Alternating Current Field Measurement Level 1 Course (ACFM L1)

Alternating Current Field Measurement
Level 1 Course
(ACFM L1)
Copyright © TWI Ltd 2013

ACFM Level 1Course Objectives
• To explain the theoretical principles.

• To carry out equipment functioning checks.
• To locate and size surface breaking fatigue cracks
on uncoated and coated steel welds.
• To gain eligibility to sit CSWIP EMD examinations.

History of Electromagnetic Techniques
Chapter 1
• First used in 1930’s by Dr Foerster for tube inspection.
• 1950’s: High frequency EMD was used in the aerospace

industry and was used on the comet airliner.
• 1970’s: The impedance plane display developed.
• 1980’s: Digital display arrives.

History of Electromagnetic Techniques
• First used for weld inspection during the 1960’s on Admiralty

ships.
• 1980’s: Thorburn technics produced instrument for weld

inspection followed by the AV100 from Hocking.
• Alternating current field measurement (ACFM) developed by UCL

as non contacting ACPD.
• 1991: TSC commercial system.
• 1995: TSC Array system.

ACFM
Alternating current field measurement.
• A technique used to find and size surface breaking

defects which can be used through non conductive
coatings.

Overview of NDT Techniques
• Currently approximately 50 NDT techniques are

available.
• The following are the most common techniques that

can be used for surface crack detection:

NDT Techniques Fall Into 5 Groups
• Visual.
• Magnetic particle inspection.
• Dye penetrant.
• Ultrasonic.
• Electro-magnetic techniques.

Visual
Can locate visible defects and discontinuities. Can be

used to locate defects in the case of visual inspection of
welds etc.

Close Visual Inspection (CVI)
Close visual inspection will be carried out to assess a

welded component. In the case of ACFM it will be carried
out prior to the inspection in order to find areas which
could show up as non-relevant indications on the
system.

Major Limitations of Visual Inspection
• Can only be used to assess defects which are on the

surface.
• Cannot find very fine defects.
• Cannot assess the depth of defects.
• Provides no permanent record.
• Open to the interpretation of the inspector.
• High level of cleaning is required.

Magnetic Particle Inspection (MPI)
• MPI can be used to find very fine surface breaking or

slightly sub surface defects in ferromagnetic materials.
• It can be used to assess the length of the defects but

not the depth.

MPI Advantages Against
Eddy Current Methods
• Sensitive to crazed and stress corrosion cracking.
• Sensitive for shallow cracks.
• Easier for transverse cracks.
• Maybe easier for tight geometries.
• Less complex equipment.

Disadvantages of MPI
• Requires high level of cleaning.
• Relatively slow in comparison to ACFM.
• Generally does not produce a permanent record.
• Hand written reports only (generally).
• Cannot be used on materials which cannot be

magnetised strongly.
• Subjective technique.

Dye Penetrants
• Dye penetrants are used to assess surface breaking

defects.
• It works by a liquid being drawn into the defect by

capillary action.
• Once this has occurred a developer is applied and

the liquid is drawn back out of defect.
• This gives a visual indication of the position and

length of the defect.

Penetrant Advantages
• Can be used on metals and non metals.
• Sensitive for the detection of crazed and stress

corrosion cracking.
• Good on shallow defects.
• Gives a visual indication.
• Very sensitive on good surfaces.
• Gives surface length.

Penetrant Disadvantages
• Cannot be used underwater.
• Difficult to assess on rough surfaces eg welds.
• No depth sizing.
• Must have very clean surface.

Electro Magnetic Detection Techniques
(EMD or EMT)
• Eddy current and ACFM are both electro magnetic
detection techniques.
• These methods can detect fine surface breaking

defects through non conductive coatings.
• In addition, they can be used to size defects for

length and ACFM can accurately depth size.

EMD Advantages
• Can be used through good quality non conducting

coatings.
• Can assess crack depth as well as length.
• Quicker than MPI.
• Can be used on all conducting materials.
• Gives an electronic and written report.
• Can replay the scan for off-line assessment.
• Operator skill may then be less important.

EMD Disadvantages
• Can be more difficult than MPI on tight geometry.
• Cannot assess sub surface defects in ferritic

materials.
• Depth of the defect will be along the plane of the

defect not ‘through thickness’.

Ultrasonic Inspection Methods
• Can be used to detect surface breaking and sub

surface defects in most materials.
• A high degree of operator skill is required. Generally

most portable machines will not provide a permanent
record.

Time Of Flight Diffraction (TOFD)
• Can be used to size for depth of a surface breaking
defects.
• Cannot be used on defects less than approximately

3- 4mm in depth size.
• Cannot be used on awkward geometry.
• Through thickness dimension is measured.
• Requires good surface.
• Works through coatings if they are in good condition.

RX Tx
Sound is diffracted at
the tip of the crack.

Creeping Wave
• Used for detection of surface cracks at weld toes, it

can detect cracks as shallow as 1mm in depth.
• Crack orientation must be correct, with respect to the

direction of approaching sound waves.

Probe

Probe

Alternating Current Potential
Difference (ACPD)
• ACPD is used for crack depth sizing of defects which
have been located using another method.
• A high standard of cleaning is required.
• Will not measure through thickness, but along the

crack.
• Very slow technique.
• Not good for short deep defects.
(Length must be at least twice the depth).

ACPD Continued
• Advantages:
− Good for profiling the defect.
− Operator skill required is low.
• Disadvantages:
− High cleaning standard.

ACFM or ACPD
TOFD assessment assessment of crack
of crack depth, depth, along the face of
through thickness. the crack.

Typical
Cleaning detection Use on
Equipment
Technique Material Coatings require- capability complex
complexity
ment (minimum geometries
defect depth,
mm)
MPI Magnetic None High 0.5 - 3 Good Low
Dye All None High - Good Low

Penetrant
Electro- Conduct- Insulating Low 1-2 Medium High

magnetic ing
Ultrasonic All Adherent High 1+ Medium Medium

CW
All
Ultrasonic High 3-4 Difficult High
Adherent
(TOFD)
ACPD Conduct Medium

None High 1 Medium
-ing

Questions?

ACFM
Chapter 2
Basic Electricity and Magnetism

Units
• Volts:
− A measure of electrical potential (the ability to carry

out work).
• Amperes:
− A measure of the electrical current flowing in a

circuit.
• Ohms:
− A measure of the resistance of a circuit.

Ohms Law
• V=IxR
» Voltage = Current x Resistance
or
• R=V
I
» Resistance = Voltage
Current
or
• I=V
R
» Current = Voltage
Resistance
Ohms Law
I R

Resistance (Ω)
• Resistance is the opposition to electrical flow in a

material, it is proportional to the length of the
conductor and inversely proportional to the cross
sectional area.
• All conductive materials have a different value and

this is called: resistivity ρ: (rho).
• Resistance is measured in Ohms.

Resistance continued
Total resistance = resistivity (ρ) x length

area

Conductance
• Conductance is the opposite to resistance. The

inverse of resistivity is called conductivity σ : (sigma)
• Conductance = conductivity (σ) x area

length

Conductivity (σ)
• The conductivity is the most frequently used
parameter of a material measured by electro magnetic
methods.
• Conductivity values are frequently expressed as a

percentage of the conductivity of copper
• This is termed the international annealed copper

standard (IACS).

IACS
• Copper = 100%.
• Aluminium = 40 – 60% (depending on alloy).
• Steels = 2 – 4%.
• Silver = 110%.
• High conductivity will result in less depth of

penetration for the eddy currents and vice versa.

Conductivity
increasing.
Depth of
Penetration
decreasing.

Magnetism and Magnetic Fields
• A permanent magnet produces an effect on any

surrounding material.
• Lines of force will travel by the path of least

resistance from North to South external of the
magnet.

Permanent Magnet
N S

Field Strength (H)
• This is the strength of the magnetic field which is

applied to the component, this field tending to set up
a magnetic field in the material.
• Measured in ampere turns per metre.

Flux Density (B)
• The magnetic flux density is defined as the number of

lines of force passing through a given area.
• It is given the symbol B and the units are tesla (lines

of force per cm/2)

Permeability (µ)
• The permeability of a material is the ease with which
it can be magnetised.
• High permeability - easily magnetised.
• Low permeability - difficult to magnetise.
• High permeability materials will have less depth of

penetration for eddy currents and Vice Versa.
• B = permeability x H.
Permeability
increasing.
Depth of
penetration
decreasing.

Magnetic Hysteresis
• Hysteresis is a comparison between an external

magnetising force (H) and the flux density (B).
• Hysteresis is the Greek term for lagging.
• Flux density always lags behind the field strength.

Flux Density and Field Strength (B/H curve)
Flux density (B) in Telsa.
Field strength (H) in ampere turns / metre.

Flux Density and Field Strength (B/H Curve)
Saturation point.
Field strength (H) in ampere turns/metre.

Differing Permeability B/H Curves
Mild steel.
Cast iron.
Field strength (H) in ampere turns/metre

Retentivity
Unmagnetised
material
Domains random

Retentivity

Saturation point.
Domains aligned in a
The virgin Ferromagnetic material.
Unmagnetised curve.
material.
Domains random.

Retentivity
Saturation point.
Domains
relaxed. Retentivity
point. The virgin
curve.
Unmagnetised
material.
Field strength (H) in ampere turns / metre
Domains random.

Coercive Force
Saturation point.
Domains oppose one
another, flux density
at zero, not
magnetised.
Retentivity
point.
Field strength (H) in ampere turns / metre.
Coercive point.

The Hysteresis Loop
S N
3 2
7
4 1 Field strength (H) in ampere
turns / metre.
5 6
N S

Differences in Permeability
B B
H H
Wide Loop Slender Loop
Low permeability (difficult to magnetise). High permeability (easily magnetised).

High retentivity. Low retentivity.
High residual magnetism. Low residual magnetism.
High reluctance. Low reluctance.
High coercive force needed to reduce the Low coercive force needed to reduce the flux
flux density to zero.
density to zero.
Magnetic Effects of Electric Current
• Any electrical charge travelling through a conductor
will create a magnetic field around it at 900 to the
direction of flow. The direction of flow is shown by
Flemings right hand rule.
• The strength of the field will be increased by

wrapping the conductor into a coil or increasing the
current.

Current Flow and Magnetism
* Note I = Current flow

Electric Current
• Electric current flow is defined as electrons

(negatively charged particles) flowing in a conducting
material.
• This could be either DC with the electrons flowing the

same way all the time.
• Or AC where the electrons change direction at

intervals depending on the frequency.

Direct Current (DC)
Electrical current flowing in a circuit with the electrons

flowing in the same direction all of the time.

Alternating Current (AC)
• Electrical current flowing in a circuit with the electron

flow changing direction at a certain frequency.
• Frequency will influence how deep an eddy current

will penetrate.
• High frequency will reduce the depth of penetration.
• Typical frequency values for ACFM probes are 5kHz

and 50kHz.

Frequency
increasing.
Depth of
penetration
decreasing.

Encircling Coils
The intensity of the magnetic field through the coil is

the product of coil current and number of turns.
Flux flow.
I I
Inductance
• The inductance of a coil is its ability to store magnetic

energy.
• Increasing the number of turns and the coil diameter

increases the inductance – current has no effect.
• Increased also by the addition of magnetic materials

close to the coil.
• Decreased by the addition of non magnetic materials

close to the coil.

Inductance Continued
• When a current is made to flow through a coil of wire, or to

cease flowing through it, the flux lines around the coil will
respectively expand or collapse. This will induce a voltage
in the coil itself. This induced voltage is in direct
opposition to the original applied voltage.
• It will be possible to create a current flow in an adjacent

conductor without any movement of the coil, this will
occur provided that the current in the coil is constantly
changing by the use of AC current or switching on or off
DC.

Questions?

Basic Principles of Eddy
Current Testing
Chapter 3

Eddy Currents
• Eddy currents are sensitive to the following:
− Electrical conductivity.
− Magnetic permeability.
− Geometry of material.

The Capability of the Technique Depends On:
• The frequency of AC used.
• The sensor design.
• Distance of sensor from the surface (lift-off).
• Eddy currents will allow assessment of

surfaces without need for direct contact
(through non-conductive coatings).

Depth of Penetration
• All methods using alternating currents are

limited by the depth of penetration of these
currents into the conducting surface.
• The theoretical depth of penetration is the

depth at which the current is reduced by a
third of the original surface value.

Factors Affecting Depth of Penetration
• Conductivity.
• Magnetic permeability.
• Frequency of operation.
• Probe design.

Frequency and Depth of Penetration
100
10
Depth of Stainless steel

penetration
1
in mm.
0.1
0.01
100 1000 10,000 100,000 1,000,000 10,000,000 100,000,000
Frequency in hertz Hz.

100
10
Depth of
penetration Stainless steel
in mm.
1
Aluminium
0.1
0.01
100 1000 10,000 100,000 1,000,000 10,000,000 100,000,000

100
10
Depth of
penetration. Stainless steel
1
Aluminium
0.25
0.1
Mild steel
0.01
100 1000 10,000 100,000 1,000,000 10,000,000 100,000,000

5000 Hz
Frequency in Hertz Hz
100
Depth of
penetration 10
in mm. Stainless steel
1
Aluminium
0.25
0.1
Mild steel
Copper
0.01
100 1000 10,000 100,000 1,000,000 10,000,000 100,000,000

5000 Hz
Induction
It was found that if current is passed through a

current carrying conductor, then a magnetic field
will result, encircling the conductor.

Induction
Also, if a conductor is moved close to another

conductor carrying a current flow, then a second
current can be made to flow in the adjacent
conductor.

Induction
Switch
Circuit A

Induction Continued
Switch
Circuit A Circuit B

Induction Continued
Switch
Circuit A Circuit B

Induction Continued
Switch
Circuit A Circuit B

Induction Continued
Switch
Circuit A Circuit B

Induction Continued
Switch
Circuit A Circuit B

Induction Continued
Switch
AC at the same
frequency produced
in circuit B.
Circuit A Circuit B

Induction Continued
Switch
Circuit A Circuit B

Induction Continued
Switch
Circuit A Circuit B

Induction Continued
In order for the above to occur there must always be

some change in either the primary circuit or the
magnetic field produced, in order to create a current
flow in circuit B.

Magnetic Field Produced in a Coil
Figure 0-1: representations of the magnetic field.

Eddy Currents Flowing in a Material
Primary coil
Ac
current
Metering
system

Primary coil
Ac
current
Primary
magnetic field Metering
system

Primary coil
Ac
current
Primary
magnetic field Metering
system
Alternating electrical
currents in the plate (eddy
currents)
Secondary Field Produced by the Primary
Magnetic Flow
Ac current
Primary coil
Primary magnetic
field Metering
system
Secondary
magnetic field
Alternating
electrical currents
in the plate (eddy
currents)

Secondary Field Produced by the Primary
Magnetic Flow
Ac current
Primary coil
Primary
magnetic field
Meter can
be zeroed
Secondary
for plate
magnetic field
Characteristics.

Eddy Current Behaviour Around a Defect
Ac current
Primary coil
Primary magnetic
field Metering
system
Secondary
magnetic field
Alternating
electrical currents
in the plate (eddy
currents)

Edge Effect

Varying Material Thickness
Ac current
Primary coil
Primary magnetic
Metering
field
system
Secondary
magnetic field
Alternating
electrical currents
in the plate (eddy
currents)

Absolute Coils
• If a probe has absolute coils, then all the coils in the

probe are wound the same way either clockwise or
anticlockwise.
• Some probes use this in conventional eddy current

machines. However, if the probe is lifted off, there will
be a significant affect on the display.

Differential Coils
• If a probe has a differential coil arrangement, this

means that there are two coils working in opposition
with one another. One would be wound clockwise the
other would be anticlockwise.
• The effect is that if one has a positive effect, the other

will have a negative effect, and the display will remain
unchanged.
• This is used to compensate for lift-off or edge effects.

Absolute Coil
Absolute coil has windings which are in one direction only.

Absolute Coil
Primary coil

Absolute Coil
Primary coil
-
Magnetic field

Absolute Coil
Primary coil
Metering
system
Magnetic field
Absolute coil has windings which are in one direction only. This will
mean that anything which affects the coil, will cause a deflection in
the meter reading.
Effect of Absolute Coil Approaching the Edge
of a Plate
Bx
Bz

Differential Coil Arrangement

A differentially wound coil has 2 sets of windings these

will have been wound in opposite directions.

Differentially
wound coil
Primary coil


Primary coil
Differentially
wound coil
Metering
system


Primary coil
Differentially
wound coil
Metering
system
Magnetic field

Differentially Primary coil

wound coil
Metering Metering
system system
Magnetic field

Differentially Primary coil

wound coil
Metering Metering
system system
Magnetic field
A differentially wound coil has 2 sets of windings these will have

been wound in opposite directions. This will mean that anything
which affects one coil will cause a deflection in its meter reading.
However, at the same time the other coil will be affected by the same
amount producing an opposite meter reading.
Effect of Differential Coils Approaching the
Edge of a Plate
Bx
Bz

Differential Probe Near an Edge
Uniform field
Coil 1
Coil 2 C
Compressed field
Plate edge

Differential Probe Near an Edge
Uniform field
Coil 1
C
Direction of scan
Coil 2
Compressed field
Both coils are affected by the same amount, but one coil changes
positively and the other negatively thus cancelling each other.
Differential Coil With Lift Off
Both coils give a meter

Probe reading of flux density (B).

Differential Coil With Lift Off
One coil changes positive

Probe
the other changes negative
thus cancelling each other.

Differential Probe Over a Crack
Coil 1
C
Coil 2
Uniform field disturbance around a crack.

Coil 1
C
Coil 2 Direction of scan
Uniform field disturbance around a crack.

• With a differential probe over a crack, there

will be a cracklike signal.
• This is due to the localised variation of the

field, which will affect one set of coils only.

Questions?

Basic Principles of ACPD
Chapter 4

The ACPD Technique
• Alternating current potential drop.
• Electromagnetic technique.
• Used to estimate defect depth of surface

breaking defects.
• The surfaces must be very clean in order to

give a good contact for the field connections
and also the sensing probe.

ACPD Theory

ACPD Theory
100mm
10V 0V
10mm
1V

ACPD Theory
10V 0V
2V
1V

ACPD Theory
V C 
CrackDepth = 0.5 D − 1
 
V R 
– Where D is the probe electrode spacing.
– Vc is the potential difference across the crack.
– Vr is the potential difference in the reference field.

ACPD Theory
• Assumes a uniform field.
• Assumes crack length > 2 times depth.
• Skin thickness is small compared to crack

depth.
• Modifiers used for short defects.

ACPD Application

ACPD Application

Benefits
• Can predict crack depth.
• Can predict crack shape.
• Easy interpretation of depth.
• No special interpretative skills required.
• No calibration.
• Very deep defects (>30mm) can be sized.

Limitations
• Difficult to set up in complex geometry.
• Requires removal of coatings or paint.
• Requires good electrical contact.
• Not easy to automate for field use.
• Poor technique for initial defect detection.

Questions?

Alternating Current Field
Basic Principles ACFM
Measurement
ACFM
Chapter 5

Uniform Field Disturbance Around a Crack

ACFM Theory
Resultant alternating magnetic field
AC Current passed through coil

ACFM Theory
Resultant alternating magnetic field
AC Current induced in metal surface

AC Current passed through coil
Magnetic field
Area of approximately uniform field

Current Flow Bx and Bz Relationship
Bz - Magnetism perpendicular to the

Bz
plate surface and perpendicular to
the electrical current flow.
By
Current flow
Bx Bx - Magnetism parallel to the

plate surface and perpendicular
to the electrical current flow.
Bx chart recorder trace

low on the graph.
Low current density (solid lines)

results in low Bx flux density
(dashed lines).

Bx chart recorder trace Bx chart recorder trace

low on the graph. higher on the graph.
Low Current density High Current density

(Solid lines) results in (Solid lines) results in
low Bx flux density High Bx flux density
(dashed lines). (dashed lines).

Currents Around a Crack in a Uniform
Field

Relationship of Bx to Current Density
Current density.

Currents Around a Crack in a Uniform Field

Relationship of Bx to Current Density
Bx.
Current density.

Bz Magnetism
Bz – Magnetism perpendicular to the
plate surface and perpendicular to
the current flow. Caused by
curvature of the current.

Currents and Generation of Perpendicular
Magnetic Fields

Relationship of Bz to Current Density
Current density.
Bz.

Relationship of Bx and Bz to Current Density
Bx.
Current density.
Bz.

Producing the Field

ACFM Sensing Coils

ACFM Sensing Coils
Bx.

ACFM Sensing Coils
Bx.
Bz.

ACFM Comparisons with Eddy Current
Systems
Eddy Current Eddy Current
ACFM
(Hocking) (Lizard)
Produces a uniform field,

Probe field. Not quantified. Not quantified.
values used in calculations.
Normally large lift-off signal Theoretically small lift- off

Lift-off Lift-off signal suppressed by
suppressed by electronic signal passes unaltered
compensation. differential probe.
means (arranged at setting up). through the electronics.
Theoretical models are used.

Calibration for Slot Signals used with Slots used with multiplication Crack depth calculation done
sizing. compensation for geometry. factor. by measurement of fields and
the use of algorithms.
Limited by accuracy of Limited by accuracy of

relationship between slot and relationship between slot and Limited by accuracy of
Accuracy of sizing. crack signals. crack signals. theoretical models and validity
Gives greater variation of Gives greater variation of signal of theoretical assumptions.
signal at lower crack sizes. at lower crack sizes.
Optimum
Portability/tight angles and Crack sizing, arrays,
application Varied display types.
edges. electronic recording.
capability.
No electronic recording &

Main restriction. Signal display complexity. Complex geometries.
Complex Scanning.

Questions?

ACFM Equipment
Hardware and Software
Chapters 6 and 11

Types of Equipment
• Model U9b ( no longer supported).
• Model U21, 31 (underwater models).
• Amigo portable system (U19).
• Array equipment.

Original U9 ACFM Crack Microgauge

Underwater ACFM Crack Microgauge
- Original Model U21

U31 Sub-Sea System

‘Amigo’ (U 19)

Walking Stick Array Technology

Flexible Array

Compliant ROV Probes

Software
• QFM version 2 (U9b) no longer supported.
• QFM version 3 (AMIGO) no longer issued.
• Assist suites of software.
• Wami 4 (underwater U21).
• QFM 31d.
• Assist 31U.
• Assistant – supports manual.
• Assist Lite- supports standard probes +3probe arrays
with or without encoders.
• Note: WAMI stands for windows activated microgauge
inspection.

Probes
• All ACFM probes have features which must be

brought to the attention of the probe operator, these
are:
– Serial number of the probe.

– A or C direction markings.
– Centre or index line.
– Connections.

Standard Weld Probe (Amigo)

U 31 Probe (Underwater)

Mini Straight Pencil Probe

Mini Probe 900

Micro Probe
• Designed for high sensitivity crack detection in tight

access areas such as ratholes and cruciforms and
have a reduced edge effect.
• Available in pencil or right angle geometry's, may be

limited to shallow cracks and are more sensitive to lift
off, also owing to the fact that the sensing coils are
offset, the butterfly will be at a gradient on the screen.

Micro Probe Right Angled

Probe Connections
Amigo probe connection U9 or U9b probe connection

Thread Probes
• ACFM is particularly suited to detection and sizing of

cracks in large threads (for example, drill string
collars).
• Probes with geometries to fit the thread exactly can

be manufactured. Note that the butterfly plot may be
oriented at an angle owing to the sensing coils being
offset

Threaded Connector Probe

ATI Pin Probe on NC50 Thread

Array Probes
• A number of array probes have been made, mainly for

ROV deployment. Array probes have the advantage of
not normally requiring scanning and can quickly
cover a large area.

Array Probe Data

Array Probe Data

Function Test Block
• ACFM does not require calibration.
• We do however need to ensure that the equipment is

functioning correctly.
• For this we use a standard function test block.

Function Test Block
Plate reference number: Pl0001
50mm x 5mm slot

standard / minis
20mm x 2mm
for checking micro probes

Features of the Function Test Block
• Each block is numbered (this number must be

recorded).
• Each block has a slot 50mm long x 5mm deep.
• The slot must be at least 100mm in from the edge.
• This will give 50% Bx and 175% Bz.

A - Direction

Bx 50% screen height

Bz 175% screen width

Plastic Function Check Block

Ancillary Equipment
• Magnetic marking arrows.
• Paintstick.
• Tape measures/ruler.
• Computer discs and log sheets.

Questions?

Operation of Computer
Basic Commands
Chapter 7

Keyboard Important Keys
• <ALT> key: (Normally positioned on the keyboard at bottom left
or right).
• <SPACE>: Large unmarked key at bottom.
• <ENTER>: (Positioned on right hand side) usually marked ↵

sometimes called return.
• <TAB>: (Normally positioned upper left side) marked← →
• <SHIFT>: Lower both sides marked ⇑
• <CTRL>: Lower left and or right side marked as Ctrl.
• <CURSOR>: Marked ← ↑ → ↓

Drives and Directories
• A:\ = The floppy disk or diskette.
− Note: Most modern computers are now supplied
without drive A.
• B:\ = Another disk drive.
• C:\ = This drive is not removable and is the main
storage area for data and programmes.
• D:\ = Normally reserved for CD Rom and DVD.
• E:\ = Removable compact flashcard or memory stick.
• G:\ = Network directories.

Files
• Computers store information in the form of Files.
• These are individually numbered Packages into which

all of the data is placed.

File Names
• Each file must have an individual identifying file name.
• The name should be easily identifiable.

Directories or Folders
• Directories or folders are the Filing cabinets into

which we place files.
• Good use of directories/folders will enable easy

location of data.

Use of Directories/Folders
• Storage of the data acquired during the ACFM

inspection, will automatically stored in sub-
directories of the programme file.

Questions?

Assist Family Software
Chapter 8

Display Format
Bx/Bz
Relationship
Chapter 9

Bx and Bz Trace Relationship
• Both of the traces Bx and Bz on the screen are

showing a level of flux density in a particular
orientation relative to plate surface.
• The butterfly plot takes both Bx and Bz values and

plots them against one another for a specific position
on the plate.

Butterfly Plot
Bx positive

Butterfly Plot
Bx positive
Bx negative
Butterfly Plot
Bx positive
Bz negative
Bx negative
Butterfly Plot
Bx positive
Bz positive Bz negative
Bx negative
Butterfly Relationship to Bx/Bz
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
C
Bx
direction
Bz -
Bz
Bx -
Bx +
C
Bx direction
F B
Bz -
Bz E G A
C
D
A Bx -
Bx +
C direction
Bx
F B
Bz -
Bz E G A
C
D
Bx -
AB
Bx +
C
Bx direction
F B
Bz -
Bz E GA C
D
A BC Bx -
Bx +
C
Bx direction
F B
Bz -
Bz E GA C
D
A BC D Bx -
Bx +
C
Bx direction
F B
Bz -
Bz E A C
D
A BC D E Bx -
Bx +
C
Bx direction
F B
Bz -
Bz E A C
D
A BC D EF Bx -
Bx +
C
Bx direction
F B
Bz -
Bz E GA C
D
A BC D EF G Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx A
direction
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
A
Bx direction
Bz -
Bz
Bx -
Bx +
Bx
Bz -
Bz
Bx -
Bx +
A
Bx direction
Bz -
Bz
Bx -
Crack
A C 1
25mm
A C 2

Seam Weld
A C 1
25mm
A C 2
Seam Weld

When Encountering an Inclusion
or Material Change
• Possibly the screen will show a crack like
signal.
• This signal will be repeated if another scan is

carried out parallel to the first but 5mm away
from the toe.
• There will also be a cracklike signal if a

transverse scan is attempted.

Scans to Prove an Inclusion or
Material Change
Weld
Scan 1
Inclusion
or
material
change.
Scan 1 will show a cracklike indication.

Material Change
Weld
Scan 1 Inclusion or
Scan 2 material
change.
• Scan 1 will show a crack like indication.
• Scan 2 will also show a crack like indication

Material Change
Weld
Scan 1
Inclusion or
Scan 2 material
change
Scan 3

• Scan 2 will also show a crack like indication.
• Scan 3 will not show a crack like indication
Material Change
Weld
Scan 1
Inclusion or
material change
Scan 2
Scan 3 Scan 4

• Scan 3 will not show a crack like indication.
Signal Interpretation Organogram
Start Downward butterfly

Yes
Start Downward butterfly Signal dies away quickly
No
Other feature

Yes
No Yes
Other feature Crack

Yes
No Yes
No Other feature Crack
Crack unlikely Any significant loops

Yes
No Yes
Crack unlikely Any significant loops Possible crack

Yes
No Yes
Any dips below Bx trend

Yes
No Yes
No
No crack

Yes
No Yes
No
Any associated peaks
No crack and troughs on Bz

Yes
No Yes
No
Any associated peaks It is possible the probe was
No crack and troughs on Bz not following the weld

Yes
No Yes
No
Any associated peaks It is possible the probe was
No crack and troughs on Bz not following the weld
Probably long crack. Scan large section

looking for cracklike trends, especially
on Bx to confirm.

Questions?

Probe Operator Briefing
Chapter 10

Probe Use
• The probe operator should be shown all the relevant

parts of the probe ie index line, A and C markings,
serial number etc.
• The start scan and end of scan dialogue should be

discussed.
• Method of holding and application of the probes to be

used should be discussed.

Standard Probe
• The probe should be held

as shown opposite.
• The scan start dialogue

may be as follows.
• When the index mark

passes a mark on the
sample, probe operator
says Mark.

End of Scan Dialogue
When either the probe

operator or the computer
operator needs to stop the
scan, the following dialogue
should be used.

AMIGO Mini Probe
The amigo mini probe has a

longer handle. The handle
should be angled along the
weld for correct results, as
shown.

Mini Probe Application
• The mini probe should not

be held onto the weld as
shown opposite.
• The probe should be held by

the body.

Probe Operator Briefing
• General introduction (names/overview).

• Safety awareness.
• Qualification (minimum 3.1U or visual).
• Nature of the probes to be used.
• Various types of probe.
• Method of operation (holding etc).
• Markings:
– Probe serial number.
– Index line.
A/C direction.
• Probe connections.

Probe Operator Briefing Continued
• Cleaning requirements.
• Visual examination:
– Edges and attachments near to scan.
• Weld features:
– Restarts.
– Seam welds.
– Grinds.
• Access for the probe.
• Edges and attachments nearby to the scan.
• Marking the sample (datum).

• Scanning techniques:
– Scan start procedure.
– Position on the weld.
– Operations checks.
• Method of holding the probe.
• Position on the weld (weld width > 40mm).
• Scan speed (50mm / sec or adjust to suit).
• Overlapping scans:
– Minimum one complete clock position.
• Dialogue between the probe operator and the topside
operator.
• Instruction on how to size for length:

– Sizing scans needed.
– Marking up of defects.
– Final scans and measurements.
– Reporting.
• Encourage questions at the end to ensure he

understands what is required of him.

Questions?

General Scanning Procedure
Chapter 12

Inspection Procedure
• Equipment function check on the slotted block over

the 50mm x 5mm slot.
• This should be done for all probes at the beginning of

each shift and saved in dedicated file.
• The slot should show 175% Bz & 50% Bx over the

50mm x 5mm slot.

Inspection Procedure Continued
• Probe operator briefing.

• Deploy equipment to the site.
• Watertight integrity (if subsea unit).
• Ancillary equipment.
• Probes secured.
• Rigging.

• Identify the component.

• Set up directories and filenames as appropriate:
– Done automatically with AMIGO.
– Suffix O function check.
– Suffix G general inspection.
• Cleaning:
– Marine growth.
– Loose scale.
– Loose paint etc. A

• Visual inspection by the probe operator:

– Grind marks.
– Weld profile, undercut etc.
– Corrosion.
• Ensure sufficient access for the probe.
• Attachments close by.
• Ends of plates or components.
• Geometry.
• Demagnetise if required.
• Mark up the component as appropriate:
– Clock Positions or marks.
– 50mm increments < 400mm > 100mm increments.

• Carry out operations check (ops check):
– Probe 50mm from toe of the weld.

– Probe held at the same angle relative to the weld
as will be needed during the toe scan.
– When ready the probe operator moves the probe
slowly into the toe of the weld.
– Allows centering of the plot and checks for 3600
cracking on tubulars and ensures scan is not
started on a cracked area for longitudinal welds.

Ops Check
Weld.
50mm Movement.
A C

Ops Check
Weld.
A C
50mm

Ops Check
Weld.
A C
Bx 50mm
Bz
Butterfly.

• Scanning for detection:

– Set clock positions (Ctrl + C), note physical
direction of scan (from probe operator).
– Ensure probe operator is ready Standby.
– Press R.
– Tell probe operator to start scanning when traces
appear on the screen.
– Press S at the end of the scan.
– Tell probe operator to stop scanning relax.
• Assess the traces looking for a downward butterfly.
• Fill out Notes pages.
• Always ensure sufficient overlap to avoid missing any

part of the weld or scanning area.
• Continue around the weld until all of the area is

covered.

• Scan for sizing:
– Position probe operator one clock position before

the defect and scan through to one beyond.
– Re-position probe operator as above.
– Scan slowly into the defect.
– Move to and fro until the Bz peak is at its maximum
or minimum.
– Tell probe operator to mark using the magnetic
arrow alongside the probe index line.

• Repeat the above operation at the other end of the defect
indication.
• Have the probe operator measure the distance between the
magnetic arrows.
• Carry out a final scan through the defect from one clock
position before with the probe operator calling the clock
positions (space bar) and the marking arrows (press enter),
ensure purple indicator lines produced are in the correct
position (If not repeat).
• When satisfied have the probe operator measure the
distance between the arrows.
• Carry out sizing procedure through the software.

Sizing Continued
• When satisfied have the probe operator check the

measured distance between the arrows.
• Carry out sizing procedure through the software.

• Backup the days work onto memory stick.
• Ensure notes pages are completed.
• Recover equipment:
– Wash with freshwater.
– Carry out any maintenance.
– Store safely.
• Recharge batteries.

Setting Scan Speed (Comms Rate)
• Sometimes the traces may be moving across the

screen either too fast or perhaps too slowly.
• This can be altered by changing the scan speed

(comms rate). Default setting is 3.

Setting Scan Speed

Setting Scan Speed (Scan Rate)
• We can change the sample rate using the dialogue

box shown.
• This will either slow down or speed up the rate of

samples taken.
• The effect is to make the scan more sensitive and

also make the traces move across the screen faster
or vice versa.




Questions?

Defect Sizing
Chapter 13

Crack Geometry and Sizing
• Sizing assumes a semi elliptical crack.
• Line contacts should be sized as one crack.
• Probe/crack angle may effect signal size.
• Angle of crack to scanned surface has no effect on

size as total length sized (not through thickness).

ACFM Length Sizing
• Find defect indication by normal methods .
• Have the probe operator position the probe one clock

position prior to the defect indication.
• Press R when traces appear tell probe operator to

start scanning into and through the defect to
confirm.

ACFM Length Sizing
• Ask the probe operator to scan slowly into the defect

from one end and watch the butterfly.
• When the butterfly reaches its maximum sideways

deflection tell probe operator to mark the index line
with the magnetic marker. This may involve some
back and forth movement by the probe operator.

Shows a point just inside
the end of the defect

Repeat for the Other End of the Defect

Repeat for the Other End of the Defect
Shows a point just inside

the end of the defect

ACFM Length Sizing
• Position the probe operator so that the probe is just

before one clock position prior to the defect.
• Press R and when traces appear inform probe

operator to start scanning slowly through the defect
calling out clock positions and arrows as they pass
the index line of the probe.

ACFM Length Sizing
• As the probe operator calls a clock position, hit the

space bar. When he calls an arrow hit the enter key
(this will place a purple line on the screen).
• Once the probe is past the defect and one extra

clock position stop the scan and assess the screen
to ensure the peaks and troughs of the Bz are
exactly on the purple lines. If not repeat scans.

ACFM Length Sizing - Final Scan
• Position the probe operator so that the probe is just

before one clock position prior to the defect.
• Press R and when traces appear inform probe

operator to start scanning slowly through the defect
calling out clock positions and arrows as they pass
the index line of the probe.

ACFM Length Sizing
Carry out the sizing operation for length and depth using the
ASSIST software:
• For this the Bz maximum and minimum positions have to
be located by left clicking and dragging the cursor from
before the Bz maximum to after the Bz minimum.
• The Bx minimum and background levels are selected by
left clicking below the Bx minimum and dragging the
cusor to the Bx background level.
• Press the Analyse button, select Size Defect and enter the
measured length.
• The ACFM length and depth will then be calculated
automatically.
Practical Demonstration

Example Scans
Level 1

Ops
check

Ops
check
Bx indicates
no defect
in the toe

Ops
check

Ops
check
Bx indicates
possible
defect in the toe

C-
direction

Shows classic
defect indication.

Shows classic
defect indication.

C-
direction

Clear of indications.

C-
direction

Defect indication
between 3 and 4

Normal plate edge effect

Normal plate edge
effect

C - Direction

C - direction Geometry effects

C - direction

Defect indication near the
end of a plate (geometry)

Crack end Defect indication near the
end of a plate (geometry)

C - direction

Indication of an
inclusion

Indication of an inclusion
Virtually no dip
below Bx background

C - direction Same inclusion as on the
previous page, scanned
5mm from the toe.

Same inclusion as on the
previous page, scanned
5mm from the toe
Shows similar scan as

before

A - direction

Crack
indication
in geometry

A - direction

Cracklike indication poor
scan

scan

scan

C - direction

Clear indication of defect

A - direction

Line contact within the
cracklike indication

Line contact within the
cracklike indication

C - direction

C - direction Scan across
magnetic
poles

C - direction

C - direction Poor probe
operation

A - direction

Probe lifted off the surface and
then replaced

A - direction

Probe rocking

A - direction

Scanning to the end of a
A - direction
grindmark

Scanning to the end of a
A - direction
grindmark

Questions?

Alternating Current Field Measurement Level 1 Course (ACFM L1)

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Alternating Current Field Measurement

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• To explain the theoretical principles.

Copyright © TWI Ltd 2013

• First used in 1930’s by Dr Foerster for tube inspection.

• 1950’s: High frequency EMD was used in the aerospace

• 1970’s: The impedance plane display developed.

• 1980’s: Digital display arrives.

Copyright © TWI Ltd 2013

• First used for weld inspection during the 1960’s on Admiralty

• 1980’s: Thorburn technics produced instrument for weld

• Alternating current field measurement (ACFM) developed by UCL

• 1991: TSC commercial system.

• 1995: TSC Array system.

Copyright © TWI Ltd 2013