SinglFuse™ SF-0603HIxxxF Series Features

n Single blow fuse for overcurrent n Surface mount packaging for automated
protection assembly
n 1608 (EIA 0603) miniature footprint
n High inrush current withstand fuse
n UL 248-14 listed
n RoHS compliant* and halogen free**
n Thin film chip design

SF-0603HIxxxF Series - High Inrush Current Withstand Surface Mount Fuses

Electrical Characteristics

Rated Current Resistance Rated Interrupting Typical

Model Fusing Time
(Amps) (Ω) Typ.*** Voltage Rating I2t (A2s) ****
SF-0603HI050F-2 0.50 0.1550 0.019
SF-0603HI075F-2 0.75 0.0830 AC/DC 35 V 50 A 0.036
DC 65 V
SF-0603HI100F-2 1.00 0.0500 DC 65 V 13 A 0.052
SF-0603HI150F-2 1.50 Open within 60 0.0290 0.110
SF-0603HI200F-2 2.00 sec. at 200 % 0.0200 0.310
SF-0603HI250F-2 2.50 rated current 0.0165 0.400
AC/DC 35 V 35 A
SF-0603HI300F-2 3.00 0.0140 DC 35 V 0.600
AC/DC 24 V 50 A
SF-0603HI350F-2 3.50 0.0120 0.800
SF-0603HI400F-2 4.00 0.0095 1.200
*** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ±25 %.
**** Melting I2t calculated at 0.001 second pre-arcing time.

Reliability Testing

No. Test Requirement Test Condition Test Reference

≤1 A: DCR change ≤ ±10 % Refer to STP
1 Bending 2 mm
>1 A: DCR change ≤ ±20 % document
MIL-STD-202
2 Solderability Minimum 95 % coverage One dip at 255 °C for 5 seconds
Method 208
DCR change ≤ ±10 % MIL-STD-202
3 Thermal shock 100 cycles between -55 °C and +125 °C
No mechanical damage Method 107
DCR change ≤ ±10 % MIL-STD-202
4 Moisture resistance 10 cycles
No excessive corrosion Method 106
DCR change ≤ ±10 % MIL-STD-202
5 Salt spray 48 hour exposure, 5 % salt solution
No excessive corrosion Method 101
DCR change ≤ ±10 % 0.4 inch D.A. or 30 G between MIL-STD-202
6 Mechanical vibration
No mechanical damage 5-3000 Hz Method 204
DCR change ≤ ±10 % MIL-STD-202
7 Mechanical shock 1500 G, 0.5 ms, half-sine shocks
No mechanical damage Method 213
No electrical “opens” during testing 75 % rated current for 2000 hours at
Refer to STP
8 Life Voltage drop change shall be less ambient temperature between
document
than ±10 % of initial value +20 °C and +30 °C

Agency Recognition
UL File Number...................................................................E198545

* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU
June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm
or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
WARNING Cancer and Reproductive Harm Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set
www.P65Warnings.ca.gov forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SinglFuse™ SF-0603HIxxxF Series Applications
n Portable memory n Cell phones n LED lighting
n LCD monitors n Rechargeable battery packs n Power tools
n Disk drives n Battery chargers
n PDAs n Set-top boxes
n Digital cameras n Industrial controllers
n MP3 players n Battery Management Systems (BMS)

SF-0603HIxxxF Series - High Inrush Current Withstand Surface Mount Fuses

Environmental Characteristics
Operating Temperature................................................................................................................................................................... -55 °C to +90 °C
Storage Conditions
Temperature............................................................................................................................................................................... +5 °C to +35 °C
Humidity.........................................................................................................................................................................................40 % to 75 %
Shelf Life..........................................................................................................................................................2 years from manufacturing date
Moisture Sensitivity Level....................................................................................................................................................................................... 1
ESD Classification (HBM)............................................................................................................................................................................ Class 6

Typical Part Marking How to Order Construction

Represents total content. Layout may SF - 0603 HI 015 F - 2 PCB
vary. CuNi/Sn
SinglFuse™
Product Designator
SMD Footprint
F 0603 = 1608 (EIA 0603) size
Fuse Blow Type
HI = High Inrush Current Withstand
RATED CURRENT (A)
C = 0.50 J = 2.50
Rated Current Cu/Sn
D = 0.75 L = 3.00 050 ~ 400 (500 mA ~ 4.0 A) EPOXY
E = 1.00 N = 3.50 1.60 ± 0.10 0.80
Structure Type
(.063 ± .004)
T = 1.50
F = 2.00
P = 4.00 F = Thin film Packaging Quantity (.031)

Packaging Type
- 2 = Tape & Reel 8,000 pieces per 7-inch reel
0.81 ± 0.10 1.00
(.039)
Product Dimensions (.032 ± .004)
Recommended Pad Layout
1.60 ± 0.10 1.60 ± 0.10 0.80 0.80
(.063 ± .004) (.063 ± .004) (.031) (.031)
0.36 ± 0.10 MM
0.36 ±DIMENSIONS:
0.10 2.20
(.014 ± .004) (INCHES)
(.014 ± .004) (.087)

0.81 ± 0.10 0.36 ± 0.10

0.81 ± 0.10 1.00 1.00
(.032 ± .004) (.014 ± .004)
(.032 ± .004) (.039) (.039)

0.36 ± 0.10 0.36 ± 0.10 0.36 ± 0.10 0.36 ±0.36

0.10± 0.10 2.20 2.20
0.36 ± 0.10
(.014 ± .004) (.014 ± .004) (.014 ± .004) (.014(.014
± .004) (.087) (.087)
± .004) (.014 ± .004)

0.36 ± 0.10 0.36 ± 0.10

Current Rating Thermal(.014
Derating
± .004) Curve (.014 ± .004)

140

120
0.36 ± 0.10 0.36 ± 0.10 0.36 ± 0.10 0.36 ± 0.10
(.014 ± .004) (.014 ± .004) (.014 ± .004) (.014 ± .004)
100
DERATING (%)

80

60

40

20

0
-60 -40 -20 0 20 40 60 80 100

MAXIMUM OPERATING TEMPERATURE (°C)

Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 SF-0603HIxxxF Series - High Inrush Current Withstand Surface Mount Fuses

Solder Reflow Recommendations

Profile Feature Pb-Free Assembly

Tp
Tc -5 °C Preheat / Soak:
tp
MAX. RAMP UP RATE = 3 °C/s Temperature Min. (Tsmin) 150 °C
MAX. RAMP DOWN RATE = 6 °C/s
TL Temperature Max. (Tsmax) 200 °C
Tsmax PREHEAT AREA tL Time (ts) from (Tsmin to Tsmax) 60~120 seconds
Ramp Up Rate (TL to Tp) 3 °C / second max.
TEMPERATURE (°C)

Tsmin Liquidous Temperature (TL) 217 °C

Time (tL) maintained above TL 60~150 seconds
ts Peak Package Body
260 °C
Temperature (Tp)
Time (tp)* within 5 °C of the
25
specified classification temperature 30 seconds*
TIME 25 °C TO PEAK (Tc)
TIME Ramp Down Rate (Tp to TL) 6 °C / second max.
Time 25 °C to Peak Temperature 8 minutes max.
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.

10 sec. max.
Average
260 Pre-Arcing Time vs. Current Curves Average I2t vs. t Curves

2.00 A2.00 A
1.50 A1.50 A 2.50 A2.50 A
1.00 A1.00 A 3.00 A3.00 A
4.00 A 4.00 A
TEMPERATURE (°C)

0.75 A0.75 A 3.50 A3.50 A 3.50 A 3.50 A

0.50 A0.50 A 4.00 A4.00 A
150 3.00 A 3.00 A
2.50 A 2.50 A
100 100 10001000 2.00 A 2.00 A
PREHEATING 1.50 A 1.50 A
1.00 A 1.00 A
0.75 A 0.75 A
0.50 A 0.50 A
100 100
10 10

120 seconds TIME

10 10
1 1
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)

I2t (A2s)
I2t (A2s)

1 1

0.1 0.1

0.1 0.1

0.010.01
0.01 0.01

0.001
0.001 0.0010.001

0.0001
0.0001 0.0001
0.0001
0.1 0.1 1 1 10 10 100 100 0.0001 0.0010.001 0.01 0.01
0.0001 0.1 0.1 1 1 10 10 100 100

CURRENT (A) (A)

CURRENT TIMETIME
(SECONDS)
(SECONDS)

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 SF-0603HIxxxF
3312 - 2Series
mmTape
SMD Trimming
and Reel Packaging Potentiometer
Specifications

SF-0603HIxxxF Series
Tape Dimensions per EIA 481-2
8.10 ± 0.20
W
(.319 ± .008)

4.0 ± 0.10
P
0 (.157 ± .004)

4.0 ± 0.10
P1 (.157 ± .004)

2.0 ± 0.05
P
2 (.079 ± .002)

1.00 ± 0.10
A0 (.039 ± .004)

1.80 ± 0.10
B0 (.071 ± .004)

3.50 ± 0.05
F (.138 ± .002)

1.75 ± 0.10
E1 (.069 ± .004)

1.55 + 0.05
D0 (.061 + .002)

PACKAGING: Paper tape, 8,000 pcs. per reel 13.40 ± 0.50

(.539 ± .020)

0.8
0.6 60.20 ± 0.50
0.4 178.00 ± 1.00
0.2 (7.008 ± .039) (2.370 ± .020)
DIA. DIA.
2.20 ± 0.30
(.087 ± .012)

13.20 +0.3/-0.2
(.520 +.012/-.008)
DIA.
0.2
0.4
0.6
0.8

1.40 ± 0.20
1.20 ± 0.20 (.055 ± .008)
(.047 ± .008)

E1
D0 P0 P2

F W

B0

P1 AO KO
MM
DIMENSIONS:
(INCHES)
DIRECTION OF UNREELING

REV. B 01/19
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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