic Units (I/O Cards) Hardware Protection

The XDM provides 1:N (N = 1-10) protection to all PDH and SDH electrical
interfaces, and hardware protection to all SDH optical interfaces via MSP 1+1 or
1:N.
The XDM’s robust architecture permits full 1:N protection for all bitrates in a
flexible manner and at the same time. For example, the XDM can provide 1:N
protection concurrently for 2 Mbit/s, 34 Mbit/s and 155 Mbit/s cards. In addition, the
XDM provides card protection flexibility. Any protection card can be inserted into
any slot.
7.5 Optical Protection

Due to the high capacity of the traffic transmitted through DWDM systems,
protection is of utmost importance. The XDM features two types of optical
protection schemes – OMSP (line protection), and OCH (Optical CHannel)
protection.

7.5.1 OMSP (Optical Multiplex Section Protection)

The XDM features optical system protection at the fiber level based on a four-fiber
connection. This protection scheme is called OMSP (Optical Multiplex Section
Protection) and performs line and I/O protection at the optical level. This protection
scheme is similar to the SDH MSP 1+1 protection.
The OMSP is a feature added to the ALS unit to eliminate the need for additional
LOS detection mechanisms and electrical control components. Therefore, the OMSP
card supports ALS functionality and does not require an additional ALS card.
In case of a fiber cut, an optical switch in the fiber switches the system automatically
to protection mode.
This is a low cost, hardware-based implementation with a very small footprint. The
switch-to-protection time is lower than 5 ms.
NE NE
Tx Tx
Rx Rx
Figure 7-6: OMSP line protection

7.5.2 OCH Protection

The XDM provides Optical CHannel (OCH) protection very similar to the path
protection mechanism. By using double transponder cards with built-in OCH units, a
dual traffic path goes around the ring and is received by the main transponder if there
are no failures, or by the protection transponder in case of failures.
Figure 7-7 illustrates the OCH protection mechanism. The protected channels are
user-selected.
Loss of signal Loss of signal
RX Loss of data Loss of data RX

Bypass Bypass
DEMUX DEMUX
LOS LOS
LOF Control BUS LOF
FEC&PM SF
SD
Control Control SF
SD
FEC&PM
MUX MUX
Selector Selector
TX LOS TX LOS
TX TX_EN TX_EN TX
Coupler
Figure 7-7: OCH protection scheme
OCH protection is currently the most popular method of optical protection for
DWDM systems. The OCH protection mechanism transports each optical channel in
two directions – clockwise and counterclockwise. The shortest path is defined as the
main or working channel, whereas the longer path is defined as the protection
channel.
The main benefit of OCH protection is its ability to choose the shortest path as the
working path separately for each channel. There are no dedicated working and
protection fibers. Each fiber carries traffic with both working and protection signals
in a single direction.

The OCH 1+1 protection scheme provides protection for each channel separately.
The protection switch functions based on performance monitoring parameters. When
it detects a malfunction in a single channel, it automatically switches to protection
mode. This is very convenient as the user can choose the channels for protection as
well as the main or protection paths.
Switch to protection time in the OCH 1+1 protection is lower than 5 ms.

Management
8.1 Layered Architecture
Lightscape Networks’ management concept is designed with layered architecture in
accordance with ITU-T recommendation M.3010. Separate management layers
make up this management structure. The lowest, the Network Element Layer (NEL),
constitutes the embedded agent software of the network elements. The second layer,
the Element Management Layer (EML) controls many individual network elements,
while the third layer, the Network Management Layer (NML), controls all the main
network management functions (see Figure 8-1).
Figure 8-1: Lightscape Networks’ layered architecture management concept

Management XDM™
In this scheme, the eNM, Lightscape Networks’ powerful network management

system, functions at the NML level, while the eNM-XDM functions at the EML
level and is known as an Element Management System or EMS. A northbound
interface connects the eNM to your Operations Support System (OSS).
8.2 The eNM Network Manager

The eNM operates at the Network Management Level of the TMN model, working
with Lightscape Networks’ element level tools. The eNM system directly manages
the entire SYNCOM™ multiplexer family at the STM-1, STM-4 and STM-16 layers
and, via additional EMS modules, it also manages the LumiNet™ family of optical
DWDM modules, repeaters and transponders; the BroadGate™ line of NTs
(Network Termination) units and CUs (Consolidation Units); and the XDM
transport platform.
It does this by providing all facets of network management, netwide, from a single
platform: configuration, fault detection, performance management, administrative
procedures, maintenance operations, and security control.
At the core of the eNM system is a detailed network database, which is updated in
real time. This object-oriented information model incorporates features of the Q3
platform, anticipating full support of emerging ITU-T and ETSI guidelines for TMN
interoperability.
For integration into an upper-level TMN system, the eNM includes a CORBA-based
Northbound Interface, the eNI. The eNM also includes a CORBA-based southbound
protocol, the eIMI (Integrated Management Interface), which allows it to manage
third-party equipment by communicating with its management software. The
resulting integration allows you to see the third party equipment in the main
topology map, and to view all alarms in a common alarm log.
The eNM working environment combines practicality and ease of use. Its man-
machine interface is completely graphic, enabling users to fully learn and operate the
system with a minimum of training (see Figure 8-2).

XDM™ Management
Figure 8-2: The eNM’s main screen
8.2.1 Topology Management

The eNM lets network administrators commission and configure equipment in local
and remote subnetworks across the deployment. Network elements can be deployed
in a wide range of topologies – single or multiple rings with appendages, chains and
composite topologies incorporating terminal multiplexers. Users move intuitively
from an overall survey of the network landscape to detailed status and control views
of any network element, transmission level, system card or trail. You can perform
detailed fault handling, configuration maintenance and performance monitoring on
any element in the network.

Management XDM™
8.2.2 Trail Configuration

The eNM provides powerful trail configuration tools. A detailed definition of
through and local cross-connects gives administrators precise control of the system’s
structure, guaranteeing uninterrupted services and maximized use of bandwidth. In
addition to manual trail routing, the system’s Automatic Route Selection (ARS)
algorithm searches for and selects optimal end-to-end primary and protection paths
across complex topologies. A powerful trail reconstruction function polls the entire
network, keeping the eNM’s topology model up to date. The system also provides
full traffic restoration via contingency traffic plans.
8.2.3 Fault Management

The eNM simplifies real-time status monitoring of your network and its elements.
The main screen’s network diagram shows equipment status at a glance, using color-
coded icons. The main screen also has a customizable alarm listing, which is
updated in real time. Administrators can acknowledge alarms from the Current
Alarm list or click on any element in the diagram to open status windows that list
alarms for each object — NEs, cards and physical ports. With the eNM, network
administrators can assign severity levels to individual alarm parameters in specific
network elements. This means remote NEs can screen out low-level alarms, while
the network administrator analyzes the eNM’s pre-filtered and sorted daily alarm
logs.
8.2.4 Performance Monitoring

Administrators can access current performance data for each network element and
trail, recorded over 15-minute or 24-hour intervals, detailed per termination point
and sorted by logging time. Analytical tools (including graphic charts) make this
information useful in troubleshooting network elements and in optimizing QoS.
8.2.5 Troubleshooting, Maintenance and Security

The system also performs troubleshooting and maintenance operations such as
loopbacks and forced signals, and tracks them using icons on the network topology
map. To restrict user access to the eNM database and configuration tools, system
administrators can define security profiles with varying functional capabilities for
individuals and groups of users. Network partitioning (restricted access per NE
group) enables users to access logical network partitions, providing full
administration management flexibility to a pre-defined geographical domain.
Passwords, user action logs and an optional keyboard lock assure the system’s
integrity.

XDM™ Management
8.3 The eNM-XDM

The eNM-XDM functions as an element management system (EMS) in the TMN
scheme and can operate directly under the eNM. It may be co-located in the same
platform, operate as a standalone or be integrated under a non- Lightscape Networks
NMS or TMN umbrella system. The eNM-XDM can control up to 100 XDM NEs at
a time and provides a wide range of XDM management functions, including alarms,
configuration, inventory, provisioning and security management (see Figure 8-3).
Figure 8-3: The XDM shelf view as displayed in the eNM-XDM
8.3.1 Alarm Management

Current alarms are displayed in the Current Alarms screen. To keep track of past
alarms, there is an Alarms log. The system also includes a netwide alarm counter.
Alarms themselves are color-coded for alarm status at a glance. Alarms management
functions include filtering, sorting, severity assignment, printing and export via FTP.

Management XDM™
8.3.2 Configuration and Inventory Management

With the eNM-XDM, you can configure the XDM down to the shelf level as well as
take shelf inventory. The system also lets you define the hardware protection
configuration. Performance monitoring and maintenance actions can be performed
on endpoints. Inventory is displayed via an easy to use tree-like structure that shows
all cards and serial numbers.
8.3.3 Provisioning
A graphic display of the cross-connect makes editing easy. Simply point and click at
cards and endpoints, then activate. For additional ease of use, the cross-connection
window is intuitive. You can easily go from one NE to another by using an NE tree.
Traffic reconfiguration is possible on batch files.
8.3.4 Security Management

The eNM-XDM provides a fully customizable security hierarchy. You can partition
NEs by group, then limit user access to specific groups. The individual NEs
themselves have embedded passwords. Only the administrator can view and change
the passwords. For surveillance purposes, a detailed user action log is included.
8.3.5 Interfaces
The eNM-XDM supports two CORBA based interfaces:
♦ eIMI – Integrated Management Interface (to eNM)
♦ eNI - Northbound Interface (generic).
In addition, it is possible to export current alarms via FTP, retrieve daily endpoint
performance files and access the database via SQL.
eIMI
The Integrated Management Interface (eIMI) is an API based on CORBA

technology that enables the eNM to manage equipment via its element manager
application. It supports integrated topology and alarm logs and provides alarm status
indications at the top level. Via the eIMI, Externally Managed Elements (EMEs) and
their topology connections are represented in the main eNM map. Double clicking
on an EME icon launches the shelf view from the slave manager application. Shelf
activities are possible from the shelf window.

XDM™ Management
eNI
The eNI is a northbound interface to an umbrella system. It is based on CORBA

technology and complies with the Multi-Technology Network Management
information model (MTNM, previously known as SSIM – SDH/SONET
Information Model). The interface covers alarms, configuration and performance
management based on the TMF (TeleManagement Forum) effort. All major telecom
equipment vendors are represented in the TMF.
8.4 eCraft – An Advanced Web-Based Craft

Terminal
The eCraft is a PC-based XDM installation, maintenance, commissioning and
configuration tool for field technicians. This extremely easy to use product features
an advanced web-based interface and can be operated from standard browsers. It
provides rapid, direct connection to deployed NEs using a standard, simple serial
interface. The eCraft is completely version independent because all software is
embedded in the NE itself.
The eCraft includes all the functionality required by a technician arriving at a site:
full installation, NE commissioning (including slot assignment, IP routing and DCC
ports configuration) and troubleshooting. The system provides the user with a clear
view and control of NE internals: cards and objects, status and configuration. Access
from the eCraft is password-protected to ensure only authorized access to the field
installed equipment (see Figure 8-4).

Management XDM™
Figure 8-4: XDM shelf view as seen from the eCraft window

Physical Description
9.1 XDM Shelf Configurations
The XDM system is supplied with three alternate shelf configurations:
− XDM-1000 Multiservice Metro Optical Switch – this is a standard shelf
designed for high capacity central exchange applications
− XDM-500 Data Aware Access Gateway – this is a compact shelf designed for
medium interface capacities and street cabinet installations
− XDM-2000 Multifunctional Intelligent Optical Switch – designed for pure
DWDM applications.
To facilitate operation and maintenance, the XDM-1000 and XDM-500 shelves

support exactly the same card types and modules. The shelves differ only in physical
size and in the number of I/O slots supported – 12 for the standard XDM-1000 shelf
and six for the XDM-500 shelf. Figure 9-1 illustrates the XDM-1000, XDM-500 and
XDM-2000 system shelves.
Figure 9-1: XDM-500, XDM-1000 and XDM-2000 shelves

Physical Description XDM™
9.1.1 The XDM-1000 Shelf Layout
The standard XDM-1000 is located in a 285 mm deep, 450 mm wide and 1100 mm
high shelf with an upper and a lower cage section as illustrated in Figure 9-2. The
lower cage houses the I/O, matrix, processor and common cards. The upper cage
houses the electrical interface connection modules and DWDM/OADM modules.
The shelf also includes two xINF (Input Power Filter Units) and three xFCU (Fan
Control Units).
ACTIVE ACTIVE ACTIVE
FAIL FAIL FAIL
xFCU xFCU xFCU
Figure 9-2: XDM-1000 standard shelf open view

XDM™ Physical Description

The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide and 725
mm high equipment cage as illustrated in Figure 9-3. The shelf consists of a single-
row cage housing the I/O, matrix, processor and common cards in two slot areas on
either side of the shelf. The electrical interface connection modules and
DWDM/OADM modules are housed in the central slot area. The shelf also includes
two xINF (Input Power Filter Units) and three xFCU (Fan Control Units).
FAIL FAIL FAIL
xFCU xFCU xFCU
Figure 9-3: XDM-500 shelf open view


The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide and 775 mm high
equipment cage. The shelf consists of a single-row cage that houses optical cards
(transponders, mux/demux, optical amplifiers), and xMCP and MECP cards.
XDM-500 and XDM-2000 shelves may be used in conjunction with the regular
XDM-1000 shelf in the same rack.
FAIL FAIL FAIL
xFCU xFCU xFCU
Figure 9-4: XDM-2000 open view

9.1.4 Rack Layouts and Expansion Shelves

The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack. Two
XDM-1000 shelves can be installed in a 2600 mm rack, whereas a 2200 mm rack
can accommodate only a single XDM-1000 shelf. Figure 9-5 shows an XDM-1000
shelf in a standard ETSI 2200 mm rack.
Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a 2200
mm rack; and one XDM-1000 shelf and one XDM-500 or XDM-2000 shelf can be
installed in a 2600 mm rack.
Several racks can be combined to expand the I/O interface capacity of a single
XDM-1000 system shelf. In this configuration, the XDM-1000 shelf containing the
matrix core is defined as the master shelf. The other units are used as expansion
shelves, providing a capacity of up to 22,000 E1 I/O ports in a complete XDM
system. When the XDM-1000 is expanded beyond a single rack domain, an inter-
rack conduit is used for all cable and fiber interconnections as illustrated in
Figure 9-5.

Fiber Spooler
xRAP
XDM-1000 shelf
Heat Buffer
XDM-1000 shelf
FAIL FAIL FAIL
xFCU xFCU xFCU
Figure 9-5: Two standard XDM-1000 shelves installed in a 2600 mm rack

XDM-500/2000
shelf
XDM-500/2000 FAIL FAIL FAIL
shelf xFCU xFCU xFCU
XDM-1000 shelf
XDM-500/2000
shelf

FAIL FAIL FAIL

FAIL FAIL FAIL
xFCU xFCU xFCU

xFCU xFCU xFCU
Figure 9-6: Two XDM-500s or XDM-2000s Figure 9-7: XDM-1000 and XDM-500 or
in a 2200 mm rack XDM-2000 in a 2600 mm rack

9.2 XDM-1000 Standard Card Layout

The XDM-1000 standard shelf consists of an upper cage housing the connection
modules, a lower cage housing the I/O and common cards, input filters and fan
control units. The XDM-1000 standard card layout is illustrated in Figure 9-8 and
allocated as follows:
Upper Cage
− Eleven (11) slots (M-IO1 to M-IO11) allocated to electric interface
connection modules or DWDM/OADM, optical booster, optical preamp
modules
− Two xINF (Input Power Filters).
Lower Cage
− Twelve (12) slots (IO1 to IO12) flexibly allocated to I/O cards and/or
transponders (depending on the configuration)
− Two (2) slots (X1 and X2) allocated to the HLXC matrix cards
− Two (2) slots (C1 and C2) allocated to the xMCP cards.
An external connection module, the MECP, is located in the lower cage of the
XDM-1000 shelf above the xMCP cards for connecting the management, overhead
access (OHA) and Orderwire (OW) interfaces to the active xMCP card.
The upper cage contains 11 double-slot connection modules. Electrical I/O cards
installed in the lower cage interface with the XDM-1000 shelf via interface
connection modules installed in the upper cage. The modules are extractable, thus
allowing a flexible assignment of physical I/O ports.
Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and do
not require connection modules in the upper cage. The free upper cage slots in
optical systems can therefore be allocated to DWDM or OADM multiplexing and
amplification modules.

xINF
Internal Power
Filter
MIO10
MIO11
MIO1
MIO2
MIO3
MIO4
MIO5
MIO6
MIO7
MIO8
MIO9
Upper cage
Connection modules
ECB
External Control
Board
MECP
Lower cage
I/O matrix and
common cards
IO12
IO10
IO11
IO7
IO8
IO9
IO1
IO2
IO3
IO4
IO5
IO6
X2
C1
C2
X1
FAIL FAIL FAIL

xFCU
Fan Control Units
xFCU xFCU xFCU
Figure 9-8: XDM-1000 standard card layout


The XDM-500 shelf consists of a single cage containing slots for six I/O cards, four
connection modules and dedicated slots for the matrix, processor and common cards.
The XDM-500’s cage design and mechanical practice conform to international
mechanical standards and ETSI specifications. The cards are distributed as follows:
− Six (6) slots (IC1 to IC6) flexibly allocated to I/O cards and/or transponders
(depending on the configuration)
− Four (4) slots (#2-#5) allocated to electric interface connection modules or
DWDM/OADM modules
− Two (2) slots (X1 and X2) allocated to the HLXC matrix cards
− Two (2) slots (C1 and C2) allocated to the xMCP cards.
An external connection module, the MECP, is located above the xMCP cards for
connecting the management, overhead access (OHA) and Orderwire (OW) interfaces
to the active xMCP card.
MECP
MIO1
MIO2
MIO3
MIO4
IC6
IC5
IC4
IC3
IC2
X2
IC1
X1
C2
C1
FAIL FAIL FAIL
xFCU xFCU xFCU

.


The XDM-2000 shelf consists of a single cage containing two slots for mux/demux
cards and/or HXLC cards; 12 slots for transponders, optical fiber amplifiers and
other optical modules; two slots for the xMCP cards and the external connection
module, the MECP.
The XDM-2000’s cage design and mechanical practice conform to international
mechanical standards and ETSI specifications. The cards are distributed as follows:
− Twelve slots allocated to transponders and other optical modules
− Two slots allocated for mux/demux cards or for the matrix HXLC cards
(depending on the system’s configuration)
− Two slots allocated to the xMCP cards
− MECP module above the xMCP cards.
MECP
IO10
IO12
IO11
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
C2
C1
X1
X2
FAIL FAIL FAIL
xFCU xFCU xFCU

9.5 XDM Control, Matrix and I/O Cards

The XDM shelves have been designed to facilitate simple installation and easy
maintenance. They incorporates the following layout features:
− The connection modules in the upper cage (XDM-1000 shelf) are located as
close as possible to the I/O cards in the lower cage.
− The HLXC-L and HLXC-R matrix cards are located near the shelf’s side wall
to facilitate the routing of the traffic buses to the I/O cards.
− The xMCP control cards are located such that they simplify the identification
of any control problem issues.
− The MECP unit is located above the xMCP cards to facilitate the routing of
the external management interfaces.
9.5.1 Hi-Lo Cross-Connect Matrix Cards (HLXC)

The XDM contains two identical Hi-Lo Cross-Connect Matrix Cards (HLXC). Both
cards perform the cross-connect and node synchronization functions simultaneously
in a 1+1 protection configuration. In case of a hardware failure in the operational
HLXC or its traffic interconnections, the I/O interface cards switch to the backup
HLXC within 50 ms. Similarly, in case of a hardware failure in the TMU of the
operational HLXC, the backup TMU takes over the timing control with no traffic
disruption. The operational HLXC card is determined by the eNM network manager.
9.5.2 Main Control Processor Cards (xMCP)

The xMCP cards perform the XDM’s communications, control, alarm and
maintenance functions. An additional xMCP card may optionally provide full
capability 1:1 protection since the standby xMCP has an identical database to the
active xMCP. Upon a failure of the active xMCP, the standby xMCP card becomes
the active control unit.

9.5.3 MECP (Main Equipment Control Panel)

The MECP connects the management, overhead access (OHA) and Orderwire (OW)
interfaces to the active xMCP card. The physical management connections are
provided by the ECB (External Connection Board) located above the MECP.
In addition, the MECP generates system alarms and activates indicators, for example
software downloads, restarts, configurations, etc.
9.5.4 ECB (External Connection Board)

The ECB provides the physical interface between the XDM and external
management and clock devices.
9.6 I/O Card Installation

Twelve slots are available in the XDM-1000 standard shelf and six on the XDM-500
shelf to accommodate the various types of I/O cards. All of the XDM’s I/O cards are
fully interchangeable in both the standard and compact shelves, and can be inserted
in any slot without any restriction.
Three IOP (Input-Output Protection) cards can be used simultaneously for the
different electrical interfaces (i.e., E1, DS3, STM-1), and any slot in the XDM shelf
is configured with a protection card for up to three other cards of the same type.
Table 9-1 details the XDM’s I/O card data configurations.

Table 9-1: I/O basecards data for XDM-1000 and XDM-500 systems
Card Ports/Bitrate Total Interfaces

Card XDM
Electrical
PIO2_84B 84 x E1 (2 Mbit/s) PDH balanced interfaces 84 924
PIO2_84U 84 x E1 (2 Mbit/s) PDH unbalanced interfaces 84 924
PIO345_16 16 x E3/DS3/STS-1 (34/45/52 Mbit/s) interfaces 16 176
PIO345_16C 13 x E3/DS3/STS-1 (34/45/52 Mbit/s) and 3 channlized x 16 176
E3/DS3/STS-1 interfaces
PIO345_8 8 x E3/DS3/STS-1 (34/45/52 Mbit/s) interfaces 8 88
PIO345_8C 5 x E3/DS3/STS-1 (34/45/52 Mbit/s) & 3 channlized x 8 88
E3/DS3/STS-1 interfaces
Optical
SIO16 *1 1 x STM-16 (2.488 Gbit/s) interface 1 12
SIO64 1 x STM-64 (10 Gbit/s) interface 1 12
Mixed
SIO1&4 Supports various electrical (e) and/or optical (o) interfaces as follows:
− 16 x STM-1o 16 232
− 16 x STM-1e 16 176
− 8 x STM-1e + 8 x STM-1o 16 184
− 4 x STM-4 4 48
− 12 x STM-1o + 1 x STM-4 13 156
− 8 x STM-1o + 1 x STM-4 9 108
SIO1&4ex Supports various electrical (e) and/or optical (o) interfaces as follows:
− 16 x STM-1e + 16 x STM-1o 32 408
− 16 x STM-1e + 4 x STM-4 20 224
− 8 x STM-1o + 4 x STM-4 12 144
− 12 x STM-1o + 8 x STM-1e + 2 x STM-4 22 256
− 8 x STM-4 8 96
Data
DIOGE1_8*2 8 x Gbit/s Ethernet 8 24-96
*1 SIO16 can be supplied with 1 or 2 STM-16 ports. Each port requires a separate optical module.
*2
DIOGE1_8 supports up to 8 x Gbit/s Ethernet ports.

9.6.1 Electrical Interface Connection Modules

Electrical I/O cards are assigned an interface connection module as indicated in
Table 9-2. This module serves as the I/O card’s electrical line transceiver and is
connected to the I/O cards via the XDM’s backplane. For example, when 11
PIO2_84 I/O cards are installed in the XDM-1000 lower cage, 11 M2_84xx
connection modules should be installed in the upper cage. In this case, if hardware
protection is required, one PIO2_84 I/O card can be configured as the protection
card and the corresponding protection connection module M2_84P I/O is installed in
the appropriate slot of the XDM-1000’s upper cage.
I/O slot 12 is always configured as a pure optical slot without an upper cage module.
Table 9-2: Connection module data for electrical I/O cards
I/O Card Bitrate I/O Module Interface Function

Mbit/s Ports Type
SIO1&4 155 16 M1_16 SDH electrical Connection module
SIO1&4ex M1_16P Connection module with
protection
M1_8 SDH electrical Connection module.
PIO345_16 34/45/52 16 M345_16 PDH Connection module
PIO345_16C M345_16P PDH Connection module with
protection
PIO345_8 34/45/52 8 M345_8BT PDH Connection module
PIO345_8C M345_8DI PDH Connection module
M345_8BN PDH Connection module
PIO2_84B 2.048 84 M2_84B PDH Balanced (120 Ω)
connection module
M2_84BR PDH Balanced (120 Ω)
connection module without
protection (reduced
functionality).
M2_84P PDH Connection module with
protection
PIO2_84U 2.048 84 M2_84U PDH Unbalanced (75 Ω)
connection module.
M2_84UR PDH Unbalanced (75 Ω)
connection module without
protection (reduced
functionality).
M2_84P PDH Connection module with
protection

9.6.2 I/O Card Optical Transceiver Modules

Optical I/O cards utilize a slide-in optical transceiver module. This module is
directly plugged into the I/O cards for signal interfacing. Table 9-3 details the
specifications for installing XDM optical transceiver modules.
Table 9-3: Optical transceiver module data for optical I/O cards
I/O Card Optical Connector I/O Ports per Modules per Ports per
Module Type Optical Module I/O Card I/O Card
SIO1&4 OM01_4 LC 4 4 16 x STM-1
OM04_1 SC 1 4 4 x STM-4
SIO1&4ex OM01_4 LC 4 4 16 x STM-1
OM04_1 SC 1 4 4 x STM-4
OM04_2 LC 2 4 8 x STM-4
SIO16 OM16_1 SC 1 2 2 x STM-16
SIO64 OM64_1 SC 1 1 1 x STM-64
9.7 DWDM Modules

Optical I/O cards do not require connection modules for signal interfacing and the
free slots can be assigned to DWDM modules for multiplexing and amplification of
optical I/O card signals. The XDM-1000’s upper cage can house up to 11 of these
modules. Table 9-4 details the specifications of the DWDM modules.

Table 9-4: DWDM module data
Module Number Conn. Width Function

of I/O Type (Modules)
Ports
MO_DW16MDR-SA 16 LC 2 Mux star, demux AWG, 16 red
channels
MO_DW16MDRE-SA 16 LC 2 Mux star, demux AWG, 16 red
channels, expandable to 32 channels
MO_DW16MDB-SA 16 LC 2 Mux star, demux AWG, 16 blue
MO_DW16MDR-SG 16 LC 2 Mux star, demux diffraction grating,
16 red channels
MO_DW16MDRE-SG 16 LC 2 Mux star, demux diffraction grating,
16 red channels expandable to 32
channels
MO_DW16MDB-SG 16 LC 2 Mux star, demux diffraction grating,
16 blue channels, expandable to 32
channels
MO_DW16MDR-ST 16 LC 2 Mux star, demux thin film, 16 red
channels
MO_DW16MDRE-ST 16 LC 2 Mux star, demux thin film, 16 red
MO_DW16MDB-ST 16 LC 2 Mux star, demux thin film, 16 blue
MO_DW40MC-S 40 LC 2 Mux star, 40 channels C band
MO_DW40MCE-S 40 LC 2 Mux star, 40 channels C band,
expandable to 32 channels
MO_DW40MC-A 40 LC 2 Mux AWG, 40 channels C band
MO_DW40MC-G 40 LC 2 Mux diffraction grating, 40 channels
C band
MO_DW40DC-S 40 LC 2 Demux star, 40 channels C band
MO_DW40DC-A 40 LC 2 Demux AWG, 40 channels C band
MO_DW40DC-G 40 LC 2 Demux diffraction grating, 40
channels C band
MO_OADM4G_01 4 SC 2 Optical add/drop multiplexing of
4 grouped channels
MO_OADM4F_01 4 SC 2 Optical add/drop multiplexing of 4
fixed channels
MO_BAC 2* SC 1 Optical DWDM booster, C band
MO_PAC 2* SC 1 Optical DWDM preamplifier, C band
*
One input port and one output port.

9.8 DWDM Basecards

Module Width Description/Function
(Slots)
DW16MDR-SA 1 Mux star, demux AGW, 16 red channels
DW16MDRE-SA 1 Mux star, demux AGW, 16 red channels, expandable to 32 channels
DW16MDR-SG 1 Mux star, demux diffraction grating, 16 red channels
DW16MDRE-SG 1 Mux star, demux diffraction grating, 16 red channels expandable to
32 channels
DW16MDB-SA 1 Mux star, demux AWG, 16 blue channels
DW16MDB-SG 1 Mux star, demux diffraction grating, 16 blue channels
DW40MC-S 1 Mux star, 40 channels C band
DW40MC-A 1 Mux AGW, 40 channels C band
DW40MC-G 1 Mux, diffraction grating, 40 channels C band
DW40DC-A 1 Demux AWG, 40 channels C band
DW40DC-G 1 Demux diffraction grating, 40 channels C band
TRP25_2 1 Baseboard for two 2.5 Gbit/s transponders
TRP10 1 10 Gbit/s transponder with outband FEC
OPM 1 Optical Performance Monitor for four fibers
ALS/OMSP 1 Automatic Laser Shutdown in conjunction with OMS Protection
ALS/OMSP-A 1 Automatic Laser Shutdown and OMS Protection including
attenuators
ALS-A 1 Partial assembly of the ALS/OMSP card with ALS circuits only and
attenuators
GOADM_4 1 Grouped OADM with four (4) equalization filters and four (4)
attenuators
OFA_2 1 Baseboard for two gain blocks (for booster, preamplifier or inline
amplifier modules)
OFA_1 1 Baseboard with one gain block (for booster, preamplifier or inline
amplifier modules), including midstage

9.8.1 Transponders Slide-in Modules

Module Description/Function Assembled In
OM25_V5xx Transmitter type V, 1 dBm, 1800 ps/nm TRP25_2 transponder baseboard
OM10_V5xx Transmitter type V, 1 dBm, 700 ps/nm TRP10 transponder baseboard
OM25_B5xx Transmitter type B, 0 dBm, 3000 ps/nm TRP25_2 transponder baseboard
OM10_B5xx Transmitter type B, 0 dBm, 1400 ps/nm TRP10 transponder baseboard
OM25_VL5xx Transmitter type VL, 1 dBm, 10,800 ps/nm TRP25_2 transponder baseboard
OM25_X5xx Transmitter type X, 5.5 dBm, 1800 ps/nm TRP25_2 transponder baseboard
OM25_S3 Transmitter type S3, -5 dBm, 200 ps/nm TRP25_2 transponder baseboard
OM10_S3 Transmitter type S3, -5 dBm, 100 ps/nm TRP10 transponder baseboard
OM25_A Type A (APD) receiver TRP25_2 transponder baseboard
OM10_10 Type A (APD) receiver TRP10 transponder baseboard
OM25_P Type P (PIN diode) receiver TRP25_2 transponder baseboard
OM10_P Type P (PIN diode) receiver TRP10 transponder baseboard
9.8.2 Optical OFA Modules

Module Description/Function Power Dissipation (W)
OM_PBC Optical booster 40
OM_PAC Optical preamplifier 34.5
OM_ILC_23 Optical inline amplifier, 23 dB gain 33.5
9.9 DIO Card and Modules

The DIO consists of a basecard and sockets for installing four slide-in data interface
modules (DMs). One or two optical transceivers can be mounted on each module.
Table 9-5 details the specifications for installing data interface modules on a DIO
basecard.

Table 9-5: DIO card data interface modules (DMs) and optical transceivers (Tx/Rx)
DM Tx/Rx sub- Conn. Tx/Rx Ports per Function

module Type per DM DIO Card
DMGE_2(1) OMGE_1SX LC Up to 2 Up to 8 1000Base-SX (850 nm)
Ethernet interface(3)
OMGE_1LX LC Up to 2 Up to 8 1000Base-LX (1310 nm)
Ethernet interface(3)
DM16_1(2) DOM16_I3 LC 1 Up to 2 External STM-16
interface
(1)
Up to 4 DMGE_2 data interface modules can be installed in DIO card sockets 1 to 4.
(2)
Up to 2 DOM16_I3 data interface modules can be installed in DIO sockets 1 and 3.
(3)
Mixed 1000Base-SX and 1000Base-LX Ethernet ports on a data interface module are available.

Maintenance
The XDM is a fully redundant all-in-one system. It eliminates and replaces
interconnections and cables with a few ultra-reliable optical connections in a self-
contained integrated package. XDM therefore provides an inherent high reliability
and the following operating features:
♦ The redundancy of all subsystems and optional switchover to protection offer
the operator uninterrupted service.
♦ The XDM’s elaborate alarms system detects and reports transmission and
equipment malfunctions.
♦ Loopback capabilities on the transmission interfaces and a sophisticated
Built-In Test (BIT) feature facilitate quick and accurate fault location,
minimizing Mean Time-To-Repair (MTTR).
♦ Maintenance configuration functions are controlled by the management
system and any management function performed at the EMS level can be
performed also at the NMS level.
10.1 Short Mean-Time-to-Repair (MTTR)

The following XDM features ensure a minimum MTTR, minimizing the probability
of service interruptions:
♦ Automatic performance monitoring and BIT mechanism for fast and accurate
fault isolation
♦ Internal diagnostic capability and automatic switchover to protection
equipment
♦ Remote diagnostics activation and control by the eNM-XDM
♦ Efficient fault location at the element, card and component levels
♦ Replacement of cards and modules under power
♦ Remote installation of new software versions through management interfaces
with minimum effect on traffic.

Maintenance XDM™
10.2 Built-In Test (BIT) Overview

The BIT hardware and its related software assist in the identification of any faulty
card in the system. The BIT outputs provide:
♦ Management reports
♦ Redundancy switching
♦ System reset
♦ Maintenance alarms
♦ Bypass (when applicable)
♦ Fault detection.
On-card dedicated test circuits under the control of an integrated software package
implement the BIT procedure.
The XDM's Main Control Processor (xMCP) cards perform the BIT procedures on
all signal paths and buses. The xMCPs also monitor the slave processors on the other
XDM cards by means of test messages.
A BIT program is automatically activated after the XDM is switched on. It is
performed for both the initialization and normal operation phases. The operator can
stop its execution (and also restart it) from the eNM's system options menu.
BIT testing covers general tests, including card presence tests and periodic sanity
checks of I/O card processors. It also covers traffic path tests, xMCP environment
tests, data tests, and more. The BIT detects traffic-affecting failures as well as
failures in other system cards. These include invisible failures in nonoperating
redundant cards.
10.3 Tandem Connection Monitoring (TCM)

Modern transmission networks are made up of a patchwork of subnetworks owned
by different national and international operators, with traffic paths passing through
multiple operator domains. In day-to-day operation, operators handle thousands of
individual traffic paths, which cross their own and other operator domains with
different Service Level Agreements (SLAs).
When a signal degeneration occurs, operators need to identify the liable operator to
compensate for the deterioration of service. It is therefore critical to have the ability
to pinpoint in which domain a fault has occurred. TCM enables the localization of
traffic deterioration, enabling an operator to determine whether the deterioration has
occurred in its domain or not.

XDM™ Maintenance
The TCM function is fully integrated into the XDM. It supports the TCM function
for both, low order and high order trails (VC-12, VC-2, VC-3, VC-4). The XDM
also supports SubNetwork Connection Protection (SNCP/S), which is based on
TCM data. The TCM operates as follows:
1. The TCM creates a “snapshot” of the trail’s status as reflected by its path
overhead when the trail enters the administrative domain.
2. The “snapshot” is then added to the path overhead.
3. When the trail exits the administrative domain, its current status is compared
with the snapshot’s content.
4. It can then be determined whether or not the trail was impaired within this
domain.
5. The results are reported to the element and network management systems.
Figure 10-1 illustrates a cross-connect network with a trail passing through an

administrative domain. TCM is enabled at the trail's entry and exit points.
Figure 10-1: Tandem Connection Monitoring (TCM)

Maintenance XDM™
10.4 The Alarms System

Alarms generated by the XDM are classified as follows:
♦ Transmission alarms – alarms associated with a malfunction of any of the
transmission paths. The XDM supports the full set of alarms specified by
ITU-T Recommendation G.783.
♦ Timing alarms – alarms associated with a malfunction of any of the XDM
timing sources.
♦ Equipment alarms – alarms associated with any hardware malfunction.
The network administrator assigns severity levels to each alarm type. The severity
levels are:
♦ Critical – an alarm that requires immediate attention at all times.
♦ Major – an alarm that does not require attention outside normal working
hours, but gives notice that attention is required.
♦ Minor – an alarm that does not require attention after normal hours.
♦ Warning – malfunction warning or unreleased maintenance action.
In addition to the management interfaces listed above, several other optional means
can be provided for alarms control and display. These include:
♦ Local displays, including LEDs that indicate malfunctions of specific plug-in
units or transmission paths.
♦ Alarm contacts, which deliver critical, major, minor and warning alarm
indications to the station alarm bus.
♦ Rack alarm buzzer with station acknowledgment mechanism.
♦ Alarm server, which delivers the network aggregated alarms from the eNM to
the operator's Central Monitoring Station (CMS).
♦ Alarm inputs from in-station devices such as security sensors, fire detectors,
external monitoring equipment and other in-station telecommunication
equipment like flexible multiplexers and DWDM units.

XDM™ Maintenance
10.5 Troubleshooting
In the event of an alarm, troubleshooting procedures are used to determine the
severity and location of the problem and the appropriate alarm clearing procedure.
Alarms are handled first by severity and then by type. Listed below, in order of
priority, are the alarm types:
♦ Equipment alarms
♦ Transmission alarms
♦ Timing alarms.
Each card is a standalone unit. By adopting Lightscape Networks’ modular system

concept, the customer's planning and maintenance personnel achieve flexible and
efficient operation. By following a simple procedure, maintenance personnel can
quickly replace faulty cards or other assemblies. Faulty units should then be
sent/shipped for repair to the assigned Lightscape Networks Customer Support
Center. The XDM's easy maintenance concept allows the user to perform these
repair and test actions:
♦ Connect or disconnect cable fibers to or from the XDM
♦ Remove or insert any cards in the XDM card cage when power is on
♦ Connect or disconnect power cable(s) to or from the system
♦ Perform system test procedures
♦ Remove or insert I/O modules
♦ Remove or insert optical modules.

Maintenance XDM™

Specifications
11.1 Cross-Connect Specifications
11.1.1 Cross-Connect Levels

Cross-connect levels......................................................... VC-4nc, VC-4, VC-3, VC-2, VC-12
11.1.2 Cross-Connect Capacity

Switch core options ................................................................ 96/192/384 x STM-1, 4/4c/3/2/1
Optimal DXC 1/0 ................................................................................. …n x 252 x VC-12 1/0
11.2 Traffic Protection

Applicable specifications .......................................................................... ITU-T G.841, G.842
SNCP I/N/S LO, HO ............................................................................................ within 30 ms
MSP 1+1, 1:N ....................................................................................................... within 50 ms
MS-SPRing ........................................................................................................... within 50 ms
11.3 Redundancy
1:1 duplicated .............................................................. control system, synchronization system
1+1 duplicated ........................switching matrix, power system, internal buses, external buses
I/O modules protection .................................................................................... 1:N (N=1 to 10)

Specifications XDM™
11.4 Synchronization
There are four timing references available from multiple timing sources:
− 2 MHz, 2 Mbit/s, 34 Mbit/s, 45 Mbit/s, 140 Mb/s, STM-1, STM-4, STM-16, STM-64.
− External 2 MHz / 2 Mbit/s timing outputs (2 per shelf).
− Synchronization Status Message (SSM) support.
− G.813 internal clock.
11.5 Jitter and Wander

Applicable specifications .......................................................................... ITU-T G.823, G.825
11.6 I/O Interfaces
2 Mbit/s
Physical level............................................................................................... G.703, Paragraph 6
Bitrate ........................................................................................................2048 kbit/s ±50 ppm
Frame options ..........................................................................Unframed, G.704, I.431 (ISDN)
Line code ..........................................................................................................................HDB3
Line impedance .................................................................... 120 Ω balanced/75 Ω unbalanced
34 Mbit/s
Bitrate ......................................................................................................34368 kbit/s ±20 ppm
Frame................................................................................................................................ G.751
Line code ..........................................................................................................................HDB3
Line impedance ...............................................................................................75 Ω unbalanced

XDM™ Specifications
45 Mbit/s
Bitrate ......................................................................................................44736 kbit/s ±20 ppm
Frame................................................................................................................................ G.751
Line code ...........................................................................................................................B3ZS
Line impedance ...............................................................................................75 Ω unbalanced
140 Mbit/s
Physical level................................................................................................ G.703 Paragraph 9
Bitrate ...................................................................................................139264 Kbit/s ±15 ppm
Frame................................................................................................................................ G.751
Line code .............................................................................................................................CMI
STM-1 Electrical
Physical level............................................................................................. G.703, Paragraph 12
Bitrate ................................................................................................. 155.520 Mbit/s ±20 ppm
Frame................................................................................................................................ G.707
Line code .............................................................................................................................CMI
STM-1 Optical
Physical level...................................................................................................... G.957, Table 2
Wavelength................................................................................................... 1310 nm, 1550 nm
Short haul, long haul bitrate .............................................................. 155.520 Mbit/s ±4.6 ppm
STM-4 Optical
Wavelength................................................................................................... 1310 nm, 1550 nm
Short haul, long haul, very long haul, ultra long haul bitrate................... 622 Mbit/s ±4.6 ppm

STM-16 Optical
Wavelength.................................................................................................. 1310 nm, 1550 nm
Short haul, long haul, very long haul, ultra long haul, DWDM (G.692) bitrate
............................................................................................................. 488.32 Mbit/s ±4.6 ppm
STM-64 Optical
Physical level.......................................................................................... G.691, G.957, Table 5
Wavelength.................................................................................................. 1310 nm, 1550 nm
Short haul, long haul, very long haul, DWDM (G.692) bitrate ............. 9952 Mbit/s ±4.6 ppm
11.7 Management
Applicable specification................................................................................................... G.784
eNM (ECI Network Manager) .................................................................. on SUN workstation
eNM-XDM (XDM element manager) ...................................................... on SUN workstation
eCraft .................................................................................................................on PC or laptop
11.7.1 Management and Alarm Interfaces

CMIP* over TCP/IP to eNM-XDM; MTNM (SSIM) to TMN; RS-232 to eCraft; OverHead
Access (OHA); Orderwire; Rack Alarm Panel.
11.7.2 Alarm and Performance

Performance concept ............................................................................................ G.821, G.826
Alarm concept .................................................................................................................. G.783
Alarm types ................................. LED indicators, dry contacts, audible alarms (per subrack)
Alarm classes......................................................................... Critical, Major, Minor, Warning

11.8 SDH Interfaces
11.8.1 SDH STM-64 I/O Card – 9953.280 Mbit/s ±4.6

ppm
CARD NAME SIO64V5 SIO64L5 SIO64S5
APPLICATION CODE V-64.2b* L-64.2b* S-64.2*
Operating Wavelength (nm) 1530-1565 1530-1565 1530-1565
TRANSMITTER
Source Type EML + Booster EML EML

Min. mean launched power (dBm) +12 +1 -1
Max. mean launched power (dBm) +15 +3 +1
Min. extinction ratio (dB) 10 10 8.2
RECEIVER
Min. sensitivity (dBm) -23 -23 -14

Min. overload (dBm) -9 -9 +1
Max. optical path penalty (dB) 2 2 2
Max. reflectance of receiver (dB) -27 -27 -27
OPTICAL PATH BETWEEN S & R
Max. attenuation range (dB) 33 22 11

Min. attenuation range (dB) 22 10 0
Max. dispersion [ps/nm] 2400 1600 800
Min. optical return loss of cable (dB) 24 24 24
Max. discrete reflectance (dB) -27 -27 -27
*All SIO-64 optics are also available for DWDM applications as per the ITU-T G.692 standard grid
(n = 1-40).

11.8.2 SDH STM-16 I/O Card – 2488.320 Mbit/s ±4.6

ppm
CARD NAME SIO16 SIO16 SIO16 SIO16 SIO16 SIO16 SIO16 SIO16
Wn VL5 X5 V5 L5 S5 S3 I
APPLICATION CODE V16.2 VL-16.2 X-16.2 V-16.2 L-16.2 S-16.2 S-16.1 I-16
Operating wavelength (nm) n* 1530- 1530- 1530- 1530- 1530- 1270- 1270-
1560 1560 1560 1560 1560 1360 1360
TRANSMITTER
Source type SLM SLM SLM SLM SLM SLM SLM MLM
Max. -20 dB width (nm) 1 1 1 1 1 1 1 -
Max. RMS width (nm) - - - - - - - 2
Min. side mode suppression (dB) 30 30 30 30 30 30 30 -
Min. mean launched power (dBm) +2 +1 +5 +1 -2 -5 -5 -3
Max. mean launched power (dBm) +3 +2 +9 +5 +3 0 0 -10
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 8.2 8.2 8.2 8.2
RECEIVER
Min. sensitivity (dBm) EOL -31 -31 -31 -31 -28 -18 -18 -18
Min. overload (dBm) -8 -8 -8 -8 -8 0 0 -3
Max. reflectance of receiver (dB) -27 -27 -27 -27 -27 -27 -27 -27
Max. dispersion [ps/nm] 1800 12800 2300 1800 1800 1200 - 12

Min. optical return cable loss (dB) -24 -24 -24 -24 -24 -24 -24 -24
Max. discrete reflectance (dB) -27 -27 -27 -27 -27 -27 -27 -27
Max. optical path penalty (dB) 2 2 2 2 2 1 1 1
*n specifies a wavelength following the ITU-T G.692 standard grid (n = 1-40).

11.8.3 SDH STM-4 I/O Card – 622 Mbit/s ±4.6 ppm

CARD NAME SIO4 SIO4 SIO4 SIO4
V5 L5 L3 S3
APPLICATION CODE V-4.2 L-4.2 L-4.1 S-4.1
Operating wavelength (nm) 1530-1570 1530-1570 1280-1335 1293-1334
TRANSMITTER
Source type SLM SLM MLM MLM

Max. RMS width (nm) - - 1.7 2.5
Max. -20 dB width (nm) 1 1 - -
Min. side mode suppression ratio (dB) 30 30 - -
Min. mean launched power (dBm) 0 -3 -3 -15
Max. mean launched power (dBm) +5 +2 +2 -8
Min. extinction ratio (dB) 10 10 10 8.2
RECEIVER
Min. sensitivity (dBm) -31 -31 -31 -31

Min. overload (dBm) -6 -6 -6 -6
Max. reflectance of receiver (dB) -27 -27 -27 -27
Max. dispersion [ps/nm] 2700 2700 210 140

Min. optical return loss of cable (dB) -20 -20 - -
Max. discrete reflectance (dB) -24 -24 20 -
Max. optical path penalty (dB) 1 1 1 1

11.8.4 SDH STM-1 I/O Card – 155 Mbit/s ±4.6 ppm

CARD NAME SIO1-4 O S3 SIO1-4 O L3 SIO1-4 O L5
APPLICATION CODE S-1.1 L-1.1 L-1.2
Operating wavelength (nm) 1285-1330 1285-1330 1530-1570

TRANSMITTER
Source type MLM MLM SLM

Max. RMS width (nm) 2 2 -
Min. side mode suppression ratio (dB) - - 1
Min. mean launched power (dBm) -15 -4 -4
Max. mean launched power (dBm) -8 0 0
Min. extinction ratio (dB) 8.2 10 10
RECEIVER
Min. sensitivity (dBm) -30 -36 -36

Min. overload (dBm) -8 -8 -8
Max. reflectance of receiver (dB) - - -25
Max. dispersion [ps/nm] 370 370 12300

Min. optical return loss of cable (dB) - - -20
Max. discrete reflectance (dB) - - -25
Max. optical path penalty (dB) 1 1 1

11.9 Optical Specifications
11.9.1 2.5 Gbit/s Transponders – Receiver Type P

TRP25PVxx TRP25PBxx TRP25PXxx TRP25PVLxx TRP25PS3
Source type SLM SLM SLM SLM SLM
Operating output wavelength (nm) 1529-1560 1529-1560 1529-1560 1529-1560 1285-1330
MTBF (years) > 40 > 40 > 40 > 40 > 40
Maximum RMS width (nm) < 0.05 < 0.05 < 0.05 < 0.05 < 0.05
Modulation Direct Direct Direct EA* Direct
Spacing (GHz) 100 100 100 100 100
Maximum dispersion (ps/nm) 1800 3000 1800 10800 200
Minimum side mode suppression 30 30 30 30 30
ratio (dB)
Mean launched (min.) EOL +1 +0 +5.5 +1 -5
(dBm)
Power (max.) (dBm) +3 +1 +7 +3 -2
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 10
Sensitivity (BER=10E-12 EOL) -18 -18 -18 -18 -18
(dBm)
OCH switching time (msec) <3 <3 <3 <3 <3
Power consumption (base card 70 70 70 70 70
with two transponders) (Watt)
Receiver type P P P P P
*EA: External Absorption

11.9.2 2.5 Gbit/s Transponders – Receiver Type A

TRP25AVxx TRP25ABxx TRP25AXxx TRP25AVLxx TRP25AS3
Source type SLM SLM SLM SLM SLM
Operating output wavelength (nm) 1529-1560 1529-1560 1529-1560 1529-1560 1285-1330
MTBF (years) > 40 > 40 > 40 > 40 > 40
Maximum RMS width (nm) < 0.05 < 0.05 < 0.05 < 0.05 < 0.05
Modulation Direct Direct Direct EA* Direct
Spacing (GHz) 100 100 100 100 100
Maximum dispersion (ps/nm) 1800 3000 1800 10800 200
Minimum side mode suppression 30 30 30 30 30
ratio (dB)
Mean launched (min.) EOL +1 +0 +5.5 +1 -5
(dBm)
Power (max.) (dBm) +3 +1 +7 +3 -2
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 10
Sensitivity (BER=10E-12 EOL) -34 -34 -34 -34 -34
(dBm)
OCH switching time (msec) <3 <3 <3 <3 <3
Power consumption (base card 70 70 70 70 70
with two transponders) (Watt)
Receiver type A A A A A
*EA: External Absorption

11.9.3 10 Gbit/s Transponders – Receiver Type P

TRP10PVxx TRP10PS3
Source type SLM SLM
Operating output wavelength (nm) 1529-1560 1285-1330
MTBF (years) > 40 > 40
Maximum RMS width (nm) < 0.05 < 0.05
Modulation External External
Spacing (GHz) 100 100
Maximum dispersion (ps/nm) 700 100
Minimum side mode suppression ratio 30 30
(dB)
Mean launched power (dBm) +1 -5
Min. extinction ratio (dB) 8.2 8.2
Sensitivity (BER=10E-12 EOL) (dBm) -16 -11
OCH switching time (msec) <3 <3
Power consumption (base card with two 90 90
transponders) (Watt)
Receiver type P P

11.9.4 10 Gbit/s Transponders – Receiver Type A

TRP10AVxx TRP10AS3
Source type SLM SLM
Operating output wavelength (nm) 1529-1560 1285-1330
MTBF (years) > 40 > 40
Maximum RMS width (nm) < 0.05 < 0.05
Modulation External External
Spacing (GHz) 100 100
Maximum dispersion (ps/nm) 700 100
Minimum side mode suppression ratio 30 30
(dB)
Mean launched power (dBm) +1 -5
Min. extinction ratio (dB) 8.2 8.2
Sensitivity (BER=10E-12 EOL) (dBm) -22 -22
OCH switching time (msec) <3 <3
Power consumption (base card with two 90 90
transponders) (Watt)
Receiver type A A

11.9.5 2.6 Gbit/s Receivers

Type P Type A
Minimum sensitivity 10E-12 EOL (STM-16/OC-48 signal) -18 -34
(dBm)
Minimum overload (dBm) 0 -8
Max. receiver reflectance (dB) -27 -27
Min. optical return cable loss (dB) -24 -24
Max. discrete reflectance (dB) -27 -27
Max. optical path penalty (dB) 2 2
11.9.6 10 Gbit/s Receivers

Type P Type A
Minimum sensitivity 10E-12 EOL (STM-16/OC-48 signal) -16 -22
(dBm)
Minimum overload (dBm) 0 -6
Max. receiver reflectance (dB) -27 -27
Min. optical return cable loss (dB) -24 -24
Max. discrete reflectance (dB) -27 -27
Max. optical path penalty (dB) 2 2
11.9.7 Mux
16-channel 32-channel 40-channel
Insertion loss (dB)
Star < 12.5 < 16 < 17
Diffraction grating - - <6
Return loss (dB) < -40 < -40 < -40
Directivity (dB) < -60 < -60 < -60
MTBF (years) > 500 > 500 > 500

11.9.8 Demux
16-channel 32-channel 40-channel
Insertion loss (dB)
AWG < 8.5 < 11.5 < 9.5
Diffraction grating - - 6
Return loss (dB) < -45 < -45 < -45
Directivity (dB) > 25 > 25 > 25
Power consumption (Watt) 10 20 20
MTBF (years) > 100 > 100 > 100
11.9.9 Optical Fiber Amplifiers (OFAs)

OMPBC OMPAC OMILC_23 OMILC_25 OMILC_29
(Booster) (Preamplifier) (Inline (Inline (Inline
amplifier) amplifier) amplifier)
Total power (dBm) +17 +12 +16 +13 +16
Gain (dB) up to 17 > up to 26 > up to 23 > up to 25 > up to 29
Spectrum (nm) 1529-1561 1529-1561 1529-1561 1529-1561 1529-1561
Gain flatness (dB) <1 <1 <1 <1 <1
Noise figure (dB) < 5.5 < 4.5 < 4.5 < 4.5 < 4.5
In/out isolation (dB) > 40 > 40 > 40 > 40 > 40
Return loss (dB) < 40 < 40 < 40 < 40 < 40
MTBF (years) > 60 > 60 > 50 > 50 > 50
Power consumption 40 34.5 33.5 33.5 33.5
(Watt)
Power consumption -- -- 42 42 42
(Watt) of two inline
amplifiers
11.9.10 LOS Detection

The LOS detection threshold should be set at -35 dBm for the REF LOS, and at -37
dBm for the protect LOS. These levels are below the detection thresholds of the
transponder or ASF cards that may be connected to the dropped channel, and
therefore can only be crossed when no signal is present.
11.9.11 LOS Monitor Splice

Insertion loss ................................................................................................................ < 0.2 dB

11.9.12 LOS Decision Circuit

Nominal threshold ........................................................................................................ -40 dBm
Threshold range................................................................................................. -50 to -30 dBM
Detection time .................................................................................................................... 1 ms
Optical Switch Unit

Switching time................................................................................................................. < 3 ms
Switch position.....................................................................0 – switch open/1 – switch closed
Control Unit
ALS position ...................................................................... 0 – ALS enabled/1 – ALS disabled
DLOS.............................................................................................................1 – LOS detection
Power consumption (ALS card with OMSP) ................................................................ 20 Watt
11.9.13 OMSP (Optical Multiplex Section Protection)

Module
Optical Switch Unit

Switching time................................................................................................................. < 4 ms
Switch position............................................................0 – normal position/1 – protect position
Control Unit
OMSP mode ................................................................ 0 – OMSP enabled/1 – OMSP disabled
OMSP switch mode........................0 – OMSP in normal mode/1 – OMSP in protection mode
OMSP switch hold-off time .... 10 msec (ignores LOS detection until protection is complete.)
Power consumption (ALS card with OMSP) ................................................................ 20 Watt

11.9.14 OSNR (Optical Signal-to-Noise Ratio)

For 2.5 Gbit/s.................................................................................................................... 17 dB
For 10 Gbit/s..................................................................................................................... 21 dB
11.9.15 Frequencies and Wavelengths

Frequency Number of Channels
Wavelength [nm]
[THz] 16 32 40
Spacing (GHz) 100 100 100
196.0 1529.55 √ √
195.9 1530.33 √ √
195.8 1531.12 √ √
195.7 1531.90 √ √
195.6 1532.68 √ √
195.5 1533.47 √ √
195.4 1534.25 √ √
195.3 1535.04 √ √
195.2 1535.82 √ √
195.1 1536.61 √ √
195.0 1537.40 √ √
194.9 1538.19 √ √
194.8 1538.98 √ √
194.7 1539.77 √ √
194.6 1540.56 √ √
194.5 1541.35 √ √
194.4 1542.14 √
194.3 1542.94 √
194.2 1543.73 √
194.1 1544.53 √
194.0 1545.32 √
193.9 1546.12 √
193.8 1546.92 √
193.7 1547.72 √
193.6 1548.51 √ √ √
193.5 1549.32 √ √ √
193.4 1550.12 √ √ √
193.3 1550.92 √ √ √

Frequency Number of Channels

Wavelength [nm]
[THz] 16 32 40
Spacing (GHz) 100 100 100
193.2 1551.72 √ √ √
193.1 1552.52 √ √ √
192.0 1553.33 √ √ √
192.9 1554.13 √ √ √
192.8 1554.94 √ √ √
192.7 1555.75 √ √ √
192.6 1556.55 √ √ √
192.5 1557.36 √ √ √
192.4 1558.17 √ √ √
192.3 1558.98 √ √ √
192.2 1559.79 √ √ √
192.1 1560.61 √ √ √
11.10 OMGE_1SX, OMGE_1LX, DOM16_I3

Specifications
OMGE_1SX OMGE_1LX DOM16_I3
Transmitter type Shortwave laser, Longwave laser, 1310 nm, single
850 nm, multimode 1310 nm, single mode
mode
Data rate (nominal) (Mbaud) 1062.5-1250 1062.5-1250 2500
Average launch power Max. -9.5 -9.5 -10
(dBm)
Min. -3 -4 -3
Min. transmitter extinction ratio (dB) 9 9 8.2
Data format 8 B/10 B 8 B/10 B
Average receiver Min. -18 -20 -21
sensitivity (dBm)
Typical -21 -25.5 -23
Max. 0 -3 -3
Typical Rx LOS level (dBm) -24 dBm -24 -25
Connector Duplex LC Duplex LC Duplex LC
Fiber lengths 550 m (50 µm MMF) 10 km (9 µm MMF) 10 km (9 µm MMF)

11.11 Physical Specifications
11.11.1 Dimensions (H x W x D)
SIO-1/4/16 ................................................................................................... 415 x 25 x 225 mm
SIO-64 ......................................................................................................... 415 x 50 x 225 mm
All PIOs ....................................................................................................... 415 x 25 x 225 mm
DIO .............................................................................................................. 415 x 25 x 225 mm
MECP .......................................................................................................... 120 x 50 x 225 mm
xMCP........................................................................................................... 265 x 25 x 225 mm
HLXC .......................................................................................................... 415 x 40 x 225 mm
XDM-1000’s upper cage connection modules (electrical/DWDM) ........... 265 x 40 x 175 mm
TRP10, TRP25, OPM, OFA (XDM-1000’s lower cage, XDM-500, XDM-2000)
..................................................................................................................... 415 x 25 x 255 mm
Mux/demux (XDM-1000 lower cage, XDM-500, XDM-2000) ................. 415 x 40 x 225 mm
GOADM_4 (XDM-1000 lower cage, XDM-500, XDM-2000) .................. 415 x 40 x 225 mm
XDM-1000 shelf...................................................................................... 1100 x 450 x 285 mm
XDM-500 shelf.......................................................................................... 725 x 450 x 285 mm
XDM-2000 shelf........................................................................................ 775 x 450 x 285 mm
Rack alarm panel (optional) ...................................................................... 100 x 450 x 285 mm
Heat buffer................................................................................................. 125 x 450 x 285 mm
Rack................................................................................................2200/2600 x 600 x 300 mm
11.11.2 Weight
XDM-1000 shelf................................................................................................................ 25 kg
XDM-1000 fully populated ............................................................................................... 70 kg
XDM-500 shelf.................................................................................................................. 20 kg
XDM-500 fully populated ................................................................................................. 50 kg
XDM-2000 shelf................................................................................................................ 20 kg
XDM-2000 fully populated ............................................................................................... 50 kg

11.11.3 Power
Power Requirements
Applicable specifications ............................................................ ETSI 300 132-2; FTZ 19FS1
Input voltage ............................................................................................. -40 V dc to -75 V dc
Nominal power source ...................................................................-60 V or -48 V BTNR 2511
Power Consumption
XDM-1000 shelf................................................................ Typical 650 W, maximum 1500 W
XDM-500 shelf..................................................................... Typical 650 W, maximum 950 W
XDM-2000 shelf............................................................... Typical 1200 W, maximum 1700 W
11.11.4 Environmental Conditions
Operation
Applicable specification............................................................... ETS 300 019-1-3 Class 3.1E
Temperature range..............................................................................................-5 oC to +45 oC
Relative humidity .................................................................................................... 5% to 95%
Storage (packed)
Applicable specification................................................................. ETS 300 019-1-1 Class 1.2
Temperature range............................................................................................-25 oC to +55 oC
Relative humidity ................................................................................................ 10% to 100%
Handling and Transportation

Applicable specification................................................................. ETS 300 019-1-2 Class 2.3
Temperature range........................................................................................... -40 oC to +70 oC
Relative humidity ...................................................................................................... up to 95%
11.11.5 EMC
Applicable specifications .................... EMC directive 89/336 (including EN 300 386-2: 1997
.................................... (emission and immunity requirements); EN 55022 Class B (emission)

11.11.6 Safety
Applicable specifications ........EN 60950 (including A1/1992, A2/1993, A3/1995, A4/1996);
....................................................................................................................................EN 41003
CE safety .......................................................................................... LVD directive 73/23/EEC
11.11.7 Laser Safety

Applicable specification...................................................EN 60825-1&2 (including A1/1997)
11.11.8 NEBS Compliance

The XDM platform complies with NEBS regulations for EMC and Safety, including GR-
1089-CORE and GR-63-CORE (Level 3).
11.11.9 Reliability
Service life.....................................................................................................................15 years

Reference Documents
The primary reference documents for this general description are:
1. ANSI T1.105-1991 – Digital Hierarchy – Optical Interface Rates and Format
Specification SONET.
2. BS ISO/IEC-3309 – Information Technology – Telecommunications and
Information Exchange between Systems – High-Level Data Link Control
(HDLC) Procedures – Frame Structure.
3. BS ISO/IEC-9595, Information Technology – Open Systems Interconnection –
Common Management Information Services.
4. ETSI ETR 114 – Functional Architecture of SDH Transport Networks.
5. ETSI ETS 300 119 – European Telecommunication Standard for Equipment
Practice.
6. ETSI ETS 300 147 – Synchronous Digital Hierarchy Multiplexing Structure.
7. ETSI ETS 300 232 – Optical interfaces for equipment’s and systems relating to
the Synchronous Digital Hierarchy.
8. ETSI ETS 300 417 – Generic Functional Requirements for Synchronous Digital
Hierarchy Equipment.
9. ETSI ETS 300 462 (Parts 1, 2, 3, 4, 5) – Transmission and Multiplexing (TM) –
Generic Requirements for Synchronization Networks; Synchronization Network
Architecture; The Control of Jitter and Wander within Synchronization; Timing
Characteristics of Slave Clocks Suitable for Operation in Synchronous Digital
Hierarchy (SDH) Equipment.
10. ETSI ETS 300 746 – Transmission and Multiplexing; Synchronous Digital
Hierarchy; Network Protection Schemes; Automatic Protection Switch (APS)
Operation.
11. IEC 917 – Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.
417006-2002-013-A2 Lightscape Networks Ltd. Proprietary A-1

XDM™ Reference Documents
12. ISO/IEC-3309 – Information Technology – Telecommunicaitons and

Inforamtion Exchange between Systems High-level Data Link Control (HDLC)
Procedures Frame Structure.
13. ITU-T Recommendation G.650 – Definition and Test Methods for the Relevant
Parameters of Single-mode Fibers.
14. ITU-T Recommendation G.651 – Characteristics of a 50/125 µm Multimode
Graded Index Optical Fiber cable.
15. ITU-T Recommendation G.652 – Characteristics of a Single-mode Optical
Fiber Cable.
16. ITU-T Recommendation G.653 – Characteristics of a Dispersion-shifted Single-
mode Optical Fiber Cable.
17. ITU-T Recommendation G.654 – Characteristics of a Cut-off Shifted Single-
mode Optical Fiber Cable.
18. ITU-T Recommendation G.655 – Characteristics of a Non-zero Dispersion
Shifted Single-mode Optical Fiber Cable.
19. ITU-T Recommendation G.661 – Definition and Test Methods for the Relevant
Generic Parameters of Optical Amplifier Devices and Subsystems.
20. ITU-T Recommendation G.662 – Generic Characteristics of Optical Fiber
Amplifier Devices and Subsystems.
21. ITU-T Recommendation G.663 – Application Related Aspects of Optical Fiber
Amplifier Devices and Subsystems.
22. ITU-T Recommendation G.664 – Optical Safety Procedures and Requirements
for Optical Transport Systems.
23. ITU-T Recommendation G.671 – Transmission Characteristics of Passive
Optical Components.
24. ITU-T Recommendation G.681 – Functional Characteristics of Interoffice and
Long-haul Line Systems Using Optical Amplifiers, Including Optical
Multiplexing.
25. ITU-T Recommendation G.691 – Optical Interfaces for Single Channel SDH
Systems with Optical Amplifiers and STM-64 systems (Draft).
26. ITU-T Recommendation G.692 – Optical Interfaces for Multi-channel Systems
with Optical Amplifiers.
27. ITU-T Recommendation G.703 – Physical/Electrical Characteristics of
Hierarchical Digital Interfaces.
A-2 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

Reference Documents XDM™
28. ITU-T Recommendation G.704 – Synchronous Frame Structures Used at 1544,

6312, 2048, 8448 and 44 736 kbit/s Hierarchical Levels.
29. ITU-T Recommendation G.707 – Network Node Interface for the Synchronous
Digital Hierarchy.
30. ITU-T Recommendation G.708 – Sub STM-0 Network Node Interface for the
Synchronous Digital Hierarchy (SDH).
31. ITU-T Recommendation G.772 – Protected Monitoring Points provided on
Digital Transmission Systems.
32. ITU-T Recommendation G.773 – Protocol Suites for Q Interfaces for
Management of Transmission Systems.
33. ITU-T Recommendation G.783 – Characteristics of SDH Equipment Functional
Blocks.
34. ITU-T Recommendation G.784 – Synchronous Digital Hierarchy (SDH)
Management.
35. ITU-T Recommendation G.803 – Architectures of Transport Networks based on
the Synchronous Digital Hierarchy.
36. ITU-T Recommendation G.811 – Timing Characteristics of Primary Reference
Clocks.
37. ITU-T Recommendation G.812 – Timing Requirements of Slave Clocks
Suitable for Use as Node Clocks in Synchronization Networks.
38. ITU-T Recommendation G.813 – Timing Characteristics of SDH Equipment
Slave Clocks (SEC).
39. ITU-T Recommendation G.821 – Error Performance of an International Digital
Connection Operating at a Bit Rate below the Primary Rate and Forming Part of
an Integrated Services Digital Network.
40. ITU-T Recommendation G.823 – The Control of Jitter and Wander within
Digital Networks which are based on the 2048 kbit/s Hierarchy.
41. ITU-T Recommendation G.825 – The Control of Jitter and Wander within
Digital Networks which are Based on the SDH (Draft).
42. ITU-T Recommendation G.826 – Error Performance Parameters and Objectives
for International, Constant Bit Rate Digital Paths at or above the Primary Rate.
43. ITU-T Recommendation G.831 – Management Capabilities of Transport
Networks Based on the SDH.
44. ITU-T Recommendation G.841 – Types and Characteristics of SDH Network
Protection Architectures.
417006-2002-013-A2 Lightscape Networks Ltd. Proprietary A-3

XDM™ Reference Documents
45. ITU-T Recommendation G.842 – Inter-working of SDH Protection

Architectures.
46. ITU-T Recommendation G.872 – Architecture of Optical Transport Networks.
47. ITU-T Recommendation G.957 – Optical Interfaces for Equipment and Systems
relating to the Synchronous Digital Hierarchy.
48. ITU-T Recommendation G.958 – Digital Line Systems Based on the
Synchronous Digital Hierarchy for Use on Optical Fiber Cables.
49. ITU-T Recommendation G.975 – Forward Error Correction for Submarine
Systems.
50. ITU-T Recommendation M.3010 – Principles for a Telecommunications
Management Network.
51. RFC-1493 – Definition of Managed Objects for Bridges.
52. RFC-1662 – PPP in HDLC-life Framing.
53. RFC-1757 – Remote Network Monitoring Management Information Base.
54. RFC-2108 – Definitions of Managed Objects for IEEE 802.3 Repeater Devices
using SMIv2.
55. RFC-2615 – PPP over SONET/SDH.
56. RFC-2737 – Entity MIB (Version 2).
57. RFC-2823 – PPP over Simple Data Link (SDL) using SONET/SDH with ATM-
like Framing.
58. Telcordia GR-253-CORE – Synchronous Optical Network (SONET) Transport
Systems, Common Generic Criteria.
A-4 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

Glossary
µSDM-1 SYNCOM™ 155.52 Mbit/s Micro Synchronous Digital
Multiplexer
3R Regenerating Reshaping and Retiming
4F-BLSR Four-Fiber Bidirectional Line Switched Ring
ADM Add-and-Drop Multiplexer
AIS Alarm Indication Signal
APD Avalanche PhotoDiode
API Application Programming Interface
APS Automatic Protection Switching
ARS Automatic Route Selection
ASP Application Service Providers
ATM Asynchronous Transfer Mode
AU-4 Administrative Unit 4
AWG Array Waveguide Grating
BB Broadband
BB-DXC Broadband Digital Cross-connect
BER Bit Error Rate
BIT Built-In Test
BSC Base Station Controller
CATV Cable TV
CLU Clock Unit
CMS Central Monitoring Station
CO Cable Operator
CORBA Common Object Request Broker Architecture
417006-2002-013-A2 Lightscape Networks Ltd. Proprietary B-1

XDM™ Glossary
CU Consolidation Unit
DCC Data Communication Channel
DCN Data Communication Network
DDF Digital Distribution Frame
DIO XDM Data I/O card
DPC Diverted Packet Connection
DWDM Dense Wavelength Division Multiplexing
DXC Digital Cross-connect
EBER Excessive Bit Error Rate
ECC Embedded Communication Channels
eCRAFT Desktop or laptop PC-based craft terminal
EDFA Erbium-Doped Fiber Amplifier
eEM ECI Element Manager
eIMI ECI Integrated Management Interface
EME Externally Managed Element
EML Element Management Layer
EMS Element Management System
eNM ECI Network Manager
eNM-XDM XDM element management system
EOW Engineering OrderWire
ETSI European Telecommunication Standards Institute
Fast Ethernet 100BaseT. Ethernet at 100 Mbit/s
FCU Fan Control Unit
FE Fast Ethernet
FEC Forward Error Correction
GbE Gigabit Ethernet. Ethernet technology that raises transmission
speed to 1 Gbit/s
GOADM Grouped OADM
HDLC High-level Data Link Channel
HFC network Hybrid Fiber-Coax network
HLXC High Level/Low Level Cross Connect card
B-2 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

Glossary XDM™
HO High Order
I/F Interface
I/O Input/Output
INF Input Filter Unit
IP Internet Protocol
ISDN Integrated Services Digital Networks
ISP Internet Service Provider
ITU-T International Telecommunications Union-Telecommunication
LAN Local Area Network
LO Low Order
LOF Loss of Frame
LOP Loss Of Pointer
LOS Loss Of Signal
LXC Local Cross-Connect
MCP Main Control Processor
MECP Main Equipment Control Panel
MS Multiplex Section
MSC Mobile Switching Center
MSP Multiplex Section Protection
MSP-L Linear Multiplex Section Protection
MS-SPRing Multiplex Section Shared Protection Ring
MTBF Mean Time Between Failures
MTTR Mean Time To Repair
Mux Multiplexer
NB Narrowband
NB-DXC Narrowband digital cross-connect
NE Network Element
NEL Network Element Layer
NML Network Management Layer
NMS Network Management System
NT Network Termination

XDM™ Glossary
NVM Non-Volatile Memory card (plugged into MCP)

OADM Optical Add/Drop Multiplexer
OAM&P Operations, Administration, Maintenance and Provisioning
OC Optical Carrier, the transmission speeds defined in the SONET
specification
OC-1 Optical Carrier level-1, 51.84 Mbit/s
OC-12 Optical Carrier level-12, 622.08 Mbit/s
OC-192 Optical Carrier level 192, 9.953 Gbit/s
OC-3 Optical Carrier level 3, 155.52 Mbit/s
OCH Optical CHannel
OCHP Optical CHannel Protection
OFA Optical Fiber Amplifier
OHA OverHead Access
OIL Optical Inline Amplifiers
OMP Optical Multiplex Protection
OMSP Optical Multiplex Section Protection
OPA Optical PreAmplifier
OPB Optical Booster
OPM Optical Performance Monitoring
OSI Open System Interconnections
OSS Operations Support System
OW Orderwire channel
PDH Plesiochronous Digital Hierarchy
PIO PDH Input/Output
PM Performance Monitoring
POH Path Overhead
POP Point of Presence
POS Packet Over SDH/SONET
PSTN Public Switched Telephone Networks

Glossary XDM™
Q RS-232 or X.21 interface synchronous port

RAP Rack Alarm Panel
S/PIO SDH or PDH I/O cards
SAM Service Access Multiplexer
SD Signal Degradation
SDH Synchronous Digital Hierarchy
SDM-1 SYNCOM™ 155.52 Mbit/s Synchronous Digital Multiplexer
SDM-1C SYNCOM™ 155.52 Mbit/s Synchronous Digital Multiplexer
SF/SD Signal Failure/Signal Degradation
SIOx SDH Input/Output STM-x cards
SLA Service Level Agreement
SNCP SubNetwork Connection Protection
SOH Section OverHead
SQL Structured Query Language
SSIM SDH/SONET Interface Module
SSM Synchronization Status Marker (protocol)
SSP Storage Service Provider
STM Synchronous Transfer Mode.
STM-1 Synchronous Transport Module 1, 155.52 Mbit/s
SU Slot Unit
TCM Tandem Connection Monitoring
TCMP Tandem Connection Performance Monitoring
TDM Time Division Multiplexing
TM Terminal Multiplexer
TMF TeleManagement Forum
TMN Telecommunications Management Network

XDM™ Glossary
TMU TiMing Unit

TO Telecom Operator
TU Tributary Unit
TVCXO Temperature Compensated Voltage Controlled Crystal
Oscillator
VC Virtual Container
VPN Virtual Private Network
WAN Wide Area Network
WB Wideband
WB-DXC Wideband Digital Cross-connect
WDM Wavelength Division Multiplexing
WTR Wait-To-Restore time
XC Cross-Connect
xINF XDM’s Input Filter Unit
xMCP XDM’s Main Control Processor

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 Copyright by LIGHTSCAPE NETWORKS LTD., 2001. All rights reserved worldwide.

The XDM – Intelligent, scalable optical networking platform

2. Optical Capabilities ...................................................................................... 2-1

3. TDM, DXC and Data Capabilities ................................................................. 3-1

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary iii

3.4 Integrated DXC/ADM Mode.............................................................. 3-8

5. Basic System Design ................................................................................... 5-1

iv Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

5.1.1 Control and Communication Subsystem ............................... 5-2

6. Migration to XDM Networks......................................................................... 6-1

7. Protection and Redundancy ........................................................................ 7-1

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary v

8. Management ................................................................................................. 8-1

9. Physical Description .................................................................................... 9-1

vi Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

9.9 DIO Card and Modules................................................................... 9-19

10. Maintenance ............................................................................................. 10-1

11. Specifications ........................................................................................... 11-1

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary vii

11.9.12 LOS Decision Circuit ....................................................... 11-15

A. Reference Documents .................................................................................A-1

viii Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary ix

Figure 4-9: Corporate network interconnections..................................... 4-18

x Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

Figure 7-4: MS line protection .................................................................. 7-6

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary xi

xii Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary xiii

xiv Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary 1-1

1.2 Unmatched DWDM Capabilities

PSTN IP ATM GbE SDH/

Figure 1-1: Hybrid optical XDM platform

1-2 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

1.3 Outstanding Performance

1.4 Unclogging the Network

1.5 Significant Savings with the XDM

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary 1-3

1-4 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

STM-16 DXC Management

Figure 1-2: Next-generation networks – a single unit instead of six

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary 1-5

1.6 Small Size

15 x TM-1 8 x ADM-1 50 x ADM-4 9 x ADM-16 9 x TM-1 50 DDF racks

2 Mbit/s to STM-64 STM-1 to 40/80 x STM-64

Figure 1-3: Size comparison

1-6 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

1.7 XDM Shelves

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

ACTIVE FAIL ACTIVE FAIL ACTIVE FAIL

FCU-1 FCU-2 FCU-3 xFCU xFCU xFCU

Figure 1-4: XDM-1000, XDM-500 and XDM-2000 shelves

In summary, Lightscape Networks’ new XDM platforms combine the functionalities

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary 1-7

1-8 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary 2-1

2.1 System Capabilities

Figure 2-1: XDM DWDM options

2-2 Lightscape Networks Ltd. Proprietary 417006-2002-013-A2

2.2 System Design

417006-2002-013-A2 Lightscape Networks Ltd. Proprietary 2-3