DIGITAL PLATES - THERMAL

Customer
Information
Manual
Kodak Thermal Platinum
Geographic Scope: US&C and
LAR region

Version 1.2
Americas Technical Applications Group

May 2008

For internal use only

Table of Contents

1.0 OPERATING, HANDLING & STORAGE CONDITIONS ................................................................. 3

2.0 PRESS PERFORMANCE........................................................................................................................4

3.0 THERMAL PLATINUM PLATE CHEMISTRY ................................................................................... 5

4.0 PROCESSOR SET-UP AND CONFIGURATION ...............................................................................6

4.1 PROCESSOR CONFIGURATION ............................................................................................................................. 6
4.2 PROCESSOR LINE SETUP ....................................................................................................................................... 8
5.0 PREHEAT AND POSTBAKE OVEN SETUP AND CONFIGURATION..........................................8
5.1 FIND THE FOG POINT AND SET OVEN TEMPERATURE ..................................................................................... 8
5.2 POSTBAKE OVEN SETUP .......................................................................................................................................11
6.0 PRESS CHEMISTRY COMPATIBILITY FOR UNBAKED/BAKED THERMAL PLATINUM
PLATES ............................................................................................................................................................... 12
6.1 CHEMICAL COMPATIBILITY ................................................................................................................................13
APPENDIX A...................................................................................................................................................... 14
TROUBLESHOOTING ............................................................................................................................................................14
APPENDIX B ...................................................................................................................................................... 15
PROCESSING LINE MAINTENANCE ....................................................................................................................................15
DEVELOPER SYSTEM CLEANING ........................................................................................................................................16
SYSTEM CLEANING PROCEDURE ........................................................................................................................................16

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1.0 Operating, Handling & Storage Conditions
Category
Operating conditions
Safelight
Manual handling
Loading into platesetters
Transport & storage
Pre-heat ventilation
CIM Kodak Thermal Platinum
V1.2 MAY 2008 – FOR INTERNAL USE ONLY
Specifications
Temperature 20°C – 23.8°C (68°F-76°F)
Humidity 40% – 50%
Yellow /gold filter sleeves
When plates are being carried in either their outer casings or interior
packaging, the plates must be carried vertically to avoid bending or
kinking. The outer packaging can look undamaged, but the plates
inside can become kinked if proper handling procedures are not
carried out.
Plates carried with any kind of bend may distort the plates and effect
the loading and punching of the plate in the platesetter
The punching and loading of plates in any platesetter is critical, with
the plates having to travel through gaps of 1 – 2 mm. Also many
platesetters do not have an auto focus systems, therefore problems
will occur in both loading and imaging of the plate if the plates are
bent or kinked. This can be seen as the plate background having
areas of undeveloped coating. Out of focus situations can also be
caused by dirt, debris or any foreign body on the platesetter drum or
on the back of a plate.
When loading plates of sizes 1030 and larger, two people should
carry the plates from the packaging to the platesetter cassette. Or
load 5 – 10 plates at a time out of the packet so they can be carried
vertically and easily loaded by one person.
Damage to the plate edges and introducing edge wave by poor
handling of the product will incur platesetter errors in loading,
registration and imaging of the plate. In most cases this will cause
the plate to be rejected by the platesetter.
Store plates flat in their packaging, away from excessive cold, heat,
high humidity or direct sunlight.
Proper plate storage conditions: Temperature 68°F– 76°F
(20°C – 23.8°C)
Humidity 40% – 50%
Not Required
PAGE 3 OF 3
2.0 Press Performance
Category Specifications
Run length Up to 250,000 unbaked, 1,000,000+ Baked
Up to 30, 000 unbaked with Magnus 400 Fiber
Devices
UV application Requires postbaking
Press solvent and wash resistance (unbaked) Do not use chemicals that have a pH greater than 8
as they will attack the image.

All chemicals should be tested on a solid and 50%

image and evaluated for image attack prior to using.
Soak a pad with chemical and allow it to be in
contact of the image of the plate for at least 2 and 5
minutes. Rinse chemical off with water. If image loss
is exhibited, discontinue use of these chemicals as
they affect run length of the product. Consult with
chemical vendor for alternative products.
Most graphic arts chemicals can be used.
Press solvent and wash resistance (postbake) Note: If image loss occurs, increase the oven
temperature 10°F and perform a postbake/deletion fluid
test.
Postbake/ deletion test:
After plate has been post baked, place a drop of
deletion fluid 229 in 10 different locations of the
image area. Wipe away one of the drops, using a
damp cloth, every minute until all the drops have
been removed. If image attack is seen before 10
minutes, increase the temperature 10°F and repeat
test.
* Depending on press, paper and exposure conditions.
** Depending on press and paper conditions. It is strongly recommend that all pressroom
chemicals that will come into contact with the Thermal Platinum printing plate be tested on a
solid image prior to using. Post baking is strongly recommended for UV applications.

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3.0 Thermal Platinum Plate Chemistry

Category Specifications
Developer Kodak MX1813 developer
Resource Number - 8014193 (5 gal.)
Resource Number - 8156325 (52 gal. drum)
Resource Number - 1206598 (220 gal. tote)
Resource Number - 8244949 (1000 liter. tote)
Replenisher Kodak MX1919 regenerator or MX1813 developer
Resource Number - 8405201 (5 gal.)
Resource Number - 1583533 (52 gal. drum)
Resource Number - 1459304 (220 gal. tote)
Resource Number - 8914004 (1000 liter. tote)
Plate finisher Kodak 850S plate finisher
(baked and Global Resource Number - 1511278 (1 gal.)
unbaked
Global Resource Number - 1031889 (5 gal.)
applications)
Global Resource Number - 1064401 (55 gal.)
Prebake solutions Kodak MX1591 prebake solution
Resource Number - 8536278 (5 gal.)
Kodak Ultratherm prebake solution
Resource Number - 156-9078 (5 gal.)
Deletion Kodak 229 deletion fluid – Resource Number – 1076702
Kimoto Corr-Quick
Addition Staedtler Lumocolor pens
Sharpie Industrial (Red Label)
Plate cleaner Kodak PR500 plate cleaner - Resource Number - 0452086
Kodak PR600 plate cleaner - Resource Number – 0452128
(used with post baked plates only)
Storage Gum Kodak Aqua-Image plate cleaner / preserver – Resource Number – 8333635
Kodak 268 storage gum – Resource Number - 0469916

Developer Filter 20” - 150µ cotton filter - Resource Number – 0630814

Water/Gum Filter 10” - 50µ cotton filter - Resource Number – 0569368

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4.0 Processor Set-Up and Configuration
Ensure that your processor is installed and set up correctly. Incorrect processor installation or set-up can
compromise imaging quality. The developer anti-oxidation cover and processor lids are to be in place at
all times during operation to reduce the oxidation of the developer that could lead to shifts in developer
conductivity and activity.
System latitude
Higher-throughput platesetter devices image the media at a faster surface speed. Frequency Modulated
(FM) screening also places extra demands on the plate making system (plate, imaging, and processing
line). Consideration of these two scenarios needs to be made as they can reduce the overall latitude of
the plate making system. It is important to ensure each part of the system is optimized and maintained
to give the widest possible latitude.

4.1 Processor Configuration

Standard Speed Settings

Settings Processor
Dwell time (Dip To Nip) 16 seconds (+/-1 second)
Brush developer rollers speed and Maximum speed setting
configuration Two developer brush rollers in developer section
Developer exit configuration Developer
Developer temperature Aim 24°C
Range 23°C to 25°C
Replenisher Kodak MX1919, CCU setup remains the same
Developer replenishment rate 10-12 ml/ft², select per plate if using the QDM
Anti-Oxidation replenishment Every hour @ 5-7ml/ft²
Developer cycle 1500ft²/gallon
Expected developer life 6 Weeks
Prebake solution life 7 working days. Replenish with full strength as needed.
Finisher solution life 7 working days. Replenish with full strength as needed.
Dual processing Yes

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Non-Standard Speed Settings
Settings Processor
Dwell time (Dip To Nip) 22 seconds (+/-1 second)
Brush developer rollers speed Maximum speed setting
and configuration Two developer brush rollers in developer section
Developer exit configuration Either developer or water
Rinse
Developer temperature Aim 24°C
Range 23°C to 25°C
Replenisher Kodak MX1919
Developer replenishment rate 10-12 ml/ft²
Anti-Oxidation replenishment Every hour @ 10-12ml/ft², based on longer dwell time
Developer cycle 1000ft²/gallon
Expected developer life 4 Weeks
Prebake solution life 7 working days. Replenish with full strength as needed.
Finisher solution life 7 working days. Replenish with full strength as needed.
Dual processing Yes
* The use of non-standard speed settings is only recommended when processing system
does not allow for standard speed of 16 seconds DTN throughout line or when intermixing with
Thermal Gold. This is not a recommended change for troubleshooting and when possible must use
the SOP settings. This is strictly for use with equipment transport limitation issues.

Non-Standard Processors
Glunz & Jensen* P-HD (HDX) 850, 1250 850 - 602-00955, 1250 – 602-00952
FM25 Only T-LD (HHW) 850 850 - 602-00952
* The all-in-one processors are limited to newspaper customers only at this time with a max
of FM25 dot.

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4.2 Processor Line Setup

• Clean processor and change filter (systems clean recommended if not done in past six months)

• Chemistry must be fresh to include prebake solution and finisher

• Set processor speed to 16 seconds dip-to-nip (overall processor speed will vary with different
processors, but dip-to-nip time must be 16seconds. Record dial settings of Thermal Platinum and
other media to reference at a later time)

Note: if customer is running a Quartz processor, speeds may not allow for a 16 second dip-to-nip
transport; In order to allow for faster processing speed you will need to order and install the following kit
(Quartz Sprocket Kit #MDK0011)

5.0 Preheat and Postbake Oven Setup and Configuration

The preheat oven setup is similar to that of Thermal Gold, but not as critical to the cross-linking process.
Thermal Platinum is more laser power dependent that preheat dependent and therefore allows us to
have a wider fog window. Although not as critical as Thermal Gold, the setup must still be correct and
the steps to make sure proper setup is achieved are still needed.

5.1 Find the Fog Point and Set Oven Temperature

• Set preheat oven transport speed to match processor input speed

• Verify temperatures in preheat oven and processor are correct

o Chemistry temperature should be at 24°C

o Starting preheat temperature set at 300°F (normally fog point is seen from 285-295°F)

• Run fog test using the following technique: (must have a deletion pen to run fog test correctly;
preferably a C51 or Corr-Quick, but others will work)

o Run a raw plate (largest size) only through the processor and not the preheat oven, as a
reference

o Test deletion pen on processed plate to verify there is no substrate/background attack

from the deletion fluid

• Pick a spot on the processed plate and run deletion pen in a circular motion as to
create a spot with deletion fluid (pen)

• With a wet rag/clothe/towel, wipe the deletion fluid from plate and then dry
with another rag/clothe/towel

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 • There should be no visual difference between the spot deleted and the rest of
the plate

• If no attack/difference is evident, deletion pen if ok to use for fog test; if there is

a visual difference, try a different deletion pen

o With preheat temperature at 300°F as a starting point, run a raw plate (largest size)
through the processing line (includes preheat oven)

o Check for fog with deletion pen similar to procedure above, except you will be checking
seven different points on the plate instead of one. Figure below displays points on plate

Note: Thermal Platinum is unlike Thermal Gold and tends to fog more evenly across the plate and
finishes around the edges rather than down the middle

Points should be at
least 2” away from
both edges of plate

o If fog is noted, drop the preheat temperature by 5°F and run the test again. You will
continue to do this until you reach a temperature where there is no visual difference
between deletion spot and the background around it; basically, you will not be able to
see a spot from the deletion pen on all 7 points of the plate

o Once you have reached this point, you will select a temperature between the clean plate
temperature and the last fog temperature. If there is fog evident at this point, then your
fog point will be this temperature; If there is no fog evident, then the last temperature
where fog was evident will be what is referred to as slight fog or fog point

• Ex. fogged plate 290°F, clean plate 285°F; check for fog at 287°F or 288°F
depending on heaviness of fog on the last fogged plate

• Ex. 287/288°F – fogged, then 267/268°F is set point

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 • Ex. 287/288°F – no fog, then 270°F is set point

o Once fog point is achieved, drop the preheat temperature 20°F from the fog point and
this now becomes your setpoint

• Ex. FP=290°F SP=270°F

• Below is an example of the fog test done on small strips to mimic what we would
visually see on the plate; although you may not clearly see the difference on this
picture, you will see it better first hand. The point is to give you an idea of how
uniformed the fogging is on the plate

Fogged Fogged Slight Fog No Fog

• Verify replenishment rate is at 10-12mls/ft² as per SOP (current settings should suffice)

• Verify Anti-Ox is active and set to 5-7mls/ft² or as determined by customer use

• If post-bake oven is present, temperature and oven speed will need to be adjusted to match the
faster processing speeds; a post-bake chemical resistance test will need to be done to verify that
the product stands up to more than five minutes of chemical attack; 425°F is a good starting
point

• In some cases, the rinse/gum unit will need a sprocket replacement kit to allow it to run at the
faster processing speeds (Quartz Sprocket Kit #MDK0011)

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Note: Determine the fog point for each plate size. If a number of different plate sizes are being used,
knowing the fog point for each size will allow you to determine if one pre-heat oven temperature setting
will work for all plate sizes.

Follow steps 1 through 5 and record the fog point for each plate size in the following table.
Plate Fog Point Temp Operating Temp (fog –20°F)
Plate#1 °F °F
Plate#2 °F °F
Plate#3 °F °F
Average °F °F

5.2 Postbake Oven Setup

Conventional Oven (Wisconsin)
If post-bake oven is present, temperature and oven speed will need to be adjusted to match the faster
processing speeds; a post-bake chemical resistance test will need to be done to verify that the product
stands up to more than 10 minutes of chemical attack; 450°F is a good starting point.

• Initial set point

o Quartz processor @ 16sec dip-to-nip 450 °F

o MOA processor @ 16 sec dip-to-nip 500 °F

• If plate is showing signs of too much waviness, drop the temperature in increments of 5°F until
waviness is close to being gone

• Plate will change to a dark green color when post baked correctly (not golden brown)

• Postbaking will help with not only chemical resistance, but with mechanical wear

In some cases, the rinse/gum unit will need a sprocket replacement kit to allow it to run at the faster
processing speeds (Quartz Sprocket Kit #MDK0011)

IR Oven (Quickbake)
If post-bake oven is present, temperature and oven speed will need to be adjusted to match the faster
processing speeds; a post-bake chemical resistance test will need to be done to verify that the product
stands up to more than 10 minutes of chemical attack. 70% setting is a good starting point.

• Initial set point

o Quartz processor @ 16sec dip-to-nip 55%
o MOA processor @ 16 sec dip-to-nip 65%

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 • If plate is showing signs of too much waviness, drop the temperature in increments of 5% until
waviness is close to being gone

• Plate will change to a dark green color when post baked correctly (not golden brown)

• Postbaking will help with not only chemical resistance, but with mechanical wear
In some cases, the Quickbake will need a speed mod upgrade to allow for faster speed throughput.

6.0 Press Chemistry Compatibility for Unbaked/Baked Thermal Platinum

Plates
Most alkaline chemicals are not compatible with non-post baked plates. Kodak Thermal Platinum
plates, when properly post baked, are impervious to almost all chemicals. It is very important that a
chemical resistance test be done at every customer site regardless of known compatibility. All customer
conditions are different and certain applications don’t run well when combined. The proper way of
conducting a chemical resistance test is to gather all the chemicals from the customer site, which will
come in contact with the printing plate in any manner and perform a drop test. If within five minutes of
the drop being applied to the plate, there are no effects of coating attack, then the chemical should be ok
to use. Post baking plates is highly recommended when a customer has questionable chemicals that in
your opinion could cause on press performance issues.

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6.1 Chemical Compatibility

Chemical Name Status Yes/No

Fountain Solution Kelstar SF-5099 & 5099XT Yes
Kelstar SF-5089 No
Prisco 3451U Yes
Prisco Web Fount 211 Yes
Prisco 3551 Yes
Prisco H8PB6 Yes
Anchor 20227 Yes
Allied All-Star Yes
RBP 9000H Yes
Rycoline 4050 Yes

Plate Cleaner Prisco LPC No, causes restart blinding

PR500 Yes
Allied UPC Yes

Deletion/Addition Corr Quick Deletion Yes

229 Deletion Yes

Press Wash Prisco Dissolin Yes

Prisco Ecure Yes
Baldwin Impact Yes
Allied Daily Wash Yes

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Appendix A
Troubleshooting
Symptom Possible causes
Coating debris in Transport rollers dirty
non image areas Developer overextended
(coating redeposit)
No re-circulation in the back of
developer tray
Developer re-circulation pump failed
Developer temperature too low
Developer brush not set @ 100 %
(maximum)
Processor speed to fast
Developer filter plugged
Tinting or Developer temperature too low
scumming Developer overextended
in the
Non-image area
Plate is underexposed
Chemistry depleted or
Water contamination
Incorrect pressure on processor brush
roller
Plate batch variation
Ghosting or image Too much re-circulation from the front
attack spray bar of the developer section
The front developer brush roller
pressure too light
Plate processor is running too slow
Developer temperature is too hot
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Corrective Action
Clean all rollers.
Drain developer and replace with fresh
developer, clean all rollers
Increase flow and check for pump
failure
Replace with a high volume pump and
hoses; use systems cleaner.
Set developer temperature to 24°C
Check developer brush speed and
adjust
Check and adjust processor speed
Replace/check filter
Set developer temperature to 24°C
Drain developer and replace with fresh
developer, clean all rollers
Reestablish proper exposure
Dump chemistry and replace (check
replenish rate if depleted prematurely)
Inspect/adjust pressure on brush
roller
Call your local Kodak representative
Decrease developer flow.
Adjust the front developer brush roller
to the correct pressure
Check and adjust the speed of the
processor
Adjust chiller or developer
temperature to
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Appendix B

Processing Line Maintenance

Note: During any maintenance of the processor and the handling of chemicals personal protective
equipment (PPE) must be worn. Always refer to Health and Safety material data sheets.
Processor Chemistry Changed
• Record plate count of chemistry change.
• Dump developer and prebake tanks.
• Remove developer filter.
• Remove all rollers from developer tank. Rinse and wipe down developer tank with water and wipe
dry.
• Remove all rollers from rinse and prebake section of processor and clean.
• Check all rollers for cuts, tears, gouges, bad swelling and worn out bushings. Any indication that the
roller or bushings needs to be replaced.
• Clean prebake section by rinsing with warm water for 10 minutes.
• Re-install all rollers.
• Replace developer filter.
• Fill developer tank with Kodak MX1813 Developer.
• Remove exhausted prebake pail and replace with new container.
• Fill prebake tank with appropriate chemical.
• Reset plate count to zero.
• Check developer circulation by watching the agitation in developer tank.
• Check levels of all chemicals. Make sure there is adequate chemistry to continue.
• Check that there is adequate rinse water coming through the water spray bars.
• Check the direction and aim for all rinse spray bars.
• Ensure the water is draining properly from the rinse water tank.
• Check for adequate flow of prebake solution being applied to plate.
• Check that the plates are exiting the processor dry and the dryer is blowing warm air.
• Run three or four "clean-up" plates to allow chemicals to mix. These can be processed plates.
• Wipe down processor and clean up lid edge.
• Once developer temperature has stabilized, you are now ready to image and process plates.
• Check and record conductivity.

Preheat Oven
• Check for worn out sprockets.
• Check for breaks in conveyor chain.
• Check fans are running (no squealing noise).
• Check conveyor speed to processor speed. This speed should be faster then the processor.

Postbake Oven
• Check for worn out sprockets.
• Check for breaks in conveyor chain.
• Check fans are running (no squealing noise).

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• Check conveyor speed to processor speed. This speed should be faster then the processor.

Conveyor to Rinse Gum Unit

• Check for worn out sprockets.
• Check for breaks in conveyor chain.

Rinse Gum Unit

• Remove all rollers from gum unit and clean with warm water.
• Check all rollers for cuts, tears, gouges, bad swelling and worn out bushings. Any indication that the
rollers or bushings needs to be replaced.
• Clean gum tank by rinsing with warm water for 10 minutes.
• Fill gum tank with appropriate chemical.
• Check levels of gum chemicals. Make sure there is adequate chemistry to continue.
• Check that the plates are exiting the processor dry and the dryer is blowing warm air.

Developer System Cleaning

Theoretically a properly replenished developer system in a processor could run forever. We are placing
an exposed plate in the machine that is depleting some of the activity of the chemicals then replenishing
with a fresh charge of chemicals that counter-act that depletion. We do a system clean for maintenance,
not because the developer is bad.
Why do I have to perform a developer system clean?
Dirt and by-product build-up will clog the recirculation system, contributing to poor performance of the
developer. These by-products adhere to the walls of tubing and pumps causing a restricted flow of
developer. Developer system cleaner is an acid or has acid-like properties that eat away this build-up
without harming the tubing/pumps/tanks.

How often should I clean the system?

Low to med. volume customers = twice/year. High volume customers = once per quarter.

How long will this take?

To thoroughly go through the processor, clean and recharge should take about 2-3 hours.

System cleaning procedure

Note: Use proper safety procedures – goggles, apron, rubber gloves and Kodak Developer Systems
Cleaner and Neutralizer – Catalog #892-2841.
• Drain the developer tank
• Remove the old developer filter
• Remove developer scrubs and check for broken gears or missing screws/parts
• Wipe out bottom of tank to remove excess build-up
• Fill with water and add Part A and B of Developer System Cleaner (as instructed by the enclosed
directions)
• Circulate for 30 minutes – Do not leave overnight
• Drain (remember to drain filter housing if processor is so equipped on each draining)
• Refill with water and run for 5 minutes
• Refill ½ way with water then add Neutralizer
• Circulate for 15 minutes
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• Drain
• Refill with water and run for 5 minutes
• Drain all water from tank, lines and filter canister
• Fill with 1 to 2 gallons of developer and recirculate to flush water out of pumps and lines
• Inspect pump head and drain lines after cleaning to make sure system is not clogged with debris
from the cleaning process.
• Install new filter
• Recharge with Kodak MX1813 Developer

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